EP0747974A3 - Photovoltaisches Bauelement und Herstellungsverfahren - Google Patents
Photovoltaisches Bauelement und Herstellungsverfahren Download PDFInfo
- Publication number
- EP0747974A3 EP0747974A3 EP96108498A EP96108498A EP0747974A3 EP 0747974 A3 EP0747974 A3 EP 0747974A3 EP 96108498 A EP96108498 A EP 96108498A EP 96108498 A EP96108498 A EP 96108498A EP 0747974 A3 EP0747974 A3 EP 0747974A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- type semiconductor
- semiconductor layer
- layer
- photovoltaic element
- fabrication process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 7
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
- H10F10/172—Photovoltaic cells having only PIN junction potential barriers comprising multiple PIN junctions, e.g. tandem cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
- H10F71/1035—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials having multiple Group IV elements, e.g. SiGe or SiC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/107—Continuous treatment of the devices, e.g. roll-to roll processes or multi-chamber deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
- H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP132431/95 | 1995-05-30 | ||
| JP13243295 | 1995-05-30 | ||
| JP13243395 | 1995-05-30 | ||
| JP13243195 | 1995-05-30 | ||
| JP132434/95 | 1995-05-30 | ||
| JP132433/95 | 1995-05-30 | ||
| JP13243495 | 1995-05-30 | ||
| JP13243495 | 1995-05-30 | ||
| JP132432/95 | 1995-05-30 | ||
| JP13243295 | 1995-05-30 | ||
| JP13243195 | 1995-05-30 | ||
| JP13243395 | 1995-05-30 | ||
| JP12475796A JP3169337B2 (ja) | 1995-05-30 | 1996-05-20 | 光起電力素子及びその製造方法 |
| JP124757/96 | 1996-05-20 | ||
| JP12475796 | 1996-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0747974A2 EP0747974A2 (de) | 1996-12-11 |
| EP0747974A3 true EP0747974A3 (de) | 1999-06-30 |
Family
ID=27527042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP96108498A Withdrawn EP0747974A3 (de) | 1995-05-30 | 1996-05-29 | Photovoltaisches Bauelement und Herstellungsverfahren |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5720826A (de) |
| EP (1) | EP0747974A3 (de) |
| JP (1) | JP3169337B2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8360001B2 (en) | 2001-02-12 | 2013-01-29 | Asm America, Inc. | Process for deposition of semiconductor films |
Families Citing this family (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR910003742B1 (ko) * | 1986-09-09 | 1991-06-10 | 세미콘덕터 에너지 라보라터리 캄파니 리미티드 | Cvd장치 |
| JP3630982B2 (ja) * | 1997-05-22 | 2005-03-23 | キヤノン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US6121541A (en) * | 1997-07-28 | 2000-09-19 | Bp Solarex | Monolithic multi-junction solar cells with amorphous silicon and CIS and their alloys |
| JPH1154773A (ja) * | 1997-08-01 | 1999-02-26 | Canon Inc | 光起電力素子及びその製造方法 |
| JPH11246971A (ja) * | 1998-03-03 | 1999-09-14 | Canon Inc | 微結晶シリコン系薄膜の作製方法及び作製装置 |
| JPH11354820A (ja) * | 1998-06-12 | 1999-12-24 | Sharp Corp | 光電変換素子及びその製造方法 |
| JP2001189478A (ja) * | 1999-12-28 | 2001-07-10 | Sanyo Electric Co Ltd | 半導体素子及びその製造方法 |
| US6667240B2 (en) | 2000-03-09 | 2003-12-23 | Canon Kabushiki Kaisha | Method and apparatus for forming deposited film |
| US6894245B2 (en) * | 2000-03-17 | 2005-05-17 | Applied Materials, Inc. | Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
| US6528751B1 (en) | 2000-03-17 | 2003-03-04 | Applied Materials, Inc. | Plasma reactor with overhead RF electrode tuned to the plasma |
| US6900596B2 (en) * | 2002-07-09 | 2005-05-31 | Applied Materials, Inc. | Capacitively coupled plasma reactor with uniform radial distribution of plasma |
| US8617351B2 (en) * | 2002-07-09 | 2013-12-31 | Applied Materials, Inc. | Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction |
| US7030335B2 (en) * | 2000-03-17 | 2006-04-18 | Applied Materials, Inc. | Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression |
| US8048806B2 (en) * | 2000-03-17 | 2011-11-01 | Applied Materials, Inc. | Methods to avoid unstable plasma states during a process transition |
| US7141757B2 (en) * | 2000-03-17 | 2006-11-28 | Applied Materials, Inc. | Plasma reactor with overhead RF source power electrode having a resonance that is virtually pressure independent |
| US20070048882A1 (en) * | 2000-03-17 | 2007-03-01 | Applied Materials, Inc. | Method to reduce plasma-induced charging damage |
| US7196283B2 (en) | 2000-03-17 | 2007-03-27 | Applied Materials, Inc. | Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface |
| US7220937B2 (en) * | 2000-03-17 | 2007-05-22 | Applied Materials, Inc. | Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination |
| JP2002020863A (ja) | 2000-05-01 | 2002-01-23 | Canon Inc | 堆積膜の形成方法及び形成装置、及び基板処理方法 |
| US6434514B1 (en) * | 2000-10-13 | 2002-08-13 | Sbc Technology Resources, Inc. | Rule based capacity management system for an inter office facility |
| US20030044539A1 (en) * | 2001-02-06 | 2003-03-06 | Oswald Robert S. | Process for producing photovoltaic devices |
| US7026219B2 (en) | 2001-02-12 | 2006-04-11 | Asm America, Inc. | Integration of high k gate dielectric |
| ITRM20010751A1 (it) * | 2001-12-20 | 2003-06-20 | Ct Sviluppo Materiali Spa | Composito a bassa emissivita' nell'infrarosso medio e lontano ed a bassa riflettivita' nel visibile e infrarosso vicino. |
| EP1369931A1 (de) * | 2002-06-03 | 2003-12-10 | Hitachi, Ltd. | Solarzelle und ihr Herstellungsverfahren sowie Metallplatte dafür |
| JP3862615B2 (ja) * | 2002-06-10 | 2006-12-27 | キヤノン株式会社 | シリコン系薄膜形成装置およびシリコン系薄膜形成方法 |
| TWI283899B (en) * | 2002-07-09 | 2007-07-11 | Applied Materials Inc | Capacitively coupled plasma reactor with magnetic plasma control |
| US7294582B2 (en) | 2002-07-19 | 2007-11-13 | Asm International, N.V. | Low temperature silicon compound deposition |
| US7297641B2 (en) | 2002-07-19 | 2007-11-20 | Asm America, Inc. | Method to form ultra high quality silicon-containing compound layers |
| US7186630B2 (en) | 2002-08-14 | 2007-03-06 | Asm America, Inc. | Deposition of amorphous silicon-containing films |
| JP2004095953A (ja) * | 2002-09-02 | 2004-03-25 | Canon Inc | 窒化シリコンの堆積膜形成方法 |
| JP2004335823A (ja) * | 2003-05-09 | 2004-11-25 | Canon Inc | 光起電力素子及び光起電力素子の形成方法 |
| US7910013B2 (en) | 2003-05-16 | 2011-03-22 | Applied Materials, Inc. | Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure |
| US7452824B2 (en) * | 2003-05-16 | 2008-11-18 | Applied Materials, Inc. | Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of plural chamber parameters |
| US7470626B2 (en) * | 2003-05-16 | 2008-12-30 | Applied Materials, Inc. | Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure |
| US7901952B2 (en) * | 2003-05-16 | 2011-03-08 | Applied Materials, Inc. | Plasma reactor control by translating desired values of M plasma parameters to values of N chamber parameters |
| US7247218B2 (en) * | 2003-05-16 | 2007-07-24 | Applied Materials, Inc. | Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power |
| US7795153B2 (en) * | 2003-05-16 | 2010-09-14 | Applied Materials, Inc. | Method of controlling a chamber based upon predetermined concurrent behavior of selected plasma parameters as a function of selected chamber parameters |
| US7667133B2 (en) * | 2003-10-29 | 2010-02-23 | The University Of Toledo | Hybrid window layer for photovoltaic cells |
| US9214590B2 (en) | 2003-12-19 | 2015-12-15 | The University Of North Carolina At Chapel Hill | High fidelity nano-structures and arrays for photovoltaics and methods of making the same |
| US7629270B2 (en) | 2004-08-27 | 2009-12-08 | Asm America, Inc. | Remote plasma activated nitridation |
| US7966969B2 (en) | 2004-09-22 | 2011-06-28 | Asm International N.V. | Deposition of TiN films in a batch reactor |
| EP1643564B1 (de) * | 2004-09-29 | 2019-01-16 | Panasonic Intellectual Property Management Co., Ltd. | Photovoltaisches Bauelement |
| US7629267B2 (en) | 2005-03-07 | 2009-12-08 | Asm International N.V. | High stress nitride film and method for formation thereof |
| US7359177B2 (en) * | 2005-05-10 | 2008-04-15 | Applied Materials, Inc. | Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output |
| WO2007075369A1 (en) | 2005-12-16 | 2007-07-05 | Asm International N.V. | Low temperature doped silicon layer formation |
| US20070261951A1 (en) * | 2006-04-06 | 2007-11-15 | Yan Ye | Reactive sputtering zinc oxide transparent conductive oxides onto large area substrates |
| US8829336B2 (en) * | 2006-05-03 | 2014-09-09 | Rochester Institute Of Technology | Nanostructured quantum dots or dashes in photovoltaic devices and methods thereof |
| CN101573802B (zh) * | 2006-05-09 | 2012-08-08 | 北卡罗来纳-查佩尔山大学 | 光伏器件用的高保真纳米结构体和阵列及其制造方法 |
| US7691757B2 (en) | 2006-06-22 | 2010-04-06 | Asm International N.V. | Deposition of complex nitride films |
| WO2008011051A1 (en) * | 2006-07-17 | 2008-01-24 | Liquidia Technologies, Inc. | Nanoparticle fabrication methods, systems, and materials |
| US7674662B2 (en) * | 2006-07-19 | 2010-03-09 | Applied Materials, Inc. | Process for making thin film field effect transistors using zinc oxide |
| US7501305B2 (en) * | 2006-10-23 | 2009-03-10 | Canon Kabushiki Kaisha | Method for forming deposited film and photovoltaic element |
| US8203071B2 (en) | 2007-01-18 | 2012-06-19 | Applied Materials, Inc. | Multi-junction solar cells and methods and apparatuses for forming the same |
| US20080254613A1 (en) * | 2007-04-10 | 2008-10-16 | Applied Materials, Inc. | Methods for forming metal interconnect structure for thin film transistor applications |
| US7927713B2 (en) * | 2007-04-27 | 2011-04-19 | Applied Materials, Inc. | Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases |
| US7629256B2 (en) | 2007-05-14 | 2009-12-08 | Asm International N.V. | In situ silicon and titanium nitride deposition |
| EP2183780A4 (de) | 2007-08-02 | 2010-07-28 | Applied Materials Inc | Dünnfilmtransistoren mit dünnfilmhalbleitermaterialien |
| US20090104733A1 (en) * | 2007-10-22 | 2009-04-23 | Yong Kee Chae | Microcrystalline silicon deposition for thin film solar applications |
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| US8980066B2 (en) * | 2008-03-14 | 2015-03-17 | Applied Materials, Inc. | Thin film metal oxynitride semiconductors |
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| US7879698B2 (en) * | 2008-03-24 | 2011-02-01 | Applied Materials, Inc. | Integrated process system and process sequence for production of thin film transistor arrays using doped or compounded metal oxide semiconductor |
| US8258511B2 (en) | 2008-07-02 | 2012-09-04 | Applied Materials, Inc. | Thin film transistors using multiple active channel layers |
| US7927986B2 (en) * | 2008-07-22 | 2011-04-19 | Varian Semiconductor Equipment Associates, Inc. | Ion implantation with heavy halogenide compounds |
| DE102008054288A1 (de) * | 2008-11-03 | 2010-05-06 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines flexiblen Leuchtbands |
| JP2010129785A (ja) | 2008-11-27 | 2010-06-10 | Mitsubishi Heavy Ind Ltd | 光電変換装置の製造方法 |
| US20100133094A1 (en) * | 2008-12-02 | 2010-06-03 | Applied Materials, Inc. | Transparent conductive film with high transmittance formed by a reactive sputter deposition |
| US7833906B2 (en) | 2008-12-11 | 2010-11-16 | Asm International N.V. | Titanium silicon nitride deposition |
| US20100163406A1 (en) * | 2008-12-30 | 2010-07-01 | Applied Materials, Inc. | Substrate support in a reactive sputter chamber |
| JP2011018857A (ja) * | 2009-07-10 | 2011-01-27 | Mitsubishi Heavy Ind Ltd | 光電変換装置の製造方法 |
| CN102640294B (zh) * | 2009-09-24 | 2014-12-17 | 应用材料公司 | 将湿式处理用于源极-漏极金属蚀刻从而制造金属氧化物或金属氮氧化物tft的方法 |
| US8840763B2 (en) * | 2009-09-28 | 2014-09-23 | Applied Materials, Inc. | Methods for stable process in a reactive sputtering process using zinc or doped zinc target |
| US20110088760A1 (en) * | 2009-10-20 | 2011-04-21 | Applied Materials, Inc. | Methods of forming an amorphous silicon layer for thin film solar cell application |
| KR101296684B1 (ko) * | 2009-11-18 | 2013-08-19 | 한국전자통신연구원 | 상 분리 현상을 이용한 유기 발광 다이오드 및 그 제조 방법 |
| US8298887B2 (en) * | 2009-12-03 | 2012-10-30 | Applied Materials, Inc. | High mobility monolithic p-i-n diodes |
| TWI395338B (zh) * | 2009-12-16 | 2013-05-01 | Nexpower Technology Corp | 具有特殊背電極結構之薄膜太陽能電池及其製作方法 |
| KR101688523B1 (ko) * | 2010-02-24 | 2016-12-21 | 삼성전자주식회사 | 적층형 이미지 센서 |
| JP2012043983A (ja) * | 2010-08-19 | 2012-03-01 | Fuji Electric Co Ltd | 多層膜形成方法およびそれに用いる成膜装置 |
| TWI453295B (zh) * | 2012-10-12 | 2014-09-21 | Iner Aec Executive Yuan | 氣體隔離腔及其電漿鍍膜裝置 |
| TWI593739B (zh) | 2013-02-04 | 2017-08-01 | Arakawa Chemical Industries Ltd | An active energy ray-curable resin composition, an active energy ray-curable resin composition, a cured film and an antistatic treated optical film |
| EP3288290A4 (de) * | 2015-04-21 | 2018-10-17 | Olympus Corporation | Ultraschallwandler, ultraschallsonde und verfahren zur herstellung eines ultraschallwandlers |
| JP7775685B2 (ja) | 2020-12-18 | 2025-11-26 | 荒川化学工業株式会社 | 活性エネルギー線硬化性樹脂組成物、硬化膜及びフィルム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4612559A (en) * | 1983-03-08 | 1986-09-16 | Director General Of Agency Of Industrial Science & Technology | Solar cell of amorphous silicon |
| US4680607A (en) * | 1984-05-11 | 1987-07-14 | Sanyo Electric Co., Ltd. | Photovoltaic cell |
| JPH04333289A (ja) * | 1991-05-08 | 1992-11-20 | Canon Inc | 光起電力素子の製造方法 |
| EP0600630A1 (de) * | 1992-11-16 | 1994-06-08 | Canon Kabushiki Kaisha | Photoelektrischer Umwandler und Stromversorgungssytem mit Anwendung desselben |
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| US2949498A (en) * | 1955-10-31 | 1960-08-16 | Texas Instruments Inc | Solar energy converter |
| US4254429A (en) * | 1978-07-08 | 1981-03-03 | Shunpei Yamazaki | Hetero junction semiconductor device |
| US4377723A (en) * | 1980-05-02 | 1983-03-22 | The University Of Delaware | High efficiency thin-film multiple-gap photovoltaic device |
| US4400409A (en) * | 1980-05-19 | 1983-08-23 | Energy Conversion Devices, Inc. | Method of making p-doped silicon films |
| US4816082A (en) * | 1987-08-19 | 1989-03-28 | Energy Conversion Devices, Inc. | Thin film solar cell including a spatially modulated intrinsic layer |
| JP2722114B2 (ja) * | 1989-06-28 | 1998-03-04 | キヤノン株式会社 | マイクロ波プラズマcvd法により大面積の機能性堆積膜を連続的に形成する方法及び装置 |
| JPH04299576A (ja) * | 1991-03-27 | 1992-10-22 | Sanyo Electric Co Ltd | 光起電力素子及びその製造方法 |
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| JP3093502B2 (ja) * | 1993-01-29 | 2000-10-03 | キヤノン株式会社 | 光起電力素子及びその形成方法及びその形成装置 |
| JP3093504B2 (ja) * | 1993-01-29 | 2000-10-03 | キヤノン株式会社 | 光起電力素子及びその形成方法及びその形成装置 |
| JP3030419U (ja) | 1996-04-19 | 1996-11-01 | 芳史 西 | 緊急連絡ホン |
-
1996
- 1996-05-20 JP JP12475796A patent/JP3169337B2/ja not_active Expired - Fee Related
- 1996-05-29 US US08/657,066 patent/US5720826A/en not_active Expired - Lifetime
- 1996-05-29 EP EP96108498A patent/EP0747974A3/de not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4612559A (en) * | 1983-03-08 | 1986-09-16 | Director General Of Agency Of Industrial Science & Technology | Solar cell of amorphous silicon |
| US4680607A (en) * | 1984-05-11 | 1987-07-14 | Sanyo Electric Co., Ltd. | Photovoltaic cell |
| JPH04333289A (ja) * | 1991-05-08 | 1992-11-20 | Canon Inc | 光起電力素子の製造方法 |
| EP0600630A1 (de) * | 1992-11-16 | 1994-06-08 | Canon Kabushiki Kaisha | Photoelektrischer Umwandler und Stromversorgungssytem mit Anwendung desselben |
Non-Patent Citations (2)
| Title |
|---|
| KATSUHIKO HIGUCHI: "HIGH-EFFICIENCY DELTA-DOPED AMORPHOUS SILICON SOLAR CELLS PREPARED BY PHOTOCHEMICAL VAPOR DEPOSITION", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 30, no. 8, 1 August 1991 (1991-08-01), pages 1635 - 1640, XP000265578 * |
| PATENT ABSTRACTS OF JAPAN vol. 017, no. 178 (E - 1347) 7 April 1993 (1993-04-07) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8360001B2 (en) | 2001-02-12 | 2013-01-29 | Asm America, Inc. | Process for deposition of semiconductor films |
Also Published As
| Publication number | Publication date |
|---|---|
| US5720826A (en) | 1998-02-24 |
| EP0747974A2 (de) | 1996-12-11 |
| JP3169337B2 (ja) | 2001-05-21 |
| JPH0951116A (ja) | 1997-02-18 |
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