ES378639A1 - Procedure for the manufacture of printed circuits. (Machine-translation by Google Translate, not legally binding) - Google Patents
Procedure for the manufacture of printed circuits. (Machine-translation by Google Translate, not legally binding)Info
- Publication number
- ES378639A1 ES378639A1 ES378639A ES378639A ES378639A1 ES 378639 A1 ES378639 A1 ES 378639A1 ES 378639 A ES378639 A ES 378639A ES 378639 A ES378639 A ES 378639A ES 378639 A1 ES378639 A1 ES 378639A1
- Authority
- ES
- Spain
- Prior art keywords
- translation
- manufacture
- machine
- legally binding
- google translate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000003989 dielectric material Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 238000005496 tempering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
Process for the manufacture of printed circuits, characterized by establishing a plate-support for the circuit made of dielectric material, preferably vitrified steel, whose plate is subjected to an operation of tempering, heating or using another means capable of determining on the surface a nature pasty and to some extent adhesive. (Machine-translation by Google Translate, not legally binding)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES378639A ES378639A1 (en) | 1970-04-15 | 1970-04-15 | Procedure for the manufacture of printed circuits. (Machine-translation by Google Translate, not legally binding) |
| FR7018514A FR2048627A5 (en) | 1970-04-15 | 1970-05-21 | Printed circuit prodn |
| NL7100315A NL7100315A (en) | 1970-04-15 | 1971-01-11 | |
| BE762051A BE762051A (en) | 1970-04-15 | 1971-01-26 | PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUITS |
| FR7111232A FR2092541A5 (en) | 1970-04-15 | 1971-03-31 | |
| DE19712117426 DE2117426A1 (en) | 1970-04-15 | 1971-04-08 | Method and apparatus for the manufacture of printed circuits |
| AR255545A AR203656Q (en) | 1970-04-15 | 1974-09-11 | PROCEDURE FOR THE MANUFACTURE OF PRINTED ELECTRICAL CIRCUITS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES378639A ES378639A1 (en) | 1970-04-15 | 1970-04-15 | Procedure for the manufacture of printed circuits. (Machine-translation by Google Translate, not legally binding) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES378639A1 true ES378639A1 (en) | 1970-08-16 |
Family
ID=8455657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES378639A Expired ES378639A1 (en) | 1970-04-15 | 1970-04-15 | Procedure for the manufacture of printed circuits. (Machine-translation by Google Translate, not legally binding) |
Country Status (6)
| Country | Link |
|---|---|
| AR (1) | AR203656Q (en) |
| BE (1) | BE762051A (en) |
| DE (1) | DE2117426A1 (en) |
| ES (1) | ES378639A1 (en) |
| FR (2) | FR2048627A5 (en) |
| NL (1) | NL7100315A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4256796A (en) * | 1979-11-05 | 1981-03-17 | Rca Corporation | Partially devitrified porcelain composition and articles prepared with same |
-
1970
- 1970-04-15 ES ES378639A patent/ES378639A1/en not_active Expired
- 1970-05-21 FR FR7018514A patent/FR2048627A5/en not_active Expired
-
1971
- 1971-01-11 NL NL7100315A patent/NL7100315A/xx unknown
- 1971-01-26 BE BE762051A patent/BE762051A/en unknown
- 1971-03-31 FR FR7111232A patent/FR2092541A5/fr not_active Expired
- 1971-04-08 DE DE19712117426 patent/DE2117426A1/en active Pending
-
1974
- 1974-09-11 AR AR255545A patent/AR203656Q/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AR203656Q (en) | 1975-09-30 |
| NL7100315A (en) | 1971-10-19 |
| DE2117426A1 (en) | 1971-10-28 |
| FR2092541A5 (en) | 1972-01-21 |
| BE762051A (en) | 1971-07-01 |
| FR2048627A5 (en) | 1971-03-19 |
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