EP2157199A4 - Copper alloy material, and method for production thereof - Google Patents
Copper alloy material, and method for production thereofInfo
- Publication number
- EP2157199A4 EP2157199A4 EP08739314A EP08739314A EP2157199A4 EP 2157199 A4 EP2157199 A4 EP 2157199A4 EP 08739314 A EP08739314 A EP 08739314A EP 08739314 A EP08739314 A EP 08739314A EP 2157199 A4 EP2157199 A4 EP 2157199A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- production
- copper alloy
- alloy material
- copper
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007086026 | 2007-03-28 | ||
| JP2008085013A JP2008266787A (en) | 2007-03-28 | 2008-03-27 | Copper alloy material and method for producing the same |
| PCT/JP2008/056196 WO2008123455A1 (en) | 2007-03-28 | 2008-03-28 | Copper alloy material, and method for production thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2157199A1 EP2157199A1 (en) | 2010-02-24 |
| EP2157199A4 true EP2157199A4 (en) | 2012-06-27 |
Family
ID=39830940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08739314A Withdrawn EP2157199A4 (en) | 2007-03-28 | 2008-03-28 | Copper alloy material, and method for production thereof |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100170595A1 (en) |
| EP (1) | EP2157199A4 (en) |
| JP (1) | JP2008266787A (en) |
| CN (1) | CN101680056B (en) |
| WO (1) | WO2008123455A1 (en) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2248921A4 (en) * | 2008-01-31 | 2011-03-16 | Furukawa Electric Co Ltd | COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL |
| CN102112639A (en) * | 2008-07-31 | 2011-06-29 | 古河电气工业株式会社 | Copper alloy material for electrical and electronic components, and manufacturing method therefof |
| JP5261161B2 (en) * | 2008-12-12 | 2013-08-14 | Jx日鉱日石金属株式会社 | Ni-Si-Co-based copper alloy and method for producing the same |
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| JP2011017070A (en) * | 2009-07-10 | 2011-01-27 | Furukawa Electric Co Ltd:The | Copper alloy material for electric and electronic component |
| JP5748945B2 (en) * | 2009-07-30 | 2015-07-15 | 古河電気工業株式会社 | Copper alloy material manufacturing method and copper alloy material obtained thereby |
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| KR101095597B1 (en) | 2009-08-28 | 2011-12-16 | 송건 | Copper alloy for electrode |
| JP4620173B1 (en) | 2010-03-30 | 2011-01-26 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy material |
| JP4677505B1 (en) | 2010-03-31 | 2011-04-27 | Jx日鉱日石金属株式会社 | Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same |
| JP4830035B2 (en) | 2010-04-14 | 2011-12-07 | Jx日鉱日石金属株式会社 | Cu-Si-Co alloy for electronic materials and method for producing the same |
| JP2012072470A (en) | 2010-09-29 | 2012-04-12 | Jx Nippon Mining & Metals Corp | Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME |
| US9476474B2 (en) | 2010-12-13 | 2016-10-25 | Nippon Seisen Co., Ltd. | Copper alloy wire and copper alloy spring |
| KR101576715B1 (en) | 2010-12-13 | 2015-12-10 | 니폰 세이센 가부시키가이샤 | Copper alloy and method for producing copper alloy |
| JP2012144789A (en) * | 2011-01-13 | 2012-08-02 | Jx Nippon Mining & Metals Corp | Cu-Co-Si-Zr ALLOY MATERIAL |
| JP5522692B2 (en) | 2011-02-16 | 2014-06-18 | 株式会社日本製鋼所 | High strength copper alloy forging |
| JP5451674B2 (en) | 2011-03-28 | 2014-03-26 | Jx日鉱日石金属株式会社 | Cu-Si-Co based copper alloy for electronic materials and method for producing the same |
| JP5818724B2 (en) * | 2011-03-29 | 2015-11-18 | 株式会社神戸製鋼所 | Copper alloy material for electric and electronic parts, copper alloy material for plated electric and electronic parts |
| JP4799701B1 (en) | 2011-03-29 | 2011-10-26 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same |
| CN103502485B (en) * | 2011-03-31 | 2015-11-25 | 国立大学法人东北大学 | Copper alloy and preparation method of copper alloy |
| CN104137191A (en) * | 2011-12-28 | 2014-11-05 | 矢崎总业株式会社 | Ultrafine conductor material, ultrafine conductor, method for preparing ultrafine conductor, and ultrafine electrical wire |
| CN102534299B (en) * | 2012-02-06 | 2013-12-04 | 南京达迈科技实业有限公司 | Beryllium-free polybasic copper alloy |
| JP5802150B2 (en) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | Copper alloy |
| JP2014127345A (en) * | 2012-12-26 | 2014-07-07 | Yazaki Corp | Insulated wire |
| KR101510222B1 (en) | 2013-03-29 | 2015-04-08 | 한국기계연구원 | A copper alloy having high strength and high electrical conductivity |
| CN103526072A (en) * | 2013-04-26 | 2014-01-22 | 洛阳新火种节能技术推广有限公司 | Copper-based alloy preparation process |
| JP2015086452A (en) * | 2013-11-01 | 2015-05-07 | 株式会社オートネットワーク技術研究所 | Copper alloy wire, copper alloy twisted wire, covered electric wire, wire harness, and copper alloy wire manufacturing method |
| CN103667785A (en) * | 2013-12-03 | 2014-03-26 | 江苏帕齐尼铜业有限公司 | Copper-cobalt alloy and preparation method thereof |
| KR102348993B1 (en) | 2013-12-27 | 2022-01-10 | 후루카와 덴키 고교 가부시키가이샤 | Copper alloy sheet material, connector, and production method for copper alloy sheet material |
| JP6266354B2 (en) * | 2014-01-15 | 2018-01-24 | 株式会社神戸製鋼所 | Copper alloy for electrical and electronic parts |
| KR101932828B1 (en) * | 2014-03-31 | 2018-12-26 | 후루카와 덴키 고교 가부시키가이샤 | Copper alloy wire material and manufacturing method thereof |
| CN103898353A (en) * | 2014-04-02 | 2014-07-02 | 太原理工大学 | Copper alloy with high strength and high conductivity and preparation method thereof |
| CN104060120B (en) * | 2014-07-03 | 2016-02-24 | 兰宝琴 | The preparation method of high strength copper alloy wire rod |
| KR102052879B1 (en) * | 2014-08-25 | 2019-12-06 | 가부시키가이샤 고베 세이코쇼 | Conductive material for connection parts which has excellent minute slide wear resistance |
| DE102014217570A1 (en) * | 2014-09-03 | 2016-03-03 | Federal-Mogul Wiesbaden Gmbh | Sliding bearing or part thereof, method for producing the same and use of a CuCrZr alloy as a sliding bearing material |
| CN104451245A (en) * | 2014-12-25 | 2015-03-25 | 春焱电子科技(苏州)有限公司 | Copper alloy for electronic material with balanced properties |
| CN105088010B (en) * | 2015-08-31 | 2017-08-25 | 河南科技大学 | A kind of high-strength highly-conductive rare earth copper zirconium alloy and preparation method thereof |
| JP6246173B2 (en) * | 2015-10-05 | 2017-12-13 | Jx金属株式会社 | Cu-Co-Ni-Si alloy for electronic parts |
| CN105274386B (en) * | 2015-10-30 | 2017-05-17 | 北京有色金属研究总院 | High-performance complex multi-element phosphor bronze alloy material and preparation method thereof |
| DE102016001994A1 (en) * | 2016-02-19 | 2017-08-24 | Wieland-Werke Ag | Sliding element made of a copper-zinc alloy |
| WO2018066414A1 (en) * | 2016-10-05 | 2018-04-12 | 株式会社神戸製鋼所 | Copper alloy plate for heat dissipation component, heat dissipation component, and method for manufacturing heat dissipation component |
| RU2622190C1 (en) * | 2016-10-10 | 2017-06-13 | Юлия Алексеевна Щепочкина | Copper-based alloy |
| WO2018100916A1 (en) * | 2016-12-01 | 2018-06-07 | 古河電気工業株式会社 | Copper alloy wire rod |
| DE102017001846B4 (en) * | 2017-02-25 | 2025-02-20 | Wieland-Werke Ag | sliding element made of a copper alloy |
| KR101900793B1 (en) | 2017-06-08 | 2018-09-20 | 주식회사 풍산 | A method for tin plating copper alloy for electrical and electronic and car components, and tin plated copper alloy therefrom |
| CA3039936C (en) * | 2017-09-29 | 2021-05-25 | Jx Nippon Mining & Metals Corporation | Metal powder for additive manufacturing metal laminate and metal additive manufactured object manufactured using said metal powder |
| KR101810925B1 (en) | 2017-10-18 | 2017-12-20 | 주식회사 풍산 | Copper alloy strips having high heat resistance and thermal dissipation properties |
| CN107739878B (en) * | 2017-11-23 | 2019-10-18 | 全南晶环科技有限责任公司 | A kind of high-strength and high-conductivity softening copper alloy and preparation method thereof |
| CN108220664A (en) * | 2017-12-31 | 2018-06-29 | 安徽晋源铜业有限公司 | A kind of preparation process of high intensity copper wire |
| WO2020014582A1 (en) * | 2018-07-12 | 2020-01-16 | Materion Corporation | Copper-nickel-silicon alloys with high strength and high electrical conductivity |
| JP7202121B2 (en) * | 2018-09-27 | 2023-01-11 | Dowaメタルテック株式会社 | Cu-Ni-Al-based copper alloy plate material, manufacturing method thereof, and conductive spring member |
| CN109355525B (en) * | 2018-11-06 | 2020-01-10 | 有研工程技术研究院有限公司 | Multi-scale multi-element high-strength high-conductivity copper chromium zirconium alloy material and preparation method thereof |
| CN110079696B (en) * | 2019-03-08 | 2020-08-04 | 陕西斯瑞新材料股份有限公司 | A kind of Cu-Fe-Ag-RE magnetic copper alloy for energy-saving motor rotor and preparation method thereof |
| US12037671B2 (en) * | 2019-04-12 | 2024-07-16 | Materion Corporation | Copper alloys with high strength and high conductivity, and processes for making such copper alloys |
| CN112080666A (en) * | 2019-06-12 | 2020-12-15 | 深圳市中科量能科技发展有限公司 | Preparation formula and preparation method of composite material with high conductivity |
| CN112030030B (en) * | 2020-08-06 | 2021-09-10 | 国网江西省电力有限公司电力科学研究院 | High-strength high-conductivity copper alloy wire and preparation method thereof |
| CN112048637B (en) * | 2020-09-15 | 2021-09-14 | 杭州铜信科技有限公司 | Copper alloy material and manufacturing method thereof |
| CN112359247B (en) * | 2020-11-16 | 2021-11-09 | 福州大学 | Cu-Hf-Si-Ni-Ce copper alloy material and preparation method thereof |
| CN113817932A (en) * | 2021-07-27 | 2021-12-21 | 中国兵器科学研究院宁波分院 | High-strength heat-resistant stress relaxation-resistant copper alloy material and preparation method thereof |
| CN114395705A (en) * | 2021-12-27 | 2022-04-26 | 中铝洛阳铜加工有限公司 | High-temperature-resistant softened nickel-zirconium bronze rod material and processing technology thereof |
| CN114774733B (en) * | 2022-04-28 | 2023-05-26 | 郑州大学 | High-performance copper-based alloy material for casting roller sleeve and preparation method thereof |
| CN115044800B (en) * | 2022-06-02 | 2023-03-24 | 浙江大学 | High-strength high-conductivity copper alloy and preparation method thereof |
| CN115821110B (en) * | 2022-12-08 | 2024-01-30 | 大连交通大学 | C70350 alloy to establish synergistic change relationship of components based on cluster method |
| CN116287847B (en) * | 2023-02-24 | 2025-03-25 | 宁波博威合金材料股份有限公司 | A high-strength and high-conductivity copper alloy wire and its preparation method and application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005118896A1 (en) * | 2004-06-02 | 2005-12-15 | The Furukawa Electric Co., Ltd. | Copper alloy for electrical and electronic devices |
| US20060137773A1 (en) * | 2004-12-24 | 2006-06-29 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy having bendability and stress relaxation property |
| JP2007016304A (en) * | 2005-06-10 | 2007-01-25 | Dowa Holdings Co Ltd | Cu-Ni-Si-Zn-based copper alloy |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1177946C (en) * | 2001-09-07 | 2004-12-01 | 同和矿业株式会社 | Copper alloy for connector and manufacturing method thereof |
| JP4728704B2 (en) * | 2005-06-01 | 2011-07-20 | 古河電気工業株式会社 | Copper alloy for electrical and electronic equipment |
| JP2006265731A (en) * | 2005-02-28 | 2006-10-05 | Furukawa Electric Co Ltd:The | Copper alloy |
| JP5202812B2 (en) * | 2005-03-02 | 2013-06-05 | 古河電気工業株式会社 | Copper alloy and its manufacturing method |
| JP3871064B2 (en) * | 2005-06-08 | 2007-01-24 | 株式会社神戸製鋼所 | Copper alloy plate for electrical connection parts |
-
2008
- 2008-03-27 JP JP2008085013A patent/JP2008266787A/en active Pending
- 2008-03-28 CN CN2008800181847A patent/CN101680056B/en active Active
- 2008-03-28 WO PCT/JP2008/056196 patent/WO2008123455A1/en not_active Ceased
- 2008-03-28 EP EP08739314A patent/EP2157199A4/en not_active Withdrawn
- 2008-03-28 US US12/593,402 patent/US20100170595A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005118896A1 (en) * | 2004-06-02 | 2005-12-15 | The Furukawa Electric Co., Ltd. | Copper alloy for electrical and electronic devices |
| US20070131321A1 (en) * | 2004-06-02 | 2007-06-14 | The Furukawa Electric Co., Ltd. | Copper alloy for electric and electronic instruments |
| US20060137773A1 (en) * | 2004-12-24 | 2006-06-29 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Copper alloy having bendability and stress relaxation property |
| JP2007016304A (en) * | 2005-06-10 | 2007-01-25 | Dowa Holdings Co Ltd | Cu-Ni-Si-Zn-based copper alloy |
Non-Patent Citations (2)
| Title |
|---|
| DATABASE WPI Week 200605, Derwent World Patents Index; AN 2006-047584 * |
| See also references of WO2008123455A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008123455A1 (en) | 2008-10-16 |
| EP2157199A1 (en) | 2010-02-24 |
| CN101680056B (en) | 2013-01-09 |
| CN101680056A (en) | 2010-03-24 |
| US20100170595A1 (en) | 2010-07-08 |
| JP2008266787A (en) | 2008-11-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| 17P | Request for examination filed |
Effective date: 20091028 |
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Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
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| AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
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| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: FURUKAWA ELECTRIC CO., LTD. |
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| DAX | Request for extension of the european patent (deleted) | ||
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20120531 |
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| RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/06 20060101ALI20120522BHEP Ipc: B21B 1/22 20060101ALI20120522BHEP Ipc: C22F 1/00 20060101ALI20120522BHEP Ipc: C22F 1/08 20060101ALI20120522BHEP Ipc: C22C 9/00 20060101AFI20120522BHEP Ipc: B21B 3/00 20060101ALI20120522BHEP |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
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| 18W | Application withdrawn |
Effective date: 20121220 |