EP4207953A4 - Leiterplattenanordnung und elektronische vorrichtung - Google Patents

Leiterplattenanordnung und elektronische vorrichtung Download PDF

Info

Publication number
EP4207953A4
EP4207953A4 EP21874196.5A EP21874196A EP4207953A4 EP 4207953 A4 EP4207953 A4 EP 4207953A4 EP 21874196 A EP21874196 A EP 21874196A EP 4207953 A4 EP4207953 A4 EP 4207953A4
Authority
EP
European Patent Office
Prior art keywords
electronic device
circuit board
printed circuit
device assembly
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21874196.5A
Other languages
English (en)
French (fr)
Other versions
EP4207953A1 (de
Inventor
Hongbin Shi
Xin Guo
Lixiang Wang
Haisheng TU
Benyin ZHENG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP4207953A1 publication Critical patent/EP4207953A1/de
Publication of EP4207953A4 publication Critical patent/EP4207953A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)
EP21874196.5A 2020-09-30 2021-09-07 Leiterplattenanordnung und elektronische vorrichtung Pending EP4207953A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202022224031.9U CN213662046U (zh) 2020-09-30 2020-09-30 电路板组件和电子设备
PCT/CN2021/116854 WO2022068535A1 (zh) 2020-09-30 2021-09-07 电路板组件和电子设备

Publications (2)

Publication Number Publication Date
EP4207953A1 EP4207953A1 (de) 2023-07-05
EP4207953A4 true EP4207953A4 (de) 2024-03-20

Family

ID=76701272

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21874196.5A Pending EP4207953A4 (de) 2020-09-30 2021-09-07 Leiterplattenanordnung und elektronische vorrichtung

Country Status (4)

Country Link
US (1) US12369249B2 (de)
EP (1) EP4207953A4 (de)
CN (1) CN213662046U (de)
WO (1) WO2022068535A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN213662046U (zh) * 2020-09-30 2021-07-09 华为技术有限公司 电路板组件和电子设备
CN222395869U (zh) * 2024-03-28 2025-01-24 荣耀终端有限公司 电路板组件和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02181305A (ja) * 1988-12-29 1990-07-16 Tatsuta Electric Wire & Cable Co Ltd 電磁波シールド付テープ状電線
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
US6531662B1 (en) * 1999-04-22 2003-03-11 Rohm Co., Ltd. Circuit board, battery pack, and method of manufacturing circuit board
US20100051334A1 (en) * 2008-09-03 2010-03-04 Nitto Denko Corporation Printed Circuit Board and Method of Manufacturing the Same
WO2019172719A1 (ko) * 2018-03-08 2019-09-12 삼성전자 주식회사 배선을 전기적으로 연결하는 도전성 구조물을 포함하는 회로 기판 및 이를 포함하는 전자 장치

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5263868A (en) * 1993-03-08 1993-11-23 The Whitaker Corporation Flexible circuit interface for coplanar printed circuit boards
JP2002216873A (ja) 2001-01-23 2002-08-02 Pfu Ltd ケーブルのシールド接続構造
WO2004066697A1 (ja) * 2003-01-20 2004-08-05 Fujikura Ltd. 多層配線板およびその製造方法
US9325043B2 (en) * 2013-07-26 2016-04-26 Alcatel-Lucent Shanghai Bell Co., Ltd. Phase shifting circuit including an elongated conductive path covered by a metal sheet having stand-off feet and also including a slidable tuning member
CN106061224B (zh) 2016-07-28 2019-03-01 Oppo广东移动通信有限公司 移动终端
US9848493B1 (en) * 2016-12-09 2017-12-19 Foxconn Interconnect Technology Limited Printed circuit board having improved high speed transmission lines
CN206423039U (zh) 2017-01-19 2017-08-18 重庆博澳特智能科技有限公司 散热式手机主板
JP6513134B2 (ja) * 2017-05-26 2019-05-15 レノボ・シンガポール・プライベート・リミテッド ケーブル接続構造及びケーブル接続方法
KR102669080B1 (ko) * 2019-02-12 2024-05-24 삼성디스플레이 주식회사 라이너 및 그를 포함하는 표시 장치
JP7297611B2 (ja) * 2019-09-10 2023-06-26 日本航空電子工業株式会社 電気中継部材
CN213662046U (zh) 2020-09-30 2021-07-09 华为技术有限公司 电路板组件和电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02181305A (ja) * 1988-12-29 1990-07-16 Tatsuta Electric Wire & Cable Co Ltd 電磁波シールド付テープ状電線
DE4425803A1 (de) * 1993-08-11 1995-02-16 Siemens Ag Oesterreich Leiterplatte
US6531662B1 (en) * 1999-04-22 2003-03-11 Rohm Co., Ltd. Circuit board, battery pack, and method of manufacturing circuit board
US20100051334A1 (en) * 2008-09-03 2010-03-04 Nitto Denko Corporation Printed Circuit Board and Method of Manufacturing the Same
WO2019172719A1 (ko) * 2018-03-08 2019-09-12 삼성전자 주식회사 배선을 전기적으로 연결하는 도전성 구조물을 포함하는 회로 기판 및 이를 포함하는 전자 장치

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2022068535A1 *

Also Published As

Publication number Publication date
WO2022068535A1 (zh) 2022-04-07
CN213662046U (zh) 2021-07-09
US20230363087A1 (en) 2023-11-09
EP4207953A1 (de) 2023-07-05
US12369249B2 (en) 2025-07-22

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