EP2814895A4 - POST-CMP ELIMINATION USING COMPOSITIONS AND METHOD OF USE - Google Patents
POST-CMP ELIMINATION USING COMPOSITIONS AND METHOD OF USEInfo
- Publication number
- EP2814895A4 EP2814895A4 EP13749640.2A EP13749640A EP2814895A4 EP 2814895 A4 EP2814895 A4 EP 2814895A4 EP 13749640 A EP13749640 A EP 13749640A EP 2814895 A4 EP2814895 A4 EP 2814895A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- cmp
- elimination
- compositions
- post
- cmp elimination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
- H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
- H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/22—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aromatic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2079—Monocarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2082—Polycarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3942—Inorganic per-compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261599162P | 2012-02-15 | 2012-02-15 | |
| US201261651287P | 2012-05-24 | 2012-05-24 | |
| US201261656992P | 2012-06-07 | 2012-06-07 | |
| US201261661160P | 2012-06-18 | 2012-06-18 | |
| PCT/US2013/026326 WO2013123317A1 (en) | 2012-02-15 | 2013-02-15 | Post-cmp removal using compositions and method of use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2814895A1 EP2814895A1 (en) | 2014-12-24 |
| EP2814895A4 true EP2814895A4 (en) | 2015-10-07 |
Family
ID=48984743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP13749640.2A Withdrawn EP2814895A4 (en) | 2012-02-15 | 2013-02-15 | POST-CMP ELIMINATION USING COMPOSITIONS AND METHOD OF USE |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10176979B2 (en) |
| EP (1) | EP2814895A4 (en) |
| JP (1) | JP2015512971A (en) |
| KR (1) | KR102105381B1 (en) |
| CN (1) | CN104508072A (en) |
| SG (1) | SG11201404930SA (en) |
| TW (1) | TWI600756B (en) |
| WO (1) | WO2013123317A1 (en) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6041624B2 (en) * | 2012-10-31 | 2016-12-14 | 株式会社ネオス | Silica scale remover composition |
| KR102118964B1 (en) | 2012-12-05 | 2020-06-08 | 엔테그리스, 아이엔씨. | Compositions for cleaning iii-v semiconductor materials and methods of using same |
| JP6363116B2 (en) | 2013-03-04 | 2018-07-25 | インテグリス・インコーポレーテッド | Compositions and methods for selectively etching titanium nitride |
| CN104968838A (en) * | 2013-04-12 | 2015-10-07 | 三菱瓦斯化学株式会社 | Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate |
| KR102338550B1 (en) | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | Compositions and methods for selectively etching titanium nitride |
| KR102338526B1 (en) | 2013-07-31 | 2021-12-14 | 엔테그리스, 아이엔씨. | AQUEOUS FORMULATIONS FOR REMOVING METAL HARD MASK AND POST-ETCH RESIDUE WITH Cu/W COMPATIBILITY |
| KR102340516B1 (en) | 2013-08-30 | 2021-12-21 | 엔테그리스, 아이엔씨. | Compositions and methods for selectively etching titanium nitride |
| CN103556164B (en) * | 2013-10-28 | 2015-08-19 | 沈阳大学 | Method for removing titanium-aluminum-chromium nitride hard reaction film |
| TWI654340B (en) | 2013-12-16 | 2019-03-21 | 美商恩特葛瑞斯股份有限公司 | Ni:NiGe:Ge SELECTIVE ETCH FORMULATIONS AND METHOD OF USING SAME |
| KR102352475B1 (en) | 2013-12-20 | 2022-01-18 | 엔테그리스, 아이엔씨. | Use of non-oxidizing strong acids for the removal of ion-implanted resist |
| US10475658B2 (en) | 2013-12-31 | 2019-11-12 | Entegris, Inc. | Formulations to selectively etch silicon and germanium |
| TWI659098B (en) | 2014-01-29 | 2019-05-11 | Entegris, Inc. | Chemical mechanical polishing formula and its use method |
| WO2015116679A1 (en) * | 2014-01-29 | 2015-08-06 | Advanced Technology Materials, Inc. | Post chemical mechanical polishing formulations and method of use |
| US11127587B2 (en) | 2014-02-05 | 2021-09-21 | Entegris, Inc. | Non-amine post-CMP compositions and method of use |
| US20150344822A1 (en) * | 2014-06-02 | 2015-12-03 | Tetra Tech, Inc. | Decontaminant and Process for Decontamination of Chemicals from Infrastructural Materials |
| US11978622B2 (en) * | 2014-06-30 | 2024-05-07 | Entegris, Inc. | Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tungsten and cobalt compatibility |
| CN107075411A (en) * | 2014-09-18 | 2017-08-18 | 应用材料公司 | The method and apparatus cleaned using CMP after the high efficiency of the viscous fluid through design |
| WO2016065057A1 (en) * | 2014-10-21 | 2016-04-28 | Cabot Microelectronics Corporation | Corrosion inhibitors and related compositions and methods |
| WO2016069576A1 (en) * | 2014-10-31 | 2016-05-06 | Entegris, Inc. | Non-amine post-cmp compositions and method of use |
| JP6454928B2 (en) * | 2015-03-11 | 2019-01-23 | 上村工業株式会社 | Treatment agent for electroless plating, and printed wiring board and package manufacturing method using the same |
| JP6670934B2 (en) * | 2015-11-19 | 2020-03-25 | オーシーアイ カンパニー リミテッドOCI Company Ltd. | Composition for etching copper and composition for etching hydrogen peroxide-based metal |
| WO2017108743A1 (en) | 2015-12-22 | 2017-06-29 | Basf Se | Composition for post chemical-mechanical-polishing cleaning |
| JP6886469B2 (en) | 2015-12-22 | 2021-06-16 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | Cleaning composition after chemical mechanical polishing |
| TWI650392B (en) * | 2016-02-16 | 2019-02-11 | Cabot Microelectronics Corporation | Method for polishing III to V materials |
| US10988718B2 (en) * | 2016-03-09 | 2021-04-27 | Entegris, Inc. | Tungsten post-CMP cleaning composition |
| CN105802763B (en) * | 2016-04-13 | 2018-08-03 | 乌鲁木齐市疾病预防控制中心 | A kind of spectrometric instrument sample introduction pipeline mercury pollution cleaning agent |
| US9685406B1 (en) | 2016-04-18 | 2017-06-20 | International Business Machines Corporation | Selective and non-selective barrier layer wet removal |
| JP6932147B2 (en) | 2016-06-10 | 2021-09-08 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | Composition for cleaning after chemical mechanical polishing |
| TWI660017B (en) * | 2016-07-14 | 2019-05-21 | Cabot Microelectronics Corporation | Alternative oxidizing agents for cobalt cmp |
| CN119194461A (en) * | 2016-08-24 | 2024-12-27 | Ppg工业俄亥俄公司 | Alkaline compositions for treating metal substrates |
| US10431464B2 (en) | 2016-10-17 | 2019-10-01 | International Business Machines Corporation | Liner planarization-free process flow for fabricating metallic interconnect structures |
| WO2018098139A1 (en) | 2016-11-25 | 2018-05-31 | Entegris, Inc. | Cleaning compositions for removing post etch residue |
| CN110178204B (en) * | 2017-01-17 | 2022-11-04 | 株式会社大赛璐 | Semiconductor substrate cleaner |
| AU2018229266B2 (en) * | 2017-02-28 | 2020-05-07 | Ecolab Usa Inc. | Alkaline cleaning composition comprising a hydroxyphosphono carboxylic acid and methods of reducing metal corrosion |
| JP7125386B2 (en) * | 2017-03-23 | 2022-08-24 | 株式会社フジミインコーポレーテッド | Polishing composition |
| AT519894A1 (en) * | 2017-04-29 | 2018-11-15 | Thonhauser Gmbh | CLEANING PROCESS |
| KR102422952B1 (en) | 2017-06-12 | 2022-07-19 | 삼성전자주식회사 | Slurry composition for polishing a metal layer and method for fabricating semiconductor device using the same |
| CN107338126A (en) * | 2017-06-23 | 2017-11-10 | 昆山欣谷微电子材料有限公司 | A kind of water base microelectronics is peeled off and cleaning liquid composition |
| JP6498734B2 (en) * | 2017-08-24 | 2019-04-10 | 攝津製油株式会社 | Cleaning composition, cleaning agent, and cleaning method |
| US11175587B2 (en) * | 2017-09-29 | 2021-11-16 | Versum Materials Us, Llc | Stripper solutions and methods of using stripper solutions |
| US10672653B2 (en) | 2017-12-18 | 2020-06-02 | International Business Machines Corporation | Metallic interconnect structures with wrap around capping layers |
| US11365379B2 (en) * | 2018-01-25 | 2022-06-21 | Merck Patent Gmbh | Photoresist remover compositions |
| US11085011B2 (en) * | 2018-08-28 | 2021-08-10 | Entegris, Inc. | Post CMP cleaning compositions for ceria particles |
| CN109179965B (en) * | 2018-11-01 | 2020-11-17 | 中国农业大学 | Compound conditioner for efficient sludge dewatering and sludge dewatering method |
| KR102687599B1 (en) * | 2018-12-21 | 2024-07-24 | 주식회사 케이씨텍 | Cleaning composition and cleaning method using the same |
| JP7462654B2 (en) * | 2019-01-15 | 2024-04-05 | アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー | Method for forming copper oxide on copper surface |
| KR102659845B1 (en) * | 2019-02-08 | 2024-04-24 | 엔테그리스, 아이엔씨. | Ceria removal composition |
| AU2020272127B2 (en) | 2019-04-12 | 2022-12-08 | Ecolab Usa Inc. | Antimicrobial multi-purpose cleaner and methods of making and using the same |
| JP2020188090A (en) * | 2019-05-13 | 2020-11-19 | Jsr株式会社 | Composition for semiconductor cleaning or chemical mechanical polishing for processing cobalt-containing substrate |
| TWI824164B (en) * | 2019-07-11 | 2023-12-01 | 德商馬克專利公司 | Photoresist remover compositions and processes for removing photoresist films from substrates |
| CN112447496B (en) * | 2019-08-28 | 2024-10-18 | 东莞新科技术研究开发有限公司 | Semiconductor ion etching cleaning method |
| WO2021111914A1 (en) * | 2019-12-03 | 2021-06-10 | 三菱ケミカル株式会社 | Cleaning liquid for removing cerium compounds, cleaning method, and method for producing semiconductor wafer |
| CA3149708A1 (en) | 2020-02-10 | 2021-02-08 | Virox Technologies Inc. | Antimicrobial compositions containing peroxyphthalic acid and/or salt thereof |
| CN111269761B (en) * | 2020-02-13 | 2021-04-27 | 金丝甲(上海)安全防范技术有限公司 | Decontamination solution and its use in decontamination of actinide and transition metal nuclide contamination |
| KR20220012521A (en) | 2020-07-23 | 2022-02-04 | 주식회사 케이씨텍 | Cleaning solution composition and cleaning method using the same |
| TWI824299B (en) * | 2020-09-22 | 2023-12-01 | 美商恩特葛瑞斯股份有限公司 | Etchant compositions |
| KR102284465B1 (en) * | 2020-09-24 | 2021-08-02 | 양영수 | Method for producing stainless container |
| MX2023011631A (en) | 2021-04-01 | 2023-12-15 | Sterilex LLC | POWDER DISINFECTANT/SANITIZER WITHOUT QUATERNARY AMMONIUM COMPOUND (QUAT). |
| JP2023047312A (en) * | 2021-09-24 | 2023-04-05 | 株式会社フジミインコーポレーテッド | cleaning composition |
| JP7760429B2 (en) * | 2022-03-29 | 2025-10-27 | 株式会社フジミインコーポレーテッド | Surface treatment composition, surface treatment method, and method for manufacturing semiconductor substrate |
| CN114854500A (en) * | 2022-05-12 | 2022-08-05 | 常州时创能源股份有限公司 | Additive and cleaning solution for cleaning silicon wafer and cleaning method for silicon wafer after texturing |
| KR102866991B1 (en) * | 2022-09-22 | 2025-10-01 | 한양대학교 산학협력단 | Cleaning composition and method of cleaning substrate using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020102852A1 (en) * | 2000-06-26 | 2002-08-01 | Steven Verhaverbeke | Cleaning method and solution for cleaning a wafer in a single wafer process |
| US20100043824A1 (en) * | 2008-08-20 | 2010-02-25 | Micron Technology, Inc. | Microelectronic substrate cleaning systems with polyelectrolyte and associated methods |
| US20100319735A1 (en) * | 2008-02-15 | 2010-12-23 | Lion Corporation | Cleaning composition and method for cleaning substrate for electronic device |
Family Cites Families (95)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5320709A (en) | 1993-02-24 | 1994-06-14 | Advanced Chemical Systems International Incorporated | Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution |
| US5466389A (en) | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US7534752B2 (en) | 1996-07-03 | 2009-05-19 | Advanced Technology Materials, Inc. | Post plasma ashing wafer cleaning formulation |
| US6323168B1 (en) | 1996-07-03 | 2001-11-27 | Advanced Technology Materials, Inc. | Post plasma ashing wafer cleaning formulation |
| US6244785B1 (en) | 1996-11-12 | 2001-06-12 | H. B. Zachry Company | Precast, modular spar system |
| US6755989B2 (en) | 1997-01-09 | 2004-06-29 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| US6896826B2 (en) | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| US8092707B2 (en) | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
| US6280651B1 (en) | 1998-12-16 | 2001-08-28 | Advanced Technology Materials, Inc. | Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent |
| US6211126B1 (en) | 1997-12-23 | 2001-04-03 | Advanced Technology Materials, Inc. | Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates |
| JP4226216B2 (en) | 1998-05-18 | 2009-02-18 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Stripping composition for semiconductor substrate |
| US6875733B1 (en) | 1998-10-14 | 2005-04-05 | Advanced Technology Materials, Inc. | Ammonium borate containing compositions for stripping residues from semiconductor substrates |
| US6344432B1 (en) | 1999-08-20 | 2002-02-05 | Advanced Technology Materials, Inc. | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures |
| US6194366B1 (en) | 1999-11-16 | 2001-02-27 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| US6723691B2 (en) | 1999-11-16 | 2004-04-20 | Advanced Technology Materials, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| US6492308B1 (en) | 1999-11-16 | 2002-12-10 | Esc, Inc. | Post chemical-mechanical planarization (CMP) cleaning composition |
| US6361407B1 (en) * | 2000-08-02 | 2002-03-26 | Memc Electronic Materials, Inc. | Method of polishing a semiconductor wafer |
| US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| US6566315B2 (en) | 2000-12-08 | 2003-05-20 | Advanced Technology Materials, Inc. | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures |
| US6627587B2 (en) | 2001-04-19 | 2003-09-30 | Esc Inc. | Cleaning compositions |
| US20030119692A1 (en) | 2001-12-07 | 2003-06-26 | So Joseph K. | Copper polishing cleaning solution |
| US6773873B2 (en) | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
| JP4304154B2 (en) | 2002-06-07 | 2009-07-29 | マリンクロッド・ベイカー・インコーポレイテッド | Microelectronic cleaning composition containing an oxidizing agent and an organic solvent |
| US6849200B2 (en) | 2002-07-23 | 2005-02-01 | Advanced Technology Materials, Inc. | Composition and process for wet stripping removal of sacrificial anti-reflective material |
| US8236485B2 (en) | 2002-12-20 | 2012-08-07 | Advanced Technology Materials, Inc. | Photoresist removal |
| TWI258504B (en) * | 2003-01-07 | 2006-07-21 | Tosoh Corp | Washing solution and washing method using the same |
| US7736405B2 (en) | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| US7056648B2 (en) | 2003-09-17 | 2006-06-06 | International Business Machines Corporation | Method for isotropic etching of copper |
| CA2544198C (en) * | 2003-10-29 | 2011-07-26 | Mallinckrodt Baker, Inc. | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors |
| CN1938412A (en) | 2003-12-02 | 2007-03-28 | 高级技术材料公司 | Resist, BARC and gap fill material stripping chemical and method |
| US20050145311A1 (en) | 2003-12-30 | 2005-07-07 | Walker Elizabeth L. | Method for monitoring surface treatment of copper containing devices |
| US7390744B2 (en) * | 2004-01-29 | 2008-06-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US8338087B2 (en) | 2004-03-03 | 2012-12-25 | Advanced Technology Materials, Inc | Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate |
| US7253111B2 (en) | 2004-04-21 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Barrier polishing solution |
| US7323421B2 (en) * | 2004-06-16 | 2008-01-29 | Memc Electronic Materials, Inc. | Silicon wafer etching process and composition |
| US20060063687A1 (en) | 2004-09-17 | 2006-03-23 | Minsek David W | Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrate |
| US20060148666A1 (en) | 2004-12-30 | 2006-07-06 | Advanced Technology Materials Inc. | Aqueous cleaner with low metal etch rate |
| US20060154186A1 (en) | 2005-01-07 | 2006-07-13 | Advanced Technology Materials, Inc. | Composition useful for removal of post-etch photoresist and bottom anti-reflection coatings |
| US7923423B2 (en) | 2005-01-27 | 2011-04-12 | Advanced Technology Materials, Inc. | Compositions for processing of semiconductor substrates |
| WO2006086265A2 (en) * | 2005-02-07 | 2006-08-17 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7365045B2 (en) | 2005-03-30 | 2008-04-29 | Advanced Tehnology Materials, Inc. | Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide |
| WO2006110645A2 (en) | 2005-04-11 | 2006-10-19 | Advanced Technology Materials, Inc. | Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices |
| US20070251551A1 (en) | 2005-04-15 | 2007-11-01 | Korzenski Michael B | Removal of high-dose ion-implanted photoresist using self-assembled monolayers in solvent systems |
| JP2008546036A (en) | 2005-06-07 | 2008-12-18 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Metal and dielectric compatible sacrificial antireflective coating purification and removal composition |
| CN101233601A (en) | 2005-06-13 | 2008-07-30 | 高级技术材料公司 | Compositions and methods for selective removal of metal or metal alloy after metal silicide formation |
| WO2007027522A2 (en) | 2005-08-29 | 2007-03-08 | Advanced Technology Materials, Inc. | Composition and method for removing thick film photoresist |
| KR20080059429A (en) | 2005-10-05 | 2008-06-27 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Compositions and Methods for Selectively Etching Gate Spacer Oxide Materials |
| WO2007044446A1 (en) | 2005-10-05 | 2007-04-19 | Advanced Technology Materials, Inc. | Oxidizing aqueous cleaner for the removal of post-etch residues |
| US8058219B2 (en) | 2005-10-13 | 2011-11-15 | Advanced Technology Materials, Inc. | Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchant |
| EP1946358A4 (en) | 2005-11-09 | 2009-03-04 | Advanced Tech Materials | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
| TW200734448A (en) | 2006-02-03 | 2007-09-16 | Advanced Tech Materials | Low pH post-CMP residue removal composition and method of use |
| US8685909B2 (en) | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| US20080076688A1 (en) | 2006-09-21 | 2008-03-27 | Barnes Jeffrey A | Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
| SG175559A1 (en) | 2006-09-25 | 2011-11-28 | Advanced Tech Materials | Compositions and methods for the removal of photoresist for a wafer rework application |
| US20080125342A1 (en) | 2006-11-07 | 2008-05-29 | Advanced Technology Materials, Inc. | Formulations for cleaning memory device structures |
| TWI611047B (en) | 2006-12-21 | 2018-01-11 | 恩特葛瑞斯股份有限公司 | Liquid cleaning agent for removing post-etching residues |
| US8778210B2 (en) | 2006-12-21 | 2014-07-15 | Advanced Technology Materials, Inc. | Compositions and methods for the selective removal of silicon nitride |
| TWI516573B (en) | 2007-02-06 | 2016-01-11 | 安堤格里斯公司 | Composition and method for selectively removing TiSiN |
| EP2128707B1 (en) | 2007-03-16 | 2014-04-30 | Mitsubishi Gas Chemical Company, Inc. | Cleaning composition and process for producing a semiconductor device |
| US20100112728A1 (en) | 2007-03-31 | 2010-05-06 | Advanced Technology Materials, Inc. | Methods for stripping material for wafer reclamation |
| US7976723B2 (en) | 2007-05-17 | 2011-07-12 | International Business Machines Corporation | Method for kinetically controlled etching of copper |
| TW200918664A (en) | 2007-06-13 | 2009-05-01 | Advanced Tech Materials | Wafer reclamation compositions and methods |
| US20100261632A1 (en) * | 2007-08-02 | 2010-10-14 | Advanced Technology Materials, Inc. | Non-fluoride containing composition for the removal of residue from a microelectronic device |
| SG183744A1 (en) | 2007-08-20 | 2012-09-27 | Advanced Tech Materials | Composition and method for removing ion-implanted photoresist |
| EP2268765A4 (en) | 2008-03-07 | 2011-10-26 | Advanced Tech Materials | MOISTURE CLEANING COMPOSITION BY ATTACKING NON-SELECTIVE OXIDE AND METHOD OF USE |
| KR20100133507A (en) | 2008-05-01 | 2010-12-21 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Low pH mixture for removal of high density implanted resist |
| CN102216854A (en) | 2008-08-04 | 2011-10-12 | 高级技术材料公司 | Environmentally friendly polymer stripping compositions |
| JP2012504871A (en) | 2008-10-02 | 2012-02-23 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Use of surfactant / antifoam mixtures for high metal loading and surface passivation of silicon substrates |
| US9074170B2 (en) | 2008-10-21 | 2015-07-07 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
| JP2012516380A (en) | 2009-01-28 | 2012-07-19 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | In situ cleaning formulation for lithographic tools |
| WO2010086745A1 (en) | 2009-02-02 | 2010-08-05 | Atmi Taiwan Co., Ltd. | Method of etching lanthanum-containing oxide layers |
| WO2010091045A2 (en) | 2009-02-05 | 2010-08-12 | Advanced Technology Materials, Inc. | Non-fluoride containing composition for the removal of polymers and other organic material from a surface |
| US8754021B2 (en) | 2009-02-27 | 2014-06-17 | Advanced Technology Materials, Inc. | Non-amine post-CMP composition and method of use |
| US20110151671A1 (en) * | 2009-12-17 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | method of texturing semiconductor substrates |
| CN102770524B (en) | 2010-01-29 | 2015-04-22 | 高级技术材料公司 | Cleaning agent for semiconductors with metal wiring |
| US9063431B2 (en) | 2010-07-16 | 2015-06-23 | Advanced Technology Materials, Inc. | Aqueous cleaner for the removal of post-etch residues |
| JP2012036750A (en) | 2010-08-04 | 2012-02-23 | Panasonic Corp | Compressor |
| JP6101421B2 (en) | 2010-08-16 | 2017-03-22 | インテグリス・インコーポレーテッド | Etching solution for copper or copper alloy |
| KR20130100297A (en) | 2010-08-27 | 2013-09-10 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Method for preventing the collapse of high aspect ratio structures during drying |
| WO2012048079A2 (en) | 2010-10-06 | 2012-04-12 | Advanced Technology Materials, Inc. | Composition and process for selectively etching metal nitrides |
| KR101891363B1 (en) | 2010-10-13 | 2018-08-24 | 엔테그리스, 아이엔씨. | Composition for and method of suppressing titanium nitride corrosion |
| CN102959691A (en) | 2010-11-19 | 2013-03-06 | 三菱瓦斯化学株式会社 | Liquid composition for cleaning semiconductor substrate and method for cleaning semiconductor substrate using same |
| US20140318584A1 (en) | 2011-01-13 | 2014-10-30 | Advanced Technology Materials, Inc. | Formulations for the removal of particles generated by cerium-containing solutions |
| JP2012186470A (en) | 2011-02-18 | 2012-09-27 | Sanyo Chem Ind Ltd | Cleaner for copper wiring semiconductor |
| JP2012251026A (en) | 2011-05-31 | 2012-12-20 | Sanyo Chem Ind Ltd | Cleaning agent for semiconductor |
| TW201311869A (en) | 2011-06-16 | 2013-03-16 | 尖端科技材料公司 | Composition and method for selectively etching tantalum nitride |
| US20130045908A1 (en) | 2011-08-15 | 2013-02-21 | Hua Cui | Method and composition for removing resist, etch residue, and copper oxide from substrates having copper, metal hardmask and low-k dielectric material |
| US9257270B2 (en) | 2011-08-15 | 2016-02-09 | Ekc Technology | Method and composition for removing resist, etch residue, and copper oxide from substrates having copper, metal hardmask and low-k dielectric material |
| JP5933950B2 (en) | 2011-09-30 | 2016-06-15 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Etching solution for copper or copper alloy |
| US8618036B2 (en) | 2011-11-14 | 2013-12-31 | International Business Machines Corporation | Aqueous cerium-containing solution having an extended bath lifetime for removing mask material |
| JP6066552B2 (en) | 2011-12-06 | 2017-01-25 | 関東化學株式会社 | Cleaning composition for electronic devices |
| SG11201403556WA (en) | 2011-12-28 | 2014-07-30 | Advanced Tech Materials | Compositions and methods for selectively etching titanium nitride |
| WO2013138276A1 (en) | 2012-03-12 | 2013-09-19 | Advanced Technology Materials, Inc. | Methods for the selective removal of ashed spin-on glass |
| WO2013138278A1 (en) | 2012-03-12 | 2013-09-19 | Advanced Technology Materials, Inc. | Copper cleaning and protection formulations |
| KR102118964B1 (en) | 2012-12-05 | 2020-06-08 | 엔테그리스, 아이엔씨. | Compositions for cleaning iii-v semiconductor materials and methods of using same |
-
2013
- 2013-02-15 KR KR1020147025340A patent/KR102105381B1/en active Active
- 2013-02-15 WO PCT/US2013/026326 patent/WO2013123317A1/en not_active Ceased
- 2013-02-15 US US14/378,842 patent/US10176979B2/en active Active
- 2013-02-15 CN CN201380018815.6A patent/CN104508072A/en active Pending
- 2013-02-15 EP EP13749640.2A patent/EP2814895A4/en not_active Withdrawn
- 2013-02-15 JP JP2014557813A patent/JP2015512971A/en active Pending
- 2013-02-15 SG SG11201404930SA patent/SG11201404930SA/en unknown
- 2013-02-18 TW TW102105519A patent/TWI600756B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020102852A1 (en) * | 2000-06-26 | 2002-08-01 | Steven Verhaverbeke | Cleaning method and solution for cleaning a wafer in a single wafer process |
| US20100319735A1 (en) * | 2008-02-15 | 2010-12-23 | Lion Corporation | Cleaning composition and method for cleaning substrate for electronic device |
| US20100043824A1 (en) * | 2008-08-20 | 2010-02-25 | Micron Technology, Inc. | Microelectronic substrate cleaning systems with polyelectrolyte and associated methods |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2013123317A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201404930SA (en) | 2014-09-26 |
| US10176979B2 (en) | 2019-01-08 |
| TWI600756B (en) | 2017-10-01 |
| TW201343905A (en) | 2013-11-01 |
| JP2015512971A (en) | 2015-04-30 |
| EP2814895A1 (en) | 2014-12-24 |
| KR20140139498A (en) | 2014-12-05 |
| WO2013123317A1 (en) | 2013-08-22 |
| US20160020087A1 (en) | 2016-01-21 |
| KR102105381B1 (en) | 2020-04-29 |
| CN104508072A (en) | 2015-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2814895A4 (en) | POST-CMP ELIMINATION USING COMPOSITIONS AND METHOD OF USE | |
| EP2834322A4 (en) | BIOCHARBON COMPOSITIONS AND METHODS OF USE | |
| AP3965A (en) | Anthelminitic compounds and compositions and method of using thereof | |
| DK2898061T3 (en) | PROBIOTIC COMPOSITIONS FOR THE TREATMENT OF OBESIS AND OBESE-RELATED CONDITIONS | |
| EP2912178A4 (en) | SUPER-ACTIVATORS AND METHODS OF USE THEREOF | |
| EP2812355A4 (en) | COMPOSITIONS AND METHODS OF USING CSF1R INHIBITORS | |
| DK3725778T4 (en) | FORMULATIONS OF ENZALUTAMID | |
| EP2938189A4 (en) | CONTROLLED RELEASE COMPOSITIONS AND METHODS OF USE | |
| BR112015003227A2 (en) | clicoconjugation processes and compositions | |
| DK3378862T3 (en) | DIHYDROPYRIMIDINOISOQUINOLINONS AND PHARMACEUTICAL COMPOSITIONS THEREOF FOR THE TREATMENT OF MULTIPLE SCLEROSIS | |
| SMT202100154T1 (en) | COMPOSITIONS AND METHODS TO PRECISELY IDENTIFY MUTATIONS | |
| EP2887930A4 (en) | ANXIOLYTIC COMPOSITION, FORMULATION AND METHOD OF USE | |
| EP2996694A4 (en) | CENICRIVIROC COMPOSITIONS AND METHODS OF MAKING AND USING THEM | |
| EP2755480A4 (en) | USE OF GALACTO-RHAMNO-GALACTURONATE COMPOSITIONS FOR TREATING NON ALCOHOLIC STÉATOHÉPATITE AND NON ALCOHOLIC HEPATIC STÉATOSE | |
| EP2890772A4 (en) | MULTIFUNCTIONAL COMPOSITIONS AND METHODS OF USE | |
| EP2964235A4 (en) | ANTIMICROBIAL-ANTIBIOFILM COMPOSITIONS AND METHODS OF USE | |
| EP2704688A4 (en) | COCHLEATE COMPOSITIONS AND METHODS OF MAKING AND USING THEM | |
| BR112015001562A2 (en) | biotins and compositions | |
| EP2917162A4 (en) | CURABLE COMPOSITIONS COMPRISING WOLLASTONITE AND PONCE PONCE AND METHODS OF USE | |
| EP2814897A4 (en) | CALOPOROUS COMPOSITIONS AND METHODS RELATING THERETO | |
| EP2934510A4 (en) | LFA-1 INHIBITOR FORMULATIONS | |
| EP2828241A4 (en) | COMPOSITIONS AND METHODS FOR INHIBITING CATHEPSINS | |
| EP2935280A4 (en) | 8'-HYDROXY-DIHYDROERGOTAMINE COMPOUNDS AND RELATED COMPOSITIONS | |
| EP2827851A4 (en) | EXTENDED RELEASE FORMULATION FOR REDUCING THE FREQUENCY OF MICTION AND METHOD OF USING THE SAME | |
| EP2854822A4 (en) | POLYSACCHARIDE COMPOSITIONS AND METHODS OF USE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20140910 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| AX | Request for extension of the european patent |
Extension state: BA ME |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: LIU, JUN Inventor name: SUN, LAISHENG Inventor name: BARNES, JEFFREY A. Inventor name: COOPER, EMANUEL I. Inventor name: THOMAS, ELIZABETH Inventor name: CHANG, JASON |
|
| DAX | Request for extension of the european patent (deleted) | ||
| RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20150909 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: C09K 3/14 20060101AFI20150903BHEP Ipc: H01L 21/306 20060101ALI20150903BHEP |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20160406 |