BE762282A - METHOD FOR MANUFACTURING A SEMICONDUCTOR ELEMENT - Google Patents

METHOD FOR MANUFACTURING A SEMICONDUCTOR ELEMENT

Info

Publication number
BE762282A
BE762282A BE762282A BE762282A BE762282A BE 762282 A BE762282 A BE 762282A BE 762282 A BE762282 A BE 762282A BE 762282 A BE762282 A BE 762282A BE 762282 A BE762282 A BE 762282A
Authority
BE
Belgium
Prior art keywords
manufacturing
semiconductor element
semiconductor
Prior art date
Application number
BE762282A
Other languages
French (fr)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE762282A publication Critical patent/BE762282A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
BE762282A 1970-01-30 1971-01-29 METHOD FOR MANUFACTURING A SEMICONDUCTOR ELEMENT BE762282A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19702004320 DE2004320A1 (en) 1970-01-30 1970-01-30 Method for producing a semiconductor component
FR7102793A FR2077409A1 (en) 1970-01-30 1971-01-28

Publications (1)

Publication Number Publication Date
BE762282A true BE762282A (en) 1971-07-29

Family

ID=25758573

Family Applications (1)

Application Number Title Priority Date Filing Date
BE762282A BE762282A (en) 1970-01-30 1971-01-29 METHOD FOR MANUFACTURING A SEMICONDUCTOR ELEMENT

Country Status (6)

Country Link
BE (1) BE762282A (en)
CH (1) CH512823A (en)
DE (1) DE2004320A1 (en)
FR (1) FR2077409A1 (en)
GB (1) GB1279585A (en)
NL (1) NL7101226A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2511210C3 (en) * 1975-03-14 1980-03-06 Brown, Boveri & Cie Ag, 6800 Mannheim Method and device for dip soldering of semiconductor components

Also Published As

Publication number Publication date
FR2077409A1 (en) 1971-10-22
GB1279585A (en) 1972-06-28
DE2004320A1 (en) 1971-08-05
CH512823A (en) 1971-09-15
NL7101226A (en) 1971-08-03

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