EP2286175A4 - Interferometric defect detection and classification - Google Patents

Interferometric defect detection and classification Download PDF

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Publication number
EP2286175A4
EP2286175A4 EP09759262.0A EP09759262A EP2286175A4 EP 2286175 A4 EP2286175 A4 EP 2286175A4 EP 09759262 A EP09759262 A EP 09759262A EP 2286175 A4 EP2286175 A4 EP 2286175A4
Authority
EP
European Patent Office
Prior art keywords
classification
defect detection
interferometric defect
interferometric
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09759262.0A
Other languages
German (de)
French (fr)
Other versions
EP2286175A1 (en
Inventor
Hwan J. Jeong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/190,144 external-priority patent/US7864334B2/en
Application filed by Individual filed Critical Individual
Publication of EP2286175A1 publication Critical patent/EP2286175A1/en
Publication of EP2286175A4 publication Critical patent/EP2286175A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
EP09759262.0A 2008-06-03 2009-06-02 Interferometric defect detection and classification Withdrawn EP2286175A4 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US13072908P 2008-06-03 2008-06-03
US13561608P 2008-07-22 2008-07-22
US12/190,144 US7864334B2 (en) 2008-06-03 2008-08-12 Interferometric defect detection
US18951008P 2008-08-20 2008-08-20
US18950908P 2008-08-20 2008-08-20
US18950808P 2008-08-20 2008-08-20
US21051309P 2009-03-19 2009-03-19
PCT/US2009/045999 WO2009149103A1 (en) 2008-06-03 2009-06-02 Interferometric defect detection and classification

Publications (2)

Publication Number Publication Date
EP2286175A1 EP2286175A1 (en) 2011-02-23
EP2286175A4 true EP2286175A4 (en) 2017-04-12

Family

ID=41398482

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09759262.0A Withdrawn EP2286175A4 (en) 2008-06-03 2009-06-02 Interferometric defect detection and classification

Country Status (5)

Country Link
EP (1) EP2286175A4 (en)
JP (1) JP5444334B2 (en)
KR (1) KR101556430B1 (en)
CN (1) CN102089616B (en)
WO (1) WO2009149103A1 (en)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421469B (en) * 2010-03-10 2014-01-01 Ind Tech Res Inst Surface measure device, surface measure method thereof and correction method thereof
EP2384692B1 (en) * 2010-05-07 2020-09-09 Rowiak GmbH Method and device for interferometry
CN103635857B (en) * 2011-07-25 2017-12-15 西铁城时计株式会社 Optics, projector, manufacture method
CN102435547B (en) * 2011-09-15 2014-02-05 上海华力微电子有限公司 Sensitive photoresist tolerance degree detection method and wafer defect detection method
CN103018202B (en) * 2011-09-22 2014-10-01 中国科学院微电子研究所 Optical detection method and device for integrated circuit defects
US8964088B2 (en) 2011-09-28 2015-02-24 Semiconductor Components Industries, Llc Time-delay-and-integrate image sensors having variable intergration times
JP5847304B2 (en) 2012-05-16 2016-01-20 株式会社日立ハイテクノロジーズ Inspection device
JP6025419B2 (en) 2012-06-27 2016-11-16 株式会社ニューフレアテクノロジー Inspection method and inspection apparatus
KR101354729B1 (en) * 2012-08-23 2014-01-27 앰코 테크놀로지 코리아 주식회사 Misalignment value measuring method of semiconductor device and semiconductor device adapted the same
JP6001383B2 (en) * 2012-08-28 2016-10-05 株式会社日立ハイテクノロジーズ Defect inspection method and apparatus using the same
JP5993691B2 (en) * 2012-09-28 2016-09-14 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
JP5946751B2 (en) * 2012-11-08 2016-07-06 株式会社日立ハイテクノロジーズ Defect detection method and apparatus, and defect observation method and apparatus
KR101336946B1 (en) 2012-11-27 2013-12-04 한국기초과학지원연구원 Failure analysis appratus and method using measurement of heat generation distribution
JP5786270B2 (en) * 2013-03-06 2015-09-30 株式会社東京精密 Two-color interference measuring device
CN104180765B (en) * 2013-05-28 2017-03-15 甘志银 The method and device of substrate warpage is measured in chemical vapor depsotition equipment in real time
US9995850B2 (en) 2013-06-06 2018-06-12 Kla-Tencor Corporation System, method and apparatus for polarization control
US9189705B2 (en) * 2013-08-08 2015-11-17 JSMSW Technology LLC Phase-controlled model-based overlay measurement systems and methods
JP6316068B2 (en) 2014-03-31 2018-04-25 国立大学法人 東京大学 Inspection system and inspection method
JP6433268B2 (en) 2014-03-31 2018-12-05 国立大学法人 東京大学 Inspection system and inspection method
CN106796098B (en) * 2014-07-14 2020-03-24 齐戈股份有限公司 Interferometric encoder using spectral analysis
JP5843179B1 (en) * 2014-09-19 2016-01-13 レーザーテック株式会社 Inspection apparatus and wavefront aberration correction method
CN104297744B (en) * 2014-10-16 2016-12-07 西安理工大学 The polarizational labelling of polarization lidar and compensation device and demarcation and compensation method
WO2016084239A1 (en) * 2014-11-28 2016-06-02 株式会社東京精密 Two-color interference measurement device
WO2016106379A1 (en) * 2014-12-22 2016-06-30 California Institute Of Technology Epi-illumination fourier ptychographic imaging for thick samples
TWI574334B (en) * 2015-03-17 2017-03-11 陳勇吉 Method of detecting wafers
CN104729712B (en) * 2015-03-30 2017-08-04 中国资源卫星应用中心 A Data Preprocessing Method for Spaceborne Atmospheric Exploration Fourier Transform Spectrometer
JP2017129500A (en) * 2016-01-21 2017-07-27 株式会社ブイ・テクノロジー Phase shift measuring device
KR102483787B1 (en) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 Apparatus and Method for Modeling of Defect to Semiconductor Apparatus, and Computer Program Therefor, and System for Inspection of Defect to Semiconductor Apparatus
KR102179989B1 (en) * 2016-04-13 2020-11-17 케이엘에이 코포레이션 Defect classification system and method based on electrical design intent
IL245932A (en) * 2016-05-30 2017-10-31 Elbit Systems Land & C4I Ltd System for object authenticity detection including a reference image acquisition module and a user module and methods therefor
JP6705356B2 (en) * 2016-10-12 2020-06-03 住友電気工業株式会社 Optical fiber characteristic evaluation method and optical fiber characteristic evaluation apparatus
US10234402B2 (en) * 2017-01-05 2019-03-19 Kla-Tencor Corporation Systems and methods for defect material classification
WO2018219639A1 (en) 2017-06-02 2018-12-06 Asml Netherlands B.V. Metrology apparatus
CN107504919B (en) * 2017-09-14 2019-08-16 深圳大学 Phase-folded three-dimensional digital imaging method and device based on phase mapping
US10522376B2 (en) * 2017-10-20 2019-12-31 Kla-Tencor Corporation Multi-step image alignment method for large offset die-die inspection
CN108280824B (en) * 2018-01-18 2022-06-14 电子科技大学 Laser shear speckle interference defect detection system based on image registration and fusion
CN108195849A (en) * 2018-01-23 2018-06-22 南京理工大学 Position phase defect detecting system and method based on the safe graceful interferometer of short relevant dynamic
NL2020623B1 (en) * 2018-01-24 2019-07-30 Illumina Inc Structured illumination microscopy with line scanning
NL2020622B1 (en) 2018-01-24 2019-07-30 Lllumina Cambridge Ltd Reduced dimensionality structured illumination microscopy with patterned arrays of nanowells
US11055836B2 (en) * 2018-02-13 2021-07-06 Camtek Ltd. Optical contrast enhancement for defect inspection
CN108550138A (en) * 2018-03-14 2018-09-18 浙江大学山东工业技术研究院 Refractory brick surface scratch recognition methods based on frequency filtering enhancing
US11193887B2 (en) * 2018-06-11 2021-12-07 Shimadzu Corporation Defect detection method and device
CN108961234A (en) * 2018-06-29 2018-12-07 中国科学院光电技术研究所 Transmission element defect detection device and method based on multi-wavelength iterative algorithm
CN108802056B (en) * 2018-08-23 2024-02-06 中国工程物理研究院激光聚变研究中心 Optical element phase type defect measuring device and detecting method
US10816464B2 (en) * 2019-01-23 2020-10-27 Applied Materials, Inc. Imaging reflectometer
US11294162B2 (en) * 2019-02-07 2022-04-05 Nanotronics Imaging, Inc. Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel
US10948423B2 (en) * 2019-02-17 2021-03-16 Kla Corporation Sensitive particle detection with spatially-varying polarization rotator and polarizer
JPWO2020196442A1 (en) * 2019-03-28 2020-10-01
CN109994398A (en) * 2019-04-18 2019-07-09 上海华力微电子有限公司 A kind of wafer defect scanning control methods
KR102166495B1 (en) * 2019-05-27 2020-10-15 김은근 Delta-bot type motorized microscope stage
CN110553580B (en) * 2019-06-04 2022-05-20 南京英特飞光电技术有限公司 Oblique incidence phase shift interferometer and rectangular prism large surface measurement method
DE102019118029A1 (en) * 2019-07-04 2021-01-07 Valeo Schalter Und Sensoren Gmbh Optical measuring device for determining object information from objects in at least one monitoring area
US11703460B2 (en) * 2019-07-09 2023-07-18 Kla Corporation Methods and systems for optical surface defect material characterization
CN114502911B (en) * 2019-09-27 2024-11-26 Asml荷兰有限公司 Measurement system, coherent scrambler illumination source and method thereof
CN111208089B (en) * 2020-01-13 2020-09-15 中国科学院上海光学精密机械研究所 Device and method for measuring defects in long-distance rough end face crystal body
CN118329927A (en) * 2020-02-24 2024-07-12 诺威有限公司 Optical metrology system and method
US11544838B2 (en) * 2020-03-21 2023-01-03 Kla Corporation Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging
KR102265540B1 (en) * 2020-04-27 2021-06-17 주식회사 에프에스티 Device of adjusting the focus, method of adjusting the focus and defect-detecting system
US11417010B2 (en) * 2020-05-19 2022-08-16 Applied Materials, Inc. Image based metrology of surface deformations
US20230298158A1 (en) * 2020-08-19 2023-09-21 Asml Netherlands B.V. Apparatus and method for selecting high quality images from raw images automatically
CN112098421B (en) * 2020-09-15 2022-06-28 上海微电子装备（集团）股份有限公司 Dark field detection device
US11353389B2 (en) * 2020-09-25 2022-06-07 Applied Materials, Inc. Method and apparatus for detection of particle size in a fluid
US12524867B2 (en) * 2021-05-21 2026-01-13 Kla Corporation System and method for optical wafer characterization with image up-sampling
CN113390467B (en) * 2021-07-14 2022-05-03 安徽至博光电科技股份有限公司 Vibration and temperature measurement device and signal processing method thereof
CN113465722B (en) * 2021-07-14 2022-06-07 安徽至博光电科技股份有限公司 Low-cost vibration measurement system and vibration measurement method
JP7307770B2 (en) * 2021-07-20 2023-07-12 日本電子株式会社 Analysis device and image processing method
CN113642422B (en) * 2021-07-27 2024-05-24 东北电力大学 Continuous Chinese sign language recognition method
CN113533351B (en) * 2021-08-20 2023-12-22 合肥御微半导体技术有限公司 A panel defect detection device and detection method
CN114820617B (en) * 2022-06-29 2022-09-20 苏州大学 Crystal defect detection method and system based on four-focus phase coherent machine vision
CN119023697A (en) * 2024-07-31 2024-11-26 聚时科技(上海)有限公司 A detection device, a detection method and a detection system
CN119688731B (en) * 2024-12-17 2026-02-17 西安交通大学 Point diffraction common-path interference wafer pattern defect detection device and method
CN120293982B (en) * 2025-03-04 2025-11-04 泸州川玻科技有限公司 A method for inspecting the quality of coating on the surface of glass bottles
CN121298771B (en) * 2025-12-12 2026-03-20 上海帆声图像科技有限公司 An inverse speckle modulation estimation method based on cosine fitting and RMSE reliability weighting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7209239B2 (en) * 2002-10-02 2007-04-24 Kla-Tencor Technologies Corporation System and method for coherent optical inspection
US7295303B1 (en) * 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501551B1 (en) * 1991-04-29 2002-12-31 Massachusetts Institute Of Technology Fiber optic imaging endoscope interferometer with at least one faraday rotator
JP2005003689A (en) * 1994-10-07 2005-01-06 Renesas Technology Corp Method and apparatus for inspecting defect in pattern on object to be inspected
US6288780B1 (en) * 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
JPH09281051A (en) * 1996-04-17 1997-10-31 Nikon Corp Inspection device
US6259055B1 (en) * 1998-10-26 2001-07-10 Lsp Technologies, Inc. Apodizers for laser peening systems
JP3881125B2 (en) * 1999-02-17 2007-02-14 レーザーテック株式会社 Level difference measuring apparatus and etching monitor apparatus and etching method using the level difference measuring apparatus
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
WO2002056332A1 (en) * 2001-01-10 2002-07-18 Ebara Corporation Inspection apparatus and inspection method with electron beam, and device manufacturing method comprising the inspection apparatus
JP4220287B2 (en) * 2003-03-31 2009-02-04 株式会社東芝 Pattern defect inspection system
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
US7357513B2 (en) * 2004-07-30 2008-04-15 Novalux, Inc. System and method for driving semiconductor laser sources for displays
US7446882B2 (en) 2005-01-20 2008-11-04 Zygo Corporation Interferometer for determining characteristics of an object surface
US7864334B2 (en) 2008-06-03 2011-01-04 Jzw Llc Interferometric defect detection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7209239B2 (en) * 2002-10-02 2007-04-24 Kla-Tencor Technologies Corporation System and method for coherent optical inspection
US7295303B1 (en) * 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009149103A1 *

Also Published As

Publication number Publication date
JP5444334B2 (en) 2014-03-19
KR101556430B1 (en) 2015-10-01
CN102089616A (en) 2011-06-08
CN102089616B (en) 2013-03-13
WO2009149103A1 (en) 2009-12-10
EP2286175A1 (en) 2011-02-23
JP2011523711A (en) 2011-08-18
KR20110031306A (en) 2011-03-25

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