ATE509058T1 - THERMOCURTABLE POLYPHENYLENE ETHERS - Google Patents

THERMOCURTABLE POLYPHENYLENE ETHERS

Info

Publication number
ATE509058T1
ATE509058T1 AT07104865T AT07104865T ATE509058T1 AT E509058 T1 ATE509058 T1 AT E509058T1 AT 07104865 T AT07104865 T AT 07104865T AT 07104865 T AT07104865 T AT 07104865T AT E509058 T1 ATE509058 T1 AT E509058T1
Authority
AT
Austria
Prior art keywords
thermocurtable
polyphenylene ethers
curable
composition
poly
Prior art date
Application number
AT07104865T
Other languages
German (de)
Inventor
Gary William Yeager
Robert Edgar Colborn
Original Assignee
Sabic Innovative Plastics Ip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sabic Innovative Plastics Ip filed Critical Sabic Innovative Plastics Ip
Application granted granted Critical
Publication of ATE509058T1 publication Critical patent/ATE509058T1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • C08L71/126Polyphenylene oxides modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • C08G65/485Polyphenylene oxides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31692Next to addition polymer from unsaturated monomers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31692Next to addition polymer from unsaturated monomers
    • Y10T428/31696Including polyene monomers [e.g., butadiene, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31692Next to addition polymer from unsaturated monomers
    • Y10T428/31699Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention relates to a curable poly(phenylene ether) composition comprising a poly(phenylene ether) containing hydroxyl groups wherein at least 10% of the hydroxyl groups have been capped with a compound containing ethylenic unsaturation; a curable unsaturated monomer composition; and a curing catalyst. The invention also relates to a laminate comprising said curable composition.
AT07104865T 1999-12-01 2000-11-14 THERMOCURTABLE POLYPHENYLENE ETHERS ATE509058T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/452,733 US6352782B2 (en) 1999-12-01 1999-12-01 Poly(phenylene ether)-polyvinyl thermosetting resin

Publications (1)

Publication Number Publication Date
ATE509058T1 true ATE509058T1 (en) 2011-05-15

Family

ID=23797699

Family Applications (2)

Application Number Title Priority Date Filing Date
AT07104865T ATE509058T1 (en) 1999-12-01 2000-11-14 THERMOCURTABLE POLYPHENYLENE ETHERS
AT00978576T ATE358151T1 (en) 1999-12-01 2000-11-14 THERMOHARDABLE BLENDS OF POLYPHENYLENE ETHERS AND VINYL POLYMERS

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT00978576T ATE358151T1 (en) 1999-12-01 2000-11-14 THERMOHARDABLE BLENDS OF POLYPHENYLENE ETHERS AND VINYL POLYMERS

Country Status (7)

Country Link
US (2) US6352782B2 (en)
EP (3) EP1265946B1 (en)
JP (1) JP4913970B2 (en)
CN (1) CN1280337C (en)
AT (2) ATE509058T1 (en)
DE (1) DE60034152T2 (en)
WO (1) WO2001040354A1 (en)

Families Citing this family (169)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6469093B1 (en) * 1999-11-12 2002-10-22 General Electric Company Conductive polyphenylene ether-polyamide blend
US6878782B2 (en) * 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US6905637B2 (en) 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
US7235192B2 (en) * 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
US6352782B2 (en) * 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US6812276B2 (en) * 1999-12-01 2004-11-02 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6521703B2 (en) 2000-01-18 2003-02-18 General Electric Company Curable resin composition, method for the preparation thereof, and articles derived thereform
ATE381588T1 (en) * 2000-03-27 2008-01-15 Japan Composite Co Ltd MULTI-LAYER MATERIAL WITH LOW THERMAL EXPANSION
US6306963B1 (en) * 2000-05-08 2001-10-23 General Electric Co. Thermosetting resins and laminates
US6384176B1 (en) * 2000-07-10 2002-05-07 General Electric Co. Composition and process for the manufacture of functionalized polyphenylene ether resins
US6897282B2 (en) 2000-07-10 2005-05-24 General Electric Compositions comprising functionalized polyphenylene ether resins
US6593391B2 (en) * 2001-03-27 2003-07-15 General Electric Company Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation
US6878781B2 (en) * 2001-03-27 2005-04-12 General Electric Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom
US6723299B1 (en) 2001-05-17 2004-04-20 Zyvex Corporation System and method for manipulating nanotubes
US20030078347A1 (en) * 2001-08-28 2003-04-24 General Electric Company Triazine compounds, polymers comprising triazine structural units, and method
US6608166B2 (en) * 2001-08-30 2003-08-19 General Electric Company Three-dimensional copolymers of polyphenylene ether resinsand sytrenic resins
US7318958B2 (en) * 2001-11-30 2008-01-15 General Electric Company Weatherable multilayer articles and method for their preparation
US8057903B2 (en) * 2001-11-30 2011-11-15 Sabic Innovative Plastics Ip B.V. Multilayer articles comprising resorcinol arylate polyester and method for making thereof
US6835785B2 (en) 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
JP2003261762A (en) * 2002-03-11 2003-09-19 Kyocera Chemical Corp Flame retardant resin composition, prepreg and laminated product
JP4208723B2 (en) * 2002-04-09 2009-01-14 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ Thermosetting composition, method and article
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
US20040034177A1 (en) 2002-05-02 2004-02-19 Jian Chen Polymer and method for using the polymer for solubilizing nanotubes
US6905667B1 (en) 2002-05-02 2005-06-14 Zyvex Corporation Polymer and method for using the polymer for noncovalently functionalizing nanotubes
TWI250995B (en) * 2002-07-25 2006-03-11 Mitsubishi Gas Chemical Co Vinyl compound and cured product thereof
JP3801117B2 (en) * 2002-08-26 2006-07-26 株式会社日立製作所 Low dielectric loss tangent film and wiring film
KR100500191B1 (en) * 2002-09-10 2005-07-14 에스에스씨피 주식회사 Uv-curable resin composition for cladding layer of optical fiber
JP4530990B2 (en) * 2002-10-11 2010-08-25 ユニバーシティ オブ コネチカット Blends of amorphous and semi-crystalline polymers with shape memory properties
US6734259B1 (en) * 2002-10-24 2004-05-11 International Business Machines Corporation Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom
US7250330B2 (en) * 2002-10-29 2007-07-31 International Business Machines Corporation Method of making an electronic package
US7022404B2 (en) * 2002-11-01 2006-04-04 World Properties, Inc. Circuit substrate material, circuits comprising the same, and method of manufacture thereof
AU2002953099A0 (en) * 2002-12-04 2002-12-19 Australian Composites Pty Ltd Reinforced polymer composition
US7250477B2 (en) * 2002-12-20 2007-07-31 General Electric Company Thermoset composite composition, method, and article
US20040137251A1 (en) 2003-01-14 2004-07-15 Davis Michael John Poly(phenylene ether)-polyvinyl thermosetting adhesives films, and substrates made therefrom
US7514147B2 (en) * 2003-01-14 2009-04-07 Sabic Innovative Plastics Ip B.V. Formable thermoplastic multi-layer laminate, a formed multi-layer laminate, an article, and a method of making an article
CN100547033C (en) * 2003-01-28 2009-10-07 松下电工株式会社 Polyphenylene ether resin composition, prepreg and laminate
US7413791B2 (en) * 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
US7270882B2 (en) * 2003-02-21 2007-09-18 General Electric Company Weatherable multilayer articles and method for their preparation
KR20050106447A (en) * 2003-02-21 2005-11-09 제너럴 일렉트릭 캄파니 Weatherable multilayer articles and method for their preparation
JP2004315725A (en) * 2003-04-18 2004-11-11 Hitachi Chem Co Ltd Preparation process of prepreg, metal-clad laminated plate, and printed circuit board
JP2004339328A (en) * 2003-05-14 2004-12-02 Matsushita Electric Works Ltd Modified polyphenylene ether compound and method for producing the same
JP2007516314A (en) 2003-05-22 2007-06-21 ザイベックス コーポレーション Nanocomposites and methods for nanocomposites
US6905941B2 (en) * 2003-06-02 2005-06-14 International Business Machines Corporation Structure and method to fabricate ultra-thin Si channel devices
US20040253428A1 (en) * 2003-06-12 2004-12-16 General Electric Company Weatherable multilayer articles and method for their preparation
CA2531039A1 (en) * 2003-07-02 2005-02-17 Francois Court Method for production of objects from thermosetting resins
US7226980B2 (en) * 2003-08-07 2007-06-05 General Electric Company Thermoset composition, method for the preparation thereof, and articles prepared therefrom
US7101923B2 (en) * 2003-10-03 2006-09-05 General Electric Company Flame-retardant thermoset composition, method, and article
US7067595B2 (en) * 2003-10-03 2006-06-27 General Electric Company Poly (arylene ether) composition and method
WO2005033179A1 (en) * 2003-10-03 2005-04-14 General Electric Company Flame-retardant thermoset composition, method, and article
US7148296B2 (en) * 2003-10-03 2006-12-12 General Electric Company Capped poly(arylene ether) composition and process
US7466868B2 (en) * 2003-10-03 2008-12-16 Adobe Systems Incorporated Determining parameters for adjusting images
US7211639B2 (en) * 2003-10-03 2007-05-01 General Electric Company Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom
US20050080185A1 (en) * 2003-10-10 2005-04-14 Mhetar Vijay R. Poly(arylene ether) composition and method of making
US20050158561A1 (en) * 2004-01-16 2005-07-21 General Electric Company Weatherable multilayer articles and method for their preparation
US7153576B2 (en) * 2004-01-20 2006-12-26 General Electric Company Weatherable multilayer article assemblies and method for their preparation
US7595362B2 (en) * 2004-01-30 2009-09-29 Nippon Steel Chemical Co., Ltd. Curable resin composition
US6962965B2 (en) * 2004-02-20 2005-11-08 General Electric Company Functionalized poly(arylene ether) composition and process
JP4626194B2 (en) * 2004-06-22 2011-02-02 パナソニック電工株式会社 Electrical insulating resin composition, prepreg, laminate and multilayer printed wiring board
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
US7296576B2 (en) 2004-08-18 2007-11-20 Zyvex Performance Materials, Llc Polymers for enhanced solubility of nanomaterials, compositions and methods therefor
US20060038324A1 (en) * 2004-08-20 2006-02-23 Yeager Gary W Molding method for curable poly(arylene ether) composition and article thereby
US7615588B2 (en) * 2004-08-30 2009-11-10 Polyone Corporation Reinforced thermoplastic compositions with enhanced processability
JP4364096B2 (en) * 2004-09-21 2009-11-11 オリンパス株式会社 Ultrasonic transducer
US20060135704A1 (en) * 2004-12-22 2006-06-22 Vallance Michael A Tack free compositions useful for electronic encapsulation
US7297370B2 (en) 2004-12-22 2007-11-20 General Electric Company Curable encapsulant composition, device including same, and associated method
US8033501B2 (en) * 2005-06-10 2011-10-11 The Boeing Company Method and apparatus for attaching electrically powered seat track cover to through hole seat track design
KR100645065B1 (en) * 2005-06-23 2006-11-10 삼성전자주식회사 Fin Field Effect Transistor, Nonvolatile Memory Device Having Same and Forming Method Thereof
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
US20070080330A1 (en) * 2005-10-06 2007-04-12 Peters Edward N Flame retardant composition and method
US7495047B2 (en) * 2005-10-06 2009-02-24 At&T Intellectual Property, I, L.P. Poly(arylene ether) composition, method, and article
US7488766B2 (en) * 2005-10-06 2009-02-10 Sabic Innovative Plastics Ip B.V. Polymer composition, method, and article
JP5123477B2 (en) * 2005-10-18 2013-01-23 パナソニック株式会社 Resin composition, prepreg, laminate
US8264137B2 (en) 2006-01-03 2012-09-11 Samsung Electronics Co., Ltd. Curing binder material for carbon nanotube electron emission cathodes
US7771696B2 (en) * 2006-07-27 2010-08-10 University Of Dayton Nanocomposites and functionalized carbon nanofibers
US20080033141A1 (en) * 2006-08-01 2008-02-07 Bates Gary M Poly(arylene ether) method
CN101522318B (en) 2006-08-08 2013-11-06 环球产权公司 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US20080071000A1 (en) * 2006-09-15 2008-03-20 Christina Louise Braidwood Poly(arylene ether) composition and article
US20080071034A1 (en) * 2006-09-15 2008-03-20 Christina Louise Braidwood Poly(arylene ether) composition and method
JP5237284B2 (en) * 2006-09-15 2013-07-17 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ Poly (arylene ether) compositions, methods and articles
US20080097069A1 (en) * 2006-10-20 2008-04-24 Hua Guo Poly(arylene ether) method and composition
US20080097027A1 (en) * 2006-10-23 2008-04-24 General Electric Company Varnish composition for insulating electrical machinery
US7638566B2 (en) * 2006-10-30 2009-12-29 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) compositions
US7655278B2 (en) * 2007-01-30 2010-02-02 Sabic Innovative Plastics Ip B.V. Composite-forming method, composites formed thereby, and printed circuit boards incorporating them
US20080194724A1 (en) * 2007-02-12 2008-08-14 Pankaj Singh Gautam Method of forming a crosslinked poly(arylene ether) film, and film formed thereby
KR20100037117A (en) * 2007-07-03 2010-04-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 A backlight assemblies having a transmissive optical film
WO2009012440A2 (en) * 2007-07-19 2009-01-22 Luzenac America, Inc. Silicone coatings, methods of making silicone coated articles and coated articles therefrom
US20090038072A1 (en) * 2007-08-10 2009-02-12 Defranks Michael S Fire resistant corner guard
US7595367B2 (en) * 2007-08-28 2009-09-29 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) preparation method
US8110132B2 (en) * 2008-02-13 2012-02-07 James Hardie Technology Limited Process and machine for manufacturing lap siding and the product made thereby
DE112009000839T5 (en) * 2008-04-10 2011-05-12 World Properties, Inc., Lincolnwood Improved bond circuit materials, methods of making the same, and articles made therefrom
US20100009207A1 (en) * 2008-07-10 2010-01-14 Sabic Innovative Plastics Ip B.V. Formable thermoplastic multi-layer article, a formed multi-layer article, an article, and a method of making an article
US8092722B2 (en) * 2008-09-30 2012-01-10 Sabic Innovative Plastics Ip B.V. Varnish compositions for electrical insulation and method of using the same
US8110632B2 (en) * 2009-01-15 2012-02-07 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) articles and compositions
CN104053302B (en) * 2009-06-11 2017-08-29 罗杰斯公司 Dielectric material, the method for forming by it sub-component and the sub-component being consequently formed
US9528035B2 (en) * 2009-09-11 2016-12-27 3M Innovative Properties Company Curable and cured adhesive compositions
JP5463117B2 (en) * 2009-10-20 2014-04-09 株式会社日立製作所 Low loss wiring board, multilayer wiring board, copper foil and laminated board used therefor
KR101837219B1 (en) 2010-07-13 2018-03-09 데이진 가부시키가이샤 Carbon fiber bundle, method for producing same, and molded article produced from same
WO2012006776A1 (en) 2010-07-14 2012-01-19 广东生益科技股份有限公司 Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof
CN102161823B (en) * 2010-07-14 2012-09-26 广东生益科技股份有限公司 Composite material, high-frequency circuit substrate therefrom and manufacture method thereof
US8614155B2 (en) 2010-08-20 2013-12-24 International Business Machines Corporation Resin composition eliminating volatile loss of initiating species for the preparation of printed circuit board laminates
US8703277B2 (en) 2010-12-16 2014-04-22 Asahi Kasei E-Materials Corporation Curable resin composition
WO2013011677A1 (en) 2011-07-19 2013-01-24 パナソニック株式会社 Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
US8446707B1 (en) 2011-10-10 2013-05-21 Endicott Interconnect Technologies, Inc. Circuitized substrate with low loss capacitive material and method of making same
SG10201406126YA (en) * 2012-03-19 2014-11-27 Asahi Kasei E Materials Corp Prepreg comprising polyphenylene ether particles
TWI468465B (en) 2012-03-23 2015-01-11 Taiwan Union Technology Corp Resin composition and uses of the same
JP5952100B2 (en) * 2012-06-15 2016-07-13 旭化成株式会社 Curable resin composition
CN102807658B (en) * 2012-08-09 2014-06-11 广东生益科技股份有限公司 Polyphenyl ether resin composite and prepreg and copper clad laminate made of polyphenyl ether resin composite
JP5914812B2 (en) 2012-08-29 2016-05-11 パナソニックIpマネジメント株式会社 Modified polyphenylene ether, method for producing the same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board
US8703848B1 (en) * 2012-10-09 2014-04-22 Sabic Innovative Plastics Blends of micronized polyphenylene ether and thermoplastic polyurethanes blend
TWI490251B (en) * 2013-02-21 2015-07-01 Chin Yee Chemical Industres Co Ltd Containing unsaturated polyphenylene ether resin and its composition, thermosetting resin composition
CN103467982B (en) * 2013-07-11 2016-06-01 广东汕头超声电子股份有限公司覆铜板厂 Cyanate compositions and prepare the method for copper-clad plate with it
US20150028247A1 (en) 2013-07-23 2015-01-29 Sabic Innovative Plastics Ip B.V. Rigid foam and associated article and method
US9175160B2 (en) 2013-08-28 2015-11-03 Sabic Global Technologies B.V. Blend of poly(phenylene ether) particles and polyoxymethylene, article thereof, and method of preparation
US9447227B2 (en) 2013-10-03 2016-09-20 Sabic Global Technologies B.V. Flexible polyurethane foam and associated method and article
EP3055354B1 (en) * 2013-10-11 2018-12-05 Isola USA Corp. Varnishes and prepregs and laminates made therefrom
US20150105505A1 (en) * 2013-10-11 2015-04-16 Isola Usa Corp. Varnishes and Prepregs and Laminates Made Therefrom
CN104629341B (en) * 2013-11-08 2017-01-04 中山台光电子材料有限公司 Low dielectric resin composition, applies its semi-solid preparation film, copper clad foil substrate, circuit board
WO2015089807A1 (en) * 2013-12-19 2015-06-25 Dow Global Technologies Llc Vinyl-capped poly(phenylene) ether and styrene-butadiene copolymer blends for curable compositions
TWI506059B (en) * 2014-02-10 2015-11-01 Chin Yee Chemical Industres Co Ltd Phosphorus-containing polyphenylene ether, phosphorus-containing polyphenylene ether composition, phosphorus-containing epoxy polyphenylene ether composition and use thereof
CN104845363B (en) 2014-02-14 2017-04-05 广东生益科技股份有限公司 A kind of halogen-free resin composition and application thereof
CN106660953B (en) 2014-07-22 2020-07-28 沙特基础工业全球技术有限公司 High heat-resistant monomer and method of using the same
EP3221402A4 (en) 2014-11-19 2018-06-06 SABIC Global Technologies B.V. Particulate poly(phenylene ether)-containing varnish composition, composite and laminate prepared therefrom, and method of forming composite
KR101865649B1 (en) * 2014-12-22 2018-07-04 주식회사 두산 Thermoplastic resin composition for high frequency, prepreg, laminate sheet and printed circuit board using the same
JP6506385B2 (en) * 2015-02-19 2019-04-24 京セラ株式会社 Resin composition, prepreg, metal-clad laminate and wiring board
US9637596B2 (en) 2015-03-10 2017-05-02 International Business Machines Corporation Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions
CN108290398A (en) 2015-11-25 2018-07-17 沙特基础工业全球技术有限公司 Including the composite material and laminate prepared therefrom of poly- (phenylene ether) and the method for forming composite material
JP6601675B2 (en) * 2016-01-14 2019-11-06 パナソニックIpマネジメント株式会社 Metal-clad laminate and resin-coated metal foil
CN106589748B (en) * 2016-11-30 2019-07-12 华南协同创新研究院 A kind of resin combination of the copper clad foil substrate for high-frequency high-speed field and its application
WO2018159080A1 (en) * 2017-03-02 2018-09-07 パナソニックIpマネジメント株式会社 Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
TWI635133B (en) * 2017-03-27 2018-09-11 廣科工業股份有限公司 Polyphenylene ether resin composition
CN108727827B (en) * 2017-04-17 2021-06-04 广东生益科技股份有限公司 Thermosetting vinyl silicone resin composition and application thereof in high-frequency circuit board
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KR102056303B1 (en) 2017-05-15 2019-12-16 주식회사 엘지화학 Resin composition for semiconductor package, prepreg and metal clad laminate using the same
WO2019103082A1 (en) * 2017-11-24 2019-05-31 ナミックス株式会社 Thermosetting resin composition, dielectric film, interlayer dielectric film, multilayer wiring board, and semiconductor device
US10745512B2 (en) * 2018-01-12 2020-08-18 Nano And Advanced Materials Institute Limited Piezo-resistive materials
EP3567068A1 (en) 2018-05-07 2019-11-13 SABIC Global Technologies B.V. Functional phenylene ether oligomer and curable and thermoset compositions prepared therefrom
CN110551257B (en) 2018-06-04 2021-10-08 台燿科技股份有限公司 Resin composition and its prepreg, metal foil laminate and printed circuit board
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CN114174459B (en) * 2019-08-02 2023-05-26 迪睿合株式会社 Adhesive composition, thermosetting adhesive sheet, and printed wiring board
WO2021033164A1 (en) * 2019-08-20 2021-02-25 Shpp Global Technologies B.V. Poly(phenylene ether) based compatibilizing material
CN110922584B (en) * 2019-10-31 2023-04-21 库尔勒郑豫石油物资有限公司 Method for preparing polyphenyl ether
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TWI740485B (en) 2020-05-04 2021-09-21 台灣中油股份有限公司 Oligomer (2,6-dimethylphenyl ether), preparation method thereof and cured product
TWI725851B (en) 2020-05-15 2021-04-21 台燿科技股份有限公司 Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
JP2022042170A (en) 2020-09-02 2022-03-14 デュポン・東レ・スペシャルティ・マテリアル株式会社 Thermosetting silicone composition
JP2023012895A (en) * 2021-07-14 2023-01-26 旭化成株式会社 Curable resin composition
CN113956481A (en) * 2021-09-07 2022-01-21 江苏诺德新材料股份有限公司 Resin composition for 5G high-frequency high-speed copper-clad plate, prepreg and laminated plate
TW202319467A (en) * 2021-11-03 2023-05-16 台燿科技股份有限公司 Resin composition and uses of the same
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JP2023103094A (en) * 2022-01-13 2023-07-26 旭化成株式会社 Curable resin composition
US12247133B2 (en) * 2022-02-17 2025-03-11 Canon Kabushiki Kaisha Photocurable composition including a reactive polymer
TWI805409B (en) * 2022-06-16 2023-06-11 南亞塑膠工業股份有限公司 Substrate material with low dielectric properties and metal clad substrate using the same
WO2024018918A1 (en) 2022-07-22 2024-01-25 日鉄ケミカル&マテリアル株式会社 Polyfunctional vinyl resin, production method therefor, composition of polyfunctional vinyl resin, and cured object therefrom
KR20250107799A (en) 2022-11-15 2025-07-14 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Multifunctional vinyl resin, method for producing same, multifunctional vinyl resin composition and cured product thereof
TWI860899B (en) 2023-11-24 2024-11-01 台燿科技股份有限公司 Prepreg and uses of the same

Family Cites Families (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL295699A (en) 1962-07-24
US3356671A (en) 1965-03-17 1967-12-05 Ici Ltd Process of preparing unsymmetrical 1:2-cobalt complexed azo compounds
US3356761A (en) 1967-04-12 1967-12-05 Gen Electric Melt processable polyphenylene ether and process
US3375228A (en) 1967-05-10 1968-03-26 Gen Electric Hot capping of polyphenylene ethers
US3557045A (en) 1967-11-13 1971-01-19 Fmc Corp Mixed thermosetting resin compositions containing polyphenylene ethers
NL141215B (en) 1968-01-23 1974-02-15 Fmc Corp PROCEDURE FOR PREPARING THERMO-HARDING RESIN MATERIALS.
CA927032A (en) 1969-06-30 1973-05-22 H. Beacham Harry Flame-retardant resin compositions
US3597216A (en) 1969-09-24 1971-08-03 Celanese Corp High temperature photoresist of cross-linked poly(2,6-dimethyl-1,4-phenylene oxide)
US3883612A (en) 1971-06-07 1975-05-13 Scm Corp Low-shrink thermosetting polymers
US4048143A (en) 1974-02-11 1977-09-13 General Electric Company Process for capping polyphenylene oxide
US4165422A (en) 1977-05-26 1979-08-21 General Electric Company Acyl capped quinone-coupled polyphenylene oxides
US4148843A (en) 1977-12-23 1979-04-10 General Electric Company Compositions of capped polyphenylene oxides and alkenyl aromatic resins
US4327013A (en) 1979-05-01 1982-04-27 Union Carbide Corporation Poly(acrylate) containing compositions and process for producing molded articles
JPS5793140A (en) * 1980-12-02 1982-06-10 Kanegafuchi Chemical Ind Paper base material noninflammable unsaturated polyester resin copper foil lined laminated board
DE3117514A1 (en) 1981-05-02 1982-12-02 Basf Ag, 6700 Ludwigshafen Aromatic polyethers containing olefinic terminal groups
USH521H (en) * 1982-06-30 1988-09-06 Thermosetting polysulfones
US4572813A (en) 1983-09-06 1986-02-25 Nikkiso Co., Ltd. Process for preparing fine carbon fibers in a gaseous phase reaction
DE3340493A1 (en) 1983-11-09 1985-05-15 Bayer Ag, 5090 Leverkusen METHOD FOR PRODUCING BIFUNCTIONAL POLYPHENYLENE OXIDES
US4665137A (en) 1984-03-06 1987-05-12 The B. F. Goodrich Company Crosslinkable difunctionalized poly(phenylene oxide) and process for preparation thereof
US4701514A (en) 1984-03-06 1987-10-20 B.F. Goodrich Company Difunctionalized polyarylene polyethers and process for preparation thereof
US4663402A (en) 1984-03-06 1987-05-05 The B. F. Goodrich Company Non-catalytic process for the preparation of difunctionalized polyarylene polyethers
US4562243A (en) 1984-03-06 1985-12-31 The B. F. Goodrich Company Crosslinkable difunctionalized polyarylene polyethers
US5091480A (en) 1984-03-06 1992-02-25 The B. F. Goodrich Company Comb-like polymers and graft copolymers from polyarylene polyether macromonomers
JPS60224816A (en) 1984-04-20 1985-11-09 Nikkiso Co Ltd Gas-phase production of carbon fiber
US4816289A (en) 1984-04-25 1989-03-28 Asahi Kasei Kogyo Kabushiki Kaisha Process for production of a carbon filament
US4565684A (en) 1984-08-20 1986-01-21 General Motors Corporation Regulation of pyrolysis methane concentration in the manufacture of graphite fibers
US4634742A (en) 1984-11-08 1987-01-06 The B. F. Goodrich Company Polyarylene polyethers with pendant vinyl groups and process for preparation thereof
US4806601A (en) 1984-11-08 1989-02-21 The B. F. Goodrich Company Polyarylene polyethers with pendant vinyl and ethynyl groups and process for preparation thereof
US4663230A (en) 1984-12-06 1987-05-05 Hyperion Catalysis International, Inc. Carbon fibrils, method for producing same and compositions containing same
US5165909A (en) 1984-12-06 1992-11-24 Hyperion Catalysis Int'l., Inc. Carbon fibrils and method for producing same
US4604417A (en) 1984-12-10 1986-08-05 The Goodyear Tire & Rubber Company Polymerizable thioester synergists
CA1285675C (en) 1985-03-25 1991-07-02 Takaaki Sakamoto Method of preparing polyphenylene oxide composition and laminate using the composition
NL8502116A (en) 1985-07-24 1987-02-16 Gen Electric PROCESS FOR PREPARING A POLYMER MIXTURE CONTAINING A POLYPHENYLENE ETHER AND A POLYAMIDE
US4618703A (en) 1985-09-13 1986-10-21 Atlantic Richfield Company Production of the acrylates and methacrylates of oxyalkylated allyl alcohol
US4667185A (en) 1985-12-06 1987-05-19 Minnesota Mining And Manufacturing Company Wireless synchronization system for electronic article surveillance system
US4871816A (en) 1986-03-10 1989-10-03 The B.F. Goodrich Company Triblock polyarylene polyether with polysiloxane segment and impact-improved blends thereof
DE3774521D1 (en) 1986-09-22 1991-12-19 Gen Electric CURABLE COMPOSITIONS OF HARDENED POLYPHENYLENE ETHERS CONTAINING POLYMERS WITH INTERSTRUCTING STRENGTHS, AND METHOD.
DE3706561A1 (en) 1987-02-28 1988-09-08 Basf Ag LIGHT-SENSITIVE RECORDING MATERIAL WITH INCREASED FLEXIBILITY
US4760118A (en) 1987-03-23 1988-07-26 General Electric Company Polyphenylene ether capped with salicylic acid ester
US4816515A (en) 1987-04-13 1989-03-28 General Electric Company Impact modified polyphenylene ether interpolymer resins
CA1336526C (en) 1987-09-09 1995-08-01 Hiroji Oda Cured polyphenylene ether resin and a curable polyphenylene ether resin
DE3813355A1 (en) 1988-04-21 1989-11-02 Huels Chemische Werke Ag FUNCTIONALIZED POLYPHENYLENE ETHER AND METHOD FOR THE PRODUCTION THEREOF
US5219951A (en) 1988-07-07 1993-06-15 Shell Internationale Research Maatschappij B.V. Process for preparation of modified polyphenylene ether or related polymers and the use thereof in modified high temperature rigid polymer of vinyl substituted aromatics
KR0147376B1 (en) 1988-07-07 1998-08-17 오노 알버어스 Process for preparing modified polyphenylene ether and use thereof in modified high temperature hard polymer of vinyl substituted aromatics
US5218030A (en) 1989-02-08 1993-06-08 Asahi Kasei Kogyo Kabushiki Kaisha Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom
US5213886A (en) 1989-02-17 1993-05-25 General Electric Company Curable dielectric polyphenylene ether-polyepoxide compositions
NL8900497A (en) 1989-03-01 1990-10-01 Gen Electric PROCESS FOR PREPARING GRANULES POLYPHENYLENE THERPOLYSTYRENE, FORMED GRANULES.
CA2013041A1 (en) 1989-04-07 1990-10-07 Johannes M. Zijderveld Process for preparation of modified polyphenylene ether or related polymers and the use thereof in modified high temperature rigid polymer of vinyl substituted aromatics
US5171761A (en) 1989-06-02 1992-12-15 Enichem S.P.A. Cross-linkable compositions based on polyphenylene ethers and unsaturated monomers copolymerizable radically
GB8913542D0 (en) 1989-06-13 1989-08-02 Shell Int Research Process for modification of polyphenylene ether or related polymers with a cyclic anhydride and the use thereof in modified,high temperature rigid polymer
US5079268A (en) 1989-06-23 1992-01-07 Shell Research Limited Poly(alkenyl substituted aromatic) and elastomer containing polymer compositions and process for their preparation
NL8902092A (en) 1989-08-18 1991-03-18 Gen Electric MATERIAL BASED ON A POLYPHENYLENE ETHHER PROVIDED WITH POLYMERISABLE END GROUPS.
US5338796A (en) 1990-03-22 1994-08-16 Montedipe S.R.L. Thermoplastic composition based on polyphenylene ether and polyamide
US5024818A (en) 1990-10-09 1991-06-18 General Motors Corporation Apparatus for forming carbon fibers
CN1036402C (en) 1991-01-11 1997-11-12 旭化成工业株式会社 Curable polyphenoxy resin composition and film made therefrom
DE4103140A1 (en) 1991-02-02 1992-08-13 Basf Ag Macro-monomer(s) for prepn. of graft copolymers - partic. omega-(vinyl:benzoyl)-poly-(2,6-di:methyl)-1,4-phenylene] ethers]
NL9100224A (en) 1991-02-08 1992-09-01 Gen Electric PROCESS FOR PREPARING A MIXTURE OF POLYPHENYLENE ETHER AND POLYVINYLAROMATIC COMPOUND.
US5591382A (en) 1993-03-31 1997-01-07 Hyperion Catalysis International Inc. High strength conductive polymers
US5407972A (en) 1993-08-02 1995-04-18 Sunrez Corp. Photocurable ethylenically unsaturated sulfide and polysulfide polymer compositions
JPH08245872A (en) 1995-03-08 1996-09-24 Asahi Chem Ind Co Ltd Polyphenylene ether resin composition with low permittivity and low loss tangent
US5965663A (en) 1995-06-06 1999-10-12 Kabushiki Kaisha Toshiba Resin composition and resin-molded type semiconductor device
DE69631573T2 (en) 1995-10-16 2004-12-16 Sumitomo Chemical Co., Ltd. Prepreg, process for its manufacture and printed circuit board substrate using the same
EP0831119A2 (en) 1996-09-18 1998-03-25 Daicel Chemical Industries, Ltd. Corsslinkable polymer composition, molded article therefrom, process for the preparation thereof, crosslinked nonwoven cloth, and process for the preparation thereof
US5834565A (en) 1996-11-12 1998-11-10 General Electric Company Curable polyphenylene ether-thermosetting resin composition and process
US6352782B2 (en) 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US6306963B1 (en) 2000-05-08 2001-10-23 General Electric Co. Thermosetting resins and laminates
US6384176B1 (en) 2000-07-10 2002-05-07 General Electric Co. Composition and process for the manufacture of functionalized polyphenylene ether resins
TWI254054B (en) 2000-12-19 2006-05-01 Ind Tech Res Inst Curable polyphenylene ether resin, composition made therefrom, and process for preparing the resin

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