EP2448377A4 - MULTIPLE PATTERN WIRING SUBSTRATE, WIRING SUBSTRATE, AND ELECTRONIC DEVICE - Google Patents

MULTIPLE PATTERN WIRING SUBSTRATE, WIRING SUBSTRATE, AND ELECTRONIC DEVICE

Info

Publication number
EP2448377A4
EP2448377A4 EP20100792138 EP10792138A EP2448377A4 EP 2448377 A4 EP2448377 A4 EP 2448377A4 EP 20100792138 EP20100792138 EP 20100792138 EP 10792138 A EP10792138 A EP 10792138A EP 2448377 A4 EP2448377 A4 EP 2448377A4
Authority
EP
European Patent Office
Prior art keywords
wiring substrate
electronic device
multiple pattern
pattern wiring
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20100792138
Other languages
German (de)
French (fr)
Other versions
EP2448377A1 (en
EP2448377B1 (en
Inventor
Shuzou Nakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of EP2448377A1 publication Critical patent/EP2448377A1/en
Publication of EP2448377A4 publication Critical patent/EP2448377A4/en
Application granted granted Critical
Publication of EP2448377B1 publication Critical patent/EP2448377B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/63—Seals characterised by their shape or disposition, e.g. between cap and walls of a container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
EP10792138.9A 2009-06-25 2010-06-23 Multi-pattern wiring substrate and electronic device Not-in-force EP2448377B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009150614A JP5355246B2 (en) 2009-06-25 2009-06-25 Multi-cavity wiring board, wiring board and electronic device
PCT/JP2010/060658 WO2010150820A1 (en) 2009-06-25 2010-06-23 Multi-pattern wiring substrate, wiring-substrate, and electronic device

Publications (3)

Publication Number Publication Date
EP2448377A1 EP2448377A1 (en) 2012-05-02
EP2448377A4 true EP2448377A4 (en) 2014-03-12
EP2448377B1 EP2448377B1 (en) 2015-11-25

Family

ID=43386589

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10792138.9A Not-in-force EP2448377B1 (en) 2009-06-25 2010-06-23 Multi-pattern wiring substrate and electronic device

Country Status (5)

Country Link
US (1) US8658908B2 (en)
EP (1) EP2448377B1 (en)
JP (1) JP5355246B2 (en)
CN (1) CN102342185B (en)
WO (1) WO2010150820A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012108229A1 (en) * 2011-02-07 2012-08-16 株式会社村田製作所 Ceramic substrate and method for manufacturing same
JP5763962B2 (en) 2011-04-19 2015-08-12 日本特殊陶業株式会社 Ceramic wiring board, multi-cavity ceramic wiring board, and manufacturing method thereof
JP5945099B2 (en) 2011-04-20 2016-07-05 日本特殊陶業株式会社 Wiring board, multi-cavity wiring board, and manufacturing method thereof
JP6006474B2 (en) 2011-04-25 2016-10-12 日本特殊陶業株式会社 Wiring board, multi-cavity wiring board, and manufacturing method thereof
KR20140109849A (en) * 2011-12-27 2014-09-16 니혼도꾸슈도교 가부시키가이샤 Circuit board and multi-cavity circuit board
KR20130081515A (en) * 2012-01-09 2013-07-17 삼성전자주식회사 A substrate for a led package and manufacturing method of a led package
JP6129491B2 (en) * 2012-08-06 2017-05-17 Ｎｇｋエレクトロデバイス株式会社 Multi-wiring board
JP6029173B2 (en) * 2013-02-04 2016-11-24 Ｎｇｋエレクトロデバイス株式会社 Ceramic package and manufacturing method thereof
CN105359632B (en) * 2013-10-23 2018-02-06 京瓷株式会社 Circuit board and electronic installation
US9820384B2 (en) * 2013-12-11 2017-11-14 Intel Corporation Flexible electronic assembly method
JP6403092B2 (en) * 2014-10-20 2018-10-10 日立金属株式会社 Ceramic substrate and method of manufacturing electronic component using the same
EP3448133B1 (en) 2016-04-22 2020-12-02 Kyocera Corporation Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board
CN111433285B (en) * 2017-12-08 2022-07-26 东洋纺株式会社 polyester elastomer resin composition
WO2020004565A1 (en) * 2018-06-28 2020-01-02 京セラ株式会社 Circuit board and electronic device comprising same
JP6550516B1 (en) * 2018-09-18 2019-07-24 レノボ・シンガポール・プライベート・リミテッド Panel, PCB and PCB manufacturing method
DE102018128570A1 (en) * 2018-11-14 2020-05-14 Osram Opto Semiconductors Gmbh METHOD FOR PRODUCING A VARIETY OF RADIATION-EMITTING COMPONENTS, RADIATION-EMITTING COMPONENT, METHOD FOR PRODUCING A CONNECTING BEARING AND CONNECTING SUPPORT
JP7200705B2 (en) * 2019-01-31 2023-01-10 セイコーエプソン株式会社 Vibration device, manufacturing method of vibration device, vibration module, electronic device, and moving body
JP7135947B2 (en) * 2019-03-12 2022-09-13 三菱マテリアル株式会社 Insulated circuit board manufacturing method and ceramic plate
JP2023139724A (en) * 2022-03-22 2023-10-04 キヤノン株式会社 Multi-panel board, functional module and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124677A (en) * 1990-08-22 1992-06-23 Harris Corporation Waffleline-configured surface-mount package for high frequency signal coupling applications
JPH10270813A (en) * 1997-03-27 1998-10-09 Murata Mfg Co Ltd Ceramic substrate with breaking groove and electronic part manufactured from the same
JP2005033450A (en) * 2003-07-11 2005-02-03 Murata Mfg Co Ltd Electronic component and its manufacturing method
US20080192446A1 (en) * 2007-02-09 2008-08-14 Johannes Hankofer Protection For Circuit Boards
US7492044B2 (en) * 2005-10-06 2009-02-17 Lenovo (Singapore) Pte. Ltd. System and method for decreasing stress on solder holding BGA module to computer motherboard

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US3608186A (en) * 1969-10-30 1971-09-28 Jearld L Hutson Semiconductor device manufacture with junction passivation
JPH0750700B2 (en) * 1989-06-27 1995-05-31 三菱電機株式会社 Semiconductor chip manufacturing method
US6603193B2 (en) * 2001-09-06 2003-08-05 Silicon Bandwidth Inc. Semiconductor package
TW551611U (en) * 2002-12-13 2003-09-01 Kingpak Tech Inc Improved structure of photo sensor package
JP2005064230A (en) * 2003-08-12 2005-03-10 Disco Abrasive Syst Ltd How to divide a plate
JP2006041456A (en) 2004-06-25 2006-02-09 Kyocera Corp Optical semiconductor element storage package and optical semiconductor device
JP4511311B2 (en) * 2004-10-28 2010-07-28 京セラ株式会社 Multi-circuit board and electronic device
JP5373262B2 (en) * 2006-12-06 2013-12-18 株式会社デンソー Cap fixing method of semiconductor substrate
JP2009105212A (en) 2007-10-23 2009-05-14 Toshiba Corp Printed wiring boards and electronic devices
US7906371B2 (en) * 2008-05-28 2011-03-15 Stats Chippac, Ltd. Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
JP5052470B2 (en) 2008-09-25 2012-10-17 京セラ株式会社 Multi-cavity wiring board, wiring board and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124677A (en) * 1990-08-22 1992-06-23 Harris Corporation Waffleline-configured surface-mount package for high frequency signal coupling applications
JPH10270813A (en) * 1997-03-27 1998-10-09 Murata Mfg Co Ltd Ceramic substrate with breaking groove and electronic part manufactured from the same
JP2005033450A (en) * 2003-07-11 2005-02-03 Murata Mfg Co Ltd Electronic component and its manufacturing method
US7492044B2 (en) * 2005-10-06 2009-02-17 Lenovo (Singapore) Pte. Ltd. System and method for decreasing stress on solder holding BGA module to computer motherboard
US20080192446A1 (en) * 2007-02-09 2008-08-14 Johannes Hankofer Protection For Circuit Boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010150820A1 *

Also Published As

Publication number Publication date
US8658908B2 (en) 2014-02-25
EP2448377A1 (en) 2012-05-02
US20110315439A1 (en) 2011-12-29
CN102342185B (en) 2015-04-22
CN102342185A (en) 2012-02-01
EP2448377B1 (en) 2015-11-25
WO2010150820A1 (en) 2010-12-29
JP2011009400A (en) 2011-01-13
JP5355246B2 (en) 2013-11-27

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