EP3553443B1 - Vereinfachte wärmeröhre und pulsierte wärmeröhre - Google Patents

Vereinfachte wärmeröhre und pulsierte wärmeröhre

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Publication number
EP3553443B1
EP3553443B1 EP19168580.9A EP19168580A EP3553443B1 EP 3553443 B1 EP3553443 B1 EP 3553443B1 EP 19168580 A EP19168580 A EP 19168580A EP 3553443 B1 EP3553443 B1 EP 3553443B1
Authority
EP
European Patent Office
Prior art keywords
grooves
plates
heat pipe
intermediate plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19168580.9A
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English (en)
French (fr)
Other versions
EP3553443A1 (de
EP3553443C0 (de
Inventor
Jean-Antoine Gruss
Mathieu Mariotto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Publication of EP3553443A1 publication Critical patent/EP3553443A1/de
Application granted granted Critical
Publication of EP3553443C0 publication Critical patent/EP3553443C0/de
Publication of EP3553443B1 publication Critical patent/EP3553443B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates to a two-phase heat transfer device that can be a thermosiphon or a simplified pulsed heat pipe.
  • a thermosiphon of conventional construction from the prior art is known from US2016381839
  • a pulsed heat pipe of standard construction is known from US2007/144574 .
  • a two-phase thermosiphon is a heat transfer device that operates by the evaporation and condensation of a liquid introduced at its vapor pressure into a sealed chamber. It has one end called the “evaporator zone,” which is in contact with a heat source, and the other end called the “condenser zone,” which is in contact with a cold source.
  • the fluid in the evaporator zone is heated and evaporates, extracting heat from the heat source.
  • the vapor then travels to the condenser zone, where it condenses and releases heat to the cold source.
  • the liquid then returns to the evaporator zone.
  • the evaporator zone is located lower than the condenser zone, so the condensate returns to the evaporator zone by gravity.
  • a pulsed heat pipe is a heat transfer system that operates by the oscillation of vapor and liquid plugs in a fluid circuit that circulates successively between one or more hot zones and one or more cold zones.
  • the cross-section of the fluid circuit is small to achieve a plug-like flow pattern. Heat transfer occurs through latent heat, but also through sensible heat thanks to the liquid plugs oscillating between the hot and cold zones.
  • Such heat transfer devices can be used in the field of electronics, for example power electronics to cool electronic components.
  • Such devices have the advantage of being able to operate efficiently against gravity, i.e. when the evaporator is positioned above the condenser.
  • thermosiphon thermosiphon
  • pulsed heat pipe of simplified realization.
  • thermosiphon or a pulsed heat pipe conforming to icacations 1 or 5 respectively.
  • the heat transfer device is therefore simple to manufacture. Indeed, since the grooves and cutouts in the intermediate plates are through-holes, their production is simplified, unlike the creation of non-through-holes. They can be advantageously produced by punching, which is particularly well-suited to medium or large production runs.
  • aluminum alloy plates they can be advantageously joined by brazing.
  • the use of aluminum alloys allows for industrial brazing using eutectic alloys.
  • the junction between the grooved intermediate plate and The other intermediate plate or one of the end plates forms angles and not a rounded shape. These angles promote capillary effects.
  • the plate with the grooves delimits the side walls of the channels
  • the plate with the cutouts forms an end wall and ensures either the balancing of the load between the different channels in the case of a thermosiphon, or the series connection of the channels, and the end plates, one forming the other end wall of the channel and the other closing the cutouts.
  • thermosiphons and pulsed heat pipes make it easier to change the manufactured device in the case of a single production line for thermosiphons and pulsed heat pipes, it is very easy to change the manufactured heat transfer device, in fact it is only necessary to modify the intermediate plate containing the collectors to make a pulsed heat pipe instead of a thermosiphon.
  • the channels are delimited by flat faces that define angles favorable to heat exchange. Even more advantageously, the grooves are structured so that all or part of the angles are acute, further promoting heat transfer.
  • the channel(s) is/are delimited by four planes.
  • the section of a channel or channels preferably includes at least two vertices whose angle is between 70° and 85°.
  • collectors or connectors are formed by grooves.
  • thermosiphon or pulsed heat pipe includes at least one other second intermediate plate with cutouts to connect all or part of the grooves together.
  • thermosiphon or pulsed heat pipe includes at least one heat exchanger in the evaporator zone and/or the condenser zone.
  • the heat exchanger can be a radiator attached to at least one of the end plates.
  • the heat exchanger is formed directly in one of the stack plates.
  • the heat exchanger can be a radiator formed directly in at least one of the end plates.
  • the heat exchanger may include a fluidic circuit formed in the intermediate plate, in which a liquid or two-phase fluid circulates.
  • the pulsed heat pipe has at least two grooves of different widths connected directly.
  • the grooves can form a channel with the connectors, forming a closed loop.
  • the heat pipe is shaped to present a serpentine form or to be wound upon itself having straight portions connected by bends, the first ends of the grooves being located at one free end of the heat pipe and the second ends of the grooves being located at another free end, and the collector and the grooves are formed in the same intermediate plate.
  • Steps b) or steps b') and c') can be carried out by punching
  • Step d) or e') can be carried out by welding, brazing, gluing.
  • the plates are made of a first aluminum alloy, are coated with a second aluminum alloy having a melting point lower than that of the first aluminum alloy, and the assembly is carried out by eutectic brazing.
  • groove and “channel” will be used interchangeably. Indeed, grooves made in a plate form channels in cooperation with other plates.
  • thermosiphon according to an example of its implementation.
  • thermosiphon T1 comprises a fluidic circuit C filled with a fluid, a first zone 2 intended for exchanging heat with a heat source, for to perform thermal control, heat transfer, component cooling.
  • the heat source at the evaporator is, for example, an electrical component, an electronic circuit, an electronic component, such as a thyristor-type power electronic component or an insulated-gate bipolar transistor, a lighting device including light-emitting diodes, a photovoltaic device, a heat-releasing chemical reactor, a hot storage, a battery, a fuel cell, or any other power system.
  • an electrical component for example, an electrical component, an electronic circuit, an electronic component, such as a thyristor-type power electronic component or an insulated-gate bipolar transistor, a lighting device including light-emitting diodes, a photovoltaic device, a heat-releasing chemical reactor, a hot storage, a battery, a fuel cell, or any other power system.
  • Heat sinks at the condenser include, for example, forced convection fins, cold plates in single or two-phase flow, and cold storage.
  • Hot and cold storage devices are storage devices that utilize one or more phase-change materials, allowing for the smoothing of heat inputs or sinks from electrical/electronic components through thermal storage.
  • thermosiphon includes a second zone 4 designed to exchange heat with a cold source, designated as the condenser zone.
  • the cold source can, for example, include a natural or forced convection radiator or a system where an endothermic reaction takes place.
  • the radiator can be chosen from, for example, pleated fin radiators, extruded fin radiators, studded fin radiators, molded fin radiators, knurled fin radiators, 3D-printed fin radiators, or any other heat exchange device.
  • the fins can be skived fins, which are produced using a method called "skiving” that involves scraping the surface of soft metal with a tool and pushing away the shavings to create fins with a high aspect ratio. This method offers a reduced production cost.
  • thermosiphon consists of a stack of plates or sheets assembled together, delimiting the fluidic circuit C between them.
  • the two end plates are the plates located furthest from the stack. In the example shown, they are solid.
  • the intermediate plates P3 and P4 are located between the end plates.
  • the first intermediate plate P3 has a plurality of grooves 6 through the entire thickness of the plate P3.
  • the grooves are parallel to each other, but such an arrangement is not limiting.
  • Each groove has a first end 6.1 located in the evaporator zone 2 and a first end 6.2 located in the condenser zone 4.
  • the second intermediate plate P4 includes balancing means suitable for balancing the load between the channels at their first 6.1 and second 6.2 ends.
  • the balancing means include a first groove 8 oriented transversely to the grooves 6, such that it is located at the first ends 6.1 of the channels 6 and extends over all the grooves.
  • the balancing means also include a second groove or cutout 10 oriented transversely to the grooves 6, such that it is located at the second ends 6.2 of the channels 6 and extends over all the grooves.
  • the first transverse groove 8 ensures fluid communication between all the channels in the evaporator zone
  • the second transverse groove 10 ensures fluid communication between all the channels in the condenser zone.
  • finned radiators 12 are provided on the end plates P2 and P3, opposite the condenser area 4 so as to promote heat dissipation.
  • Grooves 6 and transverse grooves 8 and 10 are advantageously produced by punching, a technique particularly suited to medium and large production runs. In other examples, they can be produced by laser cutting, waterjet cutting, or through-etching.
  • thermosiphon Figures 1 And 2 The operation of the thermosiphon Figures 1 And 2 will now be described.
  • the heat emitted by the heat source is transferred to the fluid in the evaporator zone.
  • the fluid evaporates and travels through the channels to the condenser zone, where it condenses and releases its heat to the cold source.
  • the liquid then returns to the evaporator zone via the radiator fins. Vapor flows from the evaporator zone to the condenser zone, roughly in the center of the channels, while liquid flows from the condenser zone to the evaporator zone along the channel walls.
  • the pressure between the channels is balanced by transverse grooves in the condenser and evaporator zones.
  • the plates for example, have a thickness ranging from 0.05 mm to 6 mm, preferably equal to 3 mm.
  • Channels 8 and 10 for example have a width between 0.5 mm and 10 mm, advantageously equal to 3 mm.
  • the dimensions of the plates can range, for example, from a few centimeters to a few meters.
  • the plates or sheets are made of a material with good thermal conductivity so as to conduct heat from the heat source to the evaporator zone and from the condenser zone to the cold source. They are made, for example, of aluminum alloy, copper, or stainless steel.
  • the sheet metal assembly process used depends on the material of the plates.
  • diffusion welding In the case of copper, stainless steel, or superalloy plates, diffusion welding, diffusion brazing, and bonding can be used.
  • the channels are filled with fluid, for example, using a filling nozzle 15 inserted into the edge of the intermediate plate P3, as shown schematically on the figure 2
  • a small plug can be used, fixed to an opening in the end plates and perpendicular to them. The plug is then pinched or sealed. Since all the channels communicate with each other via the transverse grooves, filling can be carried out through only one channel.
  • the filling fluid can be chosen from fluids commonly used in thermosiphons, and is chosen according to the operating temperature range of the device to be cooled, and also the temperatures at which the thermosiphons are likely to be stored, for example to withstand freezing phases.
  • the filling fluids that can be used are those commonly used in this type of application.
  • thermosiphon assembled by eutectic brazing ammonia, acetone, methanol, n-heptane, R134a or another fluorinated refrigerant can be used as a fluid.
  • the means for balancing the load between the channels in the evaporator and condenser zones are implemented in the same intermediate plate P4, thus reducing the number of plates required.
  • the grooves can have different widths and/or a width that varies.
  • thermosiphon has an inverted L shape; this design is by no means limiting, it could be a straight or curved bar.
  • shape of the thermosiphon is adapted to the environment in which it will be integrated.
  • thermosiphon in three dimensions.
  • the thermosiphon has been folded to present a shape extending in several planes; in this example, the two planes are orthogonal. This configuration is particularly well-suited for cooling an electrical circuit breaker.
  • thermosiphon Even further to the environment to be thermalized.
  • thermosiphon can be folded multiple times along one or more planes. Furthermore, the folding angle(s) can be arbitrary. This folding can advantageously be performed after the stack of plates has been manufactured. It should be noted that the folding angle is chosen according to the thickness of the device to prevent crushing of the channels and/or delamination of the plates.
  • This folding step can be carried out before assembling the plates to avoid the risk of delamination, however the tooling for assembly is considerably more complex.
  • the vertices of the channel section are defined by substantially flat faces.
  • the vertices therefore present an angle, a right angle in this example, and not a rounded shape as in the case of a partial engraving of the plate.
  • FIG 3B An advantageous example of a channel cross-section shape can be seen in which the lateral edges 24 of the grooves 6 are inclined to form two acute angles ⁇ at vertices A with one of the plates P1 and P4.
  • the acute angles promote fluid adhesion and are therefore even more favorable for heat transfer.
  • the two edges have opposite inclinations.
  • the two edges could have the same inclination; in this case, the acute angles at the vertices would not be delimited by the same plate P1 or P4.
  • the inclined lateral edges of the grooves can be obtained by punching.
  • Such grooves are made, for example, by using two plates, and by making grooves with inclined lateral edges in each of the two plates, such as those of the figure 3B , for example by punching, then turning one plate over and pressing it against the other so that the grooves overlap.
  • the angle ⁇ is at least equal to 70°, preferably greater than 80° and very advantageously equal to 85°.
  • the two or four vertices A can have different angle values.
  • the grooves are created using a laser.
  • a surface treatment of the channel walls is advantageous to make them wettable to the fluid.
  • a surface treatment of the channel walls is advantageous to make them wettable to the fluid.
  • chemical oxidation can be applied to make it wettable to water.
  • no treatment is required, as copper is inherently wettable.
  • aluminum alloys due to the presence of native aluminum oxide, they offer good wettability to fluids compatible with aluminum alloys.
  • thermosiphon of the figure 1
  • the thermosiphon is attached to a busbar 14 of a circuit breaker that is to be cooled. It is fixed to the busbar at the evaporator zone, for example by means of screws 18, so that an outer face of the end face P1 is in flat contact with the busbar 14 to provide excellent thermal contact and ensure efficient heat transfer between the busbar and the evaporator zone.
  • the thermosiphon is oriented so that the evaporator zone is below the condenser zone, with the return of the liquid to the evaporator zone occurring by gravity.
  • thermosiphon is used to cool a circuit board 20 carrying one or more power components 22.
  • the thermosiphon is fixed to the board so that the outer face of the end plate P1 at the evaporator area is in planar contact with a power component 22.
  • the thermosiphon consists of only a heat sink fixed to the end plate P2 at the condenser area, and the end plate P1 is in contact with the board.
  • the board is, for example, vertical, facilitating the return of the liquid to the evaporator area.
  • the card and the thermosiphon can be immersed in a bath of dielectric oil or other suitable heat transfer fluid to further improve heat dissipation.
  • the pulsed heat pipe CP1 comprises a fluidic circuit C' filled with a fluid, an evaporator zone intended to exchange heat with a heat source, and a condenser zone intended to exchange heat with a cold source.
  • the pulsed heat pipe comprises a stack of plates or sheets assembled together, delimiting between them a fluidic circuit C'.
  • the two end plates are the plates located furthest from the stack. In the example shown, they are solid.
  • the intermediate plates P103 and P104 are located between the end plates.
  • the first intermediate plate P103 has a plurality of grooves 106 through the entire thickness of the plate P103.
  • the grooves are parallel, but such an arrangement is not limiting.
  • Each groove has a first end 106.1 located in the evaporator zone and a first end 106.2 located in the condenser zone.
  • the second intermediate plate P104 includes means for connecting the grooves so as to form a single channel.
  • connection means include cutouts 108 dimensioned and arranged so that a cutout covers only two ends 106.1 of two successive grooves. Thus, one groove is connected to the adjacent groove.
  • the figure 6B represents a cross-sectional view of the stacking of the four plates along the PP plane, we can see the ends 106.1 and the cutouts 108.
  • connection means ensure that all grooves are connected in series.
  • the two ends of the channel thus formed remain separate.
  • the two ends of the channel are connected, preferably at the condenser, to form a closed-loop channel; the pulsed heat pipe is then a looped pulsed heat pipe.
  • the pulsed heat pipe is then a looped pulsed heat pipe.
  • an additional cutout is made in the second intermediate plate, which is shaped to connect the two ends of the serpentine channel.
  • a looped pulsed heat pipe is more efficient because, in addition to the oscillations, there is overall fluid circulation in one direction.
  • the grooves 106 have different widths; for example, adjacent grooves have different widths. This asymmetry promotes oscillations that are advantageous for starting the pulsed heat pipe. For example, one groove has a width of 2 mm and the adjacent groove has a width of 3 mm; this pattern is repeated for all the grooves.
  • the invention advantageously allows for the creation of a channel with angles that promote capillary action.
  • angles can be acute, which improves heat exchange through capillary action. This is because the length of the triple contact lines between the liquid, vapor, and solid is increased, thus intensifying heat transfer, which is particularly high in this area.
  • figures 3A to 3C apply to the pulsed heat pipe according to the invention.
  • thermosiphon The materials and dimension ranges given for the thermosiphon also apply to the pulsed heat pipe.
  • the heat emitted by the heat source is transferred to the fluid in the evaporator zone, causing it to evaporate.
  • Vapor plugs form and alternate with liquid plugs.
  • the oscillating movement of these plugs between the evaporator and condenser is achieved by the expansion of the vapor plugs in the evaporator and their contraction in the condenser.
  • the fluid exchanges its heat in the condenser zone. As it moves, the fluid alternately enters the evaporator and condenser zones. Heat transfer occurs through latent heat due to evaporation and sensible heat due to the oscillating liquid plugs between the evaporator and condenser zones.
  • the L-shape is only one example of a possible implementation.
  • the pulsed heat pipe can also be bent and, for example, have the following configuration: figure 11 .
  • thermosiphon according to another example of embodiment, in which the thermosiphon comprises several plates containing grooves forming superimposed channels.
  • the T2 thermosiphon has three first intermediate plates P3.1, P3.2 and P3.3 and two second intermediate plates P4.1 and P4.2.
  • Plate P4.1 is located between plates P3.1 and P3.2 and plate P4.2 is located between plates P3.2 and P3.3.
  • plates P4.1 and P4.2 have transverse grooves 8 and 10 connecting all the channels delimited in the three plates P3.1 to P3.3, and ensuring a balancing of the load between all the channels of the thermosiphon.
  • the balancing means are such that they ensure balancing between the channels of the same plate only or between the channels of a part of first intermediate plates.
  • the heat transfer fluid can include any number of first intermediate layers and therefore of channel layers.
  • thermosiphon of Figures 9A And 9B can be done like the thermosiphon of the figure 1 This can be achieved by using a single filler plug inserted into the edge of one of the first intermediate plates, provided that all the grooves communicate smoothly with each other. Alternatively, a plug fixed to an opening in one of the end plates can be used, for example, perpendicular to it.
  • the channel layers are fluidically isolated from each other by pinching a communication channel between the layers.
  • a filler tail can be provided for each first intermediate plate, or group of first intermediate plates.
  • the grooves are all connected in series; in this case, a single channel winds through the different plates.
  • groups of grooves are connected in series to form several separate channels.
  • the connection means could be such that they form a single channel through each first intermediate plate.
  • thermosiphon according to the invention.
  • the T3 thermosiphon differs from the T1 thermosiphon of the figure 1 in that it includes a heat exchanger 26 integrated at the condenser zone, which forms the cold source.
  • thermosiphon includes an additional intermediate plate P5 which has a groove 28 arranged so as to be in line with the condenser area, and is intended to allow the circulation of a heat transfer fluid extracting the heat transported by the fluid circulating in the channels of the thermosiphon.
  • Plate P5 is interposed between the second intermediate plate P4 and the end plate P2, which, together with groove 28, defines a cooling circuit.
  • Groove 28 is positioned so that it is not aligned with the transverse groove 10, ensuring load balancing at the ends 6.2 of the grooves.
  • the cooling circuit has an inlet 30 and an outlet 32 of heat transfer fluid.
  • the heat transfer fluid can remain liquid or change phase during heat exchange in the condenser area.
  • the heat exchanger can be of the air-to-air type.
  • the end plate P2 can directly integrate the radiator, for instance, by creating a perforated and/or pleated area. A large perforated area is possible because the end plate P2 is not used to seal the grooves 6. The perforated area is positioned so as not to be directly opposite the transverse groove 10. Using the end plate P2 to create a heat exchanger has the advantage of not requiring the addition of a separate plate.
  • Such a heat exchanger forming a heat source can also be implemented at the evaporator zone.
  • thermosiphon can incorporate a heat exchanger forming a cold source and/or a heat exchanger forming a heat source.
  • Heat exchangers can be of different types, one can be a liquid heat exchanger and the other can be an air or two-phase exchanger.
  • thermosiphon or pulsed heat pipe has one or more channels in multiple layers, as shown in the diagrams.
  • Figures 9A And 9B in order to bring or extract heat to the core of the stack.
  • the heat pipe CP2 is folded to form a coil.
  • the coil comprises straight sections parallel to each other D1 to D8 connected in series by bends CD1 to CD7.
  • the sections have faces of larger surfaces parallel to each other and connected by lateral edges B1, B2.
  • the lateral edges B1, B2 also have a serpentine shape, and the lighting device is arranged on the pulsed heat pipe so as to be in contact with the lateral edge B1 which, due to its serpentine conformation, forms a support.
  • a thermal conduction plate 36 is interposed between the lighting device and the lateral edge B1 and conducts heat from the lighting device to the heat pipe.
  • the conduction plate is positioned relative to the heat pipe so that, together with the lighting device, it forms a heat source for only a portion of the heat pipe, while the remaining portions of the heat pipe are in contact with a cold source.
  • the conduction plate covers only a portion of the lateral edge, thus creating a localized heat source.
  • the conduction plate 36 is positioned on a mid-section of the coil, leaving areas of the straight sections D1 to D8 and the bends CD1 to CD7 free from contact with the heat source, forming cold sources.
  • the conduction plate is positioned on the bends CD1, CD3, CD5, CD7 or on the bends CD2, CD4, CD6.
  • the device comprises two conduction plates, one positioned on the bends CD1, CD3, CD5, CD7, and the other on the bends CD2, CD4, CD6.
  • the conduction plate is located in the middle section of the coil, at one end, and at both ends of the coil.
  • multiple conduction plates can be used for hot zones.
  • This device is particularly suitable for cooling electronic and/or electrical components.
  • It comprises two end plates P201 and P202, a first intermediate plate P203 and a second intermediate plate P204 in direct contact with the first intermediate plate P203.
  • the first intermediate plate has two parallel grooves 206 extending along the length of plate P203, and the second intermediate plate P204 has two transverse grooves 208 such that the two grooves 206 are connected at their longitudinal ends, forming a single channel in a closed loop.
  • the transverse grooves 208 are similar to the grooves 108 of the figure 5 .
  • the plates are assembled according to the assembly methods described above.
  • the heat pipe is then bent to form a coil and the thermal conduction plate is fixed to the lateral edge B1 for example by welding or gluing, preferably the welding material or glue ensures good heat conduction.
  • the heat pipe may include heat exchange fins arranged between the straight sections D1 to D8 and in thermal contact with them.
  • the lighting device and the conduction plate form the heat source. Each portion D1 to D8 is therefore in contact with the heat source.
  • the areas of portions D1 to D8 free from contact with the conduction plate and the bends CD1 to CD7 are in contact with a cold source which is air with with which they exchange heat by natural convection. Forced convection methods can be implemented.
  • the channel alternately passes through a cold source and the heat source.
  • the fluid in the channel formed by the grooves opposite the conduction plate 36 evaporates. It is assumed that the heat diffuses over at least part of the height of the heat pipe, from the lateral edge B1 to the lateral edge B2.
  • the loop through the groove 206 on the side of edge B2 allows the temperature of the heat pipe to be homogenized along its length.
  • the fluid in the channel at the cold springs condenses. This results in the formation of vapor plugs that alternate with liquid plugs.
  • the oscillating movement of these plugs between the evaporator and condenser is achieved by the expansion of the vapor plugs at the evaporator and their contraction at the condenser.
  • the fluid exchanges heat in the condenser zone. As it moves, the fluid alternately enters the evaporator and condenser zones. Heat transfer occurs through latent heat due to evaporation and sensible heat due to the oscillating liquid plugs between the evaporator and condenser zones.
  • This example of implementation is very advantageous because the number of straight zones is significant, which is favorable for the start-up and operation of the heat pipe; preferably, it is desirable to have at least 16 straight zones to obtain a good start-up and operation of the pulsed heat pipe.
  • each section D1 to D8 has two straight zones.
  • the heat pipe therefore has 16 straight zones.
  • more than two grooves 206 can be provided in the height of the heat pipe.
  • the plates have a width of 10 mm, which corresponds approximately to the length of the grooves 206.
  • the heat pipe can be shaped into a rectangular or cylindrical spiral.
  • the slightly curved shape of the "straight sections" does not interfere with the operation of the pulsed heat pipe.
  • a single intermediate plate is used, featuring two parallel grooves and a single transverse groove; the resulting channel is then not looped. This simplifies the construction.
  • the pulsed heat pipe of the figure 1 may include several first intermediate plates defining several layers of superimposed channels, these being connected to each other or not.
  • thermosiphon of the figure 1 An example of a method for constructing a thermosiphon of the figure 1 will now be described. This description applies to the manufacture of a pulsed heat pipe, with the cutouts made in the second intermediate plate being adapted.
  • One of the intermediate plates is structured, for example punched to form grooves 6.
  • the other intermediate plate is structured to form cutouts 8 and 10.
  • the plates are stacked one on top of the other, with the two intermediate plates placed against each other between the two end plates.
  • the plates are then assembled, for example by brazing.
  • the channels are partially filled with fluid.
  • thermosiphon using aluminum plates by eutectic brazing of clad sheets will be described.
  • one side of the aluminum alloy sheets is coated with an aluminum alloy with a lower melting point.
  • a core sheet made of an AA3xxxx series alloy will be used, coated with a eutectic alloy from the AA4xxxx series containing silicon with a lower melting point.
  • the coating is applied using a known roll-bond technique, i.e., by rolling the sheets together.
  • Sheets are chosen with a thickness between 0.05 mm and 5 mm, with a coating typically of 5 to 10% of the total thickness.
  • the coated sheets are hot-pressed at a temperature above the eutectic melting point, but below the core alloy temperature; the eutectic alloy is then melted, forming a leak-proof brazing alloy between the two sheets.
  • the channels are then partially filled with fluid.
  • thermosiphon and pulsed heat pipe according to the invention are simplified in construction compared to those of the prior art.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Claims (16)

  1. Thermosiphon mit einem Stapel von miteinander verbundenen Platten, um einen Fluidkreislauf abzugrenzen, wobei der Fluidkreislauf mindestens zwei Kanäle aufweist, die teilweise mit einem Fluid gefüllt sind, wobei der Stapel Folgendes umfasst:
    - zwei Endplatten (P1, P2),
    - mindestens eine erste Zwischenplatte (P3), die zwischen den beiden Endplatten (P1, P2) angeordnet ist, wobei die erste Zwischenplatte (P3) mindestens zwei Nuten (6) aufweist, die durchgehend die erste Zwischenplatte (P3) über ihre gesamte Dicke durchqueren, wobei jede Nut (6) ein erstes Ende (6.1) und ein zweites Ende (6.2) aufweist, wobei die ersten Enden (6.1) in einem Bereich, dem "Verdampferbereich" (2), und die zweiten Enden (6.2) in einem Bereich, dem "Kondensatorbereich" (4), liegen, wobei der Verdampferbereich (2) von dem Kondensatorbereich (4) getrennt ist,
    - mindestens einen ersten Kollektor in dem Verdampferbereich (2), der mindestens zwei Nuten (6) nur an den ersten Enden (6.1) in fluidische Kommunikation bringt,
    - mindestens einen zweiten Kollektor in dem Kondensatorbereich (4), der mindestens zwei Nuten (6) nur an den zweiten Enden (6.2) in fluidische Kommunikation bringt,
    - wobei die ersten und zweiten Kollektoren so sind, dass sie die Nuten (6) parallel verbinden,
    - mindestens eine zweite Zwischenplatte (P4) in direktem Kontakt mit der ersten Zwischenplatte (P3) und, wobei sie mindestens einen der ersten und zweiten Kollektoren aufweist,
    wobei die ersten und zweiten Kollektoren vorteilhaft durch Nuten gebildet sind.
  2. Thermosiphon nach Anspruch 1, wobei der oder die Kanäle durch vier Ebenen abgegrenzt sind, wobei der Querschnitt eines Kanals oder mehrerer Kanäle vorteilhafterweise mindestens zwei Scheitelpunkte (A) aufweist, deren Winkel zwischen 70° und 85° liegt.
  3. Thermosiphon nach einem der Ansprüche 1 oder 2, der mindestens eine andere erste Zwischenplatte mit Nuten aufweist und vorteilhafterweise mindestens eine andere zweite Zwischenplatte mit Ausschnitten aufweist, so dass die Nuten ganz oder teilweise miteinander verbunden sind.
  4. Thermosiphon nach einem der Ansprüche 1, 2 oder 3, der mindestens einen Wärmetauscher im Verdampferbereich und/oder im Kondensatorbereich aufweist, wobei der Wärmetauscher vorteilhafterweise entweder ein Wärmetauscher mit einem Fluidkreislauf, der in der Zwischenplatte gebildet ist, und in dem ein flüssiges oder zweiphasiges Fluid zirkuliert, oder ein Heizkörper ist, der auf mindestens einer der Endplatten angebracht ist oder direkt in mindestens einer der Endplatten gebildet ist.
  5. Pulsierendes Wärmerohr, das einen Stapel von miteinander verbundenen Platten aufweist, um einen Fluidkreislauf abzugrenzen, der mindestens einen Kanal aufweist und mit einem Fluid gefüllt ist, wobei der Fluidkreislauf mindestens einen Bereich, den Verdampferbereich, und mindestens einen Bereich, den Kondensatorbereich, aufweist, wobei der Stapel Folgendes umfasst:
    - zwei Endplatten (P101, P102),
    - mindestens eine erste Zwischenplatte (P103), die zwischen den beiden Endplatten (P101, P102) angeordnet ist, wobei die erste Endplatte (P103) eine Vielzahl von Nuten (106) aufweist, die durchgehend die erste Zwischenplatte (P103) über ihre gesamte Dicke durchqueren, wobei jede Nut (106) ein erstes Ende (106.1) und ein zweites Ende (106.2) aufweist,
    - mindestens einen ersten Verbinder an den ersten Enden (106.1), der die Nuten (106) paarweise nur an den ersten Enden (106.1) in fluidische Kommunikation bringt, wobei der erste Verbinder durch eine Vielzahl von durchgehenden Ausschnitten (108) gebildet ist,
    - mindestens einen zweiten Verbinder an den zweiten Enden (106.2), der die Nuten (106) paarweise nur an den zweiten Enden (106.2) in fluidische Kommunikation bringt, wobei der zweite Verbinder durch eine Vielzahl von durchgehenden Ausschnitten (108) gebildet ist,
    - wobei die ersten und zweiten Verbinder so sind, dass sie die Nuten (106) in Reihe verbinden,
    - mindestens eine zweite Zwischenplatte (P104) in direktem Kontakt mit der ersten Zwischenplatte und, die mindestens einen der ersten und zweiten Verbinder aufweist,
    wobei die ersten und zweiten Verbinder vorteilhafterweise durch Nuten gebildet sind.
  6. Pulsierendes Wärmerohr nach Anspruch 5, wobei der oder die Kanäle durch vier Ebenen begrenzt sind, wobei der Querschnitt eines Kanals oder mehrerer Kanäle vorteilhafterweise mindestens zwei Scheitelpunkte (A) aufweist, deren Winkel zwischen 70° und 85° liegt.
  7. Pulsierendes Wärmerohr nach Anspruch 5 oder 6, das mindestens eine andere erste Zwischenplatte mit Nuten aufweist und vorteilhafterweise mindestens eine andere zweite Zwischenplatte mit Ausschnitten aufweist, so dass die Nuten ganz oder teilweise miteinander verbunden sind.
  8. Pulsierendes Wärmerohr nach einem der Ansprüche 5, 6 und 7, der mindestens einen Wärmetauscher an dem Verdampferbereich und/oder dem Kondensatorbereich aufweist, wobei der Wärmetauscher entweder ein Wärmetauscher ist, der einen Fluidkreislauf aufweist, der in der Zwischenplatte gebildet ist und in dem ein flüssiges oder zweiphasiges Fluid zirkuliert, oder ein Heizkörper, der an mindestens einer der Endplatten angebracht ist oder direkt in mindestens einer der Endplatten gebildet ist.
  9. Pulsierendes Wärmerohr nach einem der Ansprüche 5 bis 8, das mindestens zwei Nuten mit unterschiedlicher Breite aufweist, die direkt verbunden sind.
  10. Pulsierendes Wärmerohr nach einem der Ansprüche 5 bis 8, wobei die Nuten mit den Verbindern einen Kanal bilden, der eine geschlossene Schleife bildet, wobei das Wärmerohr vorteilhafterweise so gebildet ist, dass es eine Schlangenform aufweist oder um sich selbst gewickelt ist, wobei gerade Abschnitte (D1, D8) mit Bögen (CD1, CD7) verbunden sind, wobei die ersten Enden der Nuten an einem freien Ende des Wärmerohrs und die zweiten Enden der Nuten an einem anderen freien Ende liegen.
  11. Pulsierendes Wärmerohr nach einem der Ansprüche 5 bis 9, wobei das Wärmerohr so gebildet ist, dass es eine Schlangenform aufweist oder um sich selbst gewickelt ist, wobei gerade Abschnitte (D1, D8) mit Bögen (CD1, CD7) verbunden sind, wobei die ersten Enden der Nuten an einem freien Ende des Wärmerohrs und die zweiten Enden der Nuten an einem anderen freien Ende liegen, und wobei das Wärmerohr eine einzige Zwischenplatte aufweist, in der der Verbinder und die Nuten gebildet sind.
  12. Wärmeentnahmesystem mit einem pulsierenden Wärmerohr nach Anspruch 10 oder 11, wobei das pulsierende Wärmerohr zwei Seitenkanten (B1, B2) aufweist, die aus dem Stapel der Endplatten (P202) und mindestens der ersten Zwischenplatte (P203) und mindestens der zweiten Zwischenplatte (P204) gebildet sind, und eine Wärmeleitplatte (36) aufweist, die von einer Seite mit nur einem Teil (B1) der Seitenkanten in thermischem und mechanischem Kontakt steht, wobei die andere Seite so eingerichtet ist, dass sie eine Vorrichtung aufnimmt, deren Wärme entzogen werden soll, wobei die Wärmeleitplatte (36) vorteilhafterweise in Kontakt mit allen geraden Abschnitten (D1, D8) steht.
  13. Verfahren zur Herstellung eines pulsierenden Wärmerohrs nach Anspruch 11, das Folgendes aufweist:
    a) die Bereitstellung von mindestens drei Platten,
    b) Strukturierung einer Platte so, dass parallele Nuten gebildet werden, die die gesamte Dicke der Platte durchqueren,
    c) Stapeln von Platten, so dass die strukturierte Platte Kontakt hat und zwischen den beiden anderen Platten angeordnet ist,
    d) Montage der Platten,
    e) teilweise Befüllung der Nuten mit einem Fluid.
  14. Verfahren zur Herstellung eines Thermosiphons oder eines pulsierenden Wärmerohrs nach einem der Ansprüche 1 bis 12, das Folgendes aufweist:
    a') die Bereitstellung von mindestens vier Platten,
    b') Strukturierung einer Platte so, dass parallele Nuten gebildet werden, die die gesamte Dicke der Platte durchqueren,
    c') Strukturierung einer zweiten Platte so, dass sie mindestens einen Ausschnitt bildet,
    d) Stapeln von Platten, so dass die erste Platte und die zweite Platte in Kontakt sind und zwischen den beiden anderen Platten angeordnet sind,
    e') Montage der Platten,
    f') teilweise Befüllung der Nuten mit einem Fluid.
  15. Herstellungsverfahren nach Anspruch 13 oder 14, wobei die Schritte b) oder die Schritte b') und c') durch Stanzen durchgeführt werden und/oder, wobei der Schritt d) oder e') durch Schweißen, Löten, Kleben durchgeführt wird.
  16. Herstellungsverfahren nach einem der Ansprüche 13 bis 15, wobei mindestens ein Teil der Platten aus einer ersten Aluminiumlegierung beschichtet ist, mit einer zweiten Aluminiumlegierung mit einem niedrigeren Schmelzpunkt als die erste Aluminiumlegierung beschichtet ist, und wobei die Verbindung durch eutektisches Löten hergestellt wird.
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