CS902288A1 - Vacuum chamber for ionic implantation - Google Patents

Vacuum chamber for ionic implantation

Info

Publication number
CS902288A1
CS902288A1 CS889022A CS902288A CS902288A1 CS 902288 A1 CS902288 A1 CS 902288A1 CS 889022 A CS889022 A CS 889022A CS 902288 A CS902288 A CS 902288A CS 902288 A1 CS902288 A1 CS 902288A1
Authority
CS
Czechoslovakia
Prior art keywords
vacuum chamber
ionic implantation
implantation
ionic
vacuum
Prior art date
Application number
CS889022A
Other languages
English (en)
Other versions
CS272919B1 (en
Inventor
Vladimir Ing Csc Dynda
Karel Novotny
Zdenek Ing Ambroz
Jiri Ing Kabicek
Original Assignee
Vladimir Ing Csc Dynda
Karel Novotny
Ambroz Zdenek
Jiri Ing Kabicek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vladimir Ing Csc Dynda, Karel Novotny, Ambroz Zdenek, Jiri Ing Kabicek filed Critical Vladimir Ing Csc Dynda
Priority to CS902288A priority Critical patent/CS272919B1/cs
Priority to JP1338818A priority patent/JPH02225668A/ja
Priority to CN89109754.6A priority patent/CN1043826A/zh
Priority to EP19890124148 priority patent/EP0377224A3/en
Publication of CS902288A1 publication Critical patent/CS902288A1/cs
Publication of CS272919B1 publication Critical patent/CS272919B1/cs

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CS902288A 1988-12-29 1988-12-29 Vacuum chamber for ionic implantation CS272919B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CS902288A CS272919B1 (en) 1988-12-29 1988-12-29 Vacuum chamber for ionic implantation
JP1338818A JPH02225668A (ja) 1988-12-29 1989-12-28 イオン注入用真空室
CN89109754.6A CN1043826A (zh) 1988-12-29 1989-12-28 离子注入真空室
EP19890124148 EP0377224A3 (en) 1988-12-29 1989-12-29 Method and vacuum chamber for ion implantation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CS902288A CS272919B1 (en) 1988-12-29 1988-12-29 Vacuum chamber for ionic implantation

Publications (2)

Publication Number Publication Date
CS902288A1 true CS902288A1 (en) 1990-05-14
CS272919B1 CS272919B1 (en) 1991-02-12

Family

ID=5441521

Family Applications (1)

Application Number Title Priority Date Filing Date
CS902288A CS272919B1 (en) 1988-12-29 1988-12-29 Vacuum chamber for ionic implantation

Country Status (4)

Country Link
EP (1) EP0377224A3 (cs)
JP (1) JPH02225668A (cs)
CN (1) CN1043826A (cs)
CS (1) CS272919B1 (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794664B1 (en) * 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
JP5918999B2 (ja) * 2012-01-06 2016-05-18 株式会社日立ハイテクノロジーズ 真空容器を備えた荷電粒子線照射装置
US10395880B2 (en) * 2017-08-21 2019-08-27 Varex Imaging Corporation Electron gun adjustment in a vacuum
CN108866514B (zh) * 2018-07-01 2023-12-12 航天科工(长沙)新材料研究院有限公司 一种改进的mpcvd设备基板台冷却结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953659B2 (ja) * 1980-04-11 1984-12-26 株式会社日立製作所 真空室中回転体の往復動機構
JPS58153535A (ja) * 1982-03-05 1983-09-12 Hitachi Ltd 試料回転装置
JP2507302B2 (ja) * 1984-09-19 1996-06-12 アプライド マテリアルズ インコーポレーテッド 半導体ウエハをイオンインプランテ−シヨンする装置及び方法
JPS6243054A (ja) * 1985-08-20 1987-02-25 Oki Electric Ind Co Ltd 真空装置

Also Published As

Publication number Publication date
EP0377224A3 (en) 1990-12-27
CN1043826A (zh) 1990-07-11
JPH02225668A (ja) 1990-09-07
CS272919B1 (en) 1991-02-12
EP0377224A2 (en) 1990-07-11

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