CN109792003A - 基于狄尔斯–阿尔德反应的可交联聚合物及其在有机电子器件中的应用 - Google Patents

基于狄尔斯–阿尔德反应的可交联聚合物及其在有机电子器件中的应用 Download PDF

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CN109792003A
CN109792003A CN201780059822.9A CN201780059822A CN109792003A CN 109792003 A CN109792003 A CN 109792003A CN 201780059822 A CN201780059822 A CN 201780059822A CN 109792003 A CN109792003 A CN 109792003A
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diels
alder reaction
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潘君友
刘升建
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Guangzhou Chinaray Optoelectronic Materials Ltd
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Abstract

本发明提供一种可发生狄尔斯–阿尔德反应的混合物，包含聚合物(I)和聚合物(II)，所述聚合物(I)和聚合物(II)的结构如下所示：x1,y1,x2,y2,z1以及z2为百分摩尔含量；所述x1>0，x2>0，y1>0，y2>0，z1≥0，z2≥0；x1+y1+z1＝1,x2+y2+z2＝1Ar1,Ar2,Ar2‑1，Ar3,Ar4和Ar4‑1各自独立地选自：含有5‑40个环原子的芳基或杂芳基团；R1和R2各自独立地为连接基团；D为共轭双烯体官能团，A为亲双烯官能团；n1大于0，n2大于0。上述用于狄尔斯–阿尔德反应的混合物具有很好的光学性能。

Description

PCT国内申请，说明书已公开。

Claims (17)

  1. PCT国内申请，权利要求书已公开。
CN201780059822.9A 2016-12-22 2017-12-22 基于狄尔斯-阿尔德反应的可交联聚合物及其在有机电子器件中的应用 Active CN109792003B (zh)

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CN115763967A (zh) * 2022-12-27 2023-03-07 北京卫蓝新能源科技有限公司 固态电芯、制备方法及用途
CN116675834A (zh) * 2023-05-29 2023-09-01 华南理工大学 一类含热脱除功能基团和柔性链段的聚合物光活性材料及其制备和应用
CN119060386A (zh) * 2024-11-04 2024-12-03 浙江科赛新材料科技有限公司 低表面电阻率高柔性聚四氟乙烯薄膜及其制备方法和应用

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KR102407218B1 (ko) * 2019-10-15 2022-06-08 삼성에스디아이 주식회사 하드마스크 조성물, 하드마스크 층 및 패턴 형성 방법
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JP7791827B2 (ja) * 2020-09-23 2025-12-24 保土谷化学工業株式会社 熱架橋性低分子化合物を含む発光ダイオード用組成物
TWI742943B (zh) * 2020-11-26 2021-10-11 位速科技股份有限公司 芳香胺聚合物及鈣鈦礦光電元件
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