EP2879164A4 - Dicing device and dicing method - Google Patents

Dicing device and dicing method

Info

Publication number
EP2879164A4
EP2879164A4 EP13803775.9A EP13803775A EP2879164A4 EP 2879164 A4 EP2879164 A4 EP 2879164A4 EP 13803775 A EP13803775 A EP 13803775A EP 2879164 A4 EP2879164 A4 EP 2879164A4
Authority
EP
European Patent Office
Prior art keywords
dicing
dicing method
dicing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13803775.9A
Other languages
German (de)
French (fr)
Other versions
EP2879164B1 (en
EP2879164A1 (en
Inventor
Junji Watanabe
Takashi Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of EP2879164A1 publication Critical patent/EP2879164A1/en
Publication of EP2879164A4 publication Critical patent/EP2879164A4/en
Application granted granted Critical
Publication of EP2879164B1 publication Critical patent/EP2879164B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP13803775.9A 2012-06-15 2013-06-14 Dicing device and dicing method Not-in-force EP2879164B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012136060 2012-06-15
PCT/JP2013/066501 WO2013187510A1 (en) 2012-06-15 2013-06-14 Dicing device and dicing method

Publications (3)

Publication Number Publication Date
EP2879164A1 EP2879164A1 (en) 2015-06-03
EP2879164A4 true EP2879164A4 (en) 2015-11-25
EP2879164B1 EP2879164B1 (en) 2017-09-13

Family

ID=49758328

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13803775.9A Not-in-force EP2879164B1 (en) 2012-06-15 2013-06-14 Dicing device and dicing method

Country Status (6)

Country Link
US (1) US20150099428A1 (en)
EP (1) EP2879164B1 (en)
JP (2) JP5748914B2 (en)
KR (2) KR102022754B1 (en)
CN (1) CN104364884B (en)
WO (1) WO2013187510A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6077799B2 (en) * 2012-08-31 2017-02-08 三星ダイヤモンド工業株式会社 Cutter wheel and manufacturing method thereof
JP6287774B2 (en) * 2014-11-19 2018-03-07 住友電気工業株式会社 Method for manufacturing silicon carbide semiconductor device
JP6600267B2 (en) * 2016-03-15 2019-10-30 株式会社ディスコ Workpiece cutting method
WO2017183222A1 (en) * 2016-04-21 2017-10-26 三菱電機株式会社 Semiconductor device and method for manufacturing same
WO2018066508A1 (en) * 2016-10-05 2018-04-12 日本電気硝子株式会社 Method for producing glass resin laminate, and glass resin laminate
EP3766634B1 (en) * 2018-03-16 2024-08-07 Orbray Co., Ltd. Diamond crystal polishing method and diamond crystal
JP7009306B2 (en) * 2018-05-21 2022-01-25 株式会社ディスコ Cutting equipment
WO2021020484A1 (en) * 2019-07-31 2021-02-04 マニー株式会社 Dental diamond bar
JP2021040097A (en) * 2019-09-05 2021-03-11 株式会社ディスコ Cutting method of work piece
CN112318337A (en) * 2019-12-20 2021-02-05 沈阳和研科技有限公司 Method for cutting glass with warping deformation by using grinding wheel scribing machine
US11348798B2 (en) * 2020-02-07 2022-05-31 Akoustis, Inc. Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices
JP7394712B2 (en) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 Cutting device and method for manufacturing cut products
TWI832179B (en) * 2022-03-22 2024-02-11 盛新材料科技股份有限公司 Wafer positioning fixture and wafer processing method using the same
CN115026824B (en) * 2022-06-16 2025-03-18 华北电力大学 On-site robot wind turbine blade grinding control method
CN117300844B (en) * 2023-11-28 2024-02-02 中铁工程装备集团(天津)有限公司 A grinding equipment with circular runout detection function
CN117817496A (en) * 2024-01-23 2024-04-05 湖南太阳电瓷有限公司 Automatic thread digging device for pin-type insulator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144937A (en) * 1991-11-18 1993-06-11 Fujitsu Miyagi Electron:Kk Dicing blade
JPH06151586A (en) * 1992-11-12 1994-05-31 Sony Corp Dicing method and device
JP2003282490A (en) * 2002-03-27 2003-10-03 Hitachi Ltd Semiconductor device and manufacturing method thereof
WO2008004365A1 (en) * 2006-07-07 2008-01-10 Tokyo Seimitsu Co., Ltd. Dicing apparatus and dicing method
US20110132954A1 (en) * 2008-06-05 2011-06-09 Maoko Tomei Scribing wheel and method for scribing brittle material substrate
JP2012030992A (en) * 2010-07-29 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd Scribing wheel, scribing device, and scribing method

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3156077A (en) * 1963-02-06 1964-11-10 Continental Machines Diamond edge saw blade
US3371452A (en) * 1965-02-08 1968-03-05 Christensen Diamond Prod Co Diamond saw or milling blades
US3574580A (en) * 1968-11-08 1971-04-13 Atomic Energy Commission Process for producing sintered diamond compact and products
US3912500A (en) * 1972-12-27 1975-10-14 Leonid Fedorovich Vereschagin Process for producing diamond-metallic materials
US4151686A (en) * 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US4180048A (en) * 1978-06-12 1979-12-25 Regan Barrie F Cutting wheel
WO1986001433A1 (en) * 1984-08-24 1986-03-13 The Australian National University Diamond compacts and process for making same
US4636253A (en) * 1984-09-08 1987-01-13 Sumitomo Electric Industries, Ltd. Diamond sintered body for tools and method of manufacturing same
JPS61104045A (en) 1984-10-26 1986-05-22 Sumitomo Electric Ind Ltd Diamond sintered body for tools
US5010043A (en) * 1987-03-23 1991-04-23 The Australian National University Production of diamond compacts consisting essentially of diamond crystals bonded by silicon carbide
JP3209818B2 (en) * 1993-03-08 2001-09-17 株式会社東京精密 Cutting blade mounting structure for dicing equipment
JPH07276137A (en) 1994-03-31 1995-10-24 Osaka Diamond Ind Co Ltd Tool for cutting and grinding
US5479911A (en) * 1994-05-13 1996-01-02 Kulicke And Soffa Investments Inc Diamond impregnated resinoid cutting blade
US5888129A (en) * 1996-05-15 1999-03-30 Neff; Charles E. Grinding wheel
JP3610716B2 (en) * 1997-01-23 2005-01-19 トヨタ自動車株式会社 Casting seal surface processing method
US20040112359A1 (en) * 1997-04-04 2004-06-17 Chien-Min Sung Brazed diamond tools and methods for making the same
EP1013379A4 (en) * 1997-07-16 2007-05-09 Ishizuka Res Inst Ltd DIAMOND-CONTAINING LAMINATE COMPOSITE MATERIAL AND METHOD OF MANUFACTURING THE SAME
US20040112360A1 (en) * 1998-02-12 2004-06-17 Boucher John N. Substrate dicing method
DE69935084T2 (en) * 1998-07-31 2007-11-15 Saint-Gobain Abrasives, Inc., Worcester Rotary dressing roll containing abrasive inserts
JP2001038636A (en) * 1999-07-26 2001-02-13 Kimiko Sueda Thin blade of wheel cutter
JP3308246B2 (en) 1999-08-18 2002-07-29 株式会社リード Diamond blade core metal for rare earth magnet cutting
JP3892204B2 (en) 2000-03-29 2007-03-14 株式会社リード Rare earth magnet cutting blade and method for manufacturing the same
JP2002192469A (en) * 2000-12-27 2002-07-10 Allied Material Corp Super abrasive thin blade cutting whetstone
JP3956048B2 (en) * 2001-01-16 2007-08-08 株式会社ニコン Grinding stone pellet, grinding stone, production method thereof, production method of optical element using grinding stone, and production method of projection exposure apparatus
US6706319B2 (en) * 2001-12-05 2004-03-16 Siemens Westinghouse Power Corporation Mixed powder deposition of components for wear, erosion and abrasion resistant applications
JP4189156B2 (en) * 2002-02-22 2008-12-03 株式会社トクヤマ Chip pasting sheet
US20030159555A1 (en) * 2002-02-22 2003-08-28 Perry Edward Robert Thin wall singulation saw blade and method
JP2003326466A (en) 2002-05-09 2003-11-18 Read Co Ltd Highly rigid cutting blade and method of manufacturing the cutting blade
TWI238753B (en) * 2002-12-19 2005-09-01 Miyanaga Kk Diamond disk for grinding
US7959841B2 (en) * 2003-05-30 2011-06-14 Los Alamos National Security, Llc Diamond-silicon carbide composite and method
JP2005001941A (en) * 2003-06-12 2005-01-06 Thk Co Ltd Diamond wheel and scriber
JP2005082414A (en) * 2003-09-04 2005-03-31 Tokyo Metropolis Ceramic material cutting method and cutting apparatus
US20050210755A1 (en) * 2003-09-05 2005-09-29 Cho Hyun S Doubled-sided and multi-layered PCBN and PCD abrasive articles
JP2005129741A (en) * 2003-10-24 2005-05-19 Tokyo Seimitsu Co Ltd Dicing blade and dicing method
JP4340184B2 (en) * 2004-04-13 2009-10-07 株式会社ナノテム Whetstone
US6981909B2 (en) * 2004-06-04 2006-01-03 General Electric Company Method for conditioning superabrasive tools
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
JP2006082197A (en) * 2004-09-17 2006-03-30 Toyoda Mach Works Ltd Grinding wheel
JP4714453B2 (en) 2004-10-25 2011-06-29 株式会社リード Diamond or cBN tool and manufacturing method thereof
JP2006253441A (en) * 2005-03-11 2006-09-21 Kumamoto Univ Blade processing method
KR100639778B1 (en) * 2005-05-03 2006-10-31 조창신 Cutting blade structure and saw blade having the cutting structure
WO2007002745A2 (en) * 2005-06-27 2007-01-04 Husqvarna Professional Outdoor Products Inc. Tools and methods for making and using tools, blades and methods of making and using blades
US20070023026A1 (en) * 2005-07-28 2007-02-01 Broyles Michelle Dicing blade
JP2007118581A (en) * 2005-09-28 2007-05-17 Hiroshi Ishizuka Hard-brittle material thin sheet and production method thereof
JP2007216377A (en) * 2006-01-20 2007-08-30 Tokyo Seimitsu Co Ltd Dicing device and dicing method
EP2049306B1 (en) * 2006-07-31 2013-07-03 Element Six Abrasives S.A. Abrasive compacts
KR100804049B1 (en) * 2006-11-16 2008-02-18 신한다이아몬드공업 주식회사 Diamond tool and segment manufacturing method of diamond tool
DE202007013306U1 (en) * 2007-09-22 2008-04-24 Bohle Ag cutting wheel
JP2010005778A (en) 2008-06-30 2010-01-14 Mitsubishi Materials Corp Electro-cast blade
GB0902230D0 (en) * 2009-02-11 2009-03-25 Element Six Production Pty Ltd Polycrystalline super-hard element
JP5357580B2 (en) * 2009-03-09 2013-12-04 三星ダイヤモンド工業株式会社 Grooving tool and method of grooving thin film solar cell using the same
JP2010234597A (en) 2009-03-31 2010-10-21 Mitsubishi Materials Corp CUTTING BLADE, CUTTING BLADE MANUFACTURING METHOD AND CUTTING PROCESSING DEVICE
US20110073094A1 (en) * 2009-09-28 2011-03-31 3M Innovative Properties Company Abrasive article with solid core and methods of making the same
JP5534181B2 (en) * 2010-03-12 2014-06-25 住友電気工業株式会社 Diamond polycrystal
CN102905850B (en) * 2010-05-21 2016-07-06 本田技研工业株式会社 Abrasive tool manufacturing method and abrasive particle positioning jig
CN101870008B (en) * 2010-06-11 2012-01-11 西安点石超硬材料发展有限公司 Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate
JP5195981B2 (en) * 2010-10-26 2013-05-15 三星ダイヤモンド工業株式会社 Scribe head and scribing device
JP4852178B1 (en) * 2011-04-26 2012-01-11 株式会社テクノホロン Dicing machine
WO2013027243A1 (en) * 2011-08-24 2013-02-28 新日鉄マテリアルズ株式会社 Beveling grindstone
KR101252406B1 (en) * 2011-09-07 2013-04-08 이화다이아몬드공업 주식회사 Brazing bond type diamond tool with excellent machinability and method for manufacturing the same
US9316059B1 (en) * 2012-08-21 2016-04-19 Us Synthetic Corporation Polycrystalline diamond compact and applications therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144937A (en) * 1991-11-18 1993-06-11 Fujitsu Miyagi Electron:Kk Dicing blade
JPH06151586A (en) * 1992-11-12 1994-05-31 Sony Corp Dicing method and device
JP2003282490A (en) * 2002-03-27 2003-10-03 Hitachi Ltd Semiconductor device and manufacturing method thereof
WO2008004365A1 (en) * 2006-07-07 2008-01-10 Tokyo Seimitsu Co., Ltd. Dicing apparatus and dicing method
US20110132954A1 (en) * 2008-06-05 2011-06-09 Maoko Tomei Scribing wheel and method for scribing brittle material substrate
JP2012030992A (en) * 2010-07-29 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd Scribing wheel, scribing device, and scribing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013187510A1 *

Also Published As

Publication number Publication date
WO2013187510A1 (en) 2013-12-19
KR102022754B1 (en) 2019-09-18
JP5748914B2 (en) 2015-07-15
JPWO2013187510A1 (en) 2016-02-08
US20150099428A1 (en) 2015-04-09
EP2879164B1 (en) 2017-09-13
CN104364884B (en) 2017-06-23
JP2015164215A (en) 2015-09-10
KR20150004931A (en) 2015-01-13
KR20160021904A (en) 2016-02-26
JP5888827B2 (en) 2016-03-22
CN104364884A (en) 2015-02-18
EP2879164A1 (en) 2015-06-03

Similar Documents

Publication Publication Date Title
EP2676643A4 (en) Excreta-handling device and method therefor
GB2519006B (en) Size measurement device and size measurement method
EP2879164A4 (en) Dicing device and dicing method
PL2696754T3 (en) Stress-measuring device and method
GB201214555D0 (en) Optical device and method
SG10201610882XA (en) Encoding device and encoding method
SG11201404996RA (en) Noodle-steaming method and noodle-steaming device
PL2885200T3 (en) Mechanical positioning device and method
EP2899766A4 (en) Piezoelectric device and method for using same
EP2891865A4 (en) Measuring method and measuring device
SG11201504078TA (en) Wafer dicing apparatus and wafer dicing method
PT2709361T (en) Encoding method and device
EP2914038A4 (en) Triggering method and related device
EP2806084A4 (en) Forming device and construction method using forming device
EP2813833A4 (en) Thin section preparation device and thin section preparation method
EP2887583A4 (en) Service processing method and device
EP2755363A4 (en) Data-fast-distribution method and device
PL2857045T3 (en) Sterilization device and sterilization method using same
EP2806671A4 (en) Paging method and device
EP2891535A4 (en) Turning method and turning device
GB201101862D0 (en) Method and device
EP2806020A4 (en) Subject selection device and subject selection method
EP2869063A4 (en) Detection device and method
GB201211316D0 (en) Method and device for increasing microcirculation
SG11201505068RA (en) Drawing device and drawing method

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAB Information related to the publication of an a document modified or deleted

Free format text: ORIGINAL CODE: 0009199EPPU

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20141211

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20151022

RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 19/02 20060101ALI20151016BHEP

Ipc: B28D 5/00 20060101ALI20151016BHEP

Ipc: B24D 5/12 20060101ALI20151016BHEP

Ipc: B24D 3/06 20060101ALI20151016BHEP

Ipc: B24B 27/06 20060101ALI20151016BHEP

Ipc: B24D 3/00 20060101ALI20151016BHEP

Ipc: H01L 21/301 20060101AFI20151016BHEP

17Q First examination report despatched

Effective date: 20160916

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20170503

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 928918

Country of ref document: AT

Kind code of ref document: T

Effective date: 20171015

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602013026660

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20170913

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171213

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 928918

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171214

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171213

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180113

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602013026660

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

26N No opposition filed

Effective date: 20180614

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20180614

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20180630

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180614

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180614

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180630

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180614

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180630

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180630

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20190627

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180614

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170913

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20130614

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170913

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602013026660

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210101