DK1012547T3 - Miniaturehalvlederkondensatormikrofon - Google Patents

Miniaturehalvlederkondensatormikrofon

Info

Publication number
DK1012547T3
DK1012547T3 DK98908587T DK98908587T DK1012547T3 DK 1012547 T3 DK1012547 T3 DK 1012547T3 DK 98908587 T DK98908587 T DK 98908587T DK 98908587 T DK98908587 T DK 98908587T DK 1012547 T3 DK1012547 T3 DK 1012547T3
Authority
DK
Denmark
Prior art keywords
frame
movable plate
distal portion
capacitor microphone
semiconductor capacitor
Prior art date
Application number
DK98908587T
Other languages
Danish (da)
English (en)
Inventor
Peter V Loeppert
David E Schafer
Original Assignee
Knowles Electronics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics Llc filed Critical Knowles Electronics Llc
Application granted granted Critical
Publication of DK1012547T3 publication Critical patent/DK1012547T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Micromachines (AREA)
DK98908587T 1997-02-25 1998-02-19 Miniaturehalvlederkondensatormikrofon DK1012547T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/805,983 US5870482A (en) 1997-02-25 1997-02-25 Miniature silicon condenser microphone
PCT/US1998/003144 WO1998037388A1 (en) 1997-02-25 1998-02-19 Miniature silicon condenser microphone

Publications (1)

Publication Number Publication Date
DK1012547T3 true DK1012547T3 (da) 2004-07-26

Family

ID=25193025

Family Applications (1)

Application Number Title Priority Date Filing Date
DK98908587T DK1012547T3 (da) 1997-02-25 1998-02-19 Miniaturehalvlederkondensatormikrofon

Country Status (8)

Country Link
US (1) US5870482A (de)
EP (1) EP1012547B1 (de)
JP (1) JP3556676B2 (de)
AT (1) ATE266190T1 (de)
AU (1) AU6658798A (de)
DE (1) DE69823679T2 (de)
DK (1) DK1012547T3 (de)
WO (1) WO1998037388A1 (de)

Families Citing this family (222)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248249B1 (en) * 1997-07-15 2001-06-19 Silverbrook Research Pty Ltd. Method of manufacture of a Lorenz diaphragm electromagnetic ink jet printer
AU4317099A (en) * 1998-06-05 1999-12-20 Knowles Electronics, Inc. Solid-state receiver
US6088463A (en) 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
DE19852878B4 (de) * 1998-11-16 2009-11-12 Infineon Technologies Ag Mikromechanisches Bauelement und Herstellungsverfahren hierfür
JP4459498B2 (ja) * 1999-09-06 2010-04-28 パルス・エムイーエムエス・アンパルトセルスカブ シリコンベースのセンサーシステム
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
JP3611779B2 (ja) 1999-12-09 2005-01-19 シャープ株式会社 電気信号−音響信号変換器及びその製造方法並びに電気信号−音響変換装置
DE10195878T1 (de) * 2000-03-07 2003-06-12 Hearworks Pty Ltd Doppelkondensatormikrophon
US6535460B2 (en) 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US6987859B2 (en) 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
US8617934B1 (en) 2000-11-28 2013-12-31 Knowles Electronics, Llc Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
US6847090B2 (en) 2001-01-24 2005-01-25 Knowles Electronics, Llc Silicon capacitive microphone
US7103196B2 (en) 2001-03-12 2006-09-05 Knowles Electronics, Llc. Method for reducing distortion in a receiver
US6896850B2 (en) * 2001-03-26 2005-05-24 Kumetrix, Inc. Silicon nitride window for microsampling device and method of construction
JP2002345092A (ja) * 2001-05-15 2002-11-29 Citizen Electronics Co Ltd コンデンサマイクロホンの製造方法
US6859542B2 (en) * 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US7023066B2 (en) * 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
DE10160830A1 (de) * 2001-12-11 2003-06-26 Infineon Technologies Ag Mikromechanische Sensoren und Verfahren zur Herstellung derselben
DE10205585A1 (de) * 2002-02-11 2003-08-28 Infineon Technologies Ag Mikromechanisches Bauelement und Verfahren zu dessen Herstellung
FI118505B (fi) * 2002-06-04 2007-11-30 Aspocomp Oy Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
US6667189B1 (en) * 2002-09-13 2003-12-23 Institute Of Microelectronics High performance silicon condenser microphone with perforated single crystal silicon backplate
DE10247487A1 (de) * 2002-10-11 2004-05-06 Infineon Technologies Ag Membran und Verfahren zu deren Herstellung
US7142682B2 (en) * 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
US7049051B2 (en) * 2003-01-23 2006-05-23 Akustica, Inc. Process for forming and acoustically connecting structures on a substrate
US7382048B2 (en) * 2003-02-28 2008-06-03 Knowles Electronics, Llc Acoustic transducer module
US7501703B2 (en) * 2003-02-28 2009-03-10 Knowles Electronics, Llc Acoustic transducer module
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
US7876924B1 (en) 2003-10-20 2011-01-25 The Research Foundation Of State University Of New York Robust diaphragm for an acoustic device
US8582795B2 (en) * 2003-10-20 2013-11-12 The Research Foundation Of State University Of New York Robust diaphragm for an acoustic device
US20050095814A1 (en) * 2003-11-05 2005-05-05 Xu Zhu Ultrathin form factor MEMS microphones and microspeakers
US7165647B2 (en) * 2003-12-18 2007-01-23 Pei-Chau Lee Mechanical acoustic filter by erosion etching
JP5009505B2 (ja) * 2004-03-03 2012-08-22 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ダイヤフラムを備えたマイクロマシニング型の構成エレメントおよびこのような構成エレメントを製作するための方法
EP1722595A4 (de) * 2004-03-05 2010-07-28 Panasonic Corp Elektret-kondenser
EP1599067B1 (de) 2004-05-21 2013-05-01 Epcos Pte Ltd Detektion und Kontrolle des Membrankollaps in einem Kondensatormikrofon
EP1638366B1 (de) * 2004-09-20 2015-08-26 Sonion Nederland B.V. Mikrofonanordnung
TWI260938B (en) * 2004-10-01 2006-08-21 Ind Tech Res Inst Dynamic pressure sensing structure
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
JP4539450B2 (ja) 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
US7936894B2 (en) * 2004-12-23 2011-05-03 Motorola Mobility, Inc. Multielement microphone
US7795695B2 (en) 2005-01-27 2010-09-14 Analog Devices, Inc. Integrated microphone
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005008511B4 (de) * 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
JP4715260B2 (ja) * 2005-03-23 2011-07-06 ヤマハ株式会社 コンデンサマイクロホンおよびその製造方法
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US20070071268A1 (en) * 2005-08-16 2007-03-29 Analog Devices, Inc. Packaged microphone with electrically coupled lid
JP2007013509A (ja) * 2005-06-30 2007-01-18 Sanyo Electric Co Ltd 音響センサおよびダイアフラム
JP2007043327A (ja) * 2005-08-01 2007-02-15 Star Micronics Co Ltd コンデンサマイクロホン
US20070040231A1 (en) * 2005-08-16 2007-02-22 Harney Kieran P Partially etched leadframe packages having different top and bottom topologies
US8351632B2 (en) * 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
US8477983B2 (en) * 2005-08-23 2013-07-02 Analog Devices, Inc. Multi-microphone system
US7961897B2 (en) * 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
US8130979B2 (en) * 2005-08-23 2012-03-06 Analog Devices, Inc. Noise mitigating microphone system and method
CN1933682B (zh) * 2005-09-14 2010-08-18 佳乐电子股份有限公司 硅微麦克风的振膜晶片及其制造方法
SG131039A1 (en) * 2005-09-14 2007-04-26 Bse Co Ltd Condenser microphone and packaging method for the same
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
US20090116675A1 (en) * 2005-12-14 2009-05-07 Yuichi Miyoshi Mems diaphragm structure and method for forming the same
WO2007085017A1 (en) * 2006-01-20 2007-07-26 Analog Devices, Inc. Support apparatus for condenser microphone diaphragm
JP4605470B2 (ja) * 2006-03-31 2011-01-05 ヤマハ株式会社 コンデンサマイクロホン
JP4737720B2 (ja) * 2006-03-06 2011-08-03 ヤマハ株式会社 ダイヤフラム及びその製造方法並びにそのダイヤフラムを有するコンデンサマイクロホン及びその製造方法
TW200738028A (en) 2006-02-24 2007-10-01 Yamaha Corp Condenser microphone
JP2007228345A (ja) * 2006-02-24 2007-09-06 Yamaha Corp コンデンサマイクロホン
JP2007295308A (ja) * 2006-04-25 2007-11-08 Citizen Electronics Co Ltd エレクトレットコンデンサマイクロホンの製造方法。
US7493823B2 (en) * 2006-06-16 2009-02-24 Honeywell International Inc. Pressure transducer with differential amplifier
US8081783B2 (en) * 2006-06-20 2011-12-20 Industrial Technology Research Institute Miniature acoustic transducer
JP4797829B2 (ja) * 2006-06-26 2011-10-19 ヤマハ株式会社 コンデンサマイクロホン及びコンデンサマイクロホンの製造方法
US8344487B2 (en) * 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
US20080019543A1 (en) * 2006-07-19 2008-01-24 Yamaha Corporation Silicon microphone and manufacturing method therefor
EP2044802B1 (de) * 2006-07-25 2013-03-27 Analog Devices, Inc. Mehrfachmikrofonsystem
US20080042223A1 (en) * 2006-08-17 2008-02-21 Lu-Lee Liao Microelectromechanical system package and method for making the same
US20080075308A1 (en) * 2006-08-30 2008-03-27 Wen-Chieh Wei Silicon condenser microphone
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
US8165323B2 (en) 2006-11-28 2012-04-24 Zhou Tiansheng Monolithic capacitive transducer
US20080175425A1 (en) * 2006-11-30 2008-07-24 Analog Devices, Inc. Microphone System with Silicon Microphone Secured to Package Lid
EP1931173B1 (de) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Kondensatormikrofon mit Membran mit Biegescharnier und Herstellungsverfahren dafür
US8121315B2 (en) * 2007-03-21 2012-02-21 Goer Tek Inc. Condenser microphone chip
CN101321408B (zh) * 2007-06-06 2012-12-12 歌尔声学股份有限公司 内旋转梁振膜及其组成的传声器芯片
WO2008123954A1 (en) * 2007-04-06 2008-10-16 Novusonic Corporation Miniature capacitive acoustic sensor with stress-relieved actively clamped diaphragm
US8705775B2 (en) * 2007-04-25 2014-04-22 University Of Florida Research Foundation, Inc. Capacitive microphone with integrated cavity
US9078068B2 (en) * 2007-06-06 2015-07-07 Invensense, Inc. Microphone with aligned apertures
US8103027B2 (en) * 2007-06-06 2012-01-24 Analog Devices, Inc. Microphone with reduced parasitic capacitance
CN101321407B (zh) * 2007-06-06 2012-12-26 歌尔声学股份有限公司 梁式振膜组成的传声器芯片
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
GB2451909B (en) * 2007-08-17 2012-07-11 Wolfson Microelectronics Plc Mems process and device
JP2009028808A (ja) 2007-07-24 2009-02-12 Rohm Co Ltd Ｍｅｍｓセンサおよびｍｅｍｓセンサの製造方法
WO2009014118A1 (ja) * 2007-07-24 2009-01-29 Rohm Co., Ltd. Ｍｅｍｓセンサおよびｍｅｍｓセンサの製造方法
JP5412031B2 (ja) 2007-07-24 2014-02-12 ローム株式会社 Ｍｅｍｓセンサ
JP2009028807A (ja) 2007-07-24 2009-02-12 Rohm Co Ltd Ｍｅｍｓセンサ
US8208671B2 (en) * 2008-01-16 2012-06-26 Analog Devices, Inc. Microphone with backside cavity that impedes bubble formation
US8144906B2 (en) * 2008-05-21 2012-03-27 Akustica, Inc. Wind immune microphone
US20110138902A1 (en) * 2008-05-27 2011-06-16 Tufts University Mems microphone array on a chip
JP5374077B2 (ja) * 2008-06-16 2013-12-25 ローム株式会社 Ｍｅｍｓセンサ
US7951636B2 (en) * 2008-09-22 2011-05-31 Solid State System Co. Ltd. Method for fabricating micro-electro-mechanical system (MEMS) device
JP2010098518A (ja) * 2008-10-16 2010-04-30 Rohm Co Ltd Ｍｅｍｓセンサの製造方法およびｍｅｍｓセンサ
TWI374514B (en) 2008-12-12 2012-10-11 Ind Tech Res Inst Truss structure and manufacturing method thereof
EP2239961A1 (de) * 2009-04-06 2010-10-13 Nxp B.V. Rückplatte für ein Mikrofon
WO2010139050A1 (en) 2009-06-01 2010-12-09 Tiansheng Zhou Mems micromirror and micromirror array
EP2271134A1 (de) 2009-07-02 2011-01-05 Nxp B.V. Näherungssensor mit einem akustischen Wandler für den Empfang von hörbaren Tonsignalen und für das Aussenden und Empfangen von Ultraschallsignalen.
EP2269746B1 (de) 2009-07-02 2014-05-14 Nxp B.V. Kapazitiver Sensor mit Kollabiermodus
EP2271129A1 (de) * 2009-07-02 2011-01-05 Nxp B.V. Wandler mit resonantem Hohlraum
JPWO2011039798A1 (ja) * 2009-09-29 2013-02-21 パイオニア株式会社 Ｍｅｍｓセンサおよびこれを備えたセンサアレイ
CN102714773A (zh) * 2009-11-16 2012-10-03 美国亚德诺半导体公司 背板具有特定形状的通孔的传声器
JP2011114506A (ja) * 2009-11-26 2011-06-09 Funai Electric Co Ltd マイクロホンユニット
US8577063B2 (en) * 2010-02-18 2013-11-05 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US8656772B2 (en) 2010-03-22 2014-02-25 Honeywell International Inc. Flow sensor with pressure output signal
JP5206726B2 (ja) 2010-04-12 2013-06-12 株式会社デンソー 力学量検出装置およびその製造方法
CN101883306B (zh) * 2010-04-27 2012-12-12 瑞声声学科技(深圳)有限公司 振膜及包括该振膜的电容麦克风
DE102011050040B4 (de) 2010-05-14 2016-10-06 National Tsing Hua University Kapazitives Mikrosystem-Mikrofon
WO2011146846A2 (en) * 2010-05-21 2011-11-24 Sand9, Inc. Micromechanical membranes and related structures and methods
CN102264020B (zh) * 2010-05-26 2013-12-25 国立清华大学 微机电电容式麦克风
JP5588745B2 (ja) * 2010-05-27 2014-09-10 オムロン株式会社 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン
US8436435B2 (en) 2010-07-27 2013-05-07 National Tsing Hua University MEMS capacitive microphone
US8464589B2 (en) * 2010-10-14 2013-06-18 Solid State System Co., Ltd. Micro-electromechanical systems (MEMS) structure
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US9036231B2 (en) 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US8616065B2 (en) 2010-11-24 2013-12-31 Honeywell International Inc. Pressure sensor
US8695417B2 (en) 2011-01-31 2014-04-15 Honeywell International Inc. Flow sensor with enhanced flow range capability
US9070861B2 (en) 2011-02-15 2015-06-30 Fujifilm Dimatix, Inc. Piezoelectric transducers using micro-dome arrays
US9167354B2 (en) * 2011-03-09 2015-10-20 Sennheiser Electronic Gmbh & Co. Kg Electroacoustic sound transducer
US8447057B2 (en) 2011-03-18 2013-05-21 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US8625832B2 (en) 2011-04-04 2014-01-07 Invensense, Inc. Packages and methods for packaging microphone devices
US8450213B2 (en) * 2011-04-13 2013-05-28 Fujifilm Corporation Forming a membrane having curved features
US8503699B2 (en) 2011-06-01 2013-08-06 Infineon Technologies Ag Plate, transducer and methods for making and operating a transducer
US8969980B2 (en) * 2011-09-23 2015-03-03 Knowles Electronics, Llc Vented MEMS apparatus and method of manufacture
US9031266B2 (en) * 2011-10-11 2015-05-12 Infineon Technologies Ag Electrostatic loudspeaker with membrane performing out-of-plane displacement
PH12014500968A1 (en) 2011-11-04 2014-06-09 Knowles Electronics Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
US9078069B2 (en) 2012-01-11 2015-07-07 Invensense, Inc. MEMS microphone with springs and interior support
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
US8779535B2 (en) 2012-03-14 2014-07-15 Analog Devices, Inc. Packaged integrated device die between an external and internal housing
US9409763B2 (en) 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
CN202617341U (zh) * 2012-05-04 2012-12-19 瑞声声学科技(常州)有限公司 平板发声器
US9003897B2 (en) 2012-05-10 2015-04-14 Honeywell International Inc. Temperature compensated force sensor
US9491539B2 (en) 2012-08-01 2016-11-08 Knowles Electronics, Llc MEMS apparatus disposed on assembly lid
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US8987842B2 (en) * 2012-09-14 2015-03-24 Solid State System Co., Ltd. Microelectromechanical system (MEMS) device and fabrication method thereof
GB2506174A (en) * 2012-09-24 2014-03-26 Wolfson Microelectronics Plc Protecting a MEMS device from excess pressure and shock
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US9156680B2 (en) 2012-10-26 2015-10-13 Analog Devices, Inc. Packages and methods for packaging
US9052217B2 (en) 2012-11-09 2015-06-09 Honeywell International Inc. Variable scale sensor
US8921956B2 (en) 2013-01-25 2014-12-30 Infineon Technologies Ag MEMS device having a back plate with elongated protrusions
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US20140247954A1 (en) * 2013-03-01 2014-09-04 Silicon Audio, Inc. Entrained Microphones
US9082883B2 (en) 2013-03-04 2015-07-14 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US8999757B2 (en) 2013-03-04 2015-04-07 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
CN105263851B (zh) 2013-05-31 2017-10-13 罗伯特·博世有限公司 被限位的膜
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
GB2515836B (en) * 2013-07-05 2016-01-20 Cirrus Logic Int Semiconductor Ltd MEMS device and process
DE102013213717A1 (de) * 2013-07-12 2015-01-15 Robert Bosch Gmbh MEMS-Bauelement mit einer Mikrofonstruktur und Verfahren zu dessen Herstellung
DE102013223359A1 (de) * 2013-11-15 2015-05-21 Robert Bosch Gmbh Leiterplatte für die 2nd-Level-Montage eines Mikrofonbauteils und Mikrofonmodul mit einer derartigen Leiterplatte
DE102013224718A1 (de) * 2013-12-03 2015-06-03 Robert Bosch Gmbh MEMS-Mikrofonbauelement und Vorrichtung mit einem solchen MEMS-Mikrofonbauelement
DE102014203881A1 (de) 2014-03-04 2015-09-10 Robert Bosch Gmbh Bauteil mit Mikrofon- und Mediensensorfunktion
DE112014006684T5 (de) 2014-05-20 2017-02-02 Epcos Ag Mikrofon und Verfahren zum Betrieb eines Mikrofons
DE102014108984B4 (de) 2014-06-26 2017-04-06 Tdk Corporation Wandlerelement
US9369804B2 (en) * 2014-07-28 2016-06-14 Robert Bosch Gmbh MEMS membrane overtravel stop
CN204046818U (zh) 2014-07-28 2014-12-24 瑞声声学科技(深圳)有限公司 电容mems麦克风
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US9872116B2 (en) 2014-11-24 2018-01-16 Knowles Electronics, Llc Apparatus and method for detecting earphone removal and insertion
CN104507014B (zh) * 2014-12-26 2018-08-28 上海集成电路研发中心有限公司 一种具有褶皱型振动膜的mems麦克风及其制造方法
US9554207B2 (en) 2015-04-30 2017-01-24 Shure Acquisition Holdings, Inc. Offset cartridge microphones
US9565493B2 (en) * 2015-04-30 2017-02-07 Shure Acquisition Holdings, Inc. Array microphone system and method of assembling the same
DE102015107557A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren
US10045126B2 (en) * 2015-07-07 2018-08-07 Invensense, Inc. Microelectromechanical microphone having a stationary inner region
DE102015213774A1 (de) * 2015-07-22 2017-01-26 Robert Bosch Gmbh MEMS-Bauelement mit schalldruckempfindlichem Membranelement und piezosensitiver Signalerfassung
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
JP6604626B2 (ja) * 2015-08-21 2019-11-13 国立大学法人東北大学 検出装置
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
US9401158B1 (en) 2015-09-14 2016-07-26 Knowles Electronics, Llc Microphone signal fusion
US10129651B2 (en) * 2015-12-18 2018-11-13 Robert Bosch Gmbh Center-fixed MEMS microphone membrane
US9779716B2 (en) 2015-12-30 2017-10-03 Knowles Electronics, Llc Occlusion reduction and active noise reduction based on seal quality
US9830930B2 (en) 2015-12-30 2017-11-28 Knowles Electronics, Llc Voice-enhanced awareness mode
US9812149B2 (en) 2016-01-28 2017-11-07 Knowles Electronics, Llc Methods and systems for providing consistency in noise reduction during speech and non-speech periods
JP6132047B1 (ja) 2016-03-28 2017-05-24 国立大学法人東北大学 圧力センサとその製造方法
GB2557364B (en) * 2016-11-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
US10715928B2 (en) * 2016-12-29 2020-07-14 Gmems Tech Shenzhen Limited Capacitive microphone having capability of acceleration noise cancelation
US10943577B2 (en) 2017-01-03 2021-03-09 Michigan Technological University Solid-state transducer, system, and method
US10367948B2 (en) 2017-01-13 2019-07-30 Shure Acquisition Holdings, Inc. Post-mixing acoustic echo cancellation systems and methods
US12117415B2 (en) 2017-05-15 2024-10-15 Analog Devices International Unlimited Company Integrated ion sensing apparatus and methods
CN107529121A (zh) * 2017-09-28 2017-12-29 歌尔股份有限公司 电容式麦克风及电子装置
US10730743B2 (en) 2017-11-06 2020-08-04 Analog Devices Global Unlimited Company Gas sensor packages
WO2019226958A1 (en) * 2018-05-24 2019-11-28 The Research Foundation For The State University Of New York Capacitive sensor
EP3804356A1 (de) 2018-06-01 2021-04-14 Shure Acquisition Holdings, Inc. Musterbildende mikrofonanordnung
US11297423B2 (en) 2018-06-15 2022-04-05 Shure Acquisition Holdings, Inc. Endfire linear array microphone
EP3854108B1 (de) 2018-09-20 2025-10-22 Shure Acquisition Holdings, Inc. Einstellbare keulenform für array-mikrofone
US11558693B2 (en) 2019-03-21 2023-01-17 Shure Acquisition Holdings, Inc. Auto focus, auto focus within regions, and auto placement of beamformed microphone lobes with inhibition and voice activity detection functionality
JP7572964B2 (ja) 2019-03-21 2024-10-24 シュアー アクイジッション ホールディングス インコーポレイテッド 阻止機能を伴うビーム形成マイクロフォンローブの自動集束、領域内自動集束、および自動配置
EP3942842B1 (de) 2019-03-21 2026-03-11 Shure Acquisition Holdings, Inc. Gehäuse und zugehörige konstruktionsmerkmale für mikrofone einer deckenanordnung
CN114051738B (zh) 2019-05-23 2024-10-01 舒尔获得控股公司 可操纵扬声器阵列、系统及其方法
US11302347B2 (en) 2019-05-31 2022-04-12 Shure Acquisition Holdings, Inc. Low latency automixer integrated with voice and noise activity detection
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber
EP4018680B1 (de) 2019-08-23 2026-04-29 Shure Acquisition Holdings, Inc. Zweidimensionale mikrofonanordnung mit verbesserter richtcharakteristik
EP3793213B1 (de) 2019-09-13 2025-05-07 ams International AG Mikrostruktur und verfahren zur herstellung einer mikrostruktur
USD943559S1 (en) 2019-11-01 2022-02-15 Shure Acquisition Holdings, Inc. Housing for ceiling array microphone
USD943558S1 (en) 2019-11-01 2022-02-15 Shure Acquisition Holdings, Inc. Housing for ceiling array microphone
US12028678B2 (en) 2019-11-01 2024-07-02 Shure Acquisition Holdings, Inc. Proximity microphone
US12474290B2 (en) 2019-11-20 2025-11-18 Analog Devices International Unlimited Company Electrochemical device
US11552611B2 (en) 2020-02-07 2023-01-10 Shure Acquisition Holdings, Inc. System and method for automatic adjustment of reference gain
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
USD943552S1 (en) 2020-05-05 2022-02-15 Shure Acquisition Holdings, Inc. Audio device
USD944776S1 (en) 2020-05-05 2022-03-01 Shure Acquisition Holdings, Inc. Audio device
WO2021243368A2 (en) 2020-05-29 2021-12-02 Shure Acquisition Holdings, Inc. Transducer steering and configuration systems and methods using a local positioning system
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
US11785380B2 (en) 2021-01-28 2023-10-10 Shure Acquisition Holdings, Inc. Hybrid audio beamforming system
US12452584B2 (en) 2021-01-29 2025-10-21 Shure Acquisition Holdings, Inc. Scalable conferencing systems and methods
US12264064B2 (en) * 2021-05-14 2025-04-01 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Microelectromechanical system
CN215453269U (zh) * 2021-06-30 2022-01-07 瑞声声学科技(深圳)有限公司 Mems声传感器
US12542123B2 (en) 2021-08-31 2026-02-03 Shure Acquisition Holdings, Inc. Mask non-linear processor for acoustic echo cancellation
CN118216161A (zh) 2021-10-04 2024-06-18 舒尔获得控股公司 联网自动混合器系统及方法
EP4427465A1 (de) 2021-11-05 2024-09-11 Shure Acquisition Holdings, Inc. Verteilter algorithmus zur automatischen mischung von sprache über drahtlose netzwerke
WO2023133513A1 (en) 2022-01-07 2023-07-13 Shure Acquisition Holdings, Inc. Audio beamforming with nulling control system and methods
US12598261B2 (en) 2022-09-28 2026-04-07 Shure Acquisition Holdings, Inc. Wideband doubletalk detection for optimization of acoustic echo cancellation

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH466376A (de) * 1968-03-01 1968-12-15 Ibm Anordnung zur Umwandlung von Drücken in digitale elektrische Signale
US3772133A (en) * 1971-11-08 1973-11-13 Industrial Research Prod Inc Backplate construction for electret transducer
NL7313455A (nl) * 1973-10-01 1975-04-03 Philips Nv Mikrofoon met elektrostatische capsule.
JPS57193198A (en) * 1981-05-22 1982-11-27 Toshiba Corp Electrostatic microphone
SE428081B (sv) * 1981-10-07 1983-05-30 Ericsson Telefon Ab L M Tilledningsram for en elektretmikrofon
JPS6055655A (ja) * 1983-09-07 1985-03-30 Nissan Motor Co Ltd 梁構造体を有する半導体装置
US4651120A (en) * 1985-09-09 1987-03-17 Honeywell Inc. Piezoresistive pressure sensor
US4771638A (en) * 1985-09-30 1988-09-20 Kabushiki Kaisha Toyota Chuo Kenkyusho Semiconductor pressure sensor
US4783821A (en) * 1987-11-25 1988-11-08 The Regents Of The University Of California IC processed piezoelectric microphone
JPH0748564B2 (ja) * 1988-05-07 1995-05-24 シャープ株式会社 シリコンマイクロセンサ
JP2681207B2 (ja) * 1989-02-01 1997-11-26 株式会社 オーディオテクニカ 静電型電気音響変換器の振動板
US4993072A (en) * 1989-02-24 1991-02-12 Lectret S.A. Shielded electret transducer and method of making the same
US5228341A (en) * 1989-10-18 1993-07-20 Hitachi, Ltd. Capacitive acceleration detector having reduced mass portion
US5146435A (en) * 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
DE4000903C1 (de) * 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
US5188983A (en) * 1990-04-11 1993-02-23 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers and method of producing the same
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
DE69325732T2 (de) * 1992-03-18 2000-04-27 Knowles Electronics, Inc. Festkörper-Kondensatormikrofon
US5208789A (en) * 1992-04-13 1993-05-04 Lectret S. A. Condenser microphones based on silicon with humidity resistant surface treatment
US5633552A (en) * 1993-06-04 1997-05-27 The Regents Of The University Of California Cantilever pressure transducer
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response

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JP2001518246A (ja) 2001-10-09
DE69823679D1 (de) 2004-06-09
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ATE266190T1 (de) 2004-05-15
EP1012547B1 (de) 2004-05-06

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