EP3929966A4 - CLEANING LIQUID FOR CERIUM COMPOUND REMOVAL, METHOD FOR CLEANING, AND METHOD FOR FABRICATING SEMICONDUCTOR WAFER - Google Patents

CLEANING LIQUID FOR CERIUM COMPOUND REMOVAL, METHOD FOR CLEANING, AND METHOD FOR FABRICATING SEMICONDUCTOR WAFER Download PDF

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Publication number
EP3929966A4
EP3929966A4 EP20759018.3A EP20759018A EP3929966A4 EP 3929966 A4 EP3929966 A4 EP 3929966A4 EP 20759018 A EP20759018 A EP 20759018A EP 3929966 A4 EP3929966 A4 EP 3929966A4
Authority
EP
European Patent Office
Prior art keywords
cleaning
semiconductor wafer
fabricating semiconductor
cerium compound
compound removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20759018.3A
Other languages
German (de)
French (fr)
Other versions
EP3929966A1 (en
Inventor
Tomohiro Kusano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of EP3929966A1 publication Critical patent/EP3929966A1/en
Publication of EP3929966A4 publication Critical patent/EP3929966A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3245—Aminoacids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/237—Cleaning during device manufacture during, before or after processing of insulating materials the processing being a planarisation of insulating layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0047—Other compounding ingredients characterised by their effect pH regulated compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2096—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/33—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/267—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Detergent Compositions (AREA)
EP20759018.3A 2019-02-19 2020-02-17 CLEANING LIQUID FOR CERIUM COMPOUND REMOVAL, METHOD FOR CLEANING, AND METHOD FOR FABRICATING SEMICONDUCTOR WAFER Pending EP3929966A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019027048 2019-02-19
PCT/JP2020/005988 WO2020171003A1 (en) 2019-02-19 2020-02-17 Cleaning liquid for removing cerium compounds, cleaning method, and method for producing semiconductor wafer

Publications (2)

Publication Number Publication Date
EP3929966A1 EP3929966A1 (en) 2021-12-29
EP3929966A4 true EP3929966A4 (en) 2022-04-06

Family

ID=72143540

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20759018.3A Pending EP3929966A4 (en) 2019-02-19 2020-02-17 CLEANING LIQUID FOR CERIUM COMPOUND REMOVAL, METHOD FOR CLEANING, AND METHOD FOR FABRICATING SEMICONDUCTOR WAFER

Country Status (7)

Country Link
US (1) US12378504B2 (en)
EP (1) EP3929966A4 (en)
JP (1) JP7544027B2 (en)
KR (1) KR102881892B1 (en)
CN (1) CN113424301A (en)
TW (1) TWI896530B (en)
WO (1) WO2020171003A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999060448A1 (en) * 1998-05-18 1999-11-25 Mallinckrodt Inc. Silicate-containing alkaline compositions for cleaning microelectronic substrates
JP2012072267A (en) * 2010-09-28 2012-04-12 Sanyo Chem Ind Ltd Detergent for electronic material
JP2012117057A (en) * 2010-11-12 2012-06-21 Sanyo Chem Ind Ltd Cleaning agent for electronic material
US20140107008A1 (en) * 2012-10-16 2014-04-17 Uwiz Technology Co., Ltd. Cleaning composition and cleaning method using the same
US20140264151A1 (en) * 2013-03-15 2014-09-18 Cabot Microelectronics Corporation Aqueous cleaning composition for post copper chemical mechanical planarization
US20140308819A1 (en) * 2011-12-27 2014-10-16 Fujifilm Corporation Method of producing semiconductor substrate product, and etching method to be used therein

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5091373B2 (en) * 1999-12-15 2012-12-05 株式会社日本触媒 Water-absorbent resin composition, method for producing the same, and absorbent article
JP5428200B2 (en) * 2007-05-18 2014-02-26 三菱化学株式会社 Semiconductor device substrate cleaning liquid, semiconductor device substrate cleaning method, and semiconductor device substrate manufacturing method
JP5417095B2 (en) 2009-09-09 2014-02-12 ライオン株式会社 Cleaning composition and method for cleaning glass hard disk substrate
WO2015156171A1 (en) * 2014-04-10 2015-10-15 三菱瓦斯化学株式会社 Liquid composition for semiconductor element cleaning and method for cleaning semiconductor element
JP6641951B2 (en) 2015-12-07 2020-02-05 日立化成株式会社 Cleaning liquid and cleaning method
KR20190094426A (en) * 2017-01-18 2019-08-13 엔테그리스, 아이엔씨. Compositions and Methods for Removing Ceria Particles from a Surface
JP6704879B2 (en) 2017-07-26 2020-06-03 日立建機株式会社 Construction machinery

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999060448A1 (en) * 1998-05-18 1999-11-25 Mallinckrodt Inc. Silicate-containing alkaline compositions for cleaning microelectronic substrates
JP2012072267A (en) * 2010-09-28 2012-04-12 Sanyo Chem Ind Ltd Detergent for electronic material
JP2012117057A (en) * 2010-11-12 2012-06-21 Sanyo Chem Ind Ltd Cleaning agent for electronic material
US20140308819A1 (en) * 2011-12-27 2014-10-16 Fujifilm Corporation Method of producing semiconductor substrate product, and etching method to be used therein
US20140107008A1 (en) * 2012-10-16 2014-04-17 Uwiz Technology Co., Ltd. Cleaning composition and cleaning method using the same
US20140264151A1 (en) * 2013-03-15 2014-09-18 Cabot Microelectronics Corporation Aqueous cleaning composition for post copper chemical mechanical planarization

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020171003A1 *

Also Published As

Publication number Publication date
JP7544027B2 (en) 2024-09-03
EP3929966A1 (en) 2021-12-29
KR20210129049A (en) 2021-10-27
KR102881892B1 (en) 2025-11-05
CN113424301A (en) 2021-09-21
JPWO2020171003A1 (en) 2020-08-27
WO2020171003A1 (en) 2020-08-27
US20210371776A1 (en) 2021-12-02
TW202041665A (en) 2020-11-16
TWI896530B (en) 2025-09-11
US12378504B2 (en) 2025-08-05

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