EP3862111A4 - Particles for joining material and production method thereof, joining paste and preparation method thereof, and production method of joined body - Google Patents

Particles for joining material and production method thereof, joining paste and preparation method thereof, and production method of joined body Download PDF

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Publication number
EP3862111A4
EP3862111A4 EP19868689.1A EP19868689A EP3862111A4 EP 3862111 A4 EP3862111 A4 EP 3862111A4 EP 19868689 A EP19868689 A EP 19868689A EP 3862111 A4 EP3862111 A4 EP 3862111A4
Authority
EP
European Patent Office
Prior art keywords
production method
joining
particles
preparation
joined body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19868689.1A
Other languages
German (de)
French (fr)
Other versions
EP3862111A1 (en
Inventor
Tomohiko Yamaguchi
Kohei OTOGAWA
Akihiro Higami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority claimed from PCT/JP2019/038945 external-priority patent/WO2020071432A1/en
Publication of EP3862111A1 publication Critical patent/EP3862111A1/en
Publication of EP3862111A4 publication Critical patent/EP3862111A4/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP19868689.1A 2018-10-04 2019-10-02 Particles for joining material and production method thereof, joining paste and preparation method thereof, and production method of joined body Pending EP3862111A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018188905 2018-10-04
JP2018245662A JP2020059914A (en) 2018-10-04 2018-12-27 Particles for joining material and production method thereof, joining paste and preparation method thereof, and production method of joined body
PCT/JP2019/038945 WO2020071432A1 (en) 2018-10-04 2019-10-02 Particles for joining material and production method thereof, joining paste and preparation method thereof, and production method of joined body

Publications (2)

Publication Number Publication Date
EP3862111A1 EP3862111A1 (en) 2021-08-11
EP3862111A4 true EP3862111A4 (en) 2022-07-13

Family

ID=70219411

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19868689.1A Pending EP3862111A4 (en) 2018-10-04 2019-10-02 Particles for joining material and production method thereof, joining paste and preparation method thereof, and production method of joined body

Country Status (5)

Country Link
EP (1) EP3862111A4 (en)
JP (1) JP2020059914A (en)
KR (1) KR20210068468A (en)
CN (1) CN112689545A (en)
TW (1) TWI819113B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7589563B2 (en) * 2021-01-19 2024-11-26 三菱マテリアル株式会社 Bonding Sheet
JP7589564B2 (en) * 2021-01-22 2024-11-26 三菱マテリアル株式会社 Bonding Sheet
JP7589567B2 (en) * 2021-01-27 2024-11-26 三菱マテリアル株式会社 Bonding Sheet
JP7711390B2 (en) * 2021-02-22 2025-07-23 三菱マテリアル株式会社 Bonding layer, bonded body, and method for producing bonded body
JP7666011B2 (en) * 2021-02-22 2025-04-22 三菱マテリアル株式会社 Bonding paste and method for manufacturing bonded body
WO2022176926A1 (en) * 2021-02-22 2022-08-25 三菱マテリアル株式会社 Bonding paste, bonded layer, bonded body, and method for producing bonded body
JP7121884B1 (en) 2021-03-29 2022-08-19 三菱マテリアル株式会社 Copper particles and method for producing the same
US12424552B2 (en) 2021-09-24 2025-09-23 Nanya Technology Corporation Semiconductor structure and method of manufacturing thereof
JP2023098495A (en) * 2021-12-28 2023-07-10 三菱マテリアル株式会社 Bonding sheet, method for manufacturing bonding sheet, and method for manufacturing bonded body
JP2024012999A (en) * 2022-07-19 2024-01-31 三菱マテリアル株式会社 Copper particles and method for producing copper particles

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5850047A (en) * 1996-03-11 1998-12-15 Murata Manufacturing Co., Ltd. Production of copper powder
US20130177471A1 (en) * 2010-09-30 2013-07-11 Dowa Electronics Materials Co., Ltd. Copper powder for conductive paste and method for producing same
JP2018131665A (en) * 2017-02-16 2018-08-23 住友金属鉱山株式会社 Nickel-coated copper powder, method for producing the same, and conductive paste

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227828B2 (en) 1971-11-22 1977-07-22
JP4164009B2 (en) 2003-08-13 2008-10-08 石原産業株式会社 Copper powder, copper paste and paint using the same, electrode
JP4821396B2 (en) 2006-03-27 2011-11-24 住友金属鉱山株式会社 Conductive composition and method for forming conductive film
JPWO2012077548A1 (en) * 2010-12-10 2014-05-19 旭硝子株式会社 Conductive paste, base material with conductive film using the same, and method for producing base material with conductive film
WO2014042227A1 (en) * 2012-09-12 2014-03-20 エム・テクニック株式会社 Method for manufacturing metal microparticles
JP6428339B2 (en) * 2015-02-13 2018-11-28 三菱マテリアル株式会社 Silver powder and paste-like composition and method for producing silver powder
JP6656869B2 (en) * 2015-10-06 2020-03-04 国立大学法人東北大学 Method for producing copper nanoparticles
JP6839568B2 (en) * 2016-03-31 2021-03-10 古河電気工業株式会社 Dispersion solution of copper fine particle aggregate, method for manufacturing sintered conductor, and method for manufacturing sintered conductive bonding member
JP6857453B2 (en) * 2016-05-20 2021-04-14 京セラ株式会社 Manufacturing method of copper fine particles, copper fine particles, paste composition, semiconductor devices and electrical / electronic parts

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5850047A (en) * 1996-03-11 1998-12-15 Murata Manufacturing Co., Ltd. Production of copper powder
US20130177471A1 (en) * 2010-09-30 2013-07-11 Dowa Electronics Materials Co., Ltd. Copper powder for conductive paste and method for producing same
JP2018131665A (en) * 2017-02-16 2018-08-23 住友金属鉱山株式会社 Nickel-coated copper powder, method for producing the same, and conductive paste

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DENG DUNYING ET AL: "Copper Nanoparticles: Aqueous Phase Synthesis and Conductive Films Fabrication at Low Sintering Temperature", APPLIED MATERIALS & INTERFACES, vol. 5, no. 9, 23 April 2013 (2013-04-23), US, pages 3839 - 3846, XP055927598, ISSN: 1944-8244, DOI: 10.1021/am400480k *
See also references of WO2020071432A1 *

Also Published As

Publication number Publication date
TW202033779A (en) 2020-09-16
EP3862111A1 (en) 2021-08-11
KR20210068468A (en) 2021-06-09
JP2020059914A (en) 2020-04-16
CN112689545A (en) 2021-04-20
TWI819113B (en) 2023-10-21

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