FR2448276A1 - Ensemble dissipateur de chaleur, notamment pour circuits imprimes - Google Patents

Ensemble dissipateur de chaleur, notamment pour circuits imprimes

Info

Publication number
FR2448276A1
FR2448276A1 FR8001955A FR8001955A FR2448276A1 FR 2448276 A1 FR2448276 A1 FR 2448276A1 FR 8001955 A FR8001955 A FR 8001955A FR 8001955 A FR8001955 A FR 8001955A FR 2448276 A1 FR2448276 A1 FR 2448276A1
Authority
FR
France
Prior art keywords
printed circuits
heat dissipator
dissipator assembly
rod
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8001955A
Other languages
English (en)
Other versions
FR2448276B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermalloy Inc
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of FR2448276A1 publication Critical patent/FR2448276A1/fr
Application granted granted Critical
Publication of FR2448276B1 publication Critical patent/FR2448276B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

ENSEMBLE DISSIPATEUR DE CHALEUR, COMPRENANT UN DISSIPATEUR DE CHALEUR PROPREMENT DIT PRESENTANT UNE PORTION DE BASE PRATIQUEMENT PLANE, CARACTERISE EN CE QU'IL COMPORTE EN OUTRE AU MOINS UN GOUJON DE MONTAGE 20 CONSTITUE PAR UNE TIGE ALLONGEE AVEC UNE PORTION 21 DE PLUS GRAND RAYON PREVUE ENTRE LES EXTREMITES DE CETTE TIGE, UNE PORTION D'EXTREMITE DE CETTE TIGE S'ETENDANT A TRAVERS UN TROU 25 MENAGE DANS LA PORTION DE BASE PLATE ET L'AUTRE PORTION D'EXTREMITE 23, 42 DE LADITE TIGE ETANT ETAMEE.
FR8001955A 1979-01-31 1980-01-30 Ensemble dissipateur de chaleur, notamment pour circuits imprimes Expired FR2448276B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US803279A 1979-01-31 1979-01-31
US9328179A 1979-11-13 1979-11-13

Publications (2)

Publication Number Publication Date
FR2448276A1 true FR2448276A1 (fr) 1980-08-29
FR2448276B1 FR2448276B1 (fr) 1985-05-31

Family

ID=26677674

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8001955A Expired FR2448276B1 (fr) 1979-01-31 1980-01-30 Ensemble dissipateur de chaleur, notamment pour circuits imprimes

Country Status (5)

Country Link
EP (1) EP0014558B1 (fr)
CA (1) CA1130466A (fr)
DE (1) DE3067404D1 (fr)
FR (1) FR2448276B1 (fr)
GB (1) GB2042260B (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5991154A (en) * 1997-10-07 1999-11-23 Thermalloy, Inc. Attachment of electronic device packages to heat sinks

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3859570A (en) * 1973-02-20 1975-01-07 Bose Corp Power transistor mounting
DE2601035A1 (de) * 1976-01-13 1977-07-21 Bosch Gmbh Robert Elektrische schaltungsanordnung
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus

Also Published As

Publication number Publication date
GB2042260A (en) 1980-09-17
EP0014558A1 (fr) 1980-08-20
DE3067404D1 (en) 1984-05-17
CA1130466A (fr) 1982-08-24
EP0014558B1 (fr) 1984-04-11
GB2042260B (en) 1983-02-09
FR2448276B1 (fr) 1985-05-31

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Legal Events

Date Code Title Description
ST Notification of lapse