EP2157199A4 - Copper alloy material, and method for production thereof - Google Patents

Copper alloy material, and method for production thereof

Info

Publication number
EP2157199A4
EP2157199A4 EP08739314A EP08739314A EP2157199A4 EP 2157199 A4 EP2157199 A4 EP 2157199A4 EP 08739314 A EP08739314 A EP 08739314A EP 08739314 A EP08739314 A EP 08739314A EP 2157199 A4 EP2157199 A4 EP 2157199A4
Authority
EP
European Patent Office
Prior art keywords
production
copper alloy
alloy material
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08739314A
Other languages
German (de)
French (fr)
Other versions
EP2157199A1 (en
Inventor
Hiroshi Kaneko
Kuniteru Mihara
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2157199A1 publication Critical patent/EP2157199A1/en
Publication of EP2157199A4 publication Critical patent/EP2157199A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP08739314A 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof Withdrawn EP2157199A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007086026 2007-03-28
JP2008085013A JP2008266787A (en) 2007-03-28 2008-03-27 Copper alloy material and method for producing the same
PCT/JP2008/056196 WO2008123455A1 (en) 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof

Publications (2)

Publication Number Publication Date
EP2157199A1 EP2157199A1 (en) 2010-02-24
EP2157199A4 true EP2157199A4 (en) 2012-06-27

Family

ID=39830940

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08739314A Withdrawn EP2157199A4 (en) 2007-03-28 2008-03-28 Copper alloy material, and method for production thereof

Country Status (5)

Country Link
US (1) US20100170595A1 (en)
EP (1) EP2157199A4 (en)
JP (1) JP2008266787A (en)
CN (1) CN101680056B (en)
WO (1) WO2008123455A1 (en)

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EP2248921A4 (en) * 2008-01-31 2011-03-16 Furukawa Electric Co Ltd COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL
CN102112639A (en) * 2008-07-31 2011-06-29 古河电气工业株式会社 Copper alloy material for electrical and electronic components, and manufacturing method therefof
JP5261161B2 (en) * 2008-12-12 2013-08-14 Jx日鉱日石金属株式会社 Ni-Si-Co-based copper alloy and method for producing the same
JP5468798B2 (en) * 2009-03-17 2014-04-09 古河電気工業株式会社 Copper alloy sheet
JP5490439B2 (en) * 2009-04-30 2014-05-14 Jx日鉱日石金属株式会社 Manufacturing method of titanium copper for electronic parts
JP2011017070A (en) * 2009-07-10 2011-01-27 Furukawa Electric Co Ltd:The Copper alloy material for electric and electronic component
JP5748945B2 (en) * 2009-07-30 2015-07-15 古河電気工業株式会社 Copper alloy material manufacturing method and copper alloy material obtained thereby
JP5619391B2 (en) * 2009-08-12 2014-11-05 古河電気工業株式会社 Copper alloy material and method for producing the same
KR101095597B1 (en) 2009-08-28 2011-12-16 송건 Copper alloy for electrode
JP4620173B1 (en) 2010-03-30 2011-01-26 Jx日鉱日石金属株式会社 Cu-Co-Si alloy material
JP4677505B1 (en) 2010-03-31 2011-04-27 Jx日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP4830035B2 (en) 2010-04-14 2011-12-07 Jx日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP2012072470A (en) 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
US9476474B2 (en) 2010-12-13 2016-10-25 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring
KR101576715B1 (en) 2010-12-13 2015-12-10 니폰 세이센 가부시키가이샤 Copper alloy and method for producing copper alloy
JP2012144789A (en) * 2011-01-13 2012-08-02 Jx Nippon Mining & Metals Corp Cu-Co-Si-Zr ALLOY MATERIAL
JP5522692B2 (en) 2011-02-16 2014-06-18 株式会社日本製鋼所 High strength copper alloy forging
JP5451674B2 (en) 2011-03-28 2014-03-26 Jx日鉱日石金属株式会社 Cu-Si-Co based copper alloy for electronic materials and method for producing the same
JP5818724B2 (en) * 2011-03-29 2015-11-18 株式会社神戸製鋼所 Copper alloy material for electric and electronic parts, copper alloy material for plated electric and electronic parts
JP4799701B1 (en) 2011-03-29 2011-10-26 Jx日鉱日石金属株式会社 Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same
CN103502485B (en) * 2011-03-31 2015-11-25 国立大学法人东北大学 Copper alloy and preparation method of copper alloy
CN104137191A (en) * 2011-12-28 2014-11-05 矢崎总业株式会社 Ultrafine conductor material, ultrafine conductor, method for preparing ultrafine conductor, and ultrafine electrical wire
CN102534299B (en) * 2012-02-06 2013-12-04 南京达迈科技实业有限公司 Beryllium-free polybasic copper alloy
JP5802150B2 (en) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 Copper alloy
JP2014127345A (en) * 2012-12-26 2014-07-07 Yazaki Corp Insulated wire
KR101510222B1 (en) 2013-03-29 2015-04-08 한국기계연구원 A copper alloy having high strength and high electrical conductivity
CN103526072A (en) * 2013-04-26 2014-01-22 洛阳新火种节能技术推广有限公司 Copper-based alloy preparation process
JP2015086452A (en) * 2013-11-01 2015-05-07 株式会社オートネットワーク技術研究所 Copper alloy wire, copper alloy twisted wire, covered electric wire, wire harness, and copper alloy wire manufacturing method
CN103667785A (en) * 2013-12-03 2014-03-26 江苏帕齐尼铜业有限公司 Copper-cobalt alloy and preparation method thereof
KR102348993B1 (en) 2013-12-27 2022-01-10 후루카와 덴키 고교 가부시키가이샤 Copper alloy sheet material, connector, and production method for copper alloy sheet material
JP6266354B2 (en) * 2014-01-15 2018-01-24 株式会社神戸製鋼所 Copper alloy for electrical and electronic parts
KR101932828B1 (en) * 2014-03-31 2018-12-26 후루카와 덴키 고교 가부시키가이샤 Copper alloy wire material and manufacturing method thereof
CN103898353A (en) * 2014-04-02 2014-07-02 太原理工大学 Copper alloy with high strength and high conductivity and preparation method thereof
CN104060120B (en) * 2014-07-03 2016-02-24 兰宝琴 The preparation method of high strength copper alloy wire rod
KR102052879B1 (en) * 2014-08-25 2019-12-06 가부시키가이샤 고베 세이코쇼 Conductive material for connection parts which has excellent minute slide wear resistance
DE102014217570A1 (en) * 2014-09-03 2016-03-03 Federal-Mogul Wiesbaden Gmbh Sliding bearing or part thereof, method for producing the same and use of a CuCrZr alloy as a sliding bearing material
CN104451245A (en) * 2014-12-25 2015-03-25 春焱电子科技(苏州)有限公司 Copper alloy for electronic material with balanced properties
CN105088010B (en) * 2015-08-31 2017-08-25 河南科技大学 A kind of high-strength highly-conductive rare earth copper zirconium alloy and preparation method thereof
JP6246173B2 (en) * 2015-10-05 2017-12-13 Jx金属株式会社 Cu-Co-Ni-Si alloy for electronic parts
CN105274386B (en) * 2015-10-30 2017-05-17 北京有色金属研究总院 High-performance complex multi-element phosphor bronze alloy material and preparation method thereof
DE102016001994A1 (en) * 2016-02-19 2017-08-24 Wieland-Werke Ag Sliding element made of a copper-zinc alloy
WO2018066414A1 (en) * 2016-10-05 2018-04-12 株式会社神戸製鋼所 Copper alloy plate for heat dissipation component, heat dissipation component, and method for manufacturing heat dissipation component
RU2622190C1 (en) * 2016-10-10 2017-06-13 Юлия Алексеевна Щепочкина Copper-based alloy
WO2018100916A1 (en) * 2016-12-01 2018-06-07 古河電気工業株式会社 Copper alloy wire rod
DE102017001846B4 (en) * 2017-02-25 2025-02-20 Wieland-Werke Ag sliding element made of a copper alloy
KR101900793B1 (en) 2017-06-08 2018-09-20 주식회사 풍산 A method for tin plating copper alloy for electrical and electronic and car components, and tin plated copper alloy therefrom
CA3039936C (en) * 2017-09-29 2021-05-25 Jx Nippon Mining & Metals Corporation Metal powder for additive manufacturing metal laminate and metal additive manufactured object manufactured using said metal powder
KR101810925B1 (en) 2017-10-18 2017-12-20 주식회사 풍산 Copper alloy strips having high heat resistance and thermal dissipation properties
CN107739878B (en) * 2017-11-23 2019-10-18 全南晶环科技有限责任公司 A kind of high-strength and high-conductivity softening copper alloy and preparation method thereof
CN108220664A (en) * 2017-12-31 2018-06-29 安徽晋源铜业有限公司 A kind of preparation process of high intensity copper wire
WO2020014582A1 (en) * 2018-07-12 2020-01-16 Materion Corporation Copper-nickel-silicon alloys with high strength and high electrical conductivity
JP7202121B2 (en) * 2018-09-27 2023-01-11 Dowaメタルテック株式会社 Cu-Ni-Al-based copper alloy plate material, manufacturing method thereof, and conductive spring member
CN109355525B (en) * 2018-11-06 2020-01-10 有研工程技术研究院有限公司 Multi-scale multi-element high-strength high-conductivity copper chromium zirconium alloy material and preparation method thereof
CN110079696B (en) * 2019-03-08 2020-08-04 陕西斯瑞新材料股份有限公司 A kind of Cu-Fe-Ag-RE magnetic copper alloy for energy-saving motor rotor and preparation method thereof
US12037671B2 (en) * 2019-04-12 2024-07-16 Materion Corporation Copper alloys with high strength and high conductivity, and processes for making such copper alloys
CN112080666A (en) * 2019-06-12 2020-12-15 深圳市中科量能科技发展有限公司 Preparation formula and preparation method of composite material with high conductivity
CN112030030B (en) * 2020-08-06 2021-09-10 国网江西省电力有限公司电力科学研究院 High-strength high-conductivity copper alloy wire and preparation method thereof
CN112048637B (en) * 2020-09-15 2021-09-14 杭州铜信科技有限公司 Copper alloy material and manufacturing method thereof
CN112359247B (en) * 2020-11-16 2021-11-09 福州大学 Cu-Hf-Si-Ni-Ce copper alloy material and preparation method thereof
CN113817932A (en) * 2021-07-27 2021-12-21 中国兵器科学研究院宁波分院 High-strength heat-resistant stress relaxation-resistant copper alloy material and preparation method thereof
CN114395705A (en) * 2021-12-27 2022-04-26 中铝洛阳铜加工有限公司 High-temperature-resistant softened nickel-zirconium bronze rod material and processing technology thereof
CN114774733B (en) * 2022-04-28 2023-05-26 郑州大学 High-performance copper-based alloy material for casting roller sleeve and preparation method thereof
CN115044800B (en) * 2022-06-02 2023-03-24 浙江大学 High-strength high-conductivity copper alloy and preparation method thereof
CN115821110B (en) * 2022-12-08 2024-01-30 大连交通大学 C70350 alloy to establish synergistic change relationship of components based on cluster method
CN116287847B (en) * 2023-02-24 2025-03-25 宁波博威合金材料股份有限公司 A high-strength and high-conductivity copper alloy wire and its preparation method and application

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005118896A1 (en) * 2004-06-02 2005-12-15 The Furukawa Electric Co., Ltd. Copper alloy for electrical and electronic devices
US20060137773A1 (en) * 2004-12-24 2006-06-29 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy having bendability and stress relaxation property
JP2007016304A (en) * 2005-06-10 2007-01-25 Dowa Holdings Co Ltd Cu-Ni-Si-Zn-based copper alloy

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CN1177946C (en) * 2001-09-07 2004-12-01 同和矿业株式会社 Copper alloy for connector and manufacturing method thereof
JP4728704B2 (en) * 2005-06-01 2011-07-20 古河電気工業株式会社 Copper alloy for electrical and electronic equipment
JP2006265731A (en) * 2005-02-28 2006-10-05 Furukawa Electric Co Ltd:The Copper alloy
JP5202812B2 (en) * 2005-03-02 2013-06-05 古河電気工業株式会社 Copper alloy and its manufacturing method
JP3871064B2 (en) * 2005-06-08 2007-01-24 株式会社神戸製鋼所 Copper alloy plate for electrical connection parts

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
WO2005118896A1 (en) * 2004-06-02 2005-12-15 The Furukawa Electric Co., Ltd. Copper alloy for electrical and electronic devices
US20070131321A1 (en) * 2004-06-02 2007-06-14 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic instruments
US20060137773A1 (en) * 2004-12-24 2006-06-29 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy having bendability and stress relaxation property
JP2007016304A (en) * 2005-06-10 2007-01-25 Dowa Holdings Co Ltd Cu-Ni-Si-Zn-based copper alloy

Non-Patent Citations (2)

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Title
DATABASE WPI Week 200605, Derwent World Patents Index; AN 2006-047584 *
See also references of WO2008123455A1 *

Also Published As

Publication number Publication date
WO2008123455A1 (en) 2008-10-16
EP2157199A1 (en) 2010-02-24
CN101680056B (en) 2013-01-09
CN101680056A (en) 2010-03-24
US20100170595A1 (en) 2010-07-08
JP2008266787A (en) 2008-11-06

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