EP1035553A4 - LAMINATE, CAPACITOR, AND PROCESS FOR PRODUCING LAMINATE - Google Patents

LAMINATE, CAPACITOR, AND PROCESS FOR PRODUCING LAMINATE

Info

Publication number
EP1035553A4
EP1035553A4 EP98953068A EP98953068A EP1035553A4 EP 1035553 A4 EP1035553 A4 EP 1035553A4 EP 98953068 A EP98953068 A EP 98953068A EP 98953068 A EP98953068 A EP 98953068A EP 1035553 A4 EP1035553 A4 EP 1035553A4
Authority
EP
European Patent Office
Prior art keywords
laminate
capacitor
producing
producing laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP98953068A
Other languages
German (de)
French (fr)
Other versions
EP1035553B1 (en
EP1035553A1 (en
Inventor
Kazuyoshi Honda
Noriyasu Echigo
Masaru Odagiri
Nobuki Sunagare
Shinichi Suzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31741697A external-priority patent/JP3630357B2/en
Priority claimed from JP31741297A external-priority patent/JP3391677B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to EP06017841A priority Critical patent/EP1732091B1/en
Publication of EP1035553A1 publication Critical patent/EP1035553A1/en
Publication of EP1035553A4 publication Critical patent/EP1035553A4/en
Application granted granted Critical
Publication of EP1035553B1 publication Critical patent/EP1035553B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/145—Organic dielectrics vapour deposited
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/306—Stacked capacitors made by thin film techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/2438—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24405—Polymer or resin [e.g., natural or synthetic rubber, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24413—Metal or metal compound

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
EP98953068A 1997-11-18 1998-11-16 Methods for producing a layered product Expired - Lifetime EP1035553B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06017841A EP1732091B1 (en) 1997-11-18 1998-11-16 Layered product, capacitor and a method for producing the layered product

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP31741297 1997-11-18
JP31741697A JP3630357B2 (en) 1997-11-18 1997-11-18 Manufacturing method of laminate
JP31741297A JP3391677B2 (en) 1997-11-18 1997-11-18 Laminates and capacitors
JP31741697 1997-11-18
PCT/JP1998/005154 WO1999026259A1 (en) 1997-11-18 1998-11-16 Laminate, capacitor, and method for producing laminate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP06017841A Division EP1732091B1 (en) 1997-11-18 1998-11-16 Layered product, capacitor and a method for producing the layered product

Publications (3)

Publication Number Publication Date
EP1035553A1 EP1035553A1 (en) 2000-09-13
EP1035553A4 true EP1035553A4 (en) 2005-10-12
EP1035553B1 EP1035553B1 (en) 2006-12-27

Family

ID=26569008

Family Applications (2)

Application Number Title Priority Date Filing Date
EP98953068A Expired - Lifetime EP1035553B1 (en) 1997-11-18 1998-11-16 Methods for producing a layered product
EP06017841A Expired - Lifetime EP1732091B1 (en) 1997-11-18 1998-11-16 Layered product, capacitor and a method for producing the layered product

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP06017841A Expired - Lifetime EP1732091B1 (en) 1997-11-18 1998-11-16 Layered product, capacitor and a method for producing the layered product

Country Status (6)

Country Link
US (2) US6576523B1 (en)
EP (2) EP1035553B1 (en)
KR (1) KR100372863B1 (en)
CN (2) CN1158682C (en)
DE (2) DE69841227D1 (en)
WO (1) WO1999026259A1 (en)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69841227D1 (en) * 1997-11-18 2009-11-19 Panasonic Corp Multilayer product, capacitor and method of making the multi-layered product
JP4533504B2 (en) * 2000-04-28 2010-09-01 パナソニック株式会社 Manufacturing method of electronic parts
DE10026259A1 (en) * 2000-05-26 2001-12-06 Epcos Ag Capacitor and method of making the capacitor
JP4680380B2 (en) * 2000-12-26 2011-05-11 株式会社リケン Piston ring and manufacturing method thereof
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
JP2003332169A (en) * 2002-05-15 2003-11-21 Matsushita Electric Ind Co Ltd Multilayer capacitor and manufacturing method thereof
DE10330401B3 (en) * 2003-07-04 2005-02-24 Applied Films Gmbh & Co. Kg Method and device for the area-wise application of release agents
JP4964408B2 (en) * 2003-07-14 2012-06-27 フレックス プロダクツ インコーポレイテッド Vacuum roll coated anti-counterfeit thin film interference article with overt and / or hidden patterned layer
CA2542819A1 (en) * 2003-09-30 2005-04-07 Japan Science And Technology Agency Metal thin film chip production method and metal thin film chip production device
DE102005018984A1 (en) * 2005-04-22 2006-11-02 Steiner Gmbh & Co. Kg Method and device for manufacturing electronic components
USD547720S1 (en) * 2005-05-12 2007-07-31 Honda Motor Co., Ltd. Capacitor cell
JP4934325B2 (en) * 2006-02-17 2012-05-16 株式会社フジクラ Printed wiring board connection structure and printed wiring board connection method
DE102007031457A1 (en) 2007-07-05 2009-01-08 Leybold Optics Gmbh Method and device for applying a layer of a release agent to a substrate
US8482048B2 (en) * 2009-07-31 2013-07-09 Alpha & Omega Semiconductor, Inc. Metal oxide semiconductor field effect transistor integrating a capacitor
JP4511625B1 (en) * 2009-10-16 2010-07-28 ルビコン株式会社 Multilayer capacitor, manufacturing method thereof, circuit board, and electronic device
JP5603201B2 (en) * 2010-10-27 2014-10-08 サントリーホールディングス株式会社 Resin container surface modification method and resin container surface modification apparatus
JP5770539B2 (en) * 2011-06-09 2015-08-26 Tdk株式会社 Electronic component and method for manufacturing electronic component
JP2013058558A (en) 2011-09-07 2013-03-28 Tdk Corp Electronic component
DE112013001679B4 (en) 2012-03-26 2023-03-09 Kemet Electronics Corporation Asymmetric high voltage capacitor
TWI621143B (en) * 2016-08-10 2018-04-11 鈺邦科技股份有限公司 Thin film capacitor and method of manufacturing the same
TWI665692B (en) * 2017-08-11 2019-07-11 鈺邦科技股份有限公司 Device for manufacturing a multi-layer stacked structure and method for manufacturing a thin film capacitor
TWI641009B (en) * 2017-10-13 2018-11-11 鈺邦科技股份有限公司 Device for manufacturing a multi-layer stacked structure and method for manufacturing a thin film capacitor
JP7551280B2 (en) * 2018-07-24 2024-09-17 Tdk株式会社 Multilayer ceramic electronic components
KR102127804B1 (en) * 2018-11-07 2020-06-29 삼성전기주식회사 Multilayer ceramic electronic component
CN110600283B (en) * 2019-09-03 2021-08-03 黄山申格电子科技股份有限公司 Capacitor vapor deposition negative pressure gold plating device and gold plating method
JP2022021734A (en) * 2020-07-22 2022-02-03 太陽誘電株式会社 Ceramic electronic component and method of manufacturing the same
US11854748B2 (en) * 2021-11-26 2023-12-26 Rubycon Corporation Thin film high polymer laminated capacitor manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499164A (en) * 1990-08-03 1992-03-31 Matsushita Electric Ind Co Ltd Evaporator for oil mask
US5223038A (en) * 1991-01-11 1993-06-29 Leybold Ag Apparatus for producing metal-free strips
US5595781A (en) * 1993-06-29 1997-01-21 Toray Industries, Inc. Vapor deposited film, and a geometry measuring method, production process control method, production method, geometry measuring apparatus and production process control apparatus therefor

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617834A (en) * 1970-08-31 1971-11-02 Illinois Tool Works Monolithic capacitor components and process for producing same
DE2837723A1 (en) 1978-08-30 1980-03-13 Walter Krause Sludge filter of high tensile polyester yarn - has three ends warp weft tightly together one gauge apart
JPS5579867A (en) * 1978-12-11 1980-06-16 Honshu Paper Co Ltd Vacuum evaporation method
US4349862A (en) * 1980-08-11 1982-09-14 International Business Machines Corporation Capacitive chip carrier and multilayer ceramic capacitors
JPS6050053B2 (en) * 1980-11-28 1985-11-06 日本真空技術株式会社 oil mask device
EP0117258B1 (en) * 1983-02-23 1987-05-20 Ibm Deutschland Gmbh Process for the production of metallic layers adhering to plastic supports
JPS6050053A (en) 1983-08-31 1985-03-19 Nissan Motor Co Ltd Auto-theft preventing device
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
US5125138A (en) 1983-12-19 1992-06-30 Spectrum Control, Inc. Miniaturized monolithic multi-layer capacitor and apparatus and method for making same
DE3484793D1 (en) 1983-12-19 1991-08-14 Spectrum Control Inc MINIATURIZED MONOLITHIC MULTILAYER CAPACITOR AND DEVICE AND METHOD FOR PRODUCING THE SAME.
US4622058A (en) * 1984-06-22 1986-11-11 International Business Machines Corporation Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate
JPS6142903A (en) 1984-08-06 1986-03-01 株式会社村田製作所 Method of forming sheath material of electronic part
JPS61183913A (en) * 1985-02-08 1986-08-16 株式会社村田製作所 Laminate capacitor
JPH0414450Y2 (en) * 1986-03-14 1992-03-31
JPS6331570A (en) 1986-07-23 1988-02-10 Toray Ind Inc Method for painting running web
JPS6331929A (en) 1986-07-25 1988-02-10 Toshiba Corp Intermittent feeder for parts
JPS6370411A (en) * 1986-09-11 1988-03-30 松下電器産業株式会社 Manufacture of metallized film
US5037691A (en) * 1986-09-15 1991-08-06 Compositech, Ltd. Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
US5171718A (en) * 1987-11-27 1992-12-15 Sony Corporation Method for forming a fine pattern by using a patterned resist layer
JPH0611018B2 (en) * 1988-01-07 1994-02-09 株式会社村田製作所 How to stack ceramic green sheets
JPH0817143B2 (en) * 1988-03-30 1996-02-21 松下電器産業株式会社 Film capacitor and manufacturing method thereof
EP0339844A3 (en) 1988-04-29 1991-01-16 SPECTRUM CONTROL, INC. (a Delaware corporation) Multi layer structure and process for making same
US5290606A (en) * 1989-01-30 1994-03-01 Svein Hestevik Method for manufacturing a substrate for a printed circuit board
JPH0650701B2 (en) * 1989-05-18 1994-06-29 松下電器産業株式会社 Multilayer capacitor element and manufacturing method thereof
JPH0793238B2 (en) 1989-06-30 1995-10-09 松下電器産業株式会社 Method of manufacturing film capacitor
JPH10135634A (en) * 1990-03-19 1998-05-22 Hitachi Ltd Multilayer wiring board and method of manufacturing the same
JP3022582B2 (en) 1990-05-09 2000-03-21 シーアイ化成株式会社 Cosmetic film and manufacturing method thereof
US5214844A (en) * 1990-12-17 1993-06-01 Nchip, Inc. Method of assembling integrated circuits to a silicon board
EP0507113B1 (en) 1991-04-05 1995-08-30 Balzers Aktiengesellschaft Method for coating a polymer substrate with a metal layer
US5153813A (en) * 1991-10-31 1992-10-06 International Business Machines Corporation High area capacitor formation using dry etching
JP3088179B2 (en) 1992-03-17 2000-09-18 松下電器産業株式会社 Manufacturing method of multilayer thin film capacitor
EP0701277B1 (en) * 1994-05-27 2008-02-27 Texas Instruments Incorporated Interconnection method using a porous insulator for line to line capacitance reduction
US5917157A (en) * 1994-12-12 1999-06-29 Remsburg; Ralph Multilayer wiring board laminate with enhanced thermal dissipation to dielectric substrate laminate
US5583359A (en) * 1995-03-03 1996-12-10 Northern Telecom Limited Capacitor structure for an integrated circuit
DE19527604A1 (en) * 1995-07-28 1997-01-30 Leybold Ag Method and device for producing metal-free strips in metal vapor deposition
US5623160A (en) * 1995-09-14 1997-04-22 Liberkowski; Janusz B. Signal-routing or interconnect substrate, structure and apparatus
JP3374627B2 (en) * 1995-12-05 2003-02-10 東レ株式会社 Polyester film and method for producing the same
JP3316731B2 (en) * 1996-01-11 2002-08-19 株式会社村田製作所 Multilayer ceramic electronic components
US5946566A (en) * 1996-03-01 1999-08-31 Ace Memory, Inc. Method of making a smaller geometry high capacity stacked DRAM device
US5759737A (en) * 1996-09-06 1998-06-02 International Business Machines Corporation Method of making a component carrier
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
SE520173C2 (en) * 1997-04-29 2003-06-03 Ericsson Telefon Ab L M Process for manufacturing a capacitor in an integrated circuit
US5856068A (en) * 1997-05-02 1999-01-05 Motorola, Inc. Method for fabricating a printed circuit board by curing under superatmospheric pressure
US5945203A (en) * 1997-10-14 1999-08-31 Zms Llc Stratified composite dielectric and method of fabrication
DE69841227D1 (en) * 1997-11-18 2009-11-19 Panasonic Corp Multilayer product, capacitor and method of making the multi-layered product
EP1017101B1 (en) * 1998-12-29 2009-07-29 Nxp B.V. Integrated circuit comprising a capacitive network with low dispersion
US6236572B1 (en) * 1999-02-04 2001-05-22 Dell Usa, L.P. Controlled impedance bus and method for a computer system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0499164A (en) * 1990-08-03 1992-03-31 Matsushita Electric Ind Co Ltd Evaporator for oil mask
US5223038A (en) * 1991-01-11 1993-06-29 Leybold Ag Apparatus for producing metal-free strips
US5595781A (en) * 1993-06-29 1997-01-21 Toray Industries, Inc. Vapor deposited film, and a geometry measuring method, production process control method, production method, geometry measuring apparatus and production process control apparatus therefor

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 334 (C - 0964) 21 July 1992 (1992-07-21) *
See also references of WO9926259A1 *

Also Published As

Publication number Publication date
CN1257053C (en) 2006-05-24
KR20010032207A (en) 2001-04-16
CN1158682C (en) 2004-07-21
EP1732091A1 (en) 2006-12-13
CN1285952A (en) 2001-02-28
US20030087037A1 (en) 2003-05-08
WO1999026259A1 (en) 1999-05-27
KR100372863B1 (en) 2003-02-19
US6576523B1 (en) 2003-06-10
DE69836762D1 (en) 2007-02-08
CN1533881A (en) 2004-10-06
DE69841227D1 (en) 2009-11-19
US6838153B2 (en) 2005-01-04
EP1035553B1 (en) 2006-12-27
EP1732091B1 (en) 2009-10-07
EP1035553A1 (en) 2000-09-13
DE69836762T2 (en) 2007-10-11

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