AT267997B - Stabilized aqueous bath for chemical copper plating - Google Patents

Stabilized aqueous bath for chemical copper plating

Info

Publication number: AT267997B
Authority: AT; Austria
Prior art keywords: copper plating; aqueous bath; chemical copper; stabilized aqueous; stabilized
Prior art date: 1967-02-01

Application number

AT1079967A

Other languages

German (de)

Original Assignee

Schering Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1967-02-01

Filing date

1967-11-29

Publication date

1969-01-27

1967-11-29 Application filed by Schering Ag filed Critical Schering Ag

1969-01-27 Application granted granted Critical

1969-01-27 Publication of AT267997B publication Critical patent/AT267997B/en

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
229910052802 copper Inorganic materials 0.000 title 1
239000010949 copper Substances 0.000 title 1
238000007747 plating Methods 0.000 title 1
239000000126 substance Substances 0.000 title 1

AT1079967A 1967-02-01 1967-11-29 Stabilized aqueous bath for chemical copper plating AT267997B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE267997X		1967-02-01

Publications (1)

Publication Number	Publication Date
AT267997B true AT267997B (en)	1969-01-27

Family

ID=5997680

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT1079967A AT267997B (en)	1967-02-01	1967-11-29	Stabilized aqueous bath for chemical copper plating

Country Status (1)

Country	Link
AT (1)	AT267997B (en)

1967
- 1967-11-29 AT AT1079967A patent/AT267997B/en active

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