EP2721111A4 - THERMOPLASTIC THERMOPLASTIC COMPOSITIONS - Google Patents

THERMOPLASTIC THERMOPLASTIC COMPOSITIONS

Info

Publication number
EP2721111A4
EP2721111A4 EP12800067.6A EP12800067A EP2721111A4 EP 2721111 A4 EP2721111 A4 EP 2721111A4 EP 12800067 A EP12800067 A EP 12800067A EP 2721111 A4 EP2721111 A4 EP 2721111A4
Authority
EP
European Patent Office
Prior art keywords
thermoplastic
compositions
thermoplastic compositions
thermoplastic thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12800067.6A
Other languages
German (de)
French (fr)
Other versions
EP2721111B1 (en
EP2721111A2 (en
Inventor
Xiangyang Li
Mikhail Sagal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro LLC
Thermal Solution Resources LLC
Original Assignee
Thermal Solution Resources LLC
Bayer MaterialScience LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermal Solution Resources LLC, Bayer MaterialScience LLC filed Critical Thermal Solution Resources LLC
Publication of EP2721111A2 publication Critical patent/EP2721111A2/en
Publication of EP2721111A4 publication Critical patent/EP2721111A4/en
Application granted granted Critical
Publication of EP2721111B1 publication Critical patent/EP2721111B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C08L33/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
EP12800067.6A 2011-06-15 2012-07-03 Thermally conductive thermoplastic compositions Active EP2721111B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/160,740 US20120319031A1 (en) 2011-06-15 2011-06-15 Thermally conductive thermoplastic compositions
PCT/US2012/045405 WO2012174574A2 (en) 2011-06-15 2012-07-03 Thermally conductive thermoplastic compositions

Publications (3)

Publication Number Publication Date
EP2721111A2 EP2721111A2 (en) 2014-04-23
EP2721111A4 true EP2721111A4 (en) 2015-01-21
EP2721111B1 EP2721111B1 (en) 2019-05-15

Family

ID=47352955

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12800067.6A Active EP2721111B1 (en) 2011-06-15 2012-07-03 Thermally conductive thermoplastic compositions

Country Status (9)

Country Link
US (1) US20120319031A1 (en)
EP (1) EP2721111B1 (en)
JP (1) JP2014526565A (en)
KR (1) KR20150016482A (en)
CN (1) CN103781855A (en)
AU (1) AU2012271289A1 (en)
RU (1) RU2014100961A (en)
TW (1) TWI601768B (en)
WO (1) WO2012174574A2 (en)

Families Citing this family (24)

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US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140080951A1 (en) * 2012-09-19 2014-03-20 Chandrashekar Raman Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
JP2014062178A (en) * 2012-09-21 2014-04-10 Mitsubishi Engineering Plastics Corp High thermal conductive polycarbonate resin composition
US9186674B2 (en) * 2013-01-24 2015-11-17 Sabic Global Technologies B.V. Polycarbonate microfluidic articles
JP6746490B2 (en) 2013-04-19 2020-08-26 コベストロ・エルエルシー Encapsulation and assembly in molded electronic printed circuit boards
US20150069290A1 (en) * 2013-09-10 2015-03-12 Sabic Innovative Plastics Ip B.V. Polycarbonate based ductile thermally conductive polymer compositions and uses
EP2878619A1 (en) 2013-12-02 2015-06-03 LANXESS Deutschland GmbH Polyester compositions
EP3116971B1 (en) * 2014-03-14 2018-06-06 Covestro Deutschland AG Thermally conductive thermoplastic compositions with balanced processing capability
KR101606450B1 (en) * 2014-05-27 2016-03-25 주식회사 대신테크젠 Manufacturing method of Highly thermally conductive inorganic-polymer complex composition for applying lighting lamp LED that contains expanded graphite
KR101622148B1 (en) 2015-02-03 2016-06-01 주식회사 만도 Electric brake system
EP3115408B1 (en) 2015-07-08 2018-01-31 Covestro Deutschland AG Improvement of the flowability of thermally conductive polycarbonate compositions
CN105459472B (en) * 2015-11-27 2018-07-06 宁波信远石墨有限公司 A kind of high heat transfer and the material of the hot bi-directional conversion of wave and preparation and application
CN106700436A (en) * 2016-12-06 2017-05-24 苏州洛特兰新材料科技有限公司 High-plasticity heat-conducting composite material and preparation method thereof
CN106832852A (en) * 2016-12-28 2017-06-13 深圳天珑无线科技有限公司 A kind of middle board mount and preparation method and mobile device for being applied to mobile device
JP6411588B6 (en) * 2017-06-19 2022-10-07 三菱エンジニアリングプラスチックス株式会社 Sliding polycarbonate resin composition and molded article
CN111133043A (en) * 2017-07-20 2020-05-08 伊士曼化工公司 Polymer composition comprising crystalline polymer and stabilizer composition
EP3499119A1 (en) 2017-12-18 2019-06-19 Covestro Deutschland AG Device for dissipating heat from a heat source and use of this device
CN108192314A (en) * 2018-02-07 2018-06-22 佛山市富利来灯饰有限公司 The preparation method of high temperature resistant, high-intensity lamp cover material
CN108219430A (en) * 2018-02-07 2018-06-29 佛山市富利来灯饰有限公司 A kind of high temperature resistant, high-intensity lamp cover material composition
EP3588665A1 (en) 2018-06-29 2020-01-01 Covestro Deutschland AG Device for removing heat from an array of rechargeable electrochemical energy storage devices
US20210385937A1 (en) 2018-10-09 2021-12-09 Covestro Llc Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features
JP7793357B2 (en) * 2021-05-26 2026-01-05 三菱エンジニアリングプラスチックス株式会社 Thermally conductive polycarbonate resin composition and molded article
WO2024081008A1 (en) 2022-10-10 2024-04-18 Lumileds Llc Over moulded led module with integrated heatsink and optic
EP4601850A1 (en) 2022-10-10 2025-08-20 Lumileds LLC Over moulded led module with integrated heatsink and optic

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DATABASE WPI Week 200726, Derwent World Patents Index; AN 2007-260708, XP002733590 *
See also references of WO2012174574A2 *

Also Published As

Publication number Publication date
JP2014526565A (en) 2014-10-06
EP2721111B1 (en) 2019-05-15
WO2012174574A2 (en) 2012-12-20
US20120319031A1 (en) 2012-12-20
TWI601768B (en) 2017-10-11
AU2012271289A1 (en) 2013-12-12
CN103781855A (en) 2014-05-07
WO2012174574A3 (en) 2013-06-13
EP2721111A2 (en) 2014-04-23
RU2014100961A (en) 2015-07-20
KR20150016482A (en) 2015-02-12
TW201305261A (en) 2013-02-01

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