EP2331454A4 - METHOD FOR MANUFACTURING MICROFLUIDIC DEVICE CHIP AND THEREFORE FORMED THEREBY - Google Patents
METHOD FOR MANUFACTURING MICROFLUIDIC DEVICE CHIP AND THEREFORE FORMED THEREBYInfo
- Publication number
- EP2331454A4 EP2331454A4 EP09747424.1A EP09747424A EP2331454A4 EP 2331454 A4 EP2331454 A4 EP 2331454A4 EP 09747424 A EP09747424 A EP 09747424A EP 2331454 A4 EP2331454 A4 EP 2331454A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- microfluidic device
- device chip
- manufacturing microfluidic
- manufacturing
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
- G01F1/78—Direct mass flowmeters
- G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
- G01F1/84—Coriolis or gyroscopic mass flowmeters
- G01F1/8409—Coriolis or gyroscopic mass flowmeters constructional details
- G01F1/844—Coriolis or gyroscopic mass flowmeters constructional details microfluidic or miniaturised flowmeters
- G01F1/8445—Coriolis or gyroscopic mass flowmeters constructional details microfluidic or miniaturised flowmeters micromachined flowmeters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0214—Biosensors; Chemical sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0278—Temperature sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/218—Means to regulate or vary operation of device
- Y10T137/2191—By non-fluid energy field affecting input [e.g., transducer]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/2224—Structure of body of device
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12730308P | 2008-05-13 | 2008-05-13 | |
| US12/464,426 US8021961B2 (en) | 2008-05-13 | 2009-05-12 | Process of fabricating microfluidic device chips and chips formed thereby |
| PCT/US2009/043720 WO2009140340A1 (en) | 2008-05-13 | 2009-05-13 | Process of fabricating microfluidic device chips and chips formed thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2331454A1 EP2331454A1 (en) | 2011-06-15 |
| EP2331454A4 true EP2331454A4 (en) | 2014-11-26 |
Family
ID=41315348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09747424.1A Withdrawn EP2331454A4 (en) | 2008-05-13 | 2009-05-13 | METHOD FOR MANUFACTURING MICROFLUIDIC DEVICE CHIP AND THEREFORE FORMED THEREBY |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8021961B2 (en) |
| EP (1) | EP2331454A4 (en) |
| WO (1) | WO2009140340A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2719460B1 (en) * | 2012-10-12 | 2016-12-14 | Sony DADC Austria AG | Microfluidic devices |
| EP2934754B1 (en) * | 2012-12-21 | 2017-08-09 | Endress+Hauser Flowtec AG | Measuring system having a carrier element and a sensor |
| GB2515571A (en) | 2013-06-28 | 2014-12-31 | Ibm | Fabrication of microfluidic chips having electrodes level with microchannel walls |
| JP2018507390A (en) * | 2014-12-11 | 2018-03-15 | ザ テクノロジー パートナーシップ パブリック リミテッド カンパニー | Acoustic sensor |
| DE102016110905B4 (en) * | 2016-06-14 | 2026-03-26 | Endress+Hauser Flowtec Ag | Measuring device for measuring a quantity of a flowing fluid |
| EP3139159A1 (en) | 2016-08-23 | 2017-03-08 | Sensirion AG | Sensor assembly |
| EP3582894A4 (en) | 2017-04-21 | 2020-03-04 | Hewlett-Packard Development Company, L.P. | MICROFLUIDIC CHIP |
| EP3582892A4 (en) | 2017-04-21 | 2020-03-04 | Hewlett-Packard Development Company, L.P. | COPLANAR MICROFLUIDIC HANDLING |
| EP3583416B1 (en) | 2017-04-21 | 2024-05-29 | Hewlett-Packard Development Company, L.P. | Chip to chip fluidic interconnect |
| USD849265S1 (en) * | 2017-04-21 | 2019-05-21 | Precision Nanosystems Inc | Microfluidic chip |
| US11364496B2 (en) | 2017-04-21 | 2022-06-21 | Hewlett-Packard Development Company, L.P. | Coplanar fluidic interconnect |
| CN108816301B (en) * | 2018-08-09 | 2024-06-11 | 清华大学 | Microfluidic chip and packaging method thereof, and packaging accessories for microfluidic chip packaging |
| DE102019102836B4 (en) | 2019-02-05 | 2023-02-02 | Infineon Technologies Ag | METHODS OF PANEL BONDING ACTIONS AND ELECTRONIC DEVICES WITH CAVIES |
| JP2022514522A (en) * | 2019-04-29 | 2022-02-14 | ヒューレット-パッカード デベロップメント カンパニー エル.ピー. | Corrosion resistant micro electromechanical fluid discharge device |
| EP3937512A1 (en) * | 2020-07-10 | 2022-01-12 | Infineon Technologies AG | Method and structure for sensors on glass |
| US12296333B2 (en) * | 2021-02-22 | 2025-05-13 | Illumina, Inc. | Hybrid glass plastic flow cell and fabrication methods |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020185557A1 (en) * | 2001-06-06 | 2002-12-12 | Integrates Sensing Systems | Micromachined lysing device and method for performing cell lysis |
| EP1443016A2 (en) * | 2003-01-29 | 2004-08-04 | Hewlett-Packard Development Company, L.P. | Micro-Fabricated device and method of making same |
| DE102007050865A1 (en) * | 2006-10-27 | 2008-05-08 | Hitachi, Ltd. | Functional component e.g. high frequency sensor, for use in micro electromechanical system, has reaction product layer produced on boundary layer when metal layer and substrate are connected together by anodic connection |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6477901B1 (en) * | 1999-12-21 | 2002-11-12 | Integrated Sensing Systems, Inc. | Micromachined fluidic apparatus |
| KR100370398B1 (en) * | 2000-06-22 | 2003-01-30 | 삼성전자 주식회사 | Method for surface mountable chip scale packaging of electronic and MEMS devices |
| AUPR245601A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus (WSM09) |
| US6647778B2 (en) * | 2001-06-20 | 2003-11-18 | Integrated Sensing Systems | Integrated microtube sensing device |
| US6838056B2 (en) * | 2002-07-08 | 2005-01-04 | Innovative Micro Technology | Method and apparatus for sorting biological cells with a MEMS device |
| US7094345B2 (en) * | 2002-09-09 | 2006-08-22 | Cytonome, Inc. | Implementation of microfluidic components, including molecular fractionation devices, in a microfluidic system |
| US7381628B2 (en) * | 2004-08-20 | 2008-06-03 | Integrated Sensing Systems, Inc. | Process of making a microtube and microfluidic devices formed therewith |
| US7351603B2 (en) * | 2004-08-20 | 2008-04-01 | Integrated Sensing Systems, Inc. | Process of making a microtube and microfluidic devices formed therewith |
| US7568399B2 (en) * | 2006-01-05 | 2009-08-04 | Integrated Sensing Systems, Inc. | Microfluidic device |
-
2009
- 2009-05-12 US US12/464,426 patent/US8021961B2/en active Active
- 2009-05-13 WO PCT/US2009/043720 patent/WO2009140340A1/en not_active Ceased
- 2009-05-13 EP EP09747424.1A patent/EP2331454A4/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020185557A1 (en) * | 2001-06-06 | 2002-12-12 | Integrates Sensing Systems | Micromachined lysing device and method for performing cell lysis |
| EP1443016A2 (en) * | 2003-01-29 | 2004-08-04 | Hewlett-Packard Development Company, L.P. | Micro-Fabricated device and method of making same |
| DE102007050865A1 (en) * | 2006-10-27 | 2008-05-08 | Hitachi, Ltd. | Functional component e.g. high frequency sensor, for use in micro electromechanical system, has reaction product layer produced on boundary layer when metal layer and substrate are connected together by anodic connection |
Non-Patent Citations (2)
| Title |
|---|
| DANICK BRIAND ET AL: "Integration of robust fluidic interconnects using metal to glass anodic bonding; Integration of robust fluidic interconnects using metal to glass anodic bonding", JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 15, no. 9, 1 September 2005 (2005-09-01), pages 1657 - 1663, XP020091663, ISSN: 0960-1317, DOI: 10.1088/0960-1317/15/9/007 * |
| See also references of WO2009140340A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US8021961B2 (en) | 2011-09-20 |
| EP2331454A1 (en) | 2011-06-15 |
| US20090283844A1 (en) | 2009-11-19 |
| WO2009140340A1 (en) | 2009-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20110322 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR |
|
| AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
| DAX | Request for extension of the european patent (deleted) | ||
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20141029 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/12 20060101ALI20141023BHEP Ipc: B81C 1/00 20060101AFI20141023BHEP Ipc: H01L 21/02 20060101ALI20141023BHEP |
|
| 17Q | First examination report despatched |
Effective date: 20181017 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20200603 |