FR3080219B1 - Dispositif electronique comprenant des puces electroniques - Google Patents

Dispositif electronique comprenant des puces electroniques Download PDF

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Publication number
FR3080219B1
FR3080219B1 FR1853230A FR1853230A FR3080219B1 FR 3080219 B1 FR3080219 B1 FR 3080219B1 FR 1853230 A FR1853230 A FR 1853230A FR 1853230 A FR1853230 A FR 1853230A FR 3080219 B1 FR3080219 B1 FR 3080219B1
Authority
FR
France
Prior art keywords
electronic
device including
electronic device
chips
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1853230A
Other languages
English (en)
Other versions
FR3080219A1 (fr
Inventor
Romain Coffy
Laurent Herard
David Gani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Grenoble 2 SAS
STMicroelectronics Asia Pacific Pte Ltd
STMicroelectronics Pte Ltd
Original Assignee
STMicroelectronics Grenoble 2 SAS
STMicroelectronics Asia Pacific Pte Ltd
STMicroelectronics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Grenoble 2 SAS, STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics Pte Ltd filed Critical STMicroelectronics Grenoble 2 SAS
Priority to FR1853230A priority Critical patent/FR3080219B1/fr
Priority to US16/378,153 priority patent/US20190319157A1/en
Priority to CN201910293064.8A priority patent/CN110379803A/zh
Priority to CN201920492749.0U priority patent/CN210073843U/zh
Publication of FR3080219A1 publication Critical patent/FR3080219A1/fr
Application granted granted Critical
Publication of FR3080219B1 publication Critical patent/FR3080219B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/18—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)

Abstract

Dispositif électronique comprenant une plaque de support (2) présentant une face arrière (3) et une face avant (4) et pourvue d'un réseau de connexions électriques (5), d'une face à l'autre, une première puce électronique (6) montée au-dessus de la face avant (4) de la plaque de support et présentant une ouverture (10) traversante d'une face à l'autre, et une deuxième puce électronique (11) située au moins en partie dans ladite ouverture (10) et montée au-dessus de la face avant (8) de la plaque de support (2).
FR1853230A 2018-04-13 2018-04-13 Dispositif electronique comprenant des puces electroniques Active FR3080219B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1853230A FR3080219B1 (fr) 2018-04-13 2018-04-13 Dispositif electronique comprenant des puces electroniques
US16/378,153 US20190319157A1 (en) 2018-04-13 2019-04-08 Electronic device comprising electronic chips
CN201910293064.8A CN110379803A (zh) 2018-04-13 2019-04-12 包括电子芯片的电子设备
CN201920492749.0U CN210073843U (zh) 2018-04-13 2019-04-12 电子设备

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1853230 2018-04-13
FR1853230A FR3080219B1 (fr) 2018-04-13 2018-04-13 Dispositif electronique comprenant des puces electroniques

Publications (2)

Publication Number Publication Date
FR3080219A1 FR3080219A1 (fr) 2019-10-18
FR3080219B1 true FR3080219B1 (fr) 2021-03-05

Family

ID=62751113

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1853230A Active FR3080219B1 (fr) 2018-04-13 2018-04-13 Dispositif electronique comprenant des puces electroniques

Country Status (3)

Country Link
US (1) US20190319157A1 (fr)
CN (2) CN210073843U (fr)
FR (1) FR3080219B1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3080219B1 (fr) * 2018-04-13 2021-03-05 St Microelectronics Grenoble 2 Dispositif electronique comprenant des puces electroniques
US11740071B2 (en) 2018-12-21 2023-08-29 Apple Inc. Optical interferometry proximity sensor with temperature variation compensation
US11243068B1 (en) 2019-02-28 2022-02-08 Apple Inc. Configuration and operation of array of self-mixing interferometry sensors
US11156456B2 (en) 2019-05-21 2021-10-26 Apple Inc. Optical proximity sensor integrated into a camera module for an electronic device
US11473898B2 (en) 2019-05-24 2022-10-18 Apple Inc. Wearable voice-induced vibration or silent gesture sensor
US11150332B1 (en) * 2020-06-30 2021-10-19 Apple Inc. Self-calibrating optical transceiver system with reduced crosstalk sensitivity for through-display proximity sensing
US11874110B2 (en) 2020-09-25 2024-01-16 Apple Inc. Self-mixing interferometry device configured for non-reciprocal sensing
US11629948B2 (en) 2021-02-04 2023-04-18 Apple Inc. Optical interferometry proximity sensor with optical path extender
US12209890B2 (en) 2022-03-31 2025-01-28 Apple Inc. Optical sensor module including an interferometric sensor and extended depth of focus optics

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9165833B2 (en) * 2010-01-18 2015-10-20 Semiconductor Components Industries, Llc Method of forming a semiconductor die
FR2977715A1 (fr) * 2011-07-08 2013-01-11 St Microelectronics Grenoble 2 Boitier electronique optique
KR101801945B1 (ko) * 2011-08-09 2017-11-28 에스케이하이닉스 주식회사 반도체 칩 및 이를 갖는 반도체 패키지
TWI521671B (zh) * 2013-07-25 2016-02-11 菱生精密工業股份有限公司 The package structure of the optical module
US9525094B2 (en) * 2015-03-27 2016-12-20 Stmicroelectronics (Grenoble 2) Sas Proximity and ranging sensor
US10061057B2 (en) * 2015-08-21 2018-08-28 Stmicroelectronics (Research & Development) Limited Molded range and proximity sensor with optical resin lens
CN106653741B (zh) * 2015-11-02 2020-03-24 意法半导体有限公司 邻近传感器、电子设备以及制造邻近传感器的方法
US10203398B2 (en) * 2016-05-04 2019-02-12 Ting-Yi Chen Optical proximity sensor and manufacturing method thereof
US9911890B2 (en) * 2016-06-30 2018-03-06 Stmicroelectronics Pte Ltd Optical sensor package including a cavity formed in an image sensor die
CN107785357B (zh) * 2016-08-26 2025-04-08 意法半导体研发(深圳)有限公司 用于光学传感器封装体的防粘胶溢出帽盖
FR3080219B1 (fr) * 2018-04-13 2021-03-05 St Microelectronics Grenoble 2 Dispositif electronique comprenant des puces electroniques

Also Published As

Publication number Publication date
CN210073843U (zh) 2020-02-14
US20190319157A1 (en) 2019-10-17
CN110379803A (zh) 2019-10-25
FR3080219A1 (fr) 2019-10-18

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