EP2076924A4 - MEMORY ELEMENT, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE - Google Patents

MEMORY ELEMENT, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

Info

Publication number
EP2076924A4
EP2076924A4 EP07831962A EP07831962A EP2076924A4 EP 2076924 A4 EP2076924 A4 EP 2076924A4 EP 07831962 A EP07831962 A EP 07831962A EP 07831962 A EP07831962 A EP 07831962A EP 2076924 A4 EP2076924 A4 EP 2076924A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
semiconductor device
same
memory element
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07831962A
Other languages
German (de)
French (fr)
Other versions
EP2076924A1 (en
EP2076924B1 (en
Inventor
Kensuke Yoshizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of EP2076924A1 publication Critical patent/EP2076924A1/en
Publication of EP2076924A4 publication Critical patent/EP2076924A4/en
Application granted granted Critical
Publication of EP2076924B1 publication Critical patent/EP2076924B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009—RRAM elements whose operation depends upon chemical change
    • G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B20/00—Read-only memory [ROM] devices
    • H10B20/20—Programmable ROM [PROM] devices comprising field-effect components
    • H10B20/25—One-time programmable ROM [OTPROM] devices, e.g. using electrically-fusible links
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/883—Oxides or nitrides
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/79—Array wherein the access device being a transistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
EP07831962.1A 2006-11-17 2007-11-08 Unerasable memory element and method for manufacturing the same Not-in-force EP2076924B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006311960 2006-11-17
PCT/JP2007/072232 WO2008059940A1 (en) 2006-11-17 2007-11-08 Memory element and method for manufacturing the same, and semiconductor device

Publications (3)

Publication Number Publication Date
EP2076924A1 EP2076924A1 (en) 2009-07-08
EP2076924A4 true EP2076924A4 (en) 2011-01-19
EP2076924B1 EP2076924B1 (en) 2017-03-08

Family

ID=39401742

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07831962.1A Not-in-force EP2076924B1 (en) 2006-11-17 2007-11-08 Unerasable memory element and method for manufacturing the same

Country Status (5)

Country Link
US (1) US8841642B2 (en)
EP (1) EP2076924B1 (en)
JP (1) JP5486766B2 (en)
TW (1) TWI467753B (en)
WO (1) WO2008059940A1 (en)

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US8283724B2 (en) 2007-02-26 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device, and method for manufacturing the same
US8451124B2 (en) * 2007-09-14 2013-05-28 The Regents Of The University Of Michigan Passive wireless readout mechanisms for nanocomposite thin film sensors
US8057849B2 (en) * 2009-12-04 2011-11-15 Xerox Corporation Ultra low melt metal nanoparticle composition for thick-film applications
CN102332430A (en) * 2011-09-23 2012-01-25 复旦大学 A manufacturing method of flexible and transparent 1T1R based on an all-low temperature process
US9853053B2 (en) * 2012-09-10 2017-12-26 3B Technologies, Inc. Three dimension integrated circuits employing thin film transistors
WO2015077792A1 (en) * 2013-11-25 2015-05-28 Georgetown University Electronic devices with organic nanoparticles
WO2016099580A2 (en) 2014-12-23 2016-06-23 Lupino James John Three dimensional integrated circuits employing thin film transistors
US11437333B2 (en) * 2016-12-30 2022-09-06 Texas Instruments Incorporated Packaged semiconductor device with a reflow wall
US12237249B2 (en) 2018-10-30 2025-02-25 Texas Instruments Incorporated Substrates with solder barriers on leads
CN113708049B (en) * 2020-05-21 2024-10-18 华为技术有限公司 Shell structure, electronic equipment and method for preparing shell structure
US11776595B2 (en) * 2022-01-25 2023-10-03 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device with source line control
US20250006687A1 (en) * 2023-06-30 2025-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Heat dissipation in semiconductor devices
KR102943938B1 (en) * 2023-09-22 2026-03-26 경희대학교 산학협력단 Memristor device including alkaline ion storage layer and method of manufacturing the same
KR102820155B1 (en) * 2023-11-20 2025-06-12 한국항공대학교산학협력단 Device via contact resistance modulation, electronics including the same, and manufacturing method of the same

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WO2005096380A1 (en) * 2004-04-02 2005-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
US20060046336A1 (en) * 2004-08-30 2006-03-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
US20060131569A1 (en) * 2004-12-21 2006-06-22 Choi Sung Y Organic memory device and method of manufacturing the same
US20060208248A1 (en) * 2005-03-17 2006-09-21 Samsung Electronics Co., Ltd. Nonvolatile nanochannel memory device using organic-inorganic complex mesoporous material
US20060221672A1 (en) * 2005-01-11 2006-10-05 The Trustees Of The University Of Pennsylvania Nanocrystal quantum dot memory devices

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JP2000208030A (en) 1999-01-19 2000-07-28 Canon Inc Electron-emitting device, electron source, image forming apparatus, and manufacturing method thereof
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WO2005096380A1 (en) * 2004-04-02 2005-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of the same
US20060046336A1 (en) * 2004-08-30 2006-03-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing display device
US20060131569A1 (en) * 2004-12-21 2006-06-22 Choi Sung Y Organic memory device and method of manufacturing the same
US20060221672A1 (en) * 2005-01-11 2006-10-05 The Trustees Of The University Of Pennsylvania Nanocrystal quantum dot memory devices
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Also Published As

Publication number Publication date
EP2076924A1 (en) 2009-07-08
WO2008059940A1 (en) 2008-05-22
US8841642B2 (en) 2014-09-23
TW200834909A (en) 2008-08-16
JP2008182193A (en) 2008-08-07
TWI467753B (en) 2015-01-01
JP5486766B2 (en) 2014-05-07
US20100283024A1 (en) 2010-11-11
EP2076924B1 (en) 2017-03-08

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