EP1874982A4 - METHOD OF ELECTRODEPOSITION OF BRONZES - Google Patents

METHOD OF ELECTRODEPOSITION OF BRONZES

Info

Publication number: EP1874982A4
Authority: EP; European Patent Office
Prior art keywords: bronzes; electrodeposition
Prior art date: 2005-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP06750231A

Other languages

German (de)

French (fr)

Other versions

EP1874982B1 (en

EP1874982A1 (en

Inventor

Katrin Zschintzsch

Joachim Heyer

Marlies Kleinfeld

Stefan Schafer

Ortrud Steinius

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

MacDermid Enthone Inc

Original Assignee

Enthone Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-04-14

Filing date

2006-04-14

Publication date

2011-07-27

2006-04-14 Application filed by Enthone Inc filed Critical Enthone Inc

2008-01-09 Publication of EP1874982A1 publication Critical patent/EP1874982A1/en

2011-07-27 Publication of EP1874982A4 publication Critical patent/EP1874982A4/en

2014-05-07 Application granted granted Critical

2014-05-07 Publication of EP1874982B1 publication Critical patent/EP1874982B1/en

2026-04-14 Anticipated expiration legal-status Critical

Status Active legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electroplating Methods And Accessories (AREA)

EP06750231.0A 2005-04-14 2006-04-14 Method for electrodeposition of bronzes Active EP1874982B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US11/105,947 US20060260948A2 (en)	2005-04-14	2005-04-14	Method for electrodeposition of bronzes
PCT/US2006/014141 WO2006113473A1 (en)	2005-04-14	2006-04-14	Method for electrodeposition of bronzes

Publications (3)

Publication Number	Publication Date
EP1874982A1 EP1874982A1 (en)	2008-01-09
EP1874982A4 true EP1874982A4 (en)	2011-07-27
EP1874982B1 EP1874982B1 (en)	2014-05-07

Family

ID=37115474

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP06750231.0A Active EP1874982B1 (en)	2005-04-14	2006-04-14	Method for electrodeposition of bronzes

Country Status (7)

Country	Link
US (1)	US20060260948A2 (en)
EP (1)	EP1874982B1 (en)
JP (1)	JP2008537017A (en)
KR (1)	KR101361431B1 (en)
CN (1)	CN101194049B (en)
TW (1)	TWI391534B (en)
WO (1)	WO2006113473A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ES2531163T3 (en) *	2002-10-11	2015-03-11	Enthone	Procedure and electrolyte for galvanic deposition of bronzes
DE102004041701A1 (en) *	2004-08-28	2006-03-02	Enthone Inc., West Haven	Process for the electrolytic deposition of metals
US7296370B2 (en) *	2004-09-24	2007-11-20	Jarden Zinc Products, Inc.	Electroplated metals with silvery-white appearance and method of making
EP2037006B9 (en) *	2006-05-24	2012-02-15	ATOTECH Deutschland GmbH	Metal plating composition and method for the deposition of Copper-Zinc-Tin suitable for manufacturing thin film solar cell
DE102011008836B4 (en) *	2010-08-17	2013-01-10	Umicore Galvanotechnik Gmbh	Electrolyte and method for depositing copper-tin alloy layers
US8426241B2 (en)	2010-09-09	2013-04-23	International Business Machines Corporation	Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
CN102605394B (en) *	2012-03-07	2015-02-18	深圳市华傲创表面技术有限公司	Cyanogen-free acidic cupronickel-tin plating solution
JP6101510B2 (en) *	2013-02-18	2017-03-22	株式会社シミズ	Non-cyanide copper-tin alloy plating bath
US8945978B2 (en) *	2013-06-28	2015-02-03	Sunpower Corporation	Formation of metal structures in solar cells
EP3077578A4 (en) *	2013-12-05	2017-07-26	Honeywell International Inc.	Stannous methansulfonate solution with adjusted ph
WO2016004565A1 (en)	2014-07-07	2016-01-14	Honeywell International Inc.	Thermal interface material with ion scavenger
CN106661752B (en) *	2014-08-08	2021-08-10	奥野制药工业株式会社	Copper-tin alloy plating bath
US20160298249A1 (en) *	2014-09-30	2016-10-13	Rohm And Haas Electronic Materials Llc	Cyanide-free electroplating baths for white bronze based on copper (i) ions
MY183994A (en)	2014-12-05	2021-03-17	Honeywell Int Inc	High performance thermal interface materials with low thermal impedance
KR102426521B1 (en) *	2015-04-20	2022-07-27	아토테크 도이칠란트 게엠베하 운트 콤파니 카게	Electrolytic copper plating bath compositions and a method for their use
WO2016205134A2 (en) *	2015-06-16	2016-12-22	3M Innovative Properties Company	Plating bronze on polymer sheets
US10312177B2 (en)	2015-11-17	2019-06-04	Honeywell International Inc.	Thermal interface materials including a coloring agent
US10781349B2 (en)	2016-03-08	2020-09-22	Honeywell International Inc.	Thermal interface material including crosslinker and multiple fillers
US10501671B2 (en)	2016-07-26	2019-12-10	Honeywell International Inc.	Gel-type thermal interface material
US11041103B2 (en)	2017-09-08	2021-06-22	Honeywell International Inc.	Silicone-free thermal gel
US10428256B2 (en)	2017-10-23	2019-10-01	Honeywell International Inc.	Releasable thermal gel
CN108103540B (en) *	2018-01-24	2020-01-07	永星化工(上海)有限公司	Tin alloy electroplating solution
US11072706B2 (en)	2018-02-15	2021-07-27	Honeywell International Inc.	Gel-type thermal interface material
CN112236548B (en) *	2018-07-27	2022-03-04	三菱综合材料株式会社	Tin alloy plating solution
JP6645609B2 (en)	2018-07-27	2020-02-14	三菱マテリアル株式会社	Tin alloy plating solution
US11373921B2 (en)	2019-04-23	2022-06-28	Honeywell International Inc.	Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2916423A (en) *	1957-06-19	1959-12-08	Metal & Thermit Corp	Electrodeposition of copper and copper alloys
EP1408141A1 (en) *	2002-10-11	2004-04-14	Enthone Inc.	Process for galvanic deposition of bronze

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2854388A (en) *	1955-03-14	1958-09-30	City Auto Stamping Co	Electrodeposition of copper-tin alloys
DE3339541C2 (en) *	1983-11-02	1986-08-07	Degussa Ag, 6000 Frankfurt	Alkaline-cyanide bath for the galvanic deposition of copper-tin alloy coatings
DE3934866A1 (en) *	1989-10-19	1991-04-25	Blasberg Oberflaechentech	METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE
JP2901292B2 (en) *	1989-12-05	1999-06-07	住友ゴム工業株式会社	Bead wire for rubber coated tire and tire using the same
DE4336664A1 (en) *	1993-10-27	1995-05-04	Demetron Gmbh	Workpieces made of non-corrosion-resistant metals with coatings applied using the PVD process
US5385661A (en) *	1993-09-17	1995-01-31	International Business Machines Corporation	Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
SG68083A1 (en) *	1997-10-30	1999-10-19	Sung Soo Moon	Tin alloy plating compositions
US6508927B2 (en) *	1998-11-05	2003-01-21	C. Uyemura & Co., Ltd.	Tin-copper alloy electroplating bath
JP4359907B2 (en) *	1999-08-11	2009-11-11	石原薬品株式会社	Tin-copper alloy plating bath
JP3433291B2 (en) *	1999-09-27	2003-08-04	石原薬品株式会社	Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film
JP2001107287A (en) *	1999-10-07	2001-04-17	Ebara Udylite Kk	Sn-Cu alloy plating bath
JP2001181889A (en) *	1999-12-22	2001-07-03	Nippon Macdermid Kk	Bright tin-copper alloy electroplating bath
JP2001234387A (en) *	2000-02-17	2001-08-31	Yuken Industry Co Ltd	Whisker generation inhibitor and method for preventing tin-based electroplating
EP1325175B1 (en) *	2000-09-20	2005-05-04	Dr.Ing. Max Schlötter GmbH & Co. KG	Electrolyte and method for depositing tin-copper alloy layers
US20020187364A1 (en) *	2001-03-16	2002-12-12	Shipley Company, L.L.C.	Tin plating
JP3876383B2 (en) *	2002-06-03	2007-01-31	京都市	Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath
EP1477588A1 (en) *	2003-02-19	2004-11-17	Rohm and Haas Electronic Materials, L.L.C.	Copper Electroplating composition for wafers

2005
- 2005-04-14 US US11/105,947 patent/US20060260948A2/en not_active Abandoned
2006
- 2006-04-14 CN CN2006800208357A patent/CN101194049B/en active Active
- 2006-04-14 KR KR1020077026291A patent/KR101361431B1/en active Active
- 2006-04-14 EP EP06750231.0A patent/EP1874982B1/en active Active
- 2006-04-14 WO PCT/US2006/014141 patent/WO2006113473A1/en not_active Ceased
- 2006-04-14 JP JP2008506756A patent/JP2008537017A/en active Pending
- 2006-04-14 TW TW095113445A patent/TWI391534B/en active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2916423A (en) *	1957-06-19	1959-12-08	Metal & Thermit Corp	Electrodeposition of copper and copper alloys
EP1408141A1 (en) *	2002-10-11	2004-04-14	Enthone Inc.	Process for galvanic deposition of bronze

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006113473A1 *

Also Published As

Publication number	Publication date
US20050263403A1 (en)	2005-12-01
KR20070120600A (en)	2007-12-24
CN101194049A (en)	2008-06-04
US20060260948A2 (en)	2006-11-23
TW200702498A (en)	2007-01-16
JP2008537017A (en)	2008-09-11
EP1874982B1 (en)	2014-05-07
TWI391534B (en)	2013-04-01
CN101194049B (en)	2011-12-07
KR101361431B1 (en)	2014-02-10
WO2006113473A1 (en)	2006-10-26
EP1874982A1 (en)	2008-01-09

Legal Events

Date	Code	Title	Description
2007-12-07	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2008-01-09	17P	Request for examination filed	Effective date: 20071025
2008-01-09	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
2008-07-23	DAX	Request for extension of the european patent (deleted)
2011-07-27	A4	Supplementary search report drawn up and despatched	Effective date: 20110624
2012-03-28	17Q	First examination report despatched	Effective date: 20120224
2014-01-06	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2014-01-22	INTG	Intention to grant announced	Effective date: 20140107
2014-03-28	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2014-04-04	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2014-05-07	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
2014-05-07	REG	Reference to a national code	Ref country code: GB Ref legal event code: FG4D
2014-05-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: REF Ref document number: 666787 Country of ref document: AT Kind code of ref document: T Effective date: 20140515
2014-06-04	REG	Reference to a national code	Ref country code: IE Ref legal event code: FG4D
2014-06-26	REG	Reference to a national code	Ref country code: DE Ref legal event code: R096 Ref document number: 602006041478 Country of ref document: DE Effective date: 20140626
2014-09-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: MK05 Ref document number: 666787 Country of ref document: AT Kind code of ref document: T Effective date: 20140507
2014-10-08	REG	Reference to a national code	Ref country code: NL Ref legal event code: VDEP Effective date: 20140507
2014-10-27	REG	Reference to a national code	Ref country code: LT Ref legal event code: MG4D
2014-10-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140907 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140808 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2014-11-28	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2014-12-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140908
2015-01-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2015-02-10	REG	Reference to a national code	Ref country code: DE Ref legal event code: R097 Ref document number: 602006041478 Country of ref document: DE
2015-02-27	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2015-03-13	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2015-03-13	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2015-04-15	26N	No opposition filed	Effective date: 20150210
2015-05-21	REG	Reference to a national code	Ref country code: DE Ref legal event code: R097 Ref document number: 602006041478 Country of ref document: DE Effective date: 20150210
2015-07-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2015-11-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20150414 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2015-11-30	REG	Reference to a national code	Ref country code: CH Ref legal event code: PL
2015-12-23	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20150414
2016-01-27	REG	Reference to a national code	Ref country code: IE Ref legal event code: MM4A
2016-01-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150414 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150430 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150430
2016-04-21	REG	Reference to a national code	Ref country code: FR Ref legal event code: PLFP Year of fee payment: 11
2016-04-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20150414
2017-04-26	REG	Reference to a national code	Ref country code: FR Ref legal event code: PLFP Year of fee payment: 12
2017-05-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20060414 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2017-08-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140507
2018-04-25	REG	Reference to a national code	Ref country code: FR Ref legal event code: PLFP Year of fee payment: 13
2024-11-13	P01	Opt-out of the competence of the unified patent court (upc) registered	Free format text: CASE NUMBER: UPC_APP_327740/2023 Effective date: 20230524
2025-04-25	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: FR Payment date: 20250319 Year of fee payment: 20
2025-04-28	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: IT Payment date: 20250319 Year of fee payment: 20
2025-07-09	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20250319 Year of fee payment: 20

Publication	Publication Date	Title
EP1874982A4 (en)	2011-07-27	METHOD OF ELECTRODEPOSITION OF BRONZES
NL300885I2 (en)	2022-02-24	Irinotecansucrophosphate salt
ITUD20060182A1 (en)	2007-01-23	"DRILLING METHOD"
EP1855738A4 (en)	2010-07-21	CATHETER CONNECTION
EP1958295A4 (en)	2013-05-15	IMPLANT CONNECTOR
EP1819385A4 (en)	2012-03-07	AGUILLE SEIZURE MECHANISMS
DE602005022650D1 (en)	2010-09-16	Improved plating process
DE602004026114D1 (en)	2010-04-29	indwelling
IL190550A0 (en)	2008-11-03	Methods of protein production using anti-senescence compounds
BRPI0715287A2 (en)	2014-11-18	"EVALUATION PROCEDURE EVALUATION METHOD"
EP1891999A4 (en)	2010-07-28	BLOOD PURIFIER
ZA200706113B (en)	2008-09-25	Method for the treatment of copper-bearing materials
BRPI0819037A2 (en)	2014-10-07	"METHOD OF MANUFACTURING A DRINK"
DK1730327T3 (en)	2014-07-28	ADHD electrolysis
DE602006002419D1 (en)	2008-10-09	Immersion method
DE602005002498D1 (en)	2007-10-31	brain implant
EP1866961A4 (en)	2012-01-25	MICROCREUSET OF METAL OF CONTRIBUTION
EP1838906A4 (en)	2015-07-01	PREPARATION OF SUSPENSIONS
DE602006015776D1 (en)	2010-09-09	JET-solder bath
DE112005001372T5 (en)	2007-05-16	plating
FR2886944B3 (en)	2007-05-25	METHOD FOR SCREENING BACTERIA
FR2877833B1 (en)	2007-10-12	CORRECTEUR OF LORDOSES
DK1955066T3 (en)	2014-05-05	CONE-ASSAY METHOD
EP1669446A4 (en)	2008-07-16	SCREENING METHOD
EP1959001A4 (en)	2015-03-04	HYDROREFINING PROCESS