EP3473065A4 - SYSTEM AND METHOD FOR MONITORING AN ELECTRICAL CIRCUIT - Google Patents

SYSTEM AND METHOD FOR MONITORING AN ELECTRICAL CIRCUIT Download PDF

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Publication number
EP3473065A4
EP3473065A4 EP17807406.8A EP17807406A EP3473065A4 EP 3473065 A4 EP3473065 A4 EP 3473065A4 EP 17807406 A EP17807406 A EP 17807406A EP 3473065 A4 EP3473065 A4 EP 3473065A4
Authority
EP
European Patent Office
Prior art keywords
monitoring
electrical circuit
electrical
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17807406.8A
Other languages
German (de)
French (fr)
Other versions
EP3473065A1 (en
Inventor
Mark Taylor MCMEEN
Jason Edward TYNES
Michael L. Bixenman
David T. Lober
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyzen Corp
Original Assignee
Kyzen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyzen Corp filed Critical Kyzen Corp
Priority to EP21174449.5A priority Critical patent/EP3901586A1/en
Publication of EP3473065A1 publication Critical patent/EP3473065A1/en
Publication of EP3473065A4 publication Critical patent/EP3473065A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2843—In-circuit-testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/046—Materials; Selection of thermal materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/221—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance by investigating the dielectric properties
    • G01N2027/222—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance by investigating the dielectric properties for analysing gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/333—Ion-selective electrodes or membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Biochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Molecular Biology (AREA)
  • Nonlinear Science (AREA)
  • Toxicology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Maintenance And Management Of Digital Transmission (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
EP17807406.8A 2016-06-01 2017-05-31 SYSTEM AND METHOD FOR MONITORING AN ELECTRICAL CIRCUIT Withdrawn EP3473065A4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP21174449.5A EP3901586A1 (en) 2016-06-01 2017-05-31 System for monitoring electrochemical reliability of an electronic assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/170,710 US10677837B2 (en) 2016-06-01 2016-06-01 System and method for electrical circuit monitoring
PCT/US2017/035239 WO2017210310A1 (en) 2016-06-01 2017-05-31 System and method for electrical circuit monitoring

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP21174449.5A Division EP3901586A1 (en) 2016-06-01 2017-05-31 System for monitoring electrochemical reliability of an electronic assembly

Publications (2)

Publication Number Publication Date
EP3473065A1 EP3473065A1 (en) 2019-04-24
EP3473065A4 true EP3473065A4 (en) 2020-04-08

Family

ID=60477854

Family Applications (2)

Application Number Title Priority Date Filing Date
EP17807406.8A Withdrawn EP3473065A4 (en) 2016-06-01 2017-05-31 SYSTEM AND METHOD FOR MONITORING AN ELECTRICAL CIRCUIT
EP21174449.5A Ceased EP3901586A1 (en) 2016-06-01 2017-05-31 System for monitoring electrochemical reliability of an electronic assembly

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP21174449.5A Ceased EP3901586A1 (en) 2016-06-01 2017-05-31 System for monitoring electrochemical reliability of an electronic assembly

Country Status (12)

Country Link
US (2) US10677837B2 (en)
EP (2) EP3473065A4 (en)
JP (1) JP7088847B2 (en)
KR (1) KR102413262B1 (en)
CN (1) CN109315065B (en)
CA (1) CA3025873A1 (en)
IL (1) IL263271B (en)
MX (1) MX392979B (en)
MY (1) MY194949A (en)
SG (1) SG11201810493WA (en)
TW (1) TWI771300B (en)
WO (1) WO2017210310A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3084250C (en) 2018-01-03 2022-08-02 Halliburton Energy Services, Inc. Method and system for non-intrusively determining deposits in a fluidic channel
US20200064294A1 (en) 2018-08-22 2020-02-27 AerNos, Inc. Nano gas sensor system based on a hybrid nanostructure sensor array, electronics, algorithms, and normalized cloud data to detect, measure and optimize detection of gases to provide highly granular and actionable gas sensing information
US11371976B2 (en) 2018-08-22 2022-06-28 AerNos, Inc. Systems and methods for an SoC based electronic system for detecting multiple low concentration gas levels
FR3088714A1 (en) * 2018-11-16 2020-05-22 Continental Automotive France PRINTED CIRCUIT COMPRISING A DEFORMATION GAUGE
US11102921B2 (en) 2019-02-19 2021-08-24 IEC Electronics Corp. Electrically testing cleanliness of a panel having an electronic assembly
US10955372B2 (en) 2019-04-10 2021-03-23 Nokia Technologies Oy Integrated environmental sensor for damage sensing
US11037429B2 (en) * 2019-05-09 2021-06-15 Oracle International Corporation Embedded active environmental contaminant monitor
CN111975171B (en) * 2019-05-22 2025-08-22 伊利诺斯工具制品有限公司 Welding monitoring system with unknown downtime disablement
KR102315828B1 (en) * 2019-09-05 2021-10-22 국방과학연구소 A nano chemical sensor for detecting electrostatic capacity change using nano materials having metal or semiconductor property as an active material
DE102019216327A1 (en) * 2019-10-23 2021-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. SENSOR WITH A SOLID LAYERED STRUCTURE AND A METHOD FOR MANUFACTURING A SENSOR
US11493565B2 (en) * 2019-12-03 2022-11-08 International Business Machines Corporation Leakage characterization and management for electronic circuit enhancement
US11531056B2 (en) * 2020-04-15 2022-12-20 Infineon Technologies Ag Predictive chip-maintenance
WO2022104315A1 (en) * 2020-11-11 2022-05-19 Lam Research Corporation Substrate processing system tools for monitoring, assessing and responding based on health including sensor mapping and triggered datalogging
DE102021110346A1 (en) * 2021-04-22 2022-10-27 Federnfabrik Schmid Ag Controlled spring assembly and methods of manufacture and operation
US11768237B2 (en) * 2022-05-10 2023-09-26 Google Llc Leakage screening based on use-case power prediction
US12282371B2 (en) * 2022-06-24 2025-04-22 Microsoft Technology Licensing, Llc Devices, systems, and methods for monitoring an electronic device in transit
US20240085310A1 (en) * 2022-09-12 2024-03-14 Antony Trueman Resistance-Based Sensor System for Measuring Atmospheric Corrosion
US20250076156A1 (en) * 2023-08-29 2025-03-06 SK Hynix NAND Product Solutions Corp. (dba Solidigm) Thermal-mechanical testing device for platform integration
CN119996450A (en) * 2025-02-06 2025-05-13 深圳市揽胜科技有限公司 A cloud platform monitoring method for parallel processing of multiple data of smart locks

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2831113Y (en) * 2005-05-25 2006-10-25 友力微系统制造股份有限公司 Multifunctional wireless detection device
CN102565878A (en) * 2010-12-18 2012-07-11 西安迅腾科技有限责任公司 High-precision movable environment data acquisition device
EP2677314A2 (en) * 2012-06-21 2013-12-25 Sensirion AG Chemical sensor in a portable electronic device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2728561B2 (en) * 1990-11-30 1998-03-18 株式会社日立製作所 Electronic device with printed board insulation deterioration detection means
JPH07249840A (en) * 1994-03-10 1995-09-26 Toshiba Corp Printed circuit board and its deterioration diagnosis method
JPH08220158A (en) * 1995-02-08 1996-08-30 Shibafu Eng Kk Creepage insulation deterioration detection device
JPH10239374A (en) * 1997-02-24 1998-09-11 Kyocera Corp Insulation degradation detector for printed circuit boards
JPH11211684A (en) * 1998-01-20 1999-08-06 Hioki Ee Corp Migration inspection device
JP2003254923A (en) * 2002-02-28 2003-09-10 Espec Corp Migration measuring method and measuring device
TW200724881A (en) * 2005-12-16 2007-07-01 Kuender & Co Ltd Circuit board monitoring system
CN101038263A (en) * 2006-03-13 2007-09-19 华为技术有限公司 Method and system for estimating circuit board corrosion risk
US9051814B2 (en) * 2010-10-05 2015-06-09 Baker Hughes Incorporated Real-time prognostic on downhole printed circuit board assembly of measurement-while-drilling/logging-while-drilling
US8784952B2 (en) 2011-08-19 2014-07-22 Earthone Circuit Technologies Corporation Method of forming a conductive image on a non-conductive surface
US20130092843A1 (en) * 2011-10-18 2013-04-18 Marcos de Azambuja Turqueti Miniature Radiation Detector Module Configured as Smart Mobile Device/Phone Ad-On
ITTO20120516A1 (en) * 2012-06-14 2013-12-15 St Microelectronics Srl METHOD OF MANUFACTURE OF A GRAPHENE-BASED ELECTROCHEMICAL SENSOR AND ELECTROCHEMICAL SENSOR
US9582035B2 (en) * 2014-02-25 2017-02-28 Medibotics Llc Wearable computing devices and methods for the wrist and/or forearm
US9167325B2 (en) * 2012-10-23 2015-10-20 Apple Inc. Electronic devices with environmental sensors
WO2014176179A2 (en) * 2013-04-21 2014-10-30 King-Smith Oliver Ion sensitive device and method of fabrication
US9080932B2 (en) * 2013-05-13 2015-07-14 Apple Inc. Electronic device with printed circuit board stress monitoring
JP2015031666A (en) * 2013-08-06 2015-02-16 日本電信電話株式会社 Sensor element
US10321844B2 (en) * 2013-12-16 2019-06-18 Medtronic Minimed, Inc. In-vivo electrochemical impedance spectroscopy (EIS)-based calibration
JP5792332B2 (en) * 2014-02-04 2015-10-07 ファナック株式会社 Electronic device having printed circuit board deterioration detection function
GB2523173A (en) * 2014-02-17 2015-08-19 Nokia Technologies Oy An apparatus and associated methods
KR101882118B1 (en) * 2014-02-19 2018-07-25 인피니언 테크놀로지스 아게 Detection of dependent failures
KR102228782B1 (en) * 2014-10-22 2021-03-18 삼성전자주식회사 Electronic device and method for determining abnormality in the electronic device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2831113Y (en) * 2005-05-25 2006-10-25 友力微系统制造股份有限公司 Multifunctional wireless detection device
CN102565878A (en) * 2010-12-18 2012-07-11 西安迅腾科技有限责任公司 High-precision movable environment data acquisition device
EP2677314A2 (en) * 2012-06-21 2013-12-25 Sensirion AG Chemical sensor in a portable electronic device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017210310A1 *

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