BE711119A - - Google Patents

Info

Publication number
BE711119A
BE711119A BE711119DA BE711119A BE 711119 A BE711119 A BE 711119A BE 711119D A BE711119D A BE 711119DA BE 711119 A BE711119 A BE 711119A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE711119A publication Critical patent/BE711119A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/132Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C29/00Joining metals with the aid of glass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211Contact or terminal manufacturing by assembling plural parts with bonding of fused material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
BE711119D 1967-02-23 1968-02-21 BE711119A ( )

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR96270A FR1519854A (fr) 1967-02-23 1967-02-23 Embase composite, notamment pour dispositif semi-conducteur

Publications (1)

Publication Number Publication Date
BE711119A true BE711119A ( ) 1968-08-21

Family

ID=8625839

Family Applications (1)

Application Number Title Priority Date Filing Date
BE711119D BE711119A ( ) 1967-02-23 1968-02-21

Country Status (5)

Country Link
US (1) US3528102A ( )
BE (1) BE711119A ( )
DE (1) DE1639357A1 ( )
FR (1) FR1519854A ( )
GB (1) GB1215535A ( )

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6903229A ( ) * 1969-03-01 1970-09-03
GB1331980A (en) * 1970-12-15 1973-09-26 Mullard Ltd Mounting semiconductor bodies
US3775645A (en) * 1972-08-08 1973-11-27 T Mccarthy Header assembly
US4820659A (en) * 1986-07-16 1989-04-11 General Electric Company Method of making a semiconductor device assembly
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
KR20150002077A (ko) * 2013-06-28 2015-01-07 삼성전자주식회사 파워 반도체 모듈
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2975928A (en) * 1956-11-23 1961-03-21 Philips Corp Method of joining two metal parts in a vacuum-tight manner and object manufactured by the use of such method
US3119052A (en) * 1959-11-24 1964-01-21 Nippon Electric Co Enclosures for semi-conductor electronic elements
US3219748A (en) * 1961-12-04 1965-11-23 Motorola Inc Semiconductor device with cold welded package and method of sealing the same
US3258662A (en) * 1963-05-10 1966-06-28 International Telephone And Telegraph Corporation Semiconductor housing
US3419763A (en) * 1966-10-31 1968-12-31 Itt High power transistor structure

Also Published As

Publication number Publication date
GB1215535A (en) 1970-12-09
FR1519854A (fr) 1968-04-05
DE1639357A1 (de) 1971-02-04
US3528102A (en) 1970-09-08

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