CA2532215A1 - Heat-curable compositions comprising low-temperature impact strength modifiers - Google Patents
Heat-curable compositions comprising low-temperature impact strength modifiers Download PDFInfo
- Publication number
- CA2532215A1 CA2532215A1 CA002532215A CA2532215A CA2532215A1 CA 2532215 A1 CA2532215 A1 CA 2532215A1 CA 002532215 A CA002532215 A CA 002532215A CA 2532215 A CA2532215 A CA 2532215A CA 2532215 A1 CA2532215 A1 CA 2532215A1
- Authority
- CA
- Canada
- Prior art keywords
- composition
- weight
- groups
- epoxide
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 103
- 239000003607 modifier Substances 0.000 title claims abstract description 17
- 150000002118 epoxides Chemical group 0.000 claims abstract description 75
- 229920000642 polymer Polymers 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 42
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 15
- 150000003672 ureas Chemical class 0.000 claims abstract description 14
- 239000012876 carrier material Substances 0.000 claims abstract description 10
- -1 cycloaliphatic Chemical group 0.000 claims description 35
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 24
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 24
- 229920013730 reactive polymer Polymers 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 21
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 20
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims description 19
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 16
- 235000013824 polyphenols Nutrition 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 229920005862 polyol Polymers 0.000 claims description 15
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 14
- 125000005442 diisocyanate group Chemical group 0.000 claims description 14
- 239000005056 polyisocyanate Substances 0.000 claims description 14
- 229920001228 polyisocyanate Polymers 0.000 claims description 14
- 150000003077 polyols Chemical class 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 238000010276 construction Methods 0.000 claims description 13
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 13
- 150000003254 radicals Chemical class 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 11
- 229920001451 polypropylene glycol Polymers 0.000 claims description 10
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 claims description 9
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical group C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 8
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 8
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 7
- 239000000194 fatty acid Substances 0.000 claims description 7
- 229930195729 fatty acid Natural products 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 6
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 claims description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 6
- 239000003085 diluting agent Substances 0.000 claims description 6
- 150000004665 fatty acids Chemical class 0.000 claims description 6
- 229920001748 polybutylene Polymers 0.000 claims description 6
- 150000003573 thiols Chemical group 0.000 claims description 6
- 239000000470 constituent Substances 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 229920000768 polyamine Polymers 0.000 claims description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 5
- MYEWQUYMRFSJHT-UHFFFAOYSA-N 2-(2-aminophenyl)sulfonylaniline Chemical class NC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1N MYEWQUYMRFSJHT-UHFFFAOYSA-N 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical class C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 claims description 4
- 229920005906 polyester polyol Polymers 0.000 claims description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- RGCKGOZRHPZPFP-UHFFFAOYSA-N Alizarin Natural products C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 claims description 3
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 claims description 3
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 claims description 3
- KKZJGLLVHKMTCM-UHFFFAOYSA-N mitoxantrone Chemical compound O=C1C2=C(O)C=CC(O)=C2C(=O)C2=C1C(NCCNCCO)=CC=C2NCCNCCO KKZJGLLVHKMTCM-UHFFFAOYSA-N 0.000 claims description 3
- 229960001156 mitoxantrone Drugs 0.000 claims description 3
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 claims description 3
- XOOMNEFVDUTJPP-UHFFFAOYSA-N naphthalene-1,3-diol Chemical compound C1=CC=CC2=CC(O)=CC(O)=C21 XOOMNEFVDUTJPP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 3
- WWCSTJWKTAXUGJ-UHFFFAOYSA-N 1943-97-1 Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C(C2C3CCC2)CC3C1 WWCSTJWKTAXUGJ-UHFFFAOYSA-N 0.000 claims description 2
- HAMNKKUPIHEESI-UHFFFAOYSA-N aminoguanidine Chemical class NNC(N)=N HAMNKKUPIHEESI-UHFFFAOYSA-N 0.000 claims description 2
- 150000005840 aryl radicals Chemical class 0.000 claims description 2
- 150000002357 guanidines Chemical class 0.000 claims description 2
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 2
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 2
- WJIOHMVWGVGWJW-UHFFFAOYSA-N 3-methyl-n-[4-[(3-methylpyrazole-1-carbonyl)amino]butyl]pyrazole-1-carboxamide Chemical compound N1=C(C)C=CN1C(=O)NCCCCNC(=O)N1N=C(C)C=C1 WJIOHMVWGVGWJW-UHFFFAOYSA-N 0.000 claims 1
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 claims 1
- 125000003107 substituted aryl group Chemical group 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- 239000004609 Impact Modifier Substances 0.000 description 7
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 7
- 150000001298 alcohols Chemical class 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 150000002170 ethers Chemical class 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 4
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229920003051 synthetic elastomer Polymers 0.000 description 4
- 239000005061 synthetic rubber Substances 0.000 description 4
- 239000003981 vehicle Substances 0.000 description 4
- JTINZFQXZLCHNS-UHFFFAOYSA-N 2,2-bis(oxiran-2-ylmethoxymethyl)butan-1-ol Chemical compound C1OC1COCC(CO)(CC)COCC1CO1 JTINZFQXZLCHNS-UHFFFAOYSA-N 0.000 description 3
- 229910001335 Galvanized steel Inorganic materials 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
- 150000001896 cresols Chemical class 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000008397 galvanized steel Substances 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 230000007017 scission Effects 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- HSDVRWZKEDRBAG-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COC(CCCCC)OCC1CO1 HSDVRWZKEDRBAG-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 2
- OAMHYUFAZBQLPK-UHFFFAOYSA-N 5,6-di(propan-2-ylidene)cyclohexa-1,3-diene Chemical compound CC(C)=C1C=CC=CC1=C(C)C OAMHYUFAZBQLPK-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 229920013646 Hycar Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- GAFWRUXZGSUTHS-UHFFFAOYSA-N (3-chloro-4-methylphenyl)urea Chemical compound CC1=CC=C(NC(N)=O)C=C1Cl GAFWRUXZGSUTHS-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- IBVPVTPPYGGAEL-UHFFFAOYSA-N 1,3-bis(prop-1-en-2-yl)benzene Chemical compound CC(=C)C1=CC=CC(C(C)=C)=C1 IBVPVTPPYGGAEL-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- OQILSTRGJVCFAG-UHFFFAOYSA-N 1-(oxiran-2-ylmethoxy)butan-1-ol Chemical compound CCCC(O)OCC1CO1 OQILSTRGJVCFAG-UHFFFAOYSA-N 0.000 description 1
- CDVGOPJOZUAFPX-UHFFFAOYSA-N 1-(oxiran-2-ylmethoxy)hexan-1-ol Chemical compound CCCCCC(O)OCC1CO1 CDVGOPJOZUAFPX-UHFFFAOYSA-N 0.000 description 1
- YKPXTMAQTAVHDA-UHFFFAOYSA-N 1-methylcyclohexa-3,5-diene-1,3-diol Chemical compound CC1(O)CC(O)=CC=C1 YKPXTMAQTAVHDA-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- SCZZNWQQCGSWSZ-UHFFFAOYSA-N 1-prop-2-enoxy-4-[2-(4-prop-2-enoxyphenyl)propan-2-yl]benzene Chemical compound C=1C=C(OCC=C)C=CC=1C(C)(C)C1=CC=C(OCC=C)C=C1 SCZZNWQQCGSWSZ-UHFFFAOYSA-N 0.000 description 1
- PQXKWPLDPFFDJP-UHFFFAOYSA-N 2,3-dimethyloxirane Chemical compound CC1OC1C PQXKWPLDPFFDJP-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- JPEGUDKOYOIOOP-UHFFFAOYSA-N 2-(hexoxymethyl)oxirane Chemical compound CCCCCCOCC1CO1 JPEGUDKOYOIOOP-UHFFFAOYSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- RUGWIVARLJMKDM-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)furan Chemical compound C1OC1COCC1=CC=CO1 RUGWIVARLJMKDM-UHFFFAOYSA-N 0.000 description 1
- GNNHGXRETBSBMR-UHFFFAOYSA-N 2-(pentadec-3-enoxymethyl)oxirane Chemical compound CCCCCCCCCCCC=CCCOCC1CO1 GNNHGXRETBSBMR-UHFFFAOYSA-N 0.000 description 1
- SFJRUJUEMVAZLM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxymethyl]oxirane Chemical compound CC(C)(C)OCC1CO1 SFJRUJUEMVAZLM-UHFFFAOYSA-N 0.000 description 1
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- FOLVZNOYNJFEBK-UHFFFAOYSA-N 3,5-bis(isocyanatomethyl)bicyclo[2.2.1]heptane Chemical compound C1C(CN=C=O)C2C(CN=C=O)CC1C2 FOLVZNOYNJFEBK-UHFFFAOYSA-N 0.000 description 1
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical class OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- CDBAMNGURPMUTG-UHFFFAOYSA-N 4-[2-(4-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1C(C)(C)C1CCC(O)CC1 CDBAMNGURPMUTG-UHFFFAOYSA-N 0.000 description 1
- MGPOZFJWYRNWBH-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-6-ylmethanol Chemical compound C1CCCC2OC21CO MGPOZFJWYRNWBH-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 101100451537 Caenorhabditis elegans hsd-1 gene Proteins 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000005510 Diuron Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 229920005863 Lupranol® Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 239000011952 anionic catalyst Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001564 chemical vapour infiltration Methods 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- JXCGFZXSOMJFOA-UHFFFAOYSA-N chlorotoluron Chemical compound CN(C)C(=O)NC1=CC=C(C)C(Cl)=C1 JXCGFZXSOMJFOA-UHFFFAOYSA-N 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- GNBHRKFJIUUOQI-UHFFFAOYSA-N fluorescein Chemical compound O1C(=O)C2=CC=CC=C2C21C1=CC=C(O)C=C1OC1=CC(O)=CC=C21 GNBHRKFJIUUOQI-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003976 glyceryl group Chemical group [H]C([*])([H])C(O[H])([H])C(O[H])([H])[H] 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002390 heteroarenes Chemical class 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000000589 high-performance liquid chromatography-mass spectrometry Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- TWXDDNPPQUTEOV-FVGYRXGTSA-N methamphetamine hydrochloride Chemical compound Cl.CN[C@@H](C)CC1=CC=CC=C1 TWXDDNPPQUTEOV-FVGYRXGTSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- CLCWCGOCHZSFQE-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)cyclohexanamine Chemical compound C1OC1CN(C1CCCCC1)CC1CO1 CLCWCGOCHZSFQE-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229940117969 neopentyl glycol Drugs 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000012038 nucleophile Substances 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- QQWAKSKPSOFJFF-UHFFFAOYSA-N oxiran-2-ylmethyl 2,2-dimethyloctanoate Chemical compound CCCCCCC(C)(C)C(=O)OCC1CO1 QQWAKSKPSOFJFF-UHFFFAOYSA-N 0.000 description 1
- XRQKARZTFMEBBY-UHFFFAOYSA-N oxiran-2-ylmethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC1CO1 XRQKARZTFMEBBY-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 125000005506 phthalide group Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- XFVUECRWXACELC-UHFFFAOYSA-N trimethyl oxiran-2-ylmethyl silicate Chemical compound CO[Si](OC)(OC)OCC1CO1 XFVUECRWXACELC-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to compositions containing at least one epoxide adduct A
that comprises an average of more than one epoxide group per molecule, at least one polymer B of formula (I), at least one thixotropic agent C based on a urea derivative in a non-diffusing carrier material, and at least one hardener D for epoxy resins, which is activated at an increased temperature.
Said composition is used particularly as an adhesive and is provided with exceptionally high impact peel characteristics, especially at low temperatures. The invention further relates to epoxide group-terminal impact strength modifiers of formula (I), which significantly increase the impact resistance in epoxy resin compositions, particularly two-component epoxy resin compositions.
that comprises an average of more than one epoxide group per molecule, at least one polymer B of formula (I), at least one thixotropic agent C based on a urea derivative in a non-diffusing carrier material, and at least one hardener D for epoxy resins, which is activated at an increased temperature.
Said composition is used particularly as an adhesive and is provided with exceptionally high impact peel characteristics, especially at low temperatures. The invention further relates to epoxide group-terminal impact strength modifiers of formula (I), which significantly increase the impact resistance in epoxy resin compositions, particularly two-component epoxy resin compositions.
Description
HEAT-CURABLE COMPOSITIONS COMPRISING LOW-TEMPERATURE
IMPACT STRENGTH MODIFIERS
Field of the invention The invention relates to heat-curable compositions which simultaneously 1o have high impact strength and good mechanical properties at low temperatures down to -40°C and in particular can be used as one-component adhesives, and impact strength modifiers for epoxy resins at low temperatures.
Description of the prior art In the manufacture of both vehicles and add-on parts or machines and devices, high-quality adhesives are more and more frequently being used instead of or in combination with conventional joining methods, such as 2 o screwing, riveting, punching or welding. This gives rise to advantages and new possibilities in manufacture, for example the manufacture of composite and hybrid materials, or greater freedom in the design of components. For an application in vehicle manufacture, the adhesives must have good adhesion to all substrates used, in particular electrolytically galvanized, hot-galvanized and subsequently phosphated steel sheets, oiled steel sheets and various, optionally surface-treated, aluminum alloys. These good adhesion properties must be maintained in particular even after aging (alternating climatic conditions, salt spray baths, etc.) without major deterioration in quality. If the adhesives are used as body-shell construction 3 o adhesives in automotive construction, the stability of these adhesives to cleaning baths and dip coating (so-called washout stability) is of major importance in order to be able to guarantee the manufacturer's process reliability.
3 5 The adhesives for body-shell construction must cure under the conventional baking conditions of, ideally, 30 min at 180°C.
Furthermore, however, they must also be stable up to about 220°C. Further requirements for such a cured adhesive or the adhesive bond include the assurance of _ 2 _ operational reliability both at high temperatures up to about 90°C and at low temperatures down to about -40°C. Since these adhesives are structural adhesives and these adhesives therefore adhesively bond structural parts, high strength and impact strength of the adhesive are of the greatest importance.
It is true that conventional epoxy adhesives are distinguished by high mechanical strength, in particular high tensile strength. However, when the adhesive bond is subjected to impact, classical epoxy adhesives are generally too brittle and are therefore far from able to satisfy the requirements, in particular of the automotive industry, under crash conditions under which both great tensile stresses and cleavage stresses occur. In this respect, in particular the strengths at high temperatures, but in particular at low temperatures (< -10°C), are often insufficient.
The literature proposes substantially two methods for being able to reduce the brittleness of epoxy adhesives and hence being able to increase the impact strength: firstly, the aim can be achieved by the admixing of at least partly crosslinked high molecular weight compounds, such as latices of 2o core-shell polymers or other flexibilizing polymers and copolymers.
Secondly, a certain increase in strength can also be achieved by introducing flexible segments, for example by the corresponding modification of the epoxide components.
According to the first-mentioned technique corresponding to the teaching in the patent US 5,290,857, epoxy resins can be made more impact-resistant by mixing a fine, pulverulent core-shell polymer into the epoxide matrix. As a result, highly resilient domains which increase the impact strength form in the rigid brittle epoxide matrix. Such core-shell polymers are described in 3 o US Patent 5,290,857 and are based on acrylate or methacrylate polymers.
According to the second-mentioned technique, epoxy resin compositions are described in US Patent 4,952,645, which compositions have been flexibilized by the reaction with aliphatic, cycloaliphatic or aromatic 3 5 carboxylic acids, in particular di- or trimeric fatty acids, and with carboxylic acid-terminated aliphatic or cycloaliphatic diols. Such compositions are said to be distinguished by an increased flexibility in particular at low temperatures.
' - 3 -EP 0 343 676 describes a reactive hotmelt epoxy adhesive comprising a polyurethane-epoxide adduct. The terminal isocyanate groups of prepolymers are reacted with at least one epoxy resin containing hydroxyl groups and having an OH functionality greater than 2, so that a hotmelt adhesive which is solid at room temperature is obtained.
It is also known that epoxy resins can be flexibilized with reactive elastomers, such as, for example, synthetic rubbers and derivatives thereof. The main effect in relation to the imparting of tough and resilient properties is based on the only partial miscibility of the epoxy resins and the corresponding derivatized synthetic rubbers, with the result that heterodisperse phases which have an effect comparable to the core-shell polymer form in the production process. However, the establishment of this superstructure is very dependent both on the quantitative composition and on the procedure during the curing process. The result of this is that a continuous constant quality is very difficult to achieve.
Elastomers which have terminal phenol groups and are prepared by 2 o reacting isocyanate-terminated prepolymers with a large excess of bisphenols are described in EP 0307666 A1 as being particularly advantageous for the impact strength modification of epoxy resins. The high phenol content, which has an adverse effect on the storage stability of the formulated system and can lead to expulsion of gases during the curing 2 5 at 180°C, is disadvantageous for the formulation with epoxides.
In general, latent curing agents, such as dicyandiamide, are used for the high-temperature curing of the epoxy resins described above. High-temperature curing by means of phenol curing agents, such as bisphenols 3 o or novolaks, is also known. They lead to advantageously cured adhesives having high glass transition temperatures but are under discussion because of ecological aspects.
Summary of the invention It is the object of the present invention to provide novel impact strength modifiers for epoxy resin compositions, which modifiers contain in particular no free phenol and are suitable for use at low temperatures, in particular temperatures lower than -20°C. These impact strength modifiers should preferably be suitable as a component of one-component and heat-curable compositions stable at room temperature, in particular adhesives and hotmelt adhesives.
Surprisingly, it has been found that this can be achieved by the use of polymeric compounds terminated with epoxide groups and of the general formula (I):
O
Y N O~Y (I) m O
n 1o in which Y~ is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups and Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups, and n is 2, 3 or 4, and m is 1, 2 or 3. The polymer of the formula (I) additionally has at least one aromatic structural element which is bound in the polymer chain via urethane groups.
It has been found that this polymer of the formula (I) is a good impact 2 0 strength modifier.
A particular aspect of the invention is a composition which comprises at least one epoxide adduct A having on average more than one epoxide group per molecule and at least one polymer B of the formula (I) and at least one thixotropic agent C based on a urea derivative in a nondiffusing carrier material and at least one curing agent D for epoxy resins which is activated by elevated temperature.
This composition serves in particular as an adhesive and has an extremely 3 o high dynamic resistance to cleavage, in particular at low temperatures.
According to preferred embodiments, compositions which additionally ' - 5 -comprise at least one filler E and/or at least one reactive diluent F are furthermore described.
The invention furthermore relates to impact strength modifiers of the formula (I) which are terminated with epoxide groups. It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular 1-component heat-curable epoxy resin compositions and in 2-component epoxy resin compositions.
Description of the preferred embodiments The present invention relates to compositions which comprise at least one epoxide adduct A having on average more than one epoxide group per i5 molecule, at least one polymer B of the formula (I), at least one thixotropic agent C based on a urea derivative in a non-diffusing carrier material and at least one curing agent D for epoxy resins which is activated by elevated temperature.
2 o The epoxide adduct A is an epoxide adduct A1 or an epoxide adduct A2.
The epoxide adduct A1 is obtainable from the reaction of at least one dicarboxylic acid and at least one diglycidyl ether. The epoxide adduct A2 is obtainable from the reaction of at least one bis(aminophenyl) sulfone 25 isomer or of at least one aromatic alcohol and at least one diglycidyl ether.
The dicarboxylic acid used for the preparation of the epoxide adduct A1 is preferably a dimeric fatty acid. Dimeric C4-C2o fatty acids which are C8-C4o dicarboxylic acids have been found to be particularly suitable.
The diglycidyl ethers are preferably a liquid resin, in particular diglycidyl ether of bisphenol A (DGEBA), of bisphenol F and of bisphenol A/F (the designation "A/F" refers here to a mixture of acetone with formaldehyde, which is used as a starting material in the preparation thereof). Owing to 3 5 the processes for the preparation of these resins, it is clear that the liquid resins also contain higher molecular weight components. Such liquid resins are obtainable, for example, as Araldite GY 250, Araldite PY 304, Araldit GY 282 (Vantico) or D.E.R 331 (Dow).
' - 6 -The epoxide adduct A1 has a flexibilizing character.
The epoxide adduct A2 is obtainable by the reaction of at least one bis(aminophenyl) sulfone isomer or at least one aromatic alcohol with at least one diglycidyl ether. The aromatic alcohol is preferably selected from the group consisting of 2,2-bis(4-hydroxyphenyl)propane (= bisphenol A), bis(4-hydrocyphenyl)methane (= bisphenol F), bis(4-hydroxyphenyl) sulfone (bisphenol S), hydroquinone, resorcinol, pyrocatechol, naphthoquinone, naphthoresorcinol, dihydroxynaphthalene, dihydroxyanthraquinone, dihydroxybiphenyl, 3,3-bis(p-hydroxyphenyl)phthalides, 5,5-bis(4-hydroxyphenyl)hexahydro-4,7-methanoindane, 4,4'-(bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)] (= bisphenol M), 4,4'-[bis(hydroxyphenyl)-1,4-phenylenebis(1-methylethylidene)] (= bisphenol P) and all isomers of the abovementioned compounds. Bis(4-hydroxyphenyl) sulfone is suitable as a particularly preferred aromatic alcohol.
The preferred bis(aminophenyl) sulfone isomers are bis(4,-aminophenyl) sulfone and bis(3-aminophenyl) sulfone.
The preferred diglycidyl ethers are the diglycidyl ethers already described for epoxide adduct A1.
The epoxide adduct A2 tends to have a rigid structure.
The simultaneous presence of epoxide adduct A1 and epoxide adduct A2 in compositions as claimed in claim 1 is particularly preferred.
The epoxide adduct A preferably has a molecular weight of 700 -6000 Dalton, preferably 900 - 4000 Dalton, in particular 1000 - 3300 Dalton.
"Molecular weight" or "molar weight" is understood here and below as meaning the average molecular weight M~.
The epoxide adduct A is prepared in a manner known to the person skilled in the art. Advantageously, an additional amount of the diglycidyl ether or ethers used for the adduct formation is added at the end of the adduct formation and is used as epoxide adduct A premix. In this epoxide adduct _ 7 _ A premix, the total proportion of the unreacted diglycidyl ether or ethers is 12 - 50% by weight, preferably 17 - 45% by weight, based on the total weight of the epoxide adduct A premix.
"Total proportion" is understood here and below as meaning in each case the sum of all components belonging to this category. If, for example, two different diglycidyl ethers occur simultaneously in the adduct formation, the total proportion of the diglycidyl ethers is to be understood as meaning the sum of these two diglycidyl ethers.
Furthermore, the proportion by weight of the epoxide adduct A premix is advantageously 20 - 70% by weight, preferably 35 - 65% by weight, based on the weight of the total composition.
The polymer B can be represented by formula (I) O
Y N O~Y (I) m O
n In formula (I), Y~ is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups, and Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups. Furthermore, the indices n are 2, 3 or 4 and the indices m are 1, 2 or 3. In addition, the polymer B has at least one aromatic structural element which is bound in the polymer chain via urethane groups.
The polymer B of the formula (I) is obtainable, for example, by the reaction of a monohydroxy-epoxide compound of the formula (II) and of a linear or branched polyurethane prepolymer terminated with isocyanates groups and of the formula (III):
_ g _ HO~Y O (1l) 2 m NCO (III) n For the preparation of the polyurethane prepolymer of the formula (III), at least one polyisocyanate, at least one polyphenol and at least one isocyanate-reactive polymer are used.
In the entire present document, the prefix "poly" in "polyisocyanate", "polyol", "polyphenol" and "polymercaptan" designates molecules which formally contain two or more of the respective functional groups.
1o Diisocyanates, triisocyanates or tetraisocyanates, in particular di- or triisocyanates, are suitable as the polyisocyanate. Diisocyanates are preferred.
Suitable diisocyanates are aliphatic, cycloaliphatic, aromatic or araliphatic diisocyanates, in particular commercially available products, such as methylenediphenyl diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), tolidine diisocyanate (TODD, isophorone diisocyanate (IPDI), trimethylhexamethylene diisocyanate (TMDI), 2,5- or 2,6-bis(isocyanatomethyl)bicyclo[2.2.1]heptane, 1,5-naphthalene diisocyanate (NDI), dicyclohexylmethyl diisocyanate (H~2MD1), p-phenylene diisocyanate (PPDI), m-tetramethylxylylene diisocyanate (TMXDI), etc. and the dimers thereof. HDI, IPDI, TMDI, MDI or TDI are preferred.
Suitable triisocyanates are in particular trimers or biurets of aliphatic, cycloaliphatic, aromatic or araliphatic diisocyanates, in particular the isocyanurates and biurets of the diisocyanates described in the preceding paragraph.
Particularly suitable polyphenols are bis-, tris- and tetraphenols. These are 3 o understood as meaning not only pure phenols but optionally also g _ substituted phenols. The type of substitution may be very varied. In particular, this is understood as meaning substitution directly on the aromatic nucleus to which the phenolic OH group is attached. Phenols are furthermore understood as meaning not only mononuclear aromatics but also polynuclear or fused aromatics or heteroaromatics which have the phenolic OH group directly on the aromatic or heteroaromatic.
Inter alia, the reaction with isocyanates which is required for the formation of polyurethane prepolymers of the formula (III) is influenced by the type and position of such a substituent.
The bis- and triphenols are particularly suitable. Suitable bisphenols or trisphenols are, for example, 1,4-dihydroxybenzene, 1,3-dihydroxybenzene, 1,2-dihydroxybenzene, 1,3-dihydroxytoluene, 3,5-dihydroxybenzoates, 2,2-bis(4-hydroxyphenyl)propane (= bisphenol A), bis(4-hydroxyphenyl)methane (= bisphenol F), bis(4-hydroxyphenyl) sulfone (= bisphenol S), naphthoresorcinol, dihydroxynaphthalene, dihydroxy-anthraquinone, dihydroxybiphenyl, 3,3-bis(p-hydroxyphenyl)phthalides, 5,5-bis(4-hydroxyphenyl)hexahydro-4,7-methanoindane, phenolphthalein, fluorescein, 4,4'-[bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)]
(= bisphenol M), 4,4'-[bis-(hydroxyphenyl)-1,4-phenylenebis(1-methylethylidene)] (= bisphenol P), o,o-diallylbisphenol A, diphenols and dicresols prepared by reacting phenols or cresols with diisopropylidenebenzene, phloroglucinol, gallic ester, phenol novolaks or cresol novolaks having an -OH functionality of from 2.0 to 3.5 and all isomers of the abovementioned compounds.
Preferred diphenols and dicresols prepared by reacting phenols or cresols with diisopropylidenebenzene have a chemical structural formula as shown 3 o below for cresols as an example:
OH
OH
HO
Sparingly volatile bisphenols are particularly prefer-ed. Bisphenol M and bisphenol S are most preferred.
Furthermore, at least one isocyanate-reacting prepolymer is used for the preparation of the polyurethane prepolymer of the formula (III). This isocyanate-reactive polymer has isocyanate-reactive groups which are preferably amino, thiol or hydroxyl groups. These isocyanate-reactive polymers advantageously have an equivalent weight of 600 - 6000, in particular of 600 - 4000, preferably of 700 - 2200, g/equivalent of NCO-reactive groups.
In particular, these isocyanate-reactive polymers are polyols, for example the following commercially available polyols or any desired mixtures thereof:
- Polyoxyalkylene polyols, also referred to as polyetherpolyols, i5 which are the polymerization product of ethylene oxide, 1,2-propylene oxide, 1,2- or 2,3-butylene oxide, tetrahydrofuran or mixtures thereof, optionally polymerized with the aid of an initiator molecule having two or three active H atoms, such as, for example, water or compounds having two or three OH groups. It is possible to use both polyoxyalkylenepolyols 2 o which have a low degree of unsaturation (measured according to ASTM D-2849-69 and stated in milliequivalents of unsaturation per gram of polyol (meq/g)), prepared, for example, with the aid of so-called double metal cyanide complex catalysts (DMC catalysts for short), and polyoxyalkylenepolyols having a higher degree of unsaturation, prepared, 25 for example, with the aid of anionic catalysts, such as NaOH, KOH or alkali metal alcoholates. Especially suitable are polyoxypropylenediols and -triols having a degree of unsaturation of less than 0.02 meq/g and having a molecular weight in the range of 1000 - 30 000 Dalton, polyoxybutylenediols and triols, polyoxypropylenediols and -triols having a 30 molecular weight of 400 - 8000 Dalton, and so-called "EO-endcapped"
(ethylene oxide-endcapped) polyoxypropylenediols or -triols. The latter are special polyoxypropylenepolyoxyethylenepolyols which are obtained, for example, by a method in which pure polyoxypropylenepolyols are alkoxylated with ethylene oxide after the end of the polypropoxylation and 35 thus have primary hydroxyl groups.
- Polyhydroxy-terminated polybutadienepolyols, such as, for example, those which are prepared by a polymerization of 1,3-butadiene and allyl alcohol;
- styrene-acrylonitrile-grafted polyetherpolyols, as supplied, for example, by Bayer under the name Lupranol;
- polyhydroxy-terminated acrylonitrile/polybutadiene copolymers, as can be prepared, for example, from carboxyl-terminated acrylonitrile/polybutadiene copolymers (commercially available under the name Hycar~ CTBN from Hanse Chemie AG, Germany) and epoxides or from amino alcohols;
- polyesterpolyols prepared, for example, from dihydric to trihydric alcohols, such as, for example, 1,2-ethanediol, diethylene glycol, 1,2 propanediol, dipropylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6 hexanediol, neopentylglycol, glycerol, 1,1,1-trimethylolpropane or mixtures of the abovementioned alcohols, with organic dicarboxylic acids or anhydrides or esters thereof, such as, for example, succinic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, dodecanedicarboxylic acid, malefic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid and hexahydrophthalic acid or mixtures of the abovementioned acids, and polyesterpolyols obtained from lactones, such as, for example, E-caprolactone;
- polycarbonatepolyols, as are obtainable by reacting, for 2 o example, the abovementioned alcohols - used for the synthesis of the polyesterpolyols - the dialkyl carbonates, diaryl carbonates or phosgene.
The isocyanate-reactive polymers are advantageously difunctional or higher-functional polyols having OH equivalent weights of from 600 to 2 5 6000 g/OH equivalent, in particular from 600 to 4000 g/OH equivalent, preferably 700 - 2200 g/OH equivalent. Furthermore advantageous are the polyols selected from the group consisting of polyethylene glycols, polypropylene glycols, polyethylene glycol/polypropylene glycol block copolymers, polybutylene glycols, hydroxyl-terminated polybutadienes, 3 o hydroxyl-terminated butadiene-co-acrylonitriles, hydroxyl-terminated synthetic rubbers and mixtures of these stated polyols.
Furthermore, polyethylene ethers, polypropylene ethers, polybutylene ethers, polybutadienes and polybutadiene/ acrylonitriles terminated with 3 5 difunctional or higher-functional amines, as sold, for example, the under the name Hycar~ CTBN by Hanse Chemie AG, Germany, and further amine-terminated synthetic rubbers or mixtures of said components can also be used as isocyanate-reactive polymers.
. _ 12 _ It is furthermore possible that isocyanate-reactive polymers may also be chain-extended, as can be prepared in the manner known to the person skilled in the art from the reaction of polyamines, polyols and polyisocyanates, in particular from diamines, diols and diisocyanates.
Preferred isocyanate-reactive polymers are polyols having molecular weights of from 600 to 6000 Dalton, selected from the group consisting of polyethylene glycols, polypropylene glycols, polyethylene 1o glycol/polypropylene glycol block polymers, polybutylene glycols, hydroxyl-terminated polybutadienes, hydroxyl-terminated polybutadiene/ acrylonitrile copolymers and mixtures thereof.
Particularly preferred isocyanate-reactive polymers are a,w-polyalkylene glycols having C2-C6-alkylene groups or having mixed C2-Cs-alkylene groups, which are terminated with amino, thiol or, preferably, hydroxyl groups. Polypropylene glycol or polybutylene glycol are particularly preferred.
2o Various possibilities are available for the preparation of the polyurethane prepolymer of the formula (III) from at least one polyisocyanate, at least one polyphenol and at least one isocyanate-reactive polymer.
In a first process, referred to as "one-pot process", a mixture of at least one 2 5 polyphenol and at least one isocyanate-reactive polymer is reacted with at least one polyisocyanate in an excess of isocyanate.
In a second process, referred to as "2-step process I", at least one polyphenol is reacted with at least one polyisocyanate in an excess of 3 o isocyanate and then reacted with less than the stoichiometric amount of at least one isocyanate-reactive polymer.
Finally, in the third process, referred to as "2-step process II", with at least one isocyanate-reactive polymer is reacted with a polyisocyanate in an 3 5 excess of isocyanate and then with less than the stoichiometric amount of at least one polyphenol.
The three processes lead to isocyanate-terminated polyurethane prepolymers of the formula (III) which, with the same composition, may differ in the sequence of their building blocks. All three processes are suitable, but the "2-step process II" is preferred.
If the isocyanate-terminated polymers of the formula (III) which are described are composed of difunctional units, it was found that the equivalence ratio of isocyanate-reactive polymer/polyphenol is preferably greater than 1.50 and the equivalence ratio of polyisocyanatel(polyphenol +
isocyanate-reactive polymer) is preferably greater than 1.20.
If the average functionality of the components used is greater than 2, there is a more rapid increase in molecular weight than in the purely difunctional case. For the person skilled in the art, it is clear that the limits of the possible equivalence ratios depend to a great extent on whether either the chosen isocyanate-reactive polymer, the polyphenol, the polyisocyanate or a plurality of said components have a functionality > 2. Depending on circumstances, different equivalence ratios can be established, the limits of which is determined by the viscosity of the resulting polymer and which have to be determined experimentally from case to case.
The polyurethane prepolymer of the formula (III) preferably has a resilient character and possesses a glass transition temperature Tg of less than 0°C.
The monohydroxy-epoxide compound of the formula (II) has 1, 2 or 3 epoxide groups. The hydroxyl group of this monohydroxy-epoxide compound (II) may be a primary or secondary hydroxyl group.
Such monohydroxy-epoxide compounds can be produced, for example, by 3 o reacting polyols with epichlorohydrin. Depending on the reaction procedure, the corresponding monohydroxy-epoxide compounds also form in different concentrations as byproducts in the reaction of polyfunctional alcohols with epichlorohydrin. They can be isolated by conventional separation operations. As a rule, however, it is sufficient to use the product mixture 3 5 obtained in the glycidylation reaction of polyols and comprising polyols completely or partly reacted to give the glycidyl ether. Examples of such hydroxyl-containing epoxides are trimethylolpropane diglycidyl ether (contained as a mixture in trimethylolpropane triglycidyl ether), glyceryl diglycidyl ether (contained as a mixture in glyceryl triglycidyl ether), pentaerythrityl triglycidyl ether (contained as a mixture in pentaerythrityl tetraglycidyl ether). Trimethylolpropane diglycidyl ether, which occurs in a relatively high proportion in customarily prepared trimethylolpropane triglycidyl ether, is preferably used.
However, it is also possible to use other similar hydroxyl-containing epoxides, in particular glycidol, 3-glycidyloxybenzyl alcohol or hydroxymethylcyclohexene oxide. The f3-hydroxyether of the formula (VI), which is present in an amount of about 15% in commercially available liquid epoxy resins prepared from bisphenol A (R = CH3) and epichlorohydrin, and the corresponding f3-hydroxyethers (VI), which are formed in the reaction of bisphenol F (R = H) or of the mixture of bisphenol A and bisphenol F with epichlorohydrin, are furthermore preferred.
O~ R / \ O OH R
(VI) R R ~O
Furthermore, it is also possible to use a very wide range of epoxides having a f3-hydroxyether group, prepared by the reaction of (poly)epoxides with less than the stoichiometric amount of monovalent nucleophiles, such as carboxylic acids, phenols, thiols or secondary amines.
The free primary or secondary OH functionality of the monohydroxy-epoxide compounds of the formula (II) permits an efficient reaction with terminal isocyanate groups of prepolymers, it also being unnecessary to use disproportionate excess amounts of the epoxide component for this purpose.
The stoichiometric amounts of monohydroxy-epoxide compound of the formula (II) or its mixtures can be used for the reaction of the polyurethane 3o prepolymers of the formula (III). It is possible to depart from the stoichiometry with regard to its equivalents of OH groups and isocyanate groups. The ratio [OH]/[NCO] is from 0.6 to 3.0, preferably from 0.9 to 1.5, in particular from 0.98 to 1.1.
The polymer B has at least one aromatic structural element which is bound in the polymer chain via urethane groups. This structural element can be illustrated by formula (IV). Furthermore, simultaneously present in the polymer chain of the polymer B is a second structural element which can be illustrated by formula (V):
~~ O~N\*)p (IV) O
Y3 X~N~* q (V) O
The index p has the values of 2, 3 or 4, in particular p = 2 or 3, while the index q has the values of 2, 3 or 4, in particular q = 2 or 3. Furthermore, X
is S, O or NH, in particular O. The radical Are is a p-valent, optionally 1o substituted, aryl radical. The radical Y3 is a q-valent radical of an optionally chain-extended isocyanate-reactive polymer after removal of the terminal amino, thiol or hydroxyl groups. Finally, * in formulae (IV) and (V) the compound the linkage point to the remainder of the polymer chain. These structural elements are the result of the reactions for the preparation of the polymer B, which have already been described.
The polymer B advantageously has a resilient character and is furthermore advantageously soluble or dispersible in epoxy resins.
2o The polymer B can, if required, depending on the resulting viscosity, be diluted with further epoxy resins. Diglycidyl ethers of bisphenol A, bisphenol F and bisphenol A/F, and the reactive diluents F described further below and carrying epoxide groups, in particular hexanediol diglycidyl ether, polypropylene glycol diglycidyl ether and trimethylolpropane triglycidyl ether, are preferred for this purpose.
The total proportion of the polymer B is advantageously 5 - 40% by weight, preferably 7 - 35% by weight, based on the weight of the total composition.
3 o Furthermore, the composition contains at least one thixotropic agent C, based on a urea derivative in a non-diffusing carrier material. The V~10 2005/007720 PCT/EP2004/051519 preparation of such urea derivatives and carrier materials are described in detail in Patent Application EP 1 152 019 A1. The carrier material is advantageously a blocked polyurethane polymer C1, in particular obtained by reacting a trifunctional polyetherpolyol with IPDI and subsequently blocking the terminal isocyanate groups with caprolactam.
The urea derivative is a reaction product of an aromatic monomeric diisocyanate with an aliphatic amine compound. It is also entirely possible to react a plurality of different monomeric diisocyanates with one or more aliphatic amine compounds or a monomeric diisocyanate with a plurality of aliphatic amine compounds. The reaction product of 4,4'-diphenylmethylene diisocyanate (MDI) with butylamine has proven particularly advantageous.
The total proportion of the thixotropic agent C is advantageously 5 - 40% by weight, preferably 7 - 25% % by weight, based on the weight of the total composition. The proportion of the urea derivative is advantageously 5 -50% by weight, preferably 15 - 30% by weight, based on the weight of the thixotropic agent C.
The composition according to the invention furthermore contains at least one curing agent D for epoxy resins, which is activated by elevated temperature. It is preferably a curing agent which is selected from the group consisting of dicyandiamide, guanamines, guanidines, aminoguanidines and derivatives thereof. Catalytically active substituted ureas, such as 3-chloro-4-methylphenylurea (chlortoluron), or phenyldimethylureas, in particular p-chlorophenyl-N,N-dimethylurea (monuron), 3-phenyl-1,1-dimethylurea (fenuron) or 3,4-dichlorophenyl-N,N-dimethylurea (diuron) are furthermore possible. Compounds of the class consisting of the imidazoles and amine complexes may furthermore be used. Dicyandiamide is particularly preferred.
The total proportion of the curing agent D is advantageously 1 - 10% by weight, preferably 2 - 8% by weight, based on the weight of the total 3 5 composition.
In a preferred embodiment, the composition contains at least one filler E.
This preferably comprises mica, talc, kaolin, wollastonite, feldspar, chlorite, _ 17 _ bentonite, montmorillonite, calcium carbonate (precipitated or ground), dolomite, quartz, silicas (pyrogenic or precipitated), cristobalite, calcium oxide, aluminum hydroxide, magnesium oxide, hollow ceramic spheres, hollow glass spheres, hollow organic spheres, glass spheres or colored pigments. Filler E means both the organically coated and the uncoated commercially available forms known to the person skilled in the art.
The total proportion of the total filler E is advantageously 5 - 30% by weight, preferably 10 - 25% by weight, based on the weight of the total 1o composition.
In a further preferred embodiment, the composition additionally contains at least one reactive diluent F carrying epoxide groups. These reactive diluents F are in particular:
- glycidyl ethers of monofunctional saturated or unsaturated, branched or straight-chain, cyclic or open-chain C4-C3o alcohols, e.g.
butanol glycidyl ether, hexanol glycidyl ether, 2-ethylhexanol ether, allyl glycidyl ether, tetrahydrofurfuryl and furfuryl glycidyl ether, trimethoxysilyl glycidyl ether, etc.
- glycidyl ethers of difunctional saturated or unsaturated, branched or straight-chain, cyclic or open-chain C2-C3o alcohols, e.g.
ethylene glycol glycidyl ether, butanediol glycidyl ether, hexanediol glycidyl ether, octanediol glycidyl ether, cyclohexanedimethanol diglycidyl ether, neopentylglycol diglycidyl ether, etc.
- glycidyl ethers of tri- or polyfunctional, saturated or unsaturated, branched or straight-chain, cyclic or open-chain alcohols, such as epoxidized castor oil, epoxidized trimethylolpropane, epoxidized pentaerythrol or polyglycidyl ethers of aliphatic polyols, such as sorbitol, glycerol, trimethylolpropane, etc.
- glycidyl ethers of phenol and aniline compounds, such as phenyl glycidyl ether, cresol glycidyl ether, p-tert-butyl glycidyl ether, nonylphenol diglycidyl ether, 3-n-pentadecenyl glycidyl ether (from cashew nut shell oil), N,N-diglycidylaniline, etc.
- epoxidized tertiary amines, such as N,N-diglycidylcyclohexylamine, etc.
- epoxidized mono- or dicarboxylic acids, such as glycidyl neodecanoate, glycidyl methacrylate, glycidyl benzoate, diglycidyl phthalate, tetrahydrophthalate and hexahydrophthalate, diglycidyl esters of _ 1g _ dimeric fatty acids, etc.
- epoxidized di- or trifunctional, low molecular weight to high molecular weight polyetherpolyols, such as polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, etc.
Hexanediol diglycidyl ether, polypropylene glycol diglycidyl ether and polyethylene glycol diglycidyl ether are particularly preferred.
The total proportion of the reactive diluent F carrying epoxide groups is s0 advantageously 1 - 7% by weight, preferably 2 - 6% by weight, based on the weight of the total composition.
It has been found that the composition according to the invention is particularly suitable as one-component adhesives. In particular, it is possible to realize therewith heat-curable one-component adhesives which are distinguished by a high impact strength both at relatively high temperatures and especially at low temperatures, in particular from 0°C
to -40°C. Such adhesives are required for the adhesive bonding of heat-stable materials. Heat-stable materials are understood as meaning materials which are dimensionally stable at a curing temperature of 100 -220°C, preferably 120 - 200°C at least during the curing time.
These are in particular metals and plastics, such as ABS, polyamide, polyphenylene ether, composite materials, such as SMC, unsaturated polyesters glass fiber-reinforced plastics or epoxy or acrylate composite materials. The use in which at least one material is a metal is preferred. The adhesive bonding of identical or different metals, in particular in body-shell construction in the automotive industry, is considered to be a particularly preferred use. The preferred metals are especially steel, in particular electrolytically galvanized, hot-galvanized, oiled steel, bonazinc-coated steel and 3 o subsequently phosphated steel, and aluminum, in particular in the variants typically occurring in automotive construction.
In particular, the desired combination of high crash strength and high and low temperature of use can be achieved with an adhesive based on a composition according to the invention.
Such an adhesive is first brought into contact at a temperature of from 10°C
to 80°C, in particular from 10°C to 60°C, with the materials to be adhesively _ 1g _ bonded and is subsequently cured at a temperature of, typically, 100 -220°C, preferably 120 - 200°C.
Of course, in addition to heat-curable adhesives, sealing compounds or coatings can also be realized with a composition according to the invention.
Furthermore, the compositions according to the invention are suitable not only for automotive construction but also for other fields of use.
Particularly obvious are related applications in construction of means of transport, such as ships, trucks, buses or railway vehicles, or in the construction of consumer goods, such as, for example, washing machines.
The materials adhesively bonded by means of a composition according to the invention are used at temperatures of, typically, from 100°C to -40°C, preferably from 80°C to -40°C, in particular from 50°C to -40°C.
The compositions typically have a fracture energy, measured according to DIN 11343, of more than 10.0 J at -20°C and more than 7.0 J at -40°C.
Fracture energies of more than 11.0 J at -20°C and of more than 9.0 J at -40°C are preferred.
Hotmelt adhesives based on the composition according to the invention can also be realized in a special manner. Here, the hydroxyl groups forming in the case of the epoxide adduct A are additionally reacted with polyisocyanate or a polyisocyanate prepolymer. The viscosity is increased thereby, and hot application is required.
A further aspect of the invention relates to novel impact modifiers of the formula (I) of the polymer B which are terminated with epoxide groups and whose detailed constitution and methods of preparation have already been 3 o described further above.
It has been found that these impact modifiers of the formula (I) which are terminated with epoxide groups can be added to compositions containing epoxy resins. Systems which can also be formulated without adducts are possible. Both one-component and two-component or multicomponent systems, which may be room temperature-curable or heat-curable, are possible. In addition to the heat-curable, one-component compositions already described, they are also very suitable in the case of two-component ~ - 20 -or multicomponent epoxy resin compositions, in particular for those whose second component is an amine curing agent or polyamine curing agent or a mercaptan curing agent or a polymercaptan curing agent. The impact modifiers of the formula (I) which are terminated with epoxide groups are added to the curing component, one or more adducts being formed, or, preferably, added to that component which contains the epoxy resin.
Further, less preferred, possibilities are the addition of an impact modifier terminated with epoxide groups directly during the application or the addition as a constituent of a third or further component during the application.
The curing temperature of such 2-component or multicomponent epoxy resin compositions is preferably from 10°C to 60°C, in particular from 15°C
to 50°C. Impact modifiers of the formula (I) which are terminated with epoxide groups are suitable in particular as an additive to 2-component epoxy resin adhesives. Here, the increase in the impact strength is not limited to low temperatures.
Of particular interest is the partial precuring of the impact modifiers according to the invention, which are terminated with epoxide groups, by polyamines or polymercaptans, in particular by diamines and dimercaptans.
Thus, the 2-component system can be adjusted so that, as a result of partial precrosslinking, the adhesive acquires a highly viscous to rubber-like consistency which ensures the washout stability in wash processes at 2 5 temperatures up to 70°C.
These compositions, in particular adhesives, are applied, immediately before the application, by means of a 2-component or multicomponent mixing apparatus to the materials to be brought into contact. Such 2-3 o component or multicomponent adhesives can be used both in automotive construction and in the construction of means of transport (ships, trucks, buses or railway vehicles) or in the construction of consumer goods, such as, for example, washing machines, but also in the building sector, for example as stiffening structural adhesives (inter alia composite materials, 35 etc.).
Such a two-component adhesive can be formulated, for example, in such a way that the impact modifier is a constituent of the first component and at least one polyamine or at least one polymercaptan is a constituent of the second component.
After mixing and curing, such adhesives likewise have good adhesion to the substrates already described above.
Examples Some examples which further illustrate the invention but are not intended to limit the scope of the invention in any way are to be described below. The raw materials used in the examples are listed in table 1.
~ - 22 -Raw materials used Su lier Dimerized C18 fa acid Pri of 1013 Uni ema Tri hen I hos hine Fluka AG
Bis 4-h drox hen I sulfone = bis henol Fluka AG
S
Bis henol A di I cid I ether = DGEBA Vantico Polypropylene glycol diglycidyl ether (ED-506)Asah-Denka Ko 0 Dic andiamide = Dic De ussa Iso horone diisoc anate = IPDI De ussa-Huls Ca rolactam EMS Chemie N-Bu lamine BASF
4,4'-Di hen Imeth lene diisoc anate = MDI Ba er 2,4-Trimeth Ihexameth lene 1,6-diisoc anateDe ussa-Huls = TMDI
Hexanediol di I cid I ether Prummer Desmophen 3060 BS (trifunctional polypropyleneBayer glycol, OH
a uivalent wei ht = 1000 /OH a uivalent PoIyTHF 2000/PoIyTHF 2900 (difunctional BASF
polybutylene glycol, OH a uivalent wei ht = 1000 and 1450 /OH
a . res ectivel Liquiflex P (hydroxyl-terminated polybutadiene,Petroflex OH equivalent wei ht = about 1200 /OH a uivalent Pri last 2033 h drox -terminated dimerizedUni ema C18 fa acid Bis h drox meth I tric clo 5.2.1.0 2,6 Aldr7ch decane = TCD-DM
4,4'-Isopropylidenedicyclohexanol (= hydrogenatedAldrich bisphenol A, = A/H
Bis henol A Fluka AG
4,4'-[Bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)]Mitsui Chemicals = bis henol M
Resorcinol Fluka AG
Phenol hthalein Fluka AG
o-Cresol Fluka AG
Lewatit 1131 anionic ion exchan a resin BASF
1,3-Diisopropenylbenzene (= m-DIPEP) Cytec Table 1. Raw materials used.
General preparation of the epoxide adduct A or of the epoxide adduct A
premix:
Example for epoxide adduct A premix: A-VM1 123.9 g of a dimeric fatty acid, 1.1 g of triphenylphosphine and 71.3 g of bis(4-hydroxyphenyl) sulfone were reacted with 658 g of a liquid DGEBA
epoxy resin having an epoxide content of 5.45 eq/kg for 5 hours at 110°C
in vacuo and with stirring until a constant epoxide concentration of 2.82 eq/kg was reached. After the end of the reaction, 187.0 g of liquid DGEBA epoxy resin were additionally introduced into the reaction mixture A.
Exemplary areparation of a monohydroxyl-containing epoxide Trimethylolpropane glycidyl ether was prepared according to the process in 1o US Patent 5,668,227, example 1, from trimethylolpropane and epichlorohydrin with tetramethylammonium chloride and sodium hydroxide solution. A yellowish product having an epoxide number of 7.5 eq/kg and a hydroxyl group content of 1.8 eq/kg is obtained. From the HPLC-MS
spectrum, it is possible to conclude that substantially a mixture of trimethylolpropane diglycidyl ether and trimethylolpropane triglycidyl ether is present.
Exemplary preparation of a bisphenol (bis-OK5) \ \ \
H ~ ~ ~ ~ ~ OH
I\
I
2 0 _ H0 ~ "Bis-OK5"
864 g (8.0 mol) of o-cresol and 100 g of Lewatit-1131 (catalyst) were heated to 67°C at a pressure of 0.05 bar, and 50 ml of H20 (from Lewatit-1131 ) were distilled off. 316 g (2.0 mol) of m-DIPEP were then added dropwise under an N2 atmosphere in the course of 1 h, the temperature slowly increasing to 105°C. Stirring was effected for 3 h at 95°C under the N2 atmosphere. The catalyst was then filtered off through a wire net. At a pressure of 0.05 bar, the temperature was then increased stepwise to 230°C in the course of 1 h, and it was possible to distill off a 3 o total of 500 ml of o-cresol. In this way, 680 g of a highly viscous, honey-yellow material having a residual monomer content of 0.58% and an OH
content of about 5 eq/kg were obtained.
Various examples of the preparation of polymer B of the formula (I) are described below.
Examale of a polymer B (according to the invention): B-01 200 g of PoIyTHF 2000 (OH number 57.5 mg/g KOH) were dried for 30 minutes in vacuo at 100°C. 47.5 g of IPDI and 0.04 g of dibutyltin dilaurate were then added. The reaction was carried out in vacuo at 90°C until the NCO content was constant at 3.6% after 2.5 h (theoretical NCO content:
3.7%). Thereafter, 17.7 g of bisphenol M was added (NCO/OH ratio: 0.45) and stirring was continued in vacuo at 90°C once again until the NCO
content was constant at 2.1 % after 3 h (theoretical NCO content: 2.0%).
78.1 g of the trimethylolpropane glycidyl ether described above were then added as monohydroxyl-containing epoxide of the formula (II). Stirring was continued at 90°C in vacuo until the NCO content had decreased to below 0.1 % after a further 3 h. After the end of the reaction, 82.9 g of DGEBA
were added (1/3 of the mass of the unblocked, NCO-terminated prepolymer). A clear product having an epoxide content ("end EP content") of 2.51 eq/kg was thus obtained.
Further polymers B (accordingi to the invention): B-02 to B-09 Table 2 shows further examples of polymer as are used in compositions according to the invention. These polymers are prepared in the same way as example B-01.
Examale of a polymer P (not according to the invention): P-01 200 g of PoIyTHF 2000 (OH number 57.5 mg/g KOH) were dried for 30 minutes in vacuo at 100°C. 47.5 g of IPDI and 0.04 g of dibutyltin dilaurate were then added. The reaction was carried out in vacuo at 90°C until the NCO content was constant at 3.6% after 2.5 h (theoretical NCO content:
3.7%). 123.7 g of the trimethylolpropane glycidyl ether described above were then added as monohydroxyl-containing epoxide of the formula (II).
Stirring was continued at 90°C in vacuo until the NCO content had decreased to below 0.1 % after a further 3 h. After the end of the reaction, 82.5 g of DGEBA were added (1/3 of the mass of the unblocked, NCO
terminated prepolymer). A clear product having an epoxide content ("end EP content") of 3.15 eq/kg was thus obtained.
P-01 thus contains no polyphenol structural units in the polymer chain.
Further examales of aolymers P (not according to the invention): P-02 to P-The polymers P-02 to P-05 are prepared according to table 2 in the same manner as the polymer P-01 or analogously to B-01. In the case of polymer P-02, the same amount of bisphenol M as in example B-01 was used, but bisphenol M it was dissolved in the hot polymer right at the end of the synthesis. The polymer P-02 accordingly contains free, unbound bisphenol M. The polymer P-03, P-04 and P-05 contain aliphatic diols instead of the bisphenol M of example B-01.
O ~ N N 07O
O
~ O ~ N O
O O 0 O~ O
Lf1 ~ O ~ ~ D) CV
O CO OD~ fV
d~
O
O O ~ N n OM N
O O et N N
n O,Mp,N
O
W
O ~ ~ ~ OO O
O I~ N1~O
~
a N ~ t a0~ M
O ~ ~ O) _ O ~ I~
M
OD~
O O aD O~ O~ ~~ N
O
~rj ~ ~ N
m ~ ~ O~ N
O
N O O
~ M
M
Q O O ~ M OO tn O ~rj p ~~ N
~
M ~ I~M CV
O ~ N ~ O
N
O ~ nj In N ~1' N I~ OD~ N
I
h O O) m O On h O
O Npp,n O~ CV
O
I O
O O) ON M
N N
~ G~ N
O
N
X17 CO ~ O)~ O
~ N
N ~ C~ N N
p N
N O ~ ~ y(7M w ~ N
t O~ N C
D D
O
O _ N _ C
n Is O NCO~
N '~t I~ CO~ CVO
Y d d ~ ~ d ' ,nO O N O O ~ N ~ N N O O N O
O ~ ~~ ~ M ,tj~ 1nO)X I~CVIs ~ ~ d M
O I~~ ~ N ~ O O I~c0 O
N ~ ~ .- c0 . .
O
W NJ
O
O
N
'C
C a.r O H N M Z C ~ N
N
O y ~ ~ Q ~ns o a a =
y \ 4 N ~ O
Ll1 O O ' C N p C p p L D O ~ V ~
- -L I ~ V d L L L C O ~ (~t V m L C N
I
O L l _ ~ d T E
' H0 ~ .cN ~ O N L ~ ~c~ N ~ L 111 'pt N
-O H F-_ !~a _ _ m m a m O E
3 a o a a Thixotropic agent C
As an example of a thixotropic agent C based on a urea derivative in a nondiffusing carrier material, a thixotropic agent C was prepared according to Patent Application EP 1 152 019 A1 in a blocked polyurethane prepolymer using abovementioned raw materials:
Carrier material: Blocked polyurethane prepolymer C1:
600.0 g of a polyetherpolyol (3000 Dalton; OH number 57 mg/g KOH) were reacted with 140.0 g of IPDI in vacuo and with stirring at 90°C until the isocyanate content remained constant, the isocyanate-terminated prepolymer being obtained. The free isocyanate groups were then blocked with caprolactam (2% excess).
i5 Urea derivative (HSD1) in blocked polyurethane prepolymer 68.7 g of MDI flakes were melted in 181.3 g of the blocked prepolymer described above under nitrogen and with gentle heating. 40.1 g of N-butylamine, dissolved in 219.9 g of the blocked prepolymer described above, were then added dropwise in the course of two hours under 2 o nitrogen and with rapid stirring. After the end of the addition of the amine solution, the white paste was stirred for a further 30 minutes. Thus, after cooling, a white, soft paste which had a free isocyanate content of < 0.1 (proportion of urea derivative about 20%) was obtained.
2 5 Example compositions Various adhesive compositions according to tables 3 and 4 were prepared as examples.
For comparison with the example compositions Z-01 to Z-09 according to 3 o the invention, Ref 01 the highly structural epoxy adhesive Betamate~-1493 (commercially available from Dow-Automotive, Freienbach, Switzerland), Ref 02 and Ref 03, and X 01 to X 04 were used as examples not according to the invention.
3 5 After application to electrolytically galvanized steel (eloZn), the adhesives were cured at 50°C in the course of 30 minutes in an oven at 180°C. All tests were effected one day after cooling of the adhesive bond to room temperature.
. _ 2g _ A-VM1 55.6 55.6 55.655.6 55.6 55.6 55.6 55.6 55.6 B-01 36.0 B-02 36.0 B-03 36.0 B-04 36.0 B-05 36.0 B-06 36.0 8-07 36.0 B-08 36.0 B-09 36.0 C 10.0 10.0 10.010.0 10.0 10.0 10.0 10.0 10.0 Dicyandiamide 4.5 4.5 4.5 4.5 4.5 4.5 4.4 4.4 4.6 (D) [g]
Filler mixture22.0 22.0 22.022.0 22.0 22.0 22.0 22.0 22.0 (E) [g]
Hexanediol diglycidyl 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 ether ED-506 2.4 2.4 2.4 2.4 2.4 2.4 2.4 2.4 2.4 TSS MPa 19.0 19.6 20.621.5 18.5 20.7 19.0 19.7 22.5 FE' at 50C 13.7 14.7 14.215.6 12.9 15.2 14.2 12.1 15.3 J
FE' at 23C 14.5 15.0 14.215.6 13.3 14.9 14.4 14.5 15.8 J
FE' at 0C J 13.7 14.1 12.915.1 14.5 14.4 15.2 13.2 13.2 FE' at -20C 11.9 11.6 11.112.9 11.5 11.7 13.3 12.7 13.2 J
FE' at -40C 10.7 9.9 10.210.0 9.1 9.6 10.4 10.9 11.9 J
Table 3. Compositions according to the invention.
Ref Ref Ref X 01 X X 03 X
A-VM1 55.6 55.6 55.6 55.6 55.6 55.6 P-01 18.0 36.0 P-02 36.0 P-03 36.0 P-04 36.0 P-05 36.0 C 21.0 10.0 10.0 10.0 10.0 10.0 Dicyandiamide 4.0 4.6 4.6 4.6 4.5 4.5 (D) [g]
Filler mixture 22,0 22.0 22.0 22.0 22.0 22.0 (E' [g]
Hexanediol diglycidyl 1.5 1.5 1.5 1.5 1.5 1.5 ether ED-506 2.4 2.4 2.4 2.4 2.4 2.5 TSS MPa 19.9 19.8 20.3 13.2 21.0 19.6 19.9 FE' at 50C 18.0 14.3 13.8 12.9 9.0 9.7 15.0 J
FE' at 23C 17.8 14.4 13.6 13.4 12.5 10.1 13.8 J
FE' at 0C J 16.2 14.0 12.5 11.6 7.2 10.4 12.0 FE' at -20C 4.2 11.9 10.3 10.1 5.3 8.7 11.6 [J]
FE' at -40C 0.5 6.0 5.5 2.9 0.6 2.3 0.4 [J]
Table 4. Reference examples and counter-examples.
Test methods:
Tensile shear strength (TSS) (DIN EN 1465) The test specimens were produced using electrolytically galvanized steel (eloZn) having the dimensions 100 x 25 x 0.8 mm; the adhesion area was 25 x 10 mm with a layer thickness of 0.3 mm. Curing was effected for 30 min at 180°C. The take-off rate was 10 mm/min.
Dynamic resisfance fo cleavage (ISO 11343) The test specimens were produced using electrolytically galvanized steel (eloZn) having the dimensions 90 x 25 x 0.8 mm; the adhesion area was 25 x 30 mm with a layer thickness of 0.3 mm. Curing was effected for 30 min at 180°C. The take-off rate was 2 m/s. The area under the measured curve (from 25% to 90%, according to DIN 11343) is stated as the fracture energy (FE) in joules.
~ - 30 -Results:
The results of the adhesive formulations in tables 3 and 4 show that the combination of high strength and high impact strength can be achieved both at room temperature and at low temperatures down to -40°C with the compositions according to the invention (1-01 to Z-09).
The reference example Ref 01 (Betamate~-1493, Dow Automotive) shows good impact strengths at temperatures above 0°C but has significantly lower values at low temperatures, i.e. below 0°C, in comparison with the 1o adhesives according to the invention.
The reference example Ref 02 contains, as polymer P-01, a polymer terminated with epoxide groups without phenolic structural elements. This example shows considerably improved impact strength values at temperatures down to -20°C in comparison with Ref 01, but these values decrease markedly at lower temperatures in comparison with the compositions according to the invention.
The reference example Ref 03 is comparable with Ref 02 but firstly has a 2 o higher proportion of the polymer P-01 terminated with epoxide groups and secondly has a lower content of thixotropic agent C. The values obtained are comparable with those which were obtained with the adhesive formulation Ref 02.
The compositions X 01 to X 04 not according to the invention each contain the polymers P02 to P05. X 01 shows an impact strength reduction which is substantial especially at low temperatures. Instead of the phenol structural elements, X 02 to X 04 have structural elements originating from aliphatic diols. X 02 to X 04 likewise all exhibit a considerable reduction in the impact strength, particularly at low temperatures.
The compositions Z 01 to Z 09 according to the invention which are summarized in table 3 all have good fracture energies. While the remaining mechanical values, such as tensile shear strength, are maintained, in particular the values at temperatures from 0°C to -40°C are greatly improved in comparison with the reference examples from table 4. The positive effect is substantially independent of the diisocyanates and bisphenols used.
IMPACT STRENGTH MODIFIERS
Field of the invention The invention relates to heat-curable compositions which simultaneously 1o have high impact strength and good mechanical properties at low temperatures down to -40°C and in particular can be used as one-component adhesives, and impact strength modifiers for epoxy resins at low temperatures.
Description of the prior art In the manufacture of both vehicles and add-on parts or machines and devices, high-quality adhesives are more and more frequently being used instead of or in combination with conventional joining methods, such as 2 o screwing, riveting, punching or welding. This gives rise to advantages and new possibilities in manufacture, for example the manufacture of composite and hybrid materials, or greater freedom in the design of components. For an application in vehicle manufacture, the adhesives must have good adhesion to all substrates used, in particular electrolytically galvanized, hot-galvanized and subsequently phosphated steel sheets, oiled steel sheets and various, optionally surface-treated, aluminum alloys. These good adhesion properties must be maintained in particular even after aging (alternating climatic conditions, salt spray baths, etc.) without major deterioration in quality. If the adhesives are used as body-shell construction 3 o adhesives in automotive construction, the stability of these adhesives to cleaning baths and dip coating (so-called washout stability) is of major importance in order to be able to guarantee the manufacturer's process reliability.
3 5 The adhesives for body-shell construction must cure under the conventional baking conditions of, ideally, 30 min at 180°C.
Furthermore, however, they must also be stable up to about 220°C. Further requirements for such a cured adhesive or the adhesive bond include the assurance of _ 2 _ operational reliability both at high temperatures up to about 90°C and at low temperatures down to about -40°C. Since these adhesives are structural adhesives and these adhesives therefore adhesively bond structural parts, high strength and impact strength of the adhesive are of the greatest importance.
It is true that conventional epoxy adhesives are distinguished by high mechanical strength, in particular high tensile strength. However, when the adhesive bond is subjected to impact, classical epoxy adhesives are generally too brittle and are therefore far from able to satisfy the requirements, in particular of the automotive industry, under crash conditions under which both great tensile stresses and cleavage stresses occur. In this respect, in particular the strengths at high temperatures, but in particular at low temperatures (< -10°C), are often insufficient.
The literature proposes substantially two methods for being able to reduce the brittleness of epoxy adhesives and hence being able to increase the impact strength: firstly, the aim can be achieved by the admixing of at least partly crosslinked high molecular weight compounds, such as latices of 2o core-shell polymers or other flexibilizing polymers and copolymers.
Secondly, a certain increase in strength can also be achieved by introducing flexible segments, for example by the corresponding modification of the epoxide components.
According to the first-mentioned technique corresponding to the teaching in the patent US 5,290,857, epoxy resins can be made more impact-resistant by mixing a fine, pulverulent core-shell polymer into the epoxide matrix. As a result, highly resilient domains which increase the impact strength form in the rigid brittle epoxide matrix. Such core-shell polymers are described in 3 o US Patent 5,290,857 and are based on acrylate or methacrylate polymers.
According to the second-mentioned technique, epoxy resin compositions are described in US Patent 4,952,645, which compositions have been flexibilized by the reaction with aliphatic, cycloaliphatic or aromatic 3 5 carboxylic acids, in particular di- or trimeric fatty acids, and with carboxylic acid-terminated aliphatic or cycloaliphatic diols. Such compositions are said to be distinguished by an increased flexibility in particular at low temperatures.
' - 3 -EP 0 343 676 describes a reactive hotmelt epoxy adhesive comprising a polyurethane-epoxide adduct. The terminal isocyanate groups of prepolymers are reacted with at least one epoxy resin containing hydroxyl groups and having an OH functionality greater than 2, so that a hotmelt adhesive which is solid at room temperature is obtained.
It is also known that epoxy resins can be flexibilized with reactive elastomers, such as, for example, synthetic rubbers and derivatives thereof. The main effect in relation to the imparting of tough and resilient properties is based on the only partial miscibility of the epoxy resins and the corresponding derivatized synthetic rubbers, with the result that heterodisperse phases which have an effect comparable to the core-shell polymer form in the production process. However, the establishment of this superstructure is very dependent both on the quantitative composition and on the procedure during the curing process. The result of this is that a continuous constant quality is very difficult to achieve.
Elastomers which have terminal phenol groups and are prepared by 2 o reacting isocyanate-terminated prepolymers with a large excess of bisphenols are described in EP 0307666 A1 as being particularly advantageous for the impact strength modification of epoxy resins. The high phenol content, which has an adverse effect on the storage stability of the formulated system and can lead to expulsion of gases during the curing 2 5 at 180°C, is disadvantageous for the formulation with epoxides.
In general, latent curing agents, such as dicyandiamide, are used for the high-temperature curing of the epoxy resins described above. High-temperature curing by means of phenol curing agents, such as bisphenols 3 o or novolaks, is also known. They lead to advantageously cured adhesives having high glass transition temperatures but are under discussion because of ecological aspects.
Summary of the invention It is the object of the present invention to provide novel impact strength modifiers for epoxy resin compositions, which modifiers contain in particular no free phenol and are suitable for use at low temperatures, in particular temperatures lower than -20°C. These impact strength modifiers should preferably be suitable as a component of one-component and heat-curable compositions stable at room temperature, in particular adhesives and hotmelt adhesives.
Surprisingly, it has been found that this can be achieved by the use of polymeric compounds terminated with epoxide groups and of the general formula (I):
O
Y N O~Y (I) m O
n 1o in which Y~ is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups and Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups, and n is 2, 3 or 4, and m is 1, 2 or 3. The polymer of the formula (I) additionally has at least one aromatic structural element which is bound in the polymer chain via urethane groups.
It has been found that this polymer of the formula (I) is a good impact 2 0 strength modifier.
A particular aspect of the invention is a composition which comprises at least one epoxide adduct A having on average more than one epoxide group per molecule and at least one polymer B of the formula (I) and at least one thixotropic agent C based on a urea derivative in a nondiffusing carrier material and at least one curing agent D for epoxy resins which is activated by elevated temperature.
This composition serves in particular as an adhesive and has an extremely 3 o high dynamic resistance to cleavage, in particular at low temperatures.
According to preferred embodiments, compositions which additionally ' - 5 -comprise at least one filler E and/or at least one reactive diluent F are furthermore described.
The invention furthermore relates to impact strength modifiers of the formula (I) which are terminated with epoxide groups. It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular 1-component heat-curable epoxy resin compositions and in 2-component epoxy resin compositions.
Description of the preferred embodiments The present invention relates to compositions which comprise at least one epoxide adduct A having on average more than one epoxide group per i5 molecule, at least one polymer B of the formula (I), at least one thixotropic agent C based on a urea derivative in a non-diffusing carrier material and at least one curing agent D for epoxy resins which is activated by elevated temperature.
2 o The epoxide adduct A is an epoxide adduct A1 or an epoxide adduct A2.
The epoxide adduct A1 is obtainable from the reaction of at least one dicarboxylic acid and at least one diglycidyl ether. The epoxide adduct A2 is obtainable from the reaction of at least one bis(aminophenyl) sulfone 25 isomer or of at least one aromatic alcohol and at least one diglycidyl ether.
The dicarboxylic acid used for the preparation of the epoxide adduct A1 is preferably a dimeric fatty acid. Dimeric C4-C2o fatty acids which are C8-C4o dicarboxylic acids have been found to be particularly suitable.
The diglycidyl ethers are preferably a liquid resin, in particular diglycidyl ether of bisphenol A (DGEBA), of bisphenol F and of bisphenol A/F (the designation "A/F" refers here to a mixture of acetone with formaldehyde, which is used as a starting material in the preparation thereof). Owing to 3 5 the processes for the preparation of these resins, it is clear that the liquid resins also contain higher molecular weight components. Such liquid resins are obtainable, for example, as Araldite GY 250, Araldite PY 304, Araldit GY 282 (Vantico) or D.E.R 331 (Dow).
' - 6 -The epoxide adduct A1 has a flexibilizing character.
The epoxide adduct A2 is obtainable by the reaction of at least one bis(aminophenyl) sulfone isomer or at least one aromatic alcohol with at least one diglycidyl ether. The aromatic alcohol is preferably selected from the group consisting of 2,2-bis(4-hydroxyphenyl)propane (= bisphenol A), bis(4-hydrocyphenyl)methane (= bisphenol F), bis(4-hydroxyphenyl) sulfone (bisphenol S), hydroquinone, resorcinol, pyrocatechol, naphthoquinone, naphthoresorcinol, dihydroxynaphthalene, dihydroxyanthraquinone, dihydroxybiphenyl, 3,3-bis(p-hydroxyphenyl)phthalides, 5,5-bis(4-hydroxyphenyl)hexahydro-4,7-methanoindane, 4,4'-(bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)] (= bisphenol M), 4,4'-[bis(hydroxyphenyl)-1,4-phenylenebis(1-methylethylidene)] (= bisphenol P) and all isomers of the abovementioned compounds. Bis(4-hydroxyphenyl) sulfone is suitable as a particularly preferred aromatic alcohol.
The preferred bis(aminophenyl) sulfone isomers are bis(4,-aminophenyl) sulfone and bis(3-aminophenyl) sulfone.
The preferred diglycidyl ethers are the diglycidyl ethers already described for epoxide adduct A1.
The epoxide adduct A2 tends to have a rigid structure.
The simultaneous presence of epoxide adduct A1 and epoxide adduct A2 in compositions as claimed in claim 1 is particularly preferred.
The epoxide adduct A preferably has a molecular weight of 700 -6000 Dalton, preferably 900 - 4000 Dalton, in particular 1000 - 3300 Dalton.
"Molecular weight" or "molar weight" is understood here and below as meaning the average molecular weight M~.
The epoxide adduct A is prepared in a manner known to the person skilled in the art. Advantageously, an additional amount of the diglycidyl ether or ethers used for the adduct formation is added at the end of the adduct formation and is used as epoxide adduct A premix. In this epoxide adduct _ 7 _ A premix, the total proportion of the unreacted diglycidyl ether or ethers is 12 - 50% by weight, preferably 17 - 45% by weight, based on the total weight of the epoxide adduct A premix.
"Total proportion" is understood here and below as meaning in each case the sum of all components belonging to this category. If, for example, two different diglycidyl ethers occur simultaneously in the adduct formation, the total proportion of the diglycidyl ethers is to be understood as meaning the sum of these two diglycidyl ethers.
Furthermore, the proportion by weight of the epoxide adduct A premix is advantageously 20 - 70% by weight, preferably 35 - 65% by weight, based on the weight of the total composition.
The polymer B can be represented by formula (I) O
Y N O~Y (I) m O
n In formula (I), Y~ is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups, and Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups. Furthermore, the indices n are 2, 3 or 4 and the indices m are 1, 2 or 3. In addition, the polymer B has at least one aromatic structural element which is bound in the polymer chain via urethane groups.
The polymer B of the formula (I) is obtainable, for example, by the reaction of a monohydroxy-epoxide compound of the formula (II) and of a linear or branched polyurethane prepolymer terminated with isocyanates groups and of the formula (III):
_ g _ HO~Y O (1l) 2 m NCO (III) n For the preparation of the polyurethane prepolymer of the formula (III), at least one polyisocyanate, at least one polyphenol and at least one isocyanate-reactive polymer are used.
In the entire present document, the prefix "poly" in "polyisocyanate", "polyol", "polyphenol" and "polymercaptan" designates molecules which formally contain two or more of the respective functional groups.
1o Diisocyanates, triisocyanates or tetraisocyanates, in particular di- or triisocyanates, are suitable as the polyisocyanate. Diisocyanates are preferred.
Suitable diisocyanates are aliphatic, cycloaliphatic, aromatic or araliphatic diisocyanates, in particular commercially available products, such as methylenediphenyl diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), tolidine diisocyanate (TODD, isophorone diisocyanate (IPDI), trimethylhexamethylene diisocyanate (TMDI), 2,5- or 2,6-bis(isocyanatomethyl)bicyclo[2.2.1]heptane, 1,5-naphthalene diisocyanate (NDI), dicyclohexylmethyl diisocyanate (H~2MD1), p-phenylene diisocyanate (PPDI), m-tetramethylxylylene diisocyanate (TMXDI), etc. and the dimers thereof. HDI, IPDI, TMDI, MDI or TDI are preferred.
Suitable triisocyanates are in particular trimers or biurets of aliphatic, cycloaliphatic, aromatic or araliphatic diisocyanates, in particular the isocyanurates and biurets of the diisocyanates described in the preceding paragraph.
Particularly suitable polyphenols are bis-, tris- and tetraphenols. These are 3 o understood as meaning not only pure phenols but optionally also g _ substituted phenols. The type of substitution may be very varied. In particular, this is understood as meaning substitution directly on the aromatic nucleus to which the phenolic OH group is attached. Phenols are furthermore understood as meaning not only mononuclear aromatics but also polynuclear or fused aromatics or heteroaromatics which have the phenolic OH group directly on the aromatic or heteroaromatic.
Inter alia, the reaction with isocyanates which is required for the formation of polyurethane prepolymers of the formula (III) is influenced by the type and position of such a substituent.
The bis- and triphenols are particularly suitable. Suitable bisphenols or trisphenols are, for example, 1,4-dihydroxybenzene, 1,3-dihydroxybenzene, 1,2-dihydroxybenzene, 1,3-dihydroxytoluene, 3,5-dihydroxybenzoates, 2,2-bis(4-hydroxyphenyl)propane (= bisphenol A), bis(4-hydroxyphenyl)methane (= bisphenol F), bis(4-hydroxyphenyl) sulfone (= bisphenol S), naphthoresorcinol, dihydroxynaphthalene, dihydroxy-anthraquinone, dihydroxybiphenyl, 3,3-bis(p-hydroxyphenyl)phthalides, 5,5-bis(4-hydroxyphenyl)hexahydro-4,7-methanoindane, phenolphthalein, fluorescein, 4,4'-[bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)]
(= bisphenol M), 4,4'-[bis-(hydroxyphenyl)-1,4-phenylenebis(1-methylethylidene)] (= bisphenol P), o,o-diallylbisphenol A, diphenols and dicresols prepared by reacting phenols or cresols with diisopropylidenebenzene, phloroglucinol, gallic ester, phenol novolaks or cresol novolaks having an -OH functionality of from 2.0 to 3.5 and all isomers of the abovementioned compounds.
Preferred diphenols and dicresols prepared by reacting phenols or cresols with diisopropylidenebenzene have a chemical structural formula as shown 3 o below for cresols as an example:
OH
OH
HO
Sparingly volatile bisphenols are particularly prefer-ed. Bisphenol M and bisphenol S are most preferred.
Furthermore, at least one isocyanate-reacting prepolymer is used for the preparation of the polyurethane prepolymer of the formula (III). This isocyanate-reactive polymer has isocyanate-reactive groups which are preferably amino, thiol or hydroxyl groups. These isocyanate-reactive polymers advantageously have an equivalent weight of 600 - 6000, in particular of 600 - 4000, preferably of 700 - 2200, g/equivalent of NCO-reactive groups.
In particular, these isocyanate-reactive polymers are polyols, for example the following commercially available polyols or any desired mixtures thereof:
- Polyoxyalkylene polyols, also referred to as polyetherpolyols, i5 which are the polymerization product of ethylene oxide, 1,2-propylene oxide, 1,2- or 2,3-butylene oxide, tetrahydrofuran or mixtures thereof, optionally polymerized with the aid of an initiator molecule having two or three active H atoms, such as, for example, water or compounds having two or three OH groups. It is possible to use both polyoxyalkylenepolyols 2 o which have a low degree of unsaturation (measured according to ASTM D-2849-69 and stated in milliequivalents of unsaturation per gram of polyol (meq/g)), prepared, for example, with the aid of so-called double metal cyanide complex catalysts (DMC catalysts for short), and polyoxyalkylenepolyols having a higher degree of unsaturation, prepared, 25 for example, with the aid of anionic catalysts, such as NaOH, KOH or alkali metal alcoholates. Especially suitable are polyoxypropylenediols and -triols having a degree of unsaturation of less than 0.02 meq/g and having a molecular weight in the range of 1000 - 30 000 Dalton, polyoxybutylenediols and triols, polyoxypropylenediols and -triols having a 30 molecular weight of 400 - 8000 Dalton, and so-called "EO-endcapped"
(ethylene oxide-endcapped) polyoxypropylenediols or -triols. The latter are special polyoxypropylenepolyoxyethylenepolyols which are obtained, for example, by a method in which pure polyoxypropylenepolyols are alkoxylated with ethylene oxide after the end of the polypropoxylation and 35 thus have primary hydroxyl groups.
- Polyhydroxy-terminated polybutadienepolyols, such as, for example, those which are prepared by a polymerization of 1,3-butadiene and allyl alcohol;
- styrene-acrylonitrile-grafted polyetherpolyols, as supplied, for example, by Bayer under the name Lupranol;
- polyhydroxy-terminated acrylonitrile/polybutadiene copolymers, as can be prepared, for example, from carboxyl-terminated acrylonitrile/polybutadiene copolymers (commercially available under the name Hycar~ CTBN from Hanse Chemie AG, Germany) and epoxides or from amino alcohols;
- polyesterpolyols prepared, for example, from dihydric to trihydric alcohols, such as, for example, 1,2-ethanediol, diethylene glycol, 1,2 propanediol, dipropylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6 hexanediol, neopentylglycol, glycerol, 1,1,1-trimethylolpropane or mixtures of the abovementioned alcohols, with organic dicarboxylic acids or anhydrides or esters thereof, such as, for example, succinic acid, glutaric acid, adipic acid, suberic acid, sebacic acid, dodecanedicarboxylic acid, malefic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid and hexahydrophthalic acid or mixtures of the abovementioned acids, and polyesterpolyols obtained from lactones, such as, for example, E-caprolactone;
- polycarbonatepolyols, as are obtainable by reacting, for 2 o example, the abovementioned alcohols - used for the synthesis of the polyesterpolyols - the dialkyl carbonates, diaryl carbonates or phosgene.
The isocyanate-reactive polymers are advantageously difunctional or higher-functional polyols having OH equivalent weights of from 600 to 2 5 6000 g/OH equivalent, in particular from 600 to 4000 g/OH equivalent, preferably 700 - 2200 g/OH equivalent. Furthermore advantageous are the polyols selected from the group consisting of polyethylene glycols, polypropylene glycols, polyethylene glycol/polypropylene glycol block copolymers, polybutylene glycols, hydroxyl-terminated polybutadienes, 3 o hydroxyl-terminated butadiene-co-acrylonitriles, hydroxyl-terminated synthetic rubbers and mixtures of these stated polyols.
Furthermore, polyethylene ethers, polypropylene ethers, polybutylene ethers, polybutadienes and polybutadiene/ acrylonitriles terminated with 3 5 difunctional or higher-functional amines, as sold, for example, the under the name Hycar~ CTBN by Hanse Chemie AG, Germany, and further amine-terminated synthetic rubbers or mixtures of said components can also be used as isocyanate-reactive polymers.
. _ 12 _ It is furthermore possible that isocyanate-reactive polymers may also be chain-extended, as can be prepared in the manner known to the person skilled in the art from the reaction of polyamines, polyols and polyisocyanates, in particular from diamines, diols and diisocyanates.
Preferred isocyanate-reactive polymers are polyols having molecular weights of from 600 to 6000 Dalton, selected from the group consisting of polyethylene glycols, polypropylene glycols, polyethylene 1o glycol/polypropylene glycol block polymers, polybutylene glycols, hydroxyl-terminated polybutadienes, hydroxyl-terminated polybutadiene/ acrylonitrile copolymers and mixtures thereof.
Particularly preferred isocyanate-reactive polymers are a,w-polyalkylene glycols having C2-C6-alkylene groups or having mixed C2-Cs-alkylene groups, which are terminated with amino, thiol or, preferably, hydroxyl groups. Polypropylene glycol or polybutylene glycol are particularly preferred.
2o Various possibilities are available for the preparation of the polyurethane prepolymer of the formula (III) from at least one polyisocyanate, at least one polyphenol and at least one isocyanate-reactive polymer.
In a first process, referred to as "one-pot process", a mixture of at least one 2 5 polyphenol and at least one isocyanate-reactive polymer is reacted with at least one polyisocyanate in an excess of isocyanate.
In a second process, referred to as "2-step process I", at least one polyphenol is reacted with at least one polyisocyanate in an excess of 3 o isocyanate and then reacted with less than the stoichiometric amount of at least one isocyanate-reactive polymer.
Finally, in the third process, referred to as "2-step process II", with at least one isocyanate-reactive polymer is reacted with a polyisocyanate in an 3 5 excess of isocyanate and then with less than the stoichiometric amount of at least one polyphenol.
The three processes lead to isocyanate-terminated polyurethane prepolymers of the formula (III) which, with the same composition, may differ in the sequence of their building blocks. All three processes are suitable, but the "2-step process II" is preferred.
If the isocyanate-terminated polymers of the formula (III) which are described are composed of difunctional units, it was found that the equivalence ratio of isocyanate-reactive polymer/polyphenol is preferably greater than 1.50 and the equivalence ratio of polyisocyanatel(polyphenol +
isocyanate-reactive polymer) is preferably greater than 1.20.
If the average functionality of the components used is greater than 2, there is a more rapid increase in molecular weight than in the purely difunctional case. For the person skilled in the art, it is clear that the limits of the possible equivalence ratios depend to a great extent on whether either the chosen isocyanate-reactive polymer, the polyphenol, the polyisocyanate or a plurality of said components have a functionality > 2. Depending on circumstances, different equivalence ratios can be established, the limits of which is determined by the viscosity of the resulting polymer and which have to be determined experimentally from case to case.
The polyurethane prepolymer of the formula (III) preferably has a resilient character and possesses a glass transition temperature Tg of less than 0°C.
The monohydroxy-epoxide compound of the formula (II) has 1, 2 or 3 epoxide groups. The hydroxyl group of this monohydroxy-epoxide compound (II) may be a primary or secondary hydroxyl group.
Such monohydroxy-epoxide compounds can be produced, for example, by 3 o reacting polyols with epichlorohydrin. Depending on the reaction procedure, the corresponding monohydroxy-epoxide compounds also form in different concentrations as byproducts in the reaction of polyfunctional alcohols with epichlorohydrin. They can be isolated by conventional separation operations. As a rule, however, it is sufficient to use the product mixture 3 5 obtained in the glycidylation reaction of polyols and comprising polyols completely or partly reacted to give the glycidyl ether. Examples of such hydroxyl-containing epoxides are trimethylolpropane diglycidyl ether (contained as a mixture in trimethylolpropane triglycidyl ether), glyceryl diglycidyl ether (contained as a mixture in glyceryl triglycidyl ether), pentaerythrityl triglycidyl ether (contained as a mixture in pentaerythrityl tetraglycidyl ether). Trimethylolpropane diglycidyl ether, which occurs in a relatively high proportion in customarily prepared trimethylolpropane triglycidyl ether, is preferably used.
However, it is also possible to use other similar hydroxyl-containing epoxides, in particular glycidol, 3-glycidyloxybenzyl alcohol or hydroxymethylcyclohexene oxide. The f3-hydroxyether of the formula (VI), which is present in an amount of about 15% in commercially available liquid epoxy resins prepared from bisphenol A (R = CH3) and epichlorohydrin, and the corresponding f3-hydroxyethers (VI), which are formed in the reaction of bisphenol F (R = H) or of the mixture of bisphenol A and bisphenol F with epichlorohydrin, are furthermore preferred.
O~ R / \ O OH R
(VI) R R ~O
Furthermore, it is also possible to use a very wide range of epoxides having a f3-hydroxyether group, prepared by the reaction of (poly)epoxides with less than the stoichiometric amount of monovalent nucleophiles, such as carboxylic acids, phenols, thiols or secondary amines.
The free primary or secondary OH functionality of the monohydroxy-epoxide compounds of the formula (II) permits an efficient reaction with terminal isocyanate groups of prepolymers, it also being unnecessary to use disproportionate excess amounts of the epoxide component for this purpose.
The stoichiometric amounts of monohydroxy-epoxide compound of the formula (II) or its mixtures can be used for the reaction of the polyurethane 3o prepolymers of the formula (III). It is possible to depart from the stoichiometry with regard to its equivalents of OH groups and isocyanate groups. The ratio [OH]/[NCO] is from 0.6 to 3.0, preferably from 0.9 to 1.5, in particular from 0.98 to 1.1.
The polymer B has at least one aromatic structural element which is bound in the polymer chain via urethane groups. This structural element can be illustrated by formula (IV). Furthermore, simultaneously present in the polymer chain of the polymer B is a second structural element which can be illustrated by formula (V):
~~ O~N\*)p (IV) O
Y3 X~N~* q (V) O
The index p has the values of 2, 3 or 4, in particular p = 2 or 3, while the index q has the values of 2, 3 or 4, in particular q = 2 or 3. Furthermore, X
is S, O or NH, in particular O. The radical Are is a p-valent, optionally 1o substituted, aryl radical. The radical Y3 is a q-valent radical of an optionally chain-extended isocyanate-reactive polymer after removal of the terminal amino, thiol or hydroxyl groups. Finally, * in formulae (IV) and (V) the compound the linkage point to the remainder of the polymer chain. These structural elements are the result of the reactions for the preparation of the polymer B, which have already been described.
The polymer B advantageously has a resilient character and is furthermore advantageously soluble or dispersible in epoxy resins.
2o The polymer B can, if required, depending on the resulting viscosity, be diluted with further epoxy resins. Diglycidyl ethers of bisphenol A, bisphenol F and bisphenol A/F, and the reactive diluents F described further below and carrying epoxide groups, in particular hexanediol diglycidyl ether, polypropylene glycol diglycidyl ether and trimethylolpropane triglycidyl ether, are preferred for this purpose.
The total proportion of the polymer B is advantageously 5 - 40% by weight, preferably 7 - 35% by weight, based on the weight of the total composition.
3 o Furthermore, the composition contains at least one thixotropic agent C, based on a urea derivative in a non-diffusing carrier material. The V~10 2005/007720 PCT/EP2004/051519 preparation of such urea derivatives and carrier materials are described in detail in Patent Application EP 1 152 019 A1. The carrier material is advantageously a blocked polyurethane polymer C1, in particular obtained by reacting a trifunctional polyetherpolyol with IPDI and subsequently blocking the terminal isocyanate groups with caprolactam.
The urea derivative is a reaction product of an aromatic monomeric diisocyanate with an aliphatic amine compound. It is also entirely possible to react a plurality of different monomeric diisocyanates with one or more aliphatic amine compounds or a monomeric diisocyanate with a plurality of aliphatic amine compounds. The reaction product of 4,4'-diphenylmethylene diisocyanate (MDI) with butylamine has proven particularly advantageous.
The total proportion of the thixotropic agent C is advantageously 5 - 40% by weight, preferably 7 - 25% % by weight, based on the weight of the total composition. The proportion of the urea derivative is advantageously 5 -50% by weight, preferably 15 - 30% by weight, based on the weight of the thixotropic agent C.
The composition according to the invention furthermore contains at least one curing agent D for epoxy resins, which is activated by elevated temperature. It is preferably a curing agent which is selected from the group consisting of dicyandiamide, guanamines, guanidines, aminoguanidines and derivatives thereof. Catalytically active substituted ureas, such as 3-chloro-4-methylphenylurea (chlortoluron), or phenyldimethylureas, in particular p-chlorophenyl-N,N-dimethylurea (monuron), 3-phenyl-1,1-dimethylurea (fenuron) or 3,4-dichlorophenyl-N,N-dimethylurea (diuron) are furthermore possible. Compounds of the class consisting of the imidazoles and amine complexes may furthermore be used. Dicyandiamide is particularly preferred.
The total proportion of the curing agent D is advantageously 1 - 10% by weight, preferably 2 - 8% by weight, based on the weight of the total 3 5 composition.
In a preferred embodiment, the composition contains at least one filler E.
This preferably comprises mica, talc, kaolin, wollastonite, feldspar, chlorite, _ 17 _ bentonite, montmorillonite, calcium carbonate (precipitated or ground), dolomite, quartz, silicas (pyrogenic or precipitated), cristobalite, calcium oxide, aluminum hydroxide, magnesium oxide, hollow ceramic spheres, hollow glass spheres, hollow organic spheres, glass spheres or colored pigments. Filler E means both the organically coated and the uncoated commercially available forms known to the person skilled in the art.
The total proportion of the total filler E is advantageously 5 - 30% by weight, preferably 10 - 25% by weight, based on the weight of the total 1o composition.
In a further preferred embodiment, the composition additionally contains at least one reactive diluent F carrying epoxide groups. These reactive diluents F are in particular:
- glycidyl ethers of monofunctional saturated or unsaturated, branched or straight-chain, cyclic or open-chain C4-C3o alcohols, e.g.
butanol glycidyl ether, hexanol glycidyl ether, 2-ethylhexanol ether, allyl glycidyl ether, tetrahydrofurfuryl and furfuryl glycidyl ether, trimethoxysilyl glycidyl ether, etc.
- glycidyl ethers of difunctional saturated or unsaturated, branched or straight-chain, cyclic or open-chain C2-C3o alcohols, e.g.
ethylene glycol glycidyl ether, butanediol glycidyl ether, hexanediol glycidyl ether, octanediol glycidyl ether, cyclohexanedimethanol diglycidyl ether, neopentylglycol diglycidyl ether, etc.
- glycidyl ethers of tri- or polyfunctional, saturated or unsaturated, branched or straight-chain, cyclic or open-chain alcohols, such as epoxidized castor oil, epoxidized trimethylolpropane, epoxidized pentaerythrol or polyglycidyl ethers of aliphatic polyols, such as sorbitol, glycerol, trimethylolpropane, etc.
- glycidyl ethers of phenol and aniline compounds, such as phenyl glycidyl ether, cresol glycidyl ether, p-tert-butyl glycidyl ether, nonylphenol diglycidyl ether, 3-n-pentadecenyl glycidyl ether (from cashew nut shell oil), N,N-diglycidylaniline, etc.
- epoxidized tertiary amines, such as N,N-diglycidylcyclohexylamine, etc.
- epoxidized mono- or dicarboxylic acids, such as glycidyl neodecanoate, glycidyl methacrylate, glycidyl benzoate, diglycidyl phthalate, tetrahydrophthalate and hexahydrophthalate, diglycidyl esters of _ 1g _ dimeric fatty acids, etc.
- epoxidized di- or trifunctional, low molecular weight to high molecular weight polyetherpolyols, such as polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, etc.
Hexanediol diglycidyl ether, polypropylene glycol diglycidyl ether and polyethylene glycol diglycidyl ether are particularly preferred.
The total proportion of the reactive diluent F carrying epoxide groups is s0 advantageously 1 - 7% by weight, preferably 2 - 6% by weight, based on the weight of the total composition.
It has been found that the composition according to the invention is particularly suitable as one-component adhesives. In particular, it is possible to realize therewith heat-curable one-component adhesives which are distinguished by a high impact strength both at relatively high temperatures and especially at low temperatures, in particular from 0°C
to -40°C. Such adhesives are required for the adhesive bonding of heat-stable materials. Heat-stable materials are understood as meaning materials which are dimensionally stable at a curing temperature of 100 -220°C, preferably 120 - 200°C at least during the curing time.
These are in particular metals and plastics, such as ABS, polyamide, polyphenylene ether, composite materials, such as SMC, unsaturated polyesters glass fiber-reinforced plastics or epoxy or acrylate composite materials. The use in which at least one material is a metal is preferred. The adhesive bonding of identical or different metals, in particular in body-shell construction in the automotive industry, is considered to be a particularly preferred use. The preferred metals are especially steel, in particular electrolytically galvanized, hot-galvanized, oiled steel, bonazinc-coated steel and 3 o subsequently phosphated steel, and aluminum, in particular in the variants typically occurring in automotive construction.
In particular, the desired combination of high crash strength and high and low temperature of use can be achieved with an adhesive based on a composition according to the invention.
Such an adhesive is first brought into contact at a temperature of from 10°C
to 80°C, in particular from 10°C to 60°C, with the materials to be adhesively _ 1g _ bonded and is subsequently cured at a temperature of, typically, 100 -220°C, preferably 120 - 200°C.
Of course, in addition to heat-curable adhesives, sealing compounds or coatings can also be realized with a composition according to the invention.
Furthermore, the compositions according to the invention are suitable not only for automotive construction but also for other fields of use.
Particularly obvious are related applications in construction of means of transport, such as ships, trucks, buses or railway vehicles, or in the construction of consumer goods, such as, for example, washing machines.
The materials adhesively bonded by means of a composition according to the invention are used at temperatures of, typically, from 100°C to -40°C, preferably from 80°C to -40°C, in particular from 50°C to -40°C.
The compositions typically have a fracture energy, measured according to DIN 11343, of more than 10.0 J at -20°C and more than 7.0 J at -40°C.
Fracture energies of more than 11.0 J at -20°C and of more than 9.0 J at -40°C are preferred.
Hotmelt adhesives based on the composition according to the invention can also be realized in a special manner. Here, the hydroxyl groups forming in the case of the epoxide adduct A are additionally reacted with polyisocyanate or a polyisocyanate prepolymer. The viscosity is increased thereby, and hot application is required.
A further aspect of the invention relates to novel impact modifiers of the formula (I) of the polymer B which are terminated with epoxide groups and whose detailed constitution and methods of preparation have already been 3 o described further above.
It has been found that these impact modifiers of the formula (I) which are terminated with epoxide groups can be added to compositions containing epoxy resins. Systems which can also be formulated without adducts are possible. Both one-component and two-component or multicomponent systems, which may be room temperature-curable or heat-curable, are possible. In addition to the heat-curable, one-component compositions already described, they are also very suitable in the case of two-component ~ - 20 -or multicomponent epoxy resin compositions, in particular for those whose second component is an amine curing agent or polyamine curing agent or a mercaptan curing agent or a polymercaptan curing agent. The impact modifiers of the formula (I) which are terminated with epoxide groups are added to the curing component, one or more adducts being formed, or, preferably, added to that component which contains the epoxy resin.
Further, less preferred, possibilities are the addition of an impact modifier terminated with epoxide groups directly during the application or the addition as a constituent of a third or further component during the application.
The curing temperature of such 2-component or multicomponent epoxy resin compositions is preferably from 10°C to 60°C, in particular from 15°C
to 50°C. Impact modifiers of the formula (I) which are terminated with epoxide groups are suitable in particular as an additive to 2-component epoxy resin adhesives. Here, the increase in the impact strength is not limited to low temperatures.
Of particular interest is the partial precuring of the impact modifiers according to the invention, which are terminated with epoxide groups, by polyamines or polymercaptans, in particular by diamines and dimercaptans.
Thus, the 2-component system can be adjusted so that, as a result of partial precrosslinking, the adhesive acquires a highly viscous to rubber-like consistency which ensures the washout stability in wash processes at 2 5 temperatures up to 70°C.
These compositions, in particular adhesives, are applied, immediately before the application, by means of a 2-component or multicomponent mixing apparatus to the materials to be brought into contact. Such 2-3 o component or multicomponent adhesives can be used both in automotive construction and in the construction of means of transport (ships, trucks, buses or railway vehicles) or in the construction of consumer goods, such as, for example, washing machines, but also in the building sector, for example as stiffening structural adhesives (inter alia composite materials, 35 etc.).
Such a two-component adhesive can be formulated, for example, in such a way that the impact modifier is a constituent of the first component and at least one polyamine or at least one polymercaptan is a constituent of the second component.
After mixing and curing, such adhesives likewise have good adhesion to the substrates already described above.
Examples Some examples which further illustrate the invention but are not intended to limit the scope of the invention in any way are to be described below. The raw materials used in the examples are listed in table 1.
~ - 22 -Raw materials used Su lier Dimerized C18 fa acid Pri of 1013 Uni ema Tri hen I hos hine Fluka AG
Bis 4-h drox hen I sulfone = bis henol Fluka AG
S
Bis henol A di I cid I ether = DGEBA Vantico Polypropylene glycol diglycidyl ether (ED-506)Asah-Denka Ko 0 Dic andiamide = Dic De ussa Iso horone diisoc anate = IPDI De ussa-Huls Ca rolactam EMS Chemie N-Bu lamine BASF
4,4'-Di hen Imeth lene diisoc anate = MDI Ba er 2,4-Trimeth Ihexameth lene 1,6-diisoc anateDe ussa-Huls = TMDI
Hexanediol di I cid I ether Prummer Desmophen 3060 BS (trifunctional polypropyleneBayer glycol, OH
a uivalent wei ht = 1000 /OH a uivalent PoIyTHF 2000/PoIyTHF 2900 (difunctional BASF
polybutylene glycol, OH a uivalent wei ht = 1000 and 1450 /OH
a . res ectivel Liquiflex P (hydroxyl-terminated polybutadiene,Petroflex OH equivalent wei ht = about 1200 /OH a uivalent Pri last 2033 h drox -terminated dimerizedUni ema C18 fa acid Bis h drox meth I tric clo 5.2.1.0 2,6 Aldr7ch decane = TCD-DM
4,4'-Isopropylidenedicyclohexanol (= hydrogenatedAldrich bisphenol A, = A/H
Bis henol A Fluka AG
4,4'-[Bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)]Mitsui Chemicals = bis henol M
Resorcinol Fluka AG
Phenol hthalein Fluka AG
o-Cresol Fluka AG
Lewatit 1131 anionic ion exchan a resin BASF
1,3-Diisopropenylbenzene (= m-DIPEP) Cytec Table 1. Raw materials used.
General preparation of the epoxide adduct A or of the epoxide adduct A
premix:
Example for epoxide adduct A premix: A-VM1 123.9 g of a dimeric fatty acid, 1.1 g of triphenylphosphine and 71.3 g of bis(4-hydroxyphenyl) sulfone were reacted with 658 g of a liquid DGEBA
epoxy resin having an epoxide content of 5.45 eq/kg for 5 hours at 110°C
in vacuo and with stirring until a constant epoxide concentration of 2.82 eq/kg was reached. After the end of the reaction, 187.0 g of liquid DGEBA epoxy resin were additionally introduced into the reaction mixture A.
Exemplary areparation of a monohydroxyl-containing epoxide Trimethylolpropane glycidyl ether was prepared according to the process in 1o US Patent 5,668,227, example 1, from trimethylolpropane and epichlorohydrin with tetramethylammonium chloride and sodium hydroxide solution. A yellowish product having an epoxide number of 7.5 eq/kg and a hydroxyl group content of 1.8 eq/kg is obtained. From the HPLC-MS
spectrum, it is possible to conclude that substantially a mixture of trimethylolpropane diglycidyl ether and trimethylolpropane triglycidyl ether is present.
Exemplary preparation of a bisphenol (bis-OK5) \ \ \
H ~ ~ ~ ~ ~ OH
I\
I
2 0 _ H0 ~ "Bis-OK5"
864 g (8.0 mol) of o-cresol and 100 g of Lewatit-1131 (catalyst) were heated to 67°C at a pressure of 0.05 bar, and 50 ml of H20 (from Lewatit-1131 ) were distilled off. 316 g (2.0 mol) of m-DIPEP were then added dropwise under an N2 atmosphere in the course of 1 h, the temperature slowly increasing to 105°C. Stirring was effected for 3 h at 95°C under the N2 atmosphere. The catalyst was then filtered off through a wire net. At a pressure of 0.05 bar, the temperature was then increased stepwise to 230°C in the course of 1 h, and it was possible to distill off a 3 o total of 500 ml of o-cresol. In this way, 680 g of a highly viscous, honey-yellow material having a residual monomer content of 0.58% and an OH
content of about 5 eq/kg were obtained.
Various examples of the preparation of polymer B of the formula (I) are described below.
Examale of a polymer B (according to the invention): B-01 200 g of PoIyTHF 2000 (OH number 57.5 mg/g KOH) were dried for 30 minutes in vacuo at 100°C. 47.5 g of IPDI and 0.04 g of dibutyltin dilaurate were then added. The reaction was carried out in vacuo at 90°C until the NCO content was constant at 3.6% after 2.5 h (theoretical NCO content:
3.7%). Thereafter, 17.7 g of bisphenol M was added (NCO/OH ratio: 0.45) and stirring was continued in vacuo at 90°C once again until the NCO
content was constant at 2.1 % after 3 h (theoretical NCO content: 2.0%).
78.1 g of the trimethylolpropane glycidyl ether described above were then added as monohydroxyl-containing epoxide of the formula (II). Stirring was continued at 90°C in vacuo until the NCO content had decreased to below 0.1 % after a further 3 h. After the end of the reaction, 82.9 g of DGEBA
were added (1/3 of the mass of the unblocked, NCO-terminated prepolymer). A clear product having an epoxide content ("end EP content") of 2.51 eq/kg was thus obtained.
Further polymers B (accordingi to the invention): B-02 to B-09 Table 2 shows further examples of polymer as are used in compositions according to the invention. These polymers are prepared in the same way as example B-01.
Examale of a polymer P (not according to the invention): P-01 200 g of PoIyTHF 2000 (OH number 57.5 mg/g KOH) were dried for 30 minutes in vacuo at 100°C. 47.5 g of IPDI and 0.04 g of dibutyltin dilaurate were then added. The reaction was carried out in vacuo at 90°C until the NCO content was constant at 3.6% after 2.5 h (theoretical NCO content:
3.7%). 123.7 g of the trimethylolpropane glycidyl ether described above were then added as monohydroxyl-containing epoxide of the formula (II).
Stirring was continued at 90°C in vacuo until the NCO content had decreased to below 0.1 % after a further 3 h. After the end of the reaction, 82.5 g of DGEBA were added (1/3 of the mass of the unblocked, NCO
terminated prepolymer). A clear product having an epoxide content ("end EP content") of 3.15 eq/kg was thus obtained.
P-01 thus contains no polyphenol structural units in the polymer chain.
Further examales of aolymers P (not according to the invention): P-02 to P-The polymers P-02 to P-05 are prepared according to table 2 in the same manner as the polymer P-01 or analogously to B-01. In the case of polymer P-02, the same amount of bisphenol M as in example B-01 was used, but bisphenol M it was dissolved in the hot polymer right at the end of the synthesis. The polymer P-02 accordingly contains free, unbound bisphenol M. The polymer P-03, P-04 and P-05 contain aliphatic diols instead of the bisphenol M of example B-01.
O ~ N N 07O
O
~ O ~ N O
O O 0 O~ O
Lf1 ~ O ~ ~ D) CV
O CO OD~ fV
d~
O
O O ~ N n OM N
O O et N N
n O,Mp,N
O
W
O ~ ~ ~ OO O
O I~ N1~O
~
a N ~ t a0~ M
O ~ ~ O) _ O ~ I~
M
OD~
O O aD O~ O~ ~~ N
O
~rj ~ ~ N
m ~ ~ O~ N
O
N O O
~ M
M
Q O O ~ M OO tn O ~rj p ~~ N
~
M ~ I~M CV
O ~ N ~ O
N
O ~ nj In N ~1' N I~ OD~ N
I
h O O) m O On h O
O Npp,n O~ CV
O
I O
O O) ON M
N N
~ G~ N
O
N
X17 CO ~ O)~ O
~ N
N ~ C~ N N
p N
N O ~ ~ y(7M w ~ N
t O~ N C
D D
O
O _ N _ C
n Is O NCO~
N '~t I~ CO~ CVO
Y d d ~ ~ d ' ,nO O N O O ~ N ~ N N O O N O
O ~ ~~ ~ M ,tj~ 1nO)X I~CVIs ~ ~ d M
O I~~ ~ N ~ O O I~c0 O
N ~ ~ .- c0 . .
O
W NJ
O
O
N
'C
C a.r O H N M Z C ~ N
N
O y ~ ~ Q ~ns o a a =
y \ 4 N ~ O
Ll1 O O ' C N p C p p L D O ~ V ~
- -L I ~ V d L L L C O ~ (~t V m L C N
I
O L l _ ~ d T E
' H0 ~ .cN ~ O N L ~ ~c~ N ~ L 111 'pt N
-O H F-_ !~a _ _ m m a m O E
3 a o a a Thixotropic agent C
As an example of a thixotropic agent C based on a urea derivative in a nondiffusing carrier material, a thixotropic agent C was prepared according to Patent Application EP 1 152 019 A1 in a blocked polyurethane prepolymer using abovementioned raw materials:
Carrier material: Blocked polyurethane prepolymer C1:
600.0 g of a polyetherpolyol (3000 Dalton; OH number 57 mg/g KOH) were reacted with 140.0 g of IPDI in vacuo and with stirring at 90°C until the isocyanate content remained constant, the isocyanate-terminated prepolymer being obtained. The free isocyanate groups were then blocked with caprolactam (2% excess).
i5 Urea derivative (HSD1) in blocked polyurethane prepolymer 68.7 g of MDI flakes were melted in 181.3 g of the blocked prepolymer described above under nitrogen and with gentle heating. 40.1 g of N-butylamine, dissolved in 219.9 g of the blocked prepolymer described above, were then added dropwise in the course of two hours under 2 o nitrogen and with rapid stirring. After the end of the addition of the amine solution, the white paste was stirred for a further 30 minutes. Thus, after cooling, a white, soft paste which had a free isocyanate content of < 0.1 (proportion of urea derivative about 20%) was obtained.
2 5 Example compositions Various adhesive compositions according to tables 3 and 4 were prepared as examples.
For comparison with the example compositions Z-01 to Z-09 according to 3 o the invention, Ref 01 the highly structural epoxy adhesive Betamate~-1493 (commercially available from Dow-Automotive, Freienbach, Switzerland), Ref 02 and Ref 03, and X 01 to X 04 were used as examples not according to the invention.
3 5 After application to electrolytically galvanized steel (eloZn), the adhesives were cured at 50°C in the course of 30 minutes in an oven at 180°C. All tests were effected one day after cooling of the adhesive bond to room temperature.
. _ 2g _ A-VM1 55.6 55.6 55.655.6 55.6 55.6 55.6 55.6 55.6 B-01 36.0 B-02 36.0 B-03 36.0 B-04 36.0 B-05 36.0 B-06 36.0 8-07 36.0 B-08 36.0 B-09 36.0 C 10.0 10.0 10.010.0 10.0 10.0 10.0 10.0 10.0 Dicyandiamide 4.5 4.5 4.5 4.5 4.5 4.5 4.4 4.4 4.6 (D) [g]
Filler mixture22.0 22.0 22.022.0 22.0 22.0 22.0 22.0 22.0 (E) [g]
Hexanediol diglycidyl 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 ether ED-506 2.4 2.4 2.4 2.4 2.4 2.4 2.4 2.4 2.4 TSS MPa 19.0 19.6 20.621.5 18.5 20.7 19.0 19.7 22.5 FE' at 50C 13.7 14.7 14.215.6 12.9 15.2 14.2 12.1 15.3 J
FE' at 23C 14.5 15.0 14.215.6 13.3 14.9 14.4 14.5 15.8 J
FE' at 0C J 13.7 14.1 12.915.1 14.5 14.4 15.2 13.2 13.2 FE' at -20C 11.9 11.6 11.112.9 11.5 11.7 13.3 12.7 13.2 J
FE' at -40C 10.7 9.9 10.210.0 9.1 9.6 10.4 10.9 11.9 J
Table 3. Compositions according to the invention.
Ref Ref Ref X 01 X X 03 X
A-VM1 55.6 55.6 55.6 55.6 55.6 55.6 P-01 18.0 36.0 P-02 36.0 P-03 36.0 P-04 36.0 P-05 36.0 C 21.0 10.0 10.0 10.0 10.0 10.0 Dicyandiamide 4.0 4.6 4.6 4.6 4.5 4.5 (D) [g]
Filler mixture 22,0 22.0 22.0 22.0 22.0 22.0 (E' [g]
Hexanediol diglycidyl 1.5 1.5 1.5 1.5 1.5 1.5 ether ED-506 2.4 2.4 2.4 2.4 2.4 2.5 TSS MPa 19.9 19.8 20.3 13.2 21.0 19.6 19.9 FE' at 50C 18.0 14.3 13.8 12.9 9.0 9.7 15.0 J
FE' at 23C 17.8 14.4 13.6 13.4 12.5 10.1 13.8 J
FE' at 0C J 16.2 14.0 12.5 11.6 7.2 10.4 12.0 FE' at -20C 4.2 11.9 10.3 10.1 5.3 8.7 11.6 [J]
FE' at -40C 0.5 6.0 5.5 2.9 0.6 2.3 0.4 [J]
Table 4. Reference examples and counter-examples.
Test methods:
Tensile shear strength (TSS) (DIN EN 1465) The test specimens were produced using electrolytically galvanized steel (eloZn) having the dimensions 100 x 25 x 0.8 mm; the adhesion area was 25 x 10 mm with a layer thickness of 0.3 mm. Curing was effected for 30 min at 180°C. The take-off rate was 10 mm/min.
Dynamic resisfance fo cleavage (ISO 11343) The test specimens were produced using electrolytically galvanized steel (eloZn) having the dimensions 90 x 25 x 0.8 mm; the adhesion area was 25 x 30 mm with a layer thickness of 0.3 mm. Curing was effected for 30 min at 180°C. The take-off rate was 2 m/s. The area under the measured curve (from 25% to 90%, according to DIN 11343) is stated as the fracture energy (FE) in joules.
~ - 30 -Results:
The results of the adhesive formulations in tables 3 and 4 show that the combination of high strength and high impact strength can be achieved both at room temperature and at low temperatures down to -40°C with the compositions according to the invention (1-01 to Z-09).
The reference example Ref 01 (Betamate~-1493, Dow Automotive) shows good impact strengths at temperatures above 0°C but has significantly lower values at low temperatures, i.e. below 0°C, in comparison with the 1o adhesives according to the invention.
The reference example Ref 02 contains, as polymer P-01, a polymer terminated with epoxide groups without phenolic structural elements. This example shows considerably improved impact strength values at temperatures down to -20°C in comparison with Ref 01, but these values decrease markedly at lower temperatures in comparison with the compositions according to the invention.
The reference example Ref 03 is comparable with Ref 02 but firstly has a 2 o higher proportion of the polymer P-01 terminated with epoxide groups and secondly has a lower content of thixotropic agent C. The values obtained are comparable with those which were obtained with the adhesive formulation Ref 02.
The compositions X 01 to X 04 not according to the invention each contain the polymers P02 to P05. X 01 shows an impact strength reduction which is substantial especially at low temperatures. Instead of the phenol structural elements, X 02 to X 04 have structural elements originating from aliphatic diols. X 02 to X 04 likewise all exhibit a considerable reduction in the impact strength, particularly at low temperatures.
The compositions Z 01 to Z 09 according to the invention which are summarized in table 3 all have good fracture energies. While the remaining mechanical values, such as tensile shear strength, are maintained, in particular the values at temperatures from 0°C to -40°C are greatly improved in comparison with the reference examples from table 4. The positive effect is substantially independent of the diisocyanates and bisphenols used.
Claims (31)
1. A composition comprising at least one epoxide adduct A having on average more than one epoxide group per molecule;
at least one polymer B of the formula (I) in which Y1 is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups;
Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups;
n is 2, 3 or 4;
m is 1, 2 or 3;
and has at least one aromatic structural element which is bound in the polymer chain via urethane groups;
at least one thixotropic agent C based on a urea derivative in a nondiffusing carrier material;
and at least one curing agent D for epoxy resins which is activated by elevated temperature.
at least one polymer B of the formula (I) in which Y1 is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups;
Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups;
n is 2, 3 or 4;
m is 1, 2 or 3;
and has at least one aromatic structural element which is bound in the polymer chain via urethane groups;
at least one thixotropic agent C based on a urea derivative in a nondiffusing carrier material;
and at least one curing agent D for epoxy resins which is activated by elevated temperature.
2. The composition as claimed in claim 1, characterized in that the epoxide adduct A is obtainable from the reaction of at least one dicarboxylic acid and at least one diglycidyl ether;
or of at least one bis(aminophenyl) sulfone isomer or of at least one aromatic alcohol and at least one diglycidyl ether.
or of at least one bis(aminophenyl) sulfone isomer or of at least one aromatic alcohol and at least one diglycidyl ether.
3. The composition as claimed in claim 2, characterized in that the dicarboxylic acid is a dimeric fatty acid, in particular at least one dimeric C4-C20 fatty acid, and the diglycidyl ether is bisphenol A
diglycidyl ether, bisphenol F diglycidyl ether or bisphenol A/F
diglycidyl ether.
diglycidyl ether, bisphenol F diglycidyl ether or bisphenol A/F
diglycidyl ether.
4. The composition as claimed in claim 2 or 3, characterized in that the aromatic alcohol is selected from the group consisting of 2,2-bis(4-hydroxyphenyl)propane, bis(4-hydroxyphenyl)methane, bis(4-hydroxyphenyl) sulfone (= bisphenol S), hydroquinone, resorcinol, pyrocatechol, naphthohydroquinone, naphthoresorcinol, dihydroxy-naphthalene, dihydroxyanthraquinone, dihydroxybiphenyl, 3,3-bis(p-hydroxyphenyl)phthalides, 5,5-bis(4-hydroxyphenyl)hexahydro-4,7-methanoindane, 4,4'-[bis(hydroxyphenyl)-1,3-phenylenebis(1-methylethylidene)] (= bisphenol M), 4,4'-[bis(hydroxyphenyl)-1,4-phenylenebis(1-methylethylidene)] (= bisphenol P) and all isomers of the abovementioned compounds, and the diglycidyl ether is bisphenol A diglycidyl ether, bisphenol F diglycidyl ether or bisphenol A/F diglycidyl ether.
5. The composition as claimed in any of the preceding claims, characterized in that the polymer B is soluble or dispersible in epoxy resins.
6. The composition as claimed in any of the preceding claims, characterized in that the polymer B is obtainable from the reaction of a monohydroxyepoxide of the formula (II) and of a linear or branched polyurethane prepolymer terminated with isocyanate groups and of the formula (III)
7. The composition as claimed in claim 6, characterized in that, in the process for the preparation of the polyurethane prepolymer of the formula (III), at least one polyisocyanate, at least one, optionally substituted, polyphenol and at least one isocyanate-reactive polymer are used.
8. The composition as claimed in claim 7, characterized in that the isocyanate-reactive polymer of the formula (III) is a polyol selected from the group consisting of the polyoxyalkylenepolyols, polyhydroxy-terminated polybutadienepolyols, styrene/acrylonitrile-grafted polyetherpolyols, polyhydroxy-terminated acrylonitrile/butadiene copolymers, polyesterpolyols and polycarbonatepolyols.
9. The composition as claimed in claim 7 or 8, characterized in that the isocyanate-reactive polymer of the formula (III) is an .alpha.,.omega.-polyalkylene glycol having C2-C6-alkylene groups or having mixed C2-C6-alkylene groups, in particular a polypropylene glycol or a polybutylene glycol.
10. The composition as claimed in any of claims 7-9, characterized in that the isocyanate-reactive polymer of the formula (III) has an equivalent weight of 600 - 6000 g/equivalent of NCO-reactive groups, in particular of 700 - 2200 g/equivalent of NCO-reactive group.
11. The composition as claimed in any of claims 7-9, characterized in that the polyisocyanate of the formula (III) is a diisocyanate, preferably HDI, IPDI, TMDI, MDI or TDI.
12. The composition as claimed in any of the preceding claims, characterized in that the polymer chain of the polymer B
simultaneously has the structural elements of the formulae (IV) and (V) in which p is 2, 3 or 4, in particular p is 2 or 3;
q is 2, 3 or 4, in particular q is 2 or 3;
X is S, O or NH; in particular X is O;
Ar1 is a p-valent, optionally substituted, aryl radical;
Y3 is a q-valent radical of an isocyanate-reactive polymer after removal of the terminal amino, thiol or hydroxyl groups and * is the linkage point to the remainder of the polymer chain.
simultaneously has the structural elements of the formulae (IV) and (V) in which p is 2, 3 or 4, in particular p is 2 or 3;
q is 2, 3 or 4, in particular q is 2 or 3;
X is S, O or NH; in particular X is O;
Ar1 is a p-valent, optionally substituted, aryl radical;
Y3 is a q-valent radical of an isocyanate-reactive polymer after removal of the terminal amino, thiol or hydroxyl groups and * is the linkage point to the remainder of the polymer chain.
13. The composition as claimed in any of the preceding claims, characterized in that the proportion by weight of all polymers B of the formula (I) is from 5 to 40% by weight, preferably from 7 to 30%
by weight, based on the weight of the total composition.
by weight, based on the weight of the total composition.
14. The composition as claimed in any of the preceding claims, characterized in that the carrier material of the thixotropic agent C is a blocked polyurethane prepolymer.
15. The composition as claimed in any of the preceding claims, characterized in that the urea derivative in the thixotropic agent C is a product of the reaction of an aromatic monomeric diisocyanate, in particular 4,4'-diphenylmethylene diisocyanate, with an aliphatic amine compound, in particular butylamine.
16. The composition as claimed in any of the preceding claims, characterized in that the total proportion of the thixotropic agent C is 5 - 40% by weight, preferably 10 - 25% by weight, based on the weight of the total composition.
17. The composition as claimed in any of the preceding claims, characterized in that the proportion of the urea derivative is 5 - 50%
by weight, preferably 15 - 30% by weight, based on the weight of the thixotropic agent C.
by weight, preferably 15 - 30% by weight, based on the weight of the thixotropic agent C.
18. The composition as claimed in any of the preceding claims, characterized in that the curing agent D is a latent curing agent selected from the group consisting of dicyandiamide, guanamines, guanidines and aminoguanidines.
19. The composition as claimed in any of the preceding claims, characterized in that the total proportion of the curing agent D is 1 -10% by weight, preferably 2 - 8% by weight, based on the weight of the total composition.
20. The composition as claimed in any of the preceding claims, characterized in that at least one filler E is additionally present.
21. The composition as claimed in claim 20, characterized in that the total proportion of the filler E is 5 - 30% by weight, preferably 10 -25% by weight, based on the weight of the total composition.
22. The composition as claimed in any of the preceding claims, characterized in that at least one reactive diluent F carrying epoxide groups is additionally present.
23. The composition as claimed in any of the preceding claims, characterized in that the composition, after curing, has a low-temperature fracture energy, measured according to DIN 11343, of more than 10 J at -20°C and of more than 7 J at -40°C and preferably of more than 11 J at -20°C and of more than 9 J at -40°C.
24. An impact strength modifier terminated with epoxide groups and of the formula (I) in which Y1 is an n-valent radical of a linear or branched polyurethane prepolymer terminated with isocyanate groups after removal of the terminal isocyanate groups;
Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups;
n is 2, 3 or 4;
m is 1, 2 or 3;
and has at least one structural element which is bound in the polymer chain via urethane groups.
Y2 is a radical of an aliphatic, cycloaliphatic, aromatic or araliphatic epoxide containing a primary or secondary hydroxyl group after removal of the hydroxide and epoxide groups;
n is 2, 3 or 4;
m is 1, 2 or 3;
and has at least one structural element which is bound in the polymer chain via urethane groups.
25. The impact strength modifier terminated with epoxide groups, as claimed in claim 24, characterized in that the polymer chain of the impact strength modifier simultaneously has structural elements of the formulae (IV) and (V) in which p is 2, 3 or 4, in particular p is 2 or 3;
q is 2, 3 or 4, in particular q is 2 or 3;
X is S, O or NH; in particular X is O;
Ar1 is a p-valent, optionally substituted aryl radical;
Y3 is a q-valent, optionally chain-extended, radical of an isocyanate-reactive polymer after removal of the terminal amino, thiol or hydroxyl groups and * is the linkage point to the remainder of the polymer chain.
q is 2, 3 or 4, in particular q is 2 or 3;
X is S, O or NH; in particular X is O;
Ar1 is a p-valent, optionally substituted aryl radical;
Y3 is a q-valent, optionally chain-extended, radical of an isocyanate-reactive polymer after removal of the terminal amino, thiol or hydroxyl groups and * is the linkage point to the remainder of the polymer chain.
26. The impact strength modifier terminated with epoxide groups, as claimed in claim 24 or 25, characterized in that the impact strength modifier is obtainable from the reaction of a monohydroxyepoxide of the formula (II) with a linear or branched polyurethane prepolymer terminated with isocyanate groups and of the formula (III), and in that at least one polyisocyanate and at least one polyphenol and at least one isocyanate-reactive polymer are used in the preparation of this polyurethane prepolymer.
27. The use of a composition as claimed in any of claims 1 - 23 as a one-component adhesive.
28. The use of an impact strength modifier terminated with epoxide groups, as claimed in any of claims 24 - 26, in a two-component adhesive, characterized in that this impact strength modifier is a constituent of the first component and at least one polyamine or at least one polymercaptan is a constituent of the second component.
29. The use as claimed in claim 27 or 28, characterized in that the adhesive is used for the adhesive bonding of heat-stable materials, in particular of metals.
30. The use as claimed in any of claims 27 to 29, characterized in that the adhesive is used as a body-shell construction adhesive in automotive construction.
31. A method for the adhesive bonding of heat-stable materials, in particular of metals, characterized in that these materials are brought into contact with a composition as claimed in any of claims 1 - 23 and comprises a subsequent step of curing at a temperature of 100 - 220°C, preferably 120 - 200°C.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP03016146.7 | 2003-07-16 | ||
| EP03016146A EP1498441A1 (en) | 2003-07-16 | 2003-07-16 | Temperature curable compositions with low temperature impact strength modifier |
| PCT/EP2004/051519 WO2005007720A1 (en) | 2003-07-16 | 2004-07-16 | Thermohardening compositions comprising low-temperature impact strength modifiers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2532215A1 true CA2532215A1 (en) | 2005-01-27 |
Family
ID=33462132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002532215A Abandoned CA2532215A1 (en) | 2003-07-16 | 2004-07-16 | Heat-curable compositions comprising low-temperature impact strength modifiers |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8076424B2 (en) |
| EP (2) | EP1498441A1 (en) |
| JP (1) | JP4542097B2 (en) |
| KR (1) | KR20060036093A (en) |
| AT (1) | ATE364644T1 (en) |
| CA (1) | CA2532215A1 (en) |
| DE (1) | DE502004004103D1 (en) |
| ES (1) | ES2289549T3 (en) |
| MX (1) | MXPA06000429A (en) |
| WO (1) | WO2005007720A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008045270A1 (en) | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
| US7919555B2 (en) | 2005-08-24 | 2011-04-05 | Henkel Ag & Co. Kgaa | Epoxy compositions having improved impact resistance |
| US8673108B2 (en) | 2006-07-31 | 2014-03-18 | Henkel Ag & Co. Kgaa | Curable epoxy resin-based adhesive compositions |
| US9133375B2 (en) | 2007-10-30 | 2015-09-15 | Henkel Ag & Co. Kgaa | Epoxy-paste adhesives resistant to wash-off |
Families Citing this family (93)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077460B2 (en) | 2002-04-30 | 2006-07-18 | L&L Products, Inc. | Reinforcement system utilizing a hollow carrier |
| EP1359202A1 (en) | 2002-05-03 | 2003-11-05 | Sika Schweiz AG | Temperature curable epoxy resin composition |
| EP1431325A1 (en) | 2002-12-17 | 2004-06-23 | Sika Technology AG | Heat-curable epoxy resin composition with improved low-temperatur impact strength |
| US7125461B2 (en) | 2003-05-07 | 2006-10-24 | L & L Products, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| US7199165B2 (en) | 2003-06-26 | 2007-04-03 | L & L Products, Inc. | Expandable material |
| EP1498441A1 (en) | 2003-07-16 | 2005-01-19 | Sika Technology AG | Temperature curable compositions with low temperature impact strength modifier |
| US8070994B2 (en) | 2004-06-18 | 2011-12-06 | Zephyros, Inc. | Panel structure |
| US7700670B2 (en) * | 2005-05-13 | 2010-04-20 | Beach Brian A | Low-density molding compound |
| CN101193975B (en) † | 2005-06-09 | 2011-01-12 | 株式会社艾迪科 | Hardenable resin composition |
| EP1741734A1 (en) | 2005-07-05 | 2007-01-10 | Sika Technology AG | Heat curable epoxy resin composition having low temperature impact strength comprising solid epoxy resins |
| EP1754721A1 (en) * | 2005-08-16 | 2007-02-21 | Sika Technology AG | Amino groups terminated tougheners, their derivatives and their use |
| EP1876194A1 (en) * | 2006-06-30 | 2008-01-09 | Sika Technology AG | Heat curing composition usable as an adhesive for coated substrates |
| EP1916269A1 (en) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Blocked polyurethane prepolymers and heat curing epoxy resin compositions |
| EP1916270A1 (en) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Heat curable epoxy compositions with blocked polyurethane prepolymers |
| EP1916272A1 (en) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Heat curable epoxide compositions containing a blocked and an epoxyterminated polyurethane prepolymer. |
| EP1916285A1 (en) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Derivatized solid epoxy resin and its use |
| WO2008070077A2 (en) * | 2006-12-04 | 2008-06-12 | E. I. Du Pont De Nemours And Company | Coating material containing a mixture of mineral silicates and diurea |
| EP1935955A1 (en) * | 2006-12-21 | 2008-06-25 | Sika Technology AG | Method for adhesively bonding a hem flange |
| EP1972646A1 (en) | 2007-03-20 | 2008-09-24 | Sika Technology AG | Time-phased epoxy group polymers, their compositions and their utilisation as impact resistance modifiers |
| WO2008127925A2 (en) * | 2007-04-11 | 2008-10-23 | Dow Global Technologies, Inc. | Structural epoxy resins containing core-shell rubbers |
| BRPI0809752B1 (en) | 2007-04-11 | 2017-05-16 | Dow Global Technologies Inc | "one component structural adhesive and method" |
| CN101679579B (en) * | 2007-06-20 | 2012-05-30 | 陶氏环球技术公司 | Crash durable epoxy adhesives with very low sensitivity to temperature variations |
| EP2017260A1 (en) | 2007-07-16 | 2009-01-21 | Sika Technology AG | Aldimines and compounds containing aldimine |
| EP2017294A1 (en) * | 2007-07-16 | 2009-01-21 | Sika Technology AG | Heat hardened foam |
| KR20100059818A (en) * | 2007-07-26 | 2010-06-04 | 헨켈 코포레이션 | Curable epoxy resin-based adhesive compositions |
| EP2181156A1 (en) * | 2007-08-17 | 2010-05-05 | Dow Global Technologies Inc. | Two part crash durable epoxy adhesives |
| EP2030967A1 (en) * | 2007-08-31 | 2009-03-04 | Sika Technology AG | Aldimines containing hydroxyl groups and compositions containing aldimine |
| EP2060592B1 (en) | 2007-11-14 | 2010-01-27 | Sika Technology AG | Non-aromatic ureae containing thermosetting epoxy resin composition for use as a catalyst |
| WO2009094295A1 (en) * | 2008-01-22 | 2009-07-30 | Dow Global Technologies Inc. | Structural epoxy resin adhesives containing epoxide-functional, polyphenol-extended elastomeric tougheners |
| EP2085426B1 (en) * | 2008-01-30 | 2010-10-13 | Sika Technology AG | Wash-resistant thermo hardening epoxy resin adhesives |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| EP2110397A1 (en) | 2008-04-16 | 2009-10-21 | Sika Technology AG | Polyurethane polymer based on amphiphilic block copolymers and its use as impact resistance modifier |
| JP5687187B2 (en) | 2008-04-30 | 2015-03-18 | シーカ・テクノロジー・アーゲー | Activator for epoxy resin composition |
| EP2113525A1 (en) | 2008-04-30 | 2009-11-04 | Sika Technology AG | Activator for epoxy resin composites |
| EP2128182A1 (en) | 2008-05-28 | 2009-12-02 | Sika Technology AG | Heat hardened epoxy resin compound containing a catalyst with heteroatoms |
| ATE461953T1 (en) | 2008-07-17 | 2010-04-15 | Sika Technology Ag | ADHESION PROMOTER COMPOUNDS FOR OILED STEEL |
| EP2145924A1 (en) | 2008-07-18 | 2010-01-20 | Sika Technology AG | Reaction products based on amphiphilic block copolymers and use thereof as impact modifiers |
| WO2010019539A2 (en) | 2008-08-11 | 2010-02-18 | Dow Global Technologies Inc. | One-part structural epoxy resin adhesives containing elastomeric tougheners capped with phenols and hydroxy-terminated acrylates or hydroxy-terminated methacrylates |
| ATE468344T1 (en) | 2008-08-27 | 2010-06-15 | Sika Technology Ag | SILANE/UREA COMPOUND AS A HEAT ACTIVATED HARDENER FOR EPOXY RESIN COMPOSITIONS |
| EP2182025B1 (en) | 2008-10-31 | 2010-10-06 | Sika Technology AG | Heat curable epoxide resin compositions suitable as bodyshop adhesive or structural foam |
| WO2010098950A1 (en) | 2009-02-26 | 2010-09-02 | Dow Global Technologies Inc. | One-part structural epoxy resin adhesives containing dimerized fatty acid/epoxy resin adduct and a polyol |
| DE102009028100A1 (en) | 2009-07-29 | 2011-02-03 | Henkel Ag & Co. Kgaa | Impact-modified epoxy resin-based composition |
| GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
| CA2773877C (en) | 2009-10-05 | 2015-06-02 | Construction Research & Technology Gmbh | Polyurethane formulation with high green strength and gunnability |
| WO2011056357A1 (en) | 2009-11-05 | 2011-05-12 | Dow Global Technologies Llc | Structural epoxy resin adhasives containing elastomeric tougheners capped with ketoximes |
| WO2011109699A1 (en) | 2010-03-04 | 2011-09-09 | Zephyros, Inc. | Structural composite laminate |
| CN101914362B (en) * | 2010-08-10 | 2013-05-08 | 上海材料研究所 | Two-component adhesive capable of being cured at room temperature and synthesis method thereof |
| EP2436712A1 (en) | 2010-10-01 | 2012-04-04 | Sika Technology AG | Tougheners for epoxy resin compositions |
| WO2012091842A2 (en) | 2010-12-26 | 2012-07-05 | Dow Global Technologies Llc | Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds |
| JP6049705B2 (en) * | 2011-05-19 | 2016-12-21 | ダウ グローバル テクノロジーズ エルエルシー | Novel structural adhesives and their use |
| JP5110237B1 (en) * | 2011-05-27 | 2012-12-26 | Dic株式会社 | Epoxy resin composition, fiber sizing agent, fiber material and molding material |
| BR112015006555A2 (en) * | 2012-09-24 | 2017-07-04 | Sika Tech Ag | prepolymer hardener for crack resistant adhesives for windmills |
| US10214611B2 (en) | 2012-11-12 | 2019-02-26 | Sika Technology Ag | Impact modifiers for epoxy-based adhesives |
| EP2730594A1 (en) | 2012-11-12 | 2014-05-14 | Sika Technology AG | Reactive liquid rubbers from blocked isocyanate terminated prepolymers with glycol catcher |
| CN105722933A (en) | 2013-07-26 | 2016-06-29 | 泽费罗斯股份有限公司 | Improvements in or relating to thermosetting adhesive films |
| KR101678419B1 (en) | 2013-11-18 | 2016-11-22 | 한국화학연구원 | Composition using polymerization of polyurethane and polyurethane polymerized thereof |
| JP6344021B2 (en) * | 2014-04-04 | 2018-06-20 | パナソニックIpマネジメント株式会社 | Adhesive composition for metal member and thermoplastic resin-coated metal member using the same |
| CN105295325B (en) | 2014-06-27 | 2019-12-27 | 康廷南拓结构塑料有限公司 | Low-density molding materials comprising surface-modified microspheres |
| GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
| KR101637785B1 (en) * | 2014-12-22 | 2016-07-08 | 현대자동차주식회사 | Hybrid door for automobile |
| EP3240830B1 (en) | 2014-12-31 | 2020-09-30 | Dow Global Technologies LLC | Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance |
| BR112017024945B1 (en) | 2015-06-02 | 2022-05-24 | Dow Global Technologies Llc | Adhesive composition and cured adhesive |
| WO2017044359A1 (en) | 2015-09-10 | 2017-03-16 | Dow Global Technologies Llc | High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers |
| EP3347398B1 (en) | 2015-09-10 | 2024-07-31 | DDP Specialty Electronic Materials US, LLC | One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance |
| WO2017044402A1 (en) * | 2015-09-10 | 2017-03-16 | Dow Global Technologies Llc | Blocked polyurethane tougheners for epoxy adhesives |
| WO2017127253A1 (en) | 2016-01-19 | 2017-07-27 | Dow Global Technologies Llc | One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same |
| BR112019008052B1 (en) | 2016-10-24 | 2023-10-31 | Dow Global Technologies Llc | SINGLE COMPONENT THERMOCURABLE EPOXY ADHESIVE AND METHOD FOR FORMING AN ADHESIVE BOND BETWEEN TWO SUBSTRATES |
| WO2018081032A1 (en) | 2016-10-25 | 2018-05-03 | Dow Global Technologies Llc | Epoxy adhesive having improved low-temperature impact resistance |
| CN110072915A (en) | 2016-10-28 | 2019-07-30 | 陶氏环球技术有限责任公司 | Impact resistant epoxy adhesive with improved low-temperature impact resistance |
| AU2017382854B2 (en) * | 2016-12-21 | 2021-12-09 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Latent curing accelerators |
| KR102481041B1 (en) | 2017-02-26 | 2022-12-27 | 다우 글로벌 테크놀로지스 엘엘씨 | One-component reinforced epoxy adhesive containing latent hardener mixture |
| US20200140727A1 (en) | 2017-08-15 | 2020-05-07 | Ddp Specialty Electronics Materials Us, Inc. | Two-component room temperature curable toughened epoxy adhesives |
| WO2019055129A1 (en) | 2017-09-12 | 2019-03-21 | Dow Global Technologies Llc | Adhesive formulation |
| CN111630130B (en) | 2017-09-12 | 2022-09-30 | Ddp特种电子材料美国公司 | Single-component toughened epoxy adhesive |
| EP3728370B1 (en) * | 2017-12-19 | 2023-10-04 | Sika Technology Ag | Method for structurally joining substrates with different thermal length expansion coefficients |
| PL3735433T3 (en) * | 2018-01-03 | 2024-06-10 | Sika Technology Ag | Epoxy resin composition for coating applications |
| WO2019231694A1 (en) | 2018-05-29 | 2019-12-05 | Dow Global Technologies Llc | Method for bonding using one-component epoxy adhesive mixtures |
| JP7240489B2 (en) | 2018-11-14 | 2023-03-15 | シーカ テクノロジー アクチェンゲゼルシャフト | Thixotropic agent for curable compositions |
| CN109705793A (en) * | 2019-01-16 | 2019-05-03 | 荆晓东 | The preparation method of modified epoxy adhesive |
| WO2020236366A1 (en) | 2019-05-21 | 2020-11-26 | Ddp Specialty Electronic Materials Us, Llc | Epoxy adhesive composition and method of use |
| CN113966356B (en) | 2019-06-14 | 2023-10-13 | Sika技术股份公司 | Toughened two-component epoxy composition |
| CN114008162A (en) | 2019-06-18 | 2022-02-01 | Ddp特种电子材料美国有限责任公司 | One-component toughened epoxy adhesives with improved moisture resistance |
| CN110437790A (en) * | 2019-08-16 | 2019-11-12 | 浙江金石包装有限公司 | A kind of preparation method of solventless adhesive, composite soft packaging material and composite soft packaging material |
| ES2973449T3 (en) * | 2019-12-13 | 2024-06-20 | Henkel Ag & Co Kgaa | Two-component (2K) curable adhesive composition |
| EP4232496A1 (en) | 2020-10-26 | 2023-08-30 | DDP Specialty Electronic Materials US, LLC | One-component structural adhesive |
| CN112724896B (en) * | 2020-12-21 | 2022-06-07 | 东风汽车集团有限公司 | Structural adhesive with excellent moisture and heat resistance and preparation method thereof |
| CN115637124B (en) * | 2021-07-19 | 2023-09-22 | 沃顿科技股份有限公司 | Preparation method of two-component epoxy resin adhesive and two-component epoxy resin adhesive prepared therefrom |
| US12110425B2 (en) | 2021-08-17 | 2024-10-08 | Uniseal, Inc. | Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same |
| KR20240055770A (en) | 2021-08-30 | 2024-04-29 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | Two-component structural adhesive |
| WO2023072940A1 (en) | 2021-10-25 | 2023-05-04 | Sika Technology Ag | Crack-resistant two-component epoxy resin composition |
| WO2023240541A1 (en) | 2022-06-16 | 2023-12-21 | Sika Technology Ag | One-component thermosetting epoxy adhesive with improved adhesion |
| JP2025538336A (en) * | 2022-11-29 | 2025-11-28 | シーカ テクノロジー アクチェンゲゼルシャフト | Moisture and heat curable sealing composition |
| CN119390941B (en) * | 2024-10-26 | 2025-12-02 | 烟台德邦科技股份有限公司 | A high-adhesion-strength bio-based epoxy resin and its synthesis method |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2073601A (en) * | 1936-08-04 | 1937-03-16 | Joseph F Beach | Safety device for fountain pens and the like |
| US3148167A (en) * | 1958-11-14 | 1964-09-08 | Gen Tire & Rubber Co | Polyurethane composition containing an epoxy compound |
| US3533983A (en) * | 1966-06-01 | 1970-10-13 | Furane Plastics | Thermosetting phenyl glycidyl ether derivatives of isocyanate-terminated organic compounds |
| US3505283A (en) * | 1967-05-15 | 1970-04-07 | Merck & Co Inc | Isocyanates as thickening agents for epoxy resins |
| AU3296071A (en) * | 1970-09-03 | 1973-03-08 | Kolbel H | Self-curing epoxy resins |
| CA1006284A (en) * | 1972-12-11 | 1977-03-01 | August Merckens Nachf. Kommanditgesellschaft | Thixotropic coating agent, process for the preparation and use |
| JPS58194917A (en) * | 1982-05-11 | 1983-11-14 | Dainippon Ink & Chem Inc | Epoxy resin composition |
| US4486556A (en) * | 1982-09-30 | 1984-12-04 | Ford Motor Company | Thermosetting coating composition-III |
| ES2020299B3 (en) * | 1986-12-19 | 1991-08-01 | Ciba-Geigy Ag | POLYESTER CONTENT EPOXY RESINS ON A BASIS OF POLYALKYLENE GLYCOL. |
| US5278257A (en) * | 1987-08-26 | 1994-01-11 | Ciba-Geigy Corporation | Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin |
| IT213534Z2 (en) | 1988-02-02 | 1990-01-22 | Rinaldi Superforni | ELECTRIC OVEN FOR THE CONTINUOUS COOKING OF PIZZAS ARRANGED IN THE TRAY. |
| DE58907670D1 (en) | 1988-04-18 | 1994-06-23 | Ciba Geigy | Modified epoxy resins. |
| US5079094A (en) * | 1988-05-27 | 1992-01-07 | W. R. Grace & Co.-Conn. | Article comprising metal substrates bonded with reactive hot melt structural adhesive and process thereof |
| US4918878A (en) | 1988-05-27 | 1990-04-24 | Electric Avenue, Inc. | Pay telephone enclosure |
| US4962138A (en) | 1988-05-27 | 1990-10-09 | W. R. Grace & Co.-Conn. | Reactive hot melt structural adhesive |
| US5189081A (en) * | 1988-07-04 | 1993-02-23 | Somar Corporation | Penetrable, epoxy resin composition comprising glycidyl ether of bisphenol modified with glycol or urethane, and inorganic filler |
| ES2068911T3 (en) | 1988-07-28 | 1995-05-01 | Ciba Geigy Ag | COMBINATIONS OF FLEXIBILIZERS FOR EPOXY RESINS. |
| JP2749610B2 (en) * | 1989-01-30 | 1998-05-13 | 横浜ゴム株式会社 | Epoxy resin composition |
| US5151327A (en) * | 1990-03-15 | 1992-09-29 | Nitto Denko Corporation | Adhesive sheet for reinforcing thin rigid plates |
| JPH0415218A (en) * | 1990-05-08 | 1992-01-20 | Yokohama Rubber Co Ltd:The | Flame-retardant epoxy resin composition |
| JPH0772233B2 (en) * | 1991-02-19 | 1995-08-02 | 日本ゼオン株式会社 | Epoxy resin type foamable composition |
| US5290857A (en) * | 1991-09-04 | 1994-03-01 | Nippon Zeon Co., Ltd. | Epoxy resin adhesive composition |
| TW289763B (en) * | 1992-11-11 | 1996-11-01 | Ciba Geigy Ag | |
| DE4240480A1 (en) | 1992-12-02 | 1994-08-25 | Bayer Ag | Organic polyisocyanates with at least partially blocked isocyanate groups |
| JP3655646B2 (en) * | 1993-05-24 | 2005-06-02 | 日産自動車株式会社 | Adhesive reinforcing agent for epoxy resin and epoxy resin-based structural adhesive composition for automobile containing the reinforcing agent |
| US5484853A (en) * | 1993-07-28 | 1996-01-16 | China Technical Consultants, Inc. | Cryogenic adhesives made from epoxy terminated urethanes |
| JP3544003B2 (en) * | 1994-08-22 | 2004-07-21 | 大日本インキ化学工業株式会社 | Epoxy resin composition |
| US5530052A (en) * | 1995-04-03 | 1996-06-25 | General Electric Company | Layered minerals and compositions comprising the same |
| DE19549028A1 (en) * | 1995-12-28 | 1997-07-03 | Huels Chemische Werke Ag | Moisture-crosslinking hot melt adhesives that emit no or only small amounts of carbon dioxide |
| JP3245354B2 (en) * | 1996-06-12 | 2002-01-15 | 神東塗料株式会社 | Resin composition for cationic electrodeposition paint |
| US6077884A (en) * | 1996-11-20 | 2000-06-20 | Sika Chemie Gmbh | Aqueous dispersion of epoxy resin and blend of epoxy resin-polyoxyalkylene amines |
| JPH10330713A (en) * | 1997-05-28 | 1998-12-15 | Hitachi Chem Co Ltd | Adhesive composition for metal foil and metal-foil-clad laminate prepared by using the same |
| US6153709A (en) * | 1998-01-26 | 2000-11-28 | Essex Specialty Products, Inc. | Chip resistant, vibration damping coatings for vehicles |
| ES2195547T3 (en) * | 1998-02-20 | 2003-12-01 | Vantico Ag | ORGANIC PHILOSILICATES. |
| US6322890B1 (en) * | 1998-03-30 | 2001-11-27 | Wm. Marsh Rice University | Supra-molecular alkylalumoxanes |
| AT407748B (en) * | 1998-05-12 | 2001-05-25 | Solutia Austria Gmbh | CAPTURED AMINES AS HARDENERS FOR WATER-THINNABLE COMPONENTS (1K) EPOXY RESIN SYSTEMS |
| DE19858921A1 (en) * | 1998-12-19 | 2000-06-21 | Henkel Teroson Gmbh | Compositions used as structural adhesives contain epoxide-reactive copolymer, reaction product of polyurethane prepolymer with poly:phenol or amino-phenol and epoxy resin |
| JP2002533487A (en) | 1998-12-22 | 2002-10-08 | アクゾ ノーベル ナムローゼ フェンノートシャップ | Thixotropic aminoformaldehyde resin |
| JP2000212504A (en) | 1999-01-26 | 2000-08-02 | Somar Corp | Coating film for coil coating |
| US6248204B1 (en) * | 1999-05-14 | 2001-06-19 | Loctite Corporation | Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness |
| DE19924170A1 (en) * | 1999-05-25 | 2000-11-30 | Basf Coatings Ag | Thixotropic agent |
| WO2001023466A1 (en) * | 1999-09-27 | 2001-04-05 | Georgia Tech Research Corp. | Electrically conductive adhesive containing epoxide-modified polyurethane |
| US6740192B1 (en) * | 1999-09-27 | 2004-05-25 | Georgia Tech Research Corp. | Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane |
| JP2001234038A (en) * | 2000-02-23 | 2001-08-28 | Sekisui Chem Co Ltd | Curable epoxy resin composition |
| CA2370542A1 (en) * | 2000-04-18 | 2001-10-25 | Rstar Corporation | Methods and apparatuses for tracking world wide web use |
| EP1152019A1 (en) | 2000-05-02 | 2001-11-07 | Sika AG, vorm. Kaspar Winkler & Co. | Thixotropic agents |
| US20020061970A1 (en) * | 2000-09-14 | 2002-05-23 | Hidenori Sawada | Resin composition for coating material |
| US6903180B2 (en) * | 2000-12-11 | 2005-06-07 | Nippon Steel Chemical Co., Ltd. | Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles |
| JP2003096266A (en) * | 2001-09-20 | 2003-04-03 | Mitsui Kinzoku Toryo Kagaku Kk | Pavement binder composition and pavement material using the same |
| DE10250399A1 (en) * | 2001-10-30 | 2003-05-28 | Yokohama Rubber Co Ltd | Curable resin composition useful for coating composition, adhesive agents, sealing agents and other molded products, comprises isocyanate compound having two or more isocyanate groups blocked by blocking agent, and nylon salts |
| EP1359202A1 (en) | 2002-05-03 | 2003-11-05 | Sika Schweiz AG | Temperature curable epoxy resin composition |
| EP1431325A1 (en) | 2002-12-17 | 2004-06-23 | Sika Technology AG | Heat-curable epoxy resin composition with improved low-temperatur impact strength |
| CA2529737C (en) | 2003-07-07 | 2013-05-07 | Dow Global Technologies Inc. | Adhesive epoxy composition and process for applying it |
| EP1498441A1 (en) | 2003-07-16 | 2005-01-19 | Sika Technology AG | Temperature curable compositions with low temperature impact strength modifier |
| ATE352576T1 (en) * | 2004-03-12 | 2007-02-15 | Dow Global Technologies Inc | EPOXY RESIN ADHESIVE COMPOSITION |
| EP1876194A1 (en) | 2006-06-30 | 2008-01-09 | Sika Technology AG | Heat curing composition usable as an adhesive for coated substrates |
| EP1916272A1 (en) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Heat curable epoxide compositions containing a blocked and an epoxyterminated polyurethane prepolymer. |
| EP1916269A1 (en) * | 2006-10-24 | 2008-04-30 | Sika Technology AG | Blocked polyurethane prepolymers and heat curing epoxy resin compositions |
-
2003
- 2003-07-16 EP EP03016146A patent/EP1498441A1/en not_active Withdrawn
-
2004
- 2004-07-16 EP EP04766243A patent/EP1648950B1/en not_active Expired - Lifetime
- 2004-07-16 ES ES04766243T patent/ES2289549T3/en not_active Expired - Lifetime
- 2004-07-16 DE DE502004004103T patent/DE502004004103D1/en not_active Expired - Lifetime
- 2004-07-16 MX MXPA06000429A patent/MXPA06000429A/en unknown
- 2004-07-16 KR KR1020067000956A patent/KR20060036093A/en not_active Withdrawn
- 2004-07-16 WO PCT/EP2004/051519 patent/WO2005007720A1/en not_active Ceased
- 2004-07-16 US US10/564,889 patent/US8076424B2/en not_active Expired - Fee Related
- 2004-07-16 CA CA002532215A patent/CA2532215A1/en not_active Abandoned
- 2004-07-16 AT AT04766243T patent/ATE364644T1/en not_active IP Right Cessation
- 2004-07-16 JP JP2006519936A patent/JP4542097B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7919555B2 (en) | 2005-08-24 | 2011-04-05 | Henkel Ag & Co. Kgaa | Epoxy compositions having improved impact resistance |
| US8673108B2 (en) | 2006-07-31 | 2014-03-18 | Henkel Ag & Co. Kgaa | Curable epoxy resin-based adhesive compositions |
| WO2008045270A1 (en) | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
| US8545667B2 (en) | 2006-10-06 | 2013-10-01 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
| US9133375B2 (en) | 2007-10-30 | 2015-09-15 | Henkel Ag & Co. Kgaa | Epoxy-paste adhesives resistant to wash-off |
Also Published As
| Publication number | Publication date |
|---|---|
| MXPA06000429A (en) | 2006-04-05 |
| DE502004004103D1 (en) | 2007-07-26 |
| JP4542097B2 (en) | 2010-09-08 |
| EP1498441A1 (en) | 2005-01-19 |
| JP2007527453A (en) | 2007-09-27 |
| EP1648950B1 (en) | 2007-06-13 |
| KR20060036093A (en) | 2006-04-27 |
| US20070066721A1 (en) | 2007-03-22 |
| ES2289549T3 (en) | 2008-02-01 |
| EP1648950A1 (en) | 2006-04-26 |
| ATE364644T1 (en) | 2007-07-15 |
| WO2005007720A1 (en) | 2005-01-27 |
| US8076424B2 (en) | 2011-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8076424B2 (en) | Heat-curable compositions comprising low-temperature impact strength modifiers | |
| US9221969B2 (en) | Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures | |
| US8062468B2 (en) | Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins | |
| US11198754B2 (en) | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator | |
| US7786214B2 (en) | Composition of epoxy resin, epoxy adduct, urea derivative thixotropic agent and curing agent | |
| JP2011503315A5 (en) | ||
| KR20110045046A (en) | 1-part epoxy resin structural adhesives containing elastomer tougheners capped with phenol and hydroxy-terminated acrylate or hydroxy-terminated methacrylate | |
| EP2285862A1 (en) | Heat-curing epoxy resin composition comprising an accelerator having heteroatoms | |
| US20090324958A1 (en) | Heat Setting Compounds Suitable for Sticking Together Coated Substrates | |
| JP2015535868A (en) | Prepolymer toughening agent for crack resistance adhesive of windmill | |
| EP2274359B1 (en) | Activator for epoxy resin compositions | |
| EP2113525A1 (en) | Activator for epoxy resin composites |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |