EP3178969A4 - Copper-tin alloy plating bath - Google Patents
Copper-tin alloy plating bath Download PDFInfo
- Publication number
- EP3178969A4 EP3178969A4 EP15829133.6A EP15829133A EP3178969A4 EP 3178969 A4 EP3178969 A4 EP 3178969A4 EP 15829133 A EP15829133 A EP 15829133A EP 3178969 A4 EP3178969 A4 EP 3178969A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- plating bath
- alloy plating
- tin alloy
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014162294 | 2014-08-08 | ||
| PCT/JP2015/071330 WO2016021439A1 (en) | 2014-08-08 | 2015-07-28 | Copper-tin alloy plating bath |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP3178969A1 EP3178969A1 (en) | 2017-06-14 |
| EP3178969A4 true EP3178969A4 (en) | 2017-12-27 |
| EP3178969B1 EP3178969B1 (en) | 2020-01-01 |
Family
ID=55263710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15829133.6A Active EP3178969B1 (en) | 2014-08-08 | 2015-07-28 | Copper-tin alloy plating bath |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170204528A1 (en) |
| EP (1) | EP3178969B1 (en) |
| JP (1) | JP6048712B2 (en) |
| CN (1) | CN106661752B (en) |
| CA (1) | CA2957587C (en) |
| TW (1) | TWI641729B (en) |
| WO (1) | WO2016021439A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019052355A (en) * | 2017-09-15 | 2019-04-04 | 上村工業株式会社 | Electrolytic Sn or Sn alloy plating solution and method for producing Sn or Sn alloy plating product |
| JP6645609B2 (en) * | 2018-07-27 | 2020-02-14 | 三菱マテリアル株式会社 | Tin alloy plating solution |
| CN110205659B (en) * | 2019-07-17 | 2020-06-16 | 广州三孚新材料科技股份有限公司 | Electrotinning additive and preparation method thereof |
| CN120485893A (en) * | 2025-06-18 | 2025-08-15 | 东强（连州）铜箔有限公司 | High-strength VLP copper foil for ultra-high definition PCB and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040035714A1 (en) * | 2000-09-20 | 2004-02-26 | Michael Dietterle | Electrolyte and method for depositing tin-copper alloy layers |
| EP1591563A1 (en) * | 2003-01-24 | 2005-11-02 | Ishihara Chemical Co., Ltd. | Tin-containing plating bath |
| US20050263403A1 (en) * | 2002-10-11 | 2005-12-01 | Enthone Inc. | Method for electrodeposition of bronzes |
| US20100216302A1 (en) * | 2008-12-31 | 2010-08-26 | Rohm And Haas Electronics Materials Llc | Lead-free tin alloy electroplating compositions and methods |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3871013B2 (en) * | 1998-11-05 | 2007-01-24 | 上村工業株式会社 | Tin-copper alloy electroplating bath and plating method using the same |
| EP1408141B1 (en) * | 2002-10-11 | 2014-12-17 | Enthone Inc. | Process and electrolyte for the galvanic deposition of bronze |
| JP5419021B2 (en) * | 2008-11-11 | 2014-02-19 | ユケン工業株式会社 | Zincate-type galvanizing bath |
| JP5313773B2 (en) * | 2009-06-04 | 2013-10-09 | 三菱伸銅株式会社 | Plated copper strip and method for producing the same |
| JP6133056B2 (en) * | 2012-12-27 | 2017-05-24 | ローム・アンド・ハース電子材料株式会社 | Tin or tin alloy plating solution |
-
2015
- 2015-07-28 JP JP2015559750A patent/JP6048712B2/en active Active
- 2015-07-28 CN CN201580038971.8A patent/CN106661752B/en not_active Expired - Fee Related
- 2015-07-28 WO PCT/JP2015/071330 patent/WO2016021439A1/en not_active Ceased
- 2015-07-28 US US15/326,328 patent/US20170204528A1/en not_active Abandoned
- 2015-07-28 CA CA2957587A patent/CA2957587C/en active Active
- 2015-07-28 EP EP15829133.6A patent/EP3178969B1/en active Active
- 2015-08-04 TW TW104125247A patent/TWI641729B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040035714A1 (en) * | 2000-09-20 | 2004-02-26 | Michael Dietterle | Electrolyte and method for depositing tin-copper alloy layers |
| US20050263403A1 (en) * | 2002-10-11 | 2005-12-01 | Enthone Inc. | Method for electrodeposition of bronzes |
| EP1591563A1 (en) * | 2003-01-24 | 2005-11-02 | Ishihara Chemical Co., Ltd. | Tin-containing plating bath |
| US20100216302A1 (en) * | 2008-12-31 | 2010-08-26 | Rohm And Haas Electronics Materials Llc | Lead-free tin alloy electroplating compositions and methods |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2016021439A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016021439A1 (en) | 2016-02-11 |
| JP6048712B2 (en) | 2016-12-21 |
| CA2957587C (en) | 2019-03-05 |
| JPWO2016021439A1 (en) | 2017-04-27 |
| HK1232261A1 (en) | 2018-01-05 |
| TWI641729B (en) | 2018-11-21 |
| CN106661752A (en) | 2017-05-10 |
| CN106661752B (en) | 2021-08-10 |
| EP3178969B1 (en) | 2020-01-01 |
| EP3178969A1 (en) | 2017-06-14 |
| TW201612362A (en) | 2016-04-01 |
| US20170204528A1 (en) | 2017-07-20 |
| CA2957587A1 (en) | 2016-02-11 |
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| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: NAGAO, TOSHIMITSU Inventor name: OTSUKA, KUNIAKI Inventor name: KATAYAMA, JUNICHI Inventor name: TSUJIMOTO, TAKAMITSU Inventor name: HARA, KENJI |
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