EP1475670A3 - Appareil lithographique et méthode de fabrication d'un dispositif - Google Patents

Appareil lithographique et méthode de fabrication d'un dispositif Download PDF

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Publication number
EP1475670A3
EP1475670A3 EP04076311A EP04076311A EP1475670A3 EP 1475670 A3 EP1475670 A3 EP 1475670A3 EP 04076311 A EP04076311 A EP 04076311A EP 04076311 A EP04076311 A EP 04076311A EP 1475670 A3 EP1475670 A3 EP 1475670A3
Authority
EP
European Patent Office
Prior art keywords
substrate
holder
release
projection
device manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04076311A
Other languages
German (de)
English (en)
Other versions
EP1475670A2 (fr
EP1475670B1 (fr
Inventor
Koen Jacobus Johannes Maria Zaal
Aschwin Lodewijk Hendricus Johannes Van Meer
Tjarko Adriaan Rudolf Van Empel
Jan Rein Miedema
Joost Jeroen Ottens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP03076400A external-priority patent/EP1475667A1/fr
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Priority to EP04076311A priority Critical patent/EP1475670B1/fr
Priority to EP06076721A priority patent/EP1762898A3/fr
Publication of EP1475670A2 publication Critical patent/EP1475670A2/fr
Publication of EP1475670A3 publication Critical patent/EP1475670A3/fr
Application granted granted Critical
Publication of EP1475670B1 publication Critical patent/EP1475670B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP04076311A 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif Expired - Lifetime EP1475670B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04076311A EP1475670B1 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif
EP06076721A EP1762898A3 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP03076400 2003-05-09
EP03076400A EP1475667A1 (fr) 2003-05-09 2003-05-09 Appareil lithographique et méthode de fabrication d'un dispositif
EP04076311A EP1475670B1 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP06076721A Division EP1762898A3 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif

Publications (3)

Publication Number Publication Date
EP1475670A2 EP1475670A2 (fr) 2004-11-10
EP1475670A3 true EP1475670A3 (fr) 2005-02-16
EP1475670B1 EP1475670B1 (fr) 2008-10-29

Family

ID=32992405

Family Applications (2)

Application Number Title Priority Date Filing Date
EP06076721A Withdrawn EP1762898A3 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif
EP04076311A Expired - Lifetime EP1475670B1 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP06076721A Withdrawn EP1762898A3 (fr) 2003-05-09 2004-04-29 Appareil lithographique et méthode de fabrication d'un dispositif

Country Status (1)

Country Link
EP (2) EP1762898A3 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102905163B1 (ko) * 2023-11-28 2025-12-30 삼성전자주식회사 웨이퍼 테이블

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0298564A1 (fr) * 1987-07-08 1989-01-11 Philips and Du Pont Optical Company Dispositif à vide pour tenir des pièces de travail
US5669977A (en) * 1995-12-22 1997-09-23 Lam Research Corporation Shape memory alloy lift pins for semiconductor processing equipment
US5684669A (en) * 1995-06-07 1997-11-04 Applied Materials, Inc. Method for dechucking a workpiece from an electrostatic chuck
US5956837A (en) * 1996-11-20 1999-09-28 Tokyo Electron Limited Method of detaching object to be processed from electrostatic chuck
US6307620B1 (en) * 1999-04-27 2001-10-23 Canon Kabushiki Kaisha Substrate holding apparatus, substrate transfer system, exposure apparatus, coating apparatus, method for making a device, and method for cleaning a substrate holding section
US20020142492A1 (en) * 2001-03-27 2002-10-03 Andreas Fischer Acoustic detection of dechucking and apparatus therefor
US20020141133A1 (en) * 2001-03-30 2002-10-03 Anderson Thomas W. Semiconductor wafer lifting device and methods for implementing the same
US20030079691A1 (en) * 2000-07-20 2003-05-01 Applied Materials, Inc. Method and apparatus for dechucking a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6215642B1 (en) * 1999-03-11 2001-04-10 Nikon Corporation Of Japan Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
JP2000286189A (ja) * 1999-03-31 2000-10-13 Nikon Corp 露光装置および露光方法ならびにデバイス製造方法
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
US6747282B2 (en) * 2001-06-13 2004-06-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0298564A1 (fr) * 1987-07-08 1989-01-11 Philips and Du Pont Optical Company Dispositif à vide pour tenir des pièces de travail
US5684669A (en) * 1995-06-07 1997-11-04 Applied Materials, Inc. Method for dechucking a workpiece from an electrostatic chuck
US5669977A (en) * 1995-12-22 1997-09-23 Lam Research Corporation Shape memory alloy lift pins for semiconductor processing equipment
US5956837A (en) * 1996-11-20 1999-09-28 Tokyo Electron Limited Method of detaching object to be processed from electrostatic chuck
US6307620B1 (en) * 1999-04-27 2001-10-23 Canon Kabushiki Kaisha Substrate holding apparatus, substrate transfer system, exposure apparatus, coating apparatus, method for making a device, and method for cleaning a substrate holding section
US20030079691A1 (en) * 2000-07-20 2003-05-01 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US20020142492A1 (en) * 2001-03-27 2002-10-03 Andreas Fischer Acoustic detection of dechucking and apparatus therefor
US20020141133A1 (en) * 2001-03-30 2002-10-03 Anderson Thomas W. Semiconductor wafer lifting device and methods for implementing the same

Also Published As

Publication number Publication date
EP1762898A2 (fr) 2007-03-14
EP1475670A2 (fr) 2004-11-10
EP1475670B1 (fr) 2008-10-29
EP1762898A3 (fr) 2007-03-28

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