FR2872823B1 - Composition de polissage mecano chimique, procede de preparation, et utilisation - Google Patents
Composition de polissage mecano chimique, procede de preparation, et utilisationInfo
- Publication number
- FR2872823B1 FR2872823B1 FR0407653A FR0407653A FR2872823B1 FR 2872823 B1 FR2872823 B1 FR 2872823B1 FR 0407653 A FR0407653 A FR 0407653A FR 0407653 A FR0407653 A FR 0407653A FR 2872823 B1 FR2872823 B1 FR 2872823B1
- Authority
- FR
- France
- Prior art keywords
- mecano
- chemical
- preparation
- polishing composition
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0407653A FR2872823B1 (fr) | 2004-07-08 | 2004-07-08 | Composition de polissage mecano chimique, procede de preparation, et utilisation |
| PCT/FR2005/001641 WO2006016030A1 (fr) | 2004-07-08 | 2005-06-28 | Composition de polissage mecano chimique, procede de preparation et utilisation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0407653A FR2872823B1 (fr) | 2004-07-08 | 2004-07-08 | Composition de polissage mecano chimique, procede de preparation, et utilisation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2872823A1 FR2872823A1 (fr) | 2006-01-13 |
| FR2872823B1 true FR2872823B1 (fr) | 2006-10-06 |
Family
ID=34946735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0407653A Expired - Fee Related FR2872823B1 (fr) | 2004-07-08 | 2004-07-08 | Composition de polissage mecano chimique, procede de preparation, et utilisation |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2872823B1 (fr) |
| WO (1) | WO2006016030A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY142433A (en) * | 2007-09-14 | 2010-11-30 | Frazer Internat Sdn Bhd De | Paper pallets |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
| US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
| US6294105B1 (en) * | 1997-12-23 | 2001-09-25 | International Business Machines Corporation | Chemical mechanical polishing slurry and method for polishing metal/oxide layers |
| US6582623B1 (en) * | 1999-07-07 | 2003-06-24 | Cabot Microelectronics Corporation | CMP composition containing silane modified abrasive particles |
-
2004
- 2004-07-08 FR FR0407653A patent/FR2872823B1/fr not_active Expired - Fee Related
-
2005
- 2005-06-28 WO PCT/FR2005/001641 patent/WO2006016030A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| FR2872823A1 (fr) | 2006-01-13 |
| WO2006016030A1 (fr) | 2006-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20160331 |