IL305596A - Wireless cargo-sensing systems and methods of using the same - Google Patents

Description

WIRELESS CARGO-SENSING SYSTEMS AND METHODS OF USING THE SAME TECHNICAL FIELD Aspects of the present disclosure relate generally to asset management, and more specifically to wireless cargo sensors, wireless cargo-sensing units, cargo-sensing systems, in particular temperature and humidity and methods of using the same.

BACKGROUND Accurate measurement of temperature and humidity is essential in a wide range of industries, from agriculture and food processing to healthcare and manufacturing. Traditional temperature and humidity sensors often fall short when it comes to providing precise and reliable measurements, especially in challenging environments. Furthermore, prior art temperature and humidity sensors fall short in complying with the European cold chain EN12830 requirements, including the required response time.

Cold chain is defined (Wikipedia) as: the series of actions and equipment applied to maintain a product within a specified low-temperature range from harvest/production to consumption. An unbroken cold chain is an uninterrupted sequence of refrigerated production, enclosed storage and distribution activities, along with associated equipment and logistics, which maintain a desired low-temperature interval to keep the safety and quality of perishable or sensitive products, such as foods and medicines. Therefore, fast response time of the measuring sensors is required. In other words, the term denotes a low temperature-controlled supply chain network used to ensure and extend the shelf life of such products (for example, fresh agricultural produce, seafood, frozen food, photographic film, chemicals, and pharmaceutical products).

Unlike other cargo goods or merchandise, cold chain goods are perishable and always enroute towards end use or destination, even when held temporarily in cold stores and hence commonly referred to as "cargo" during its entire logistics cycle. Adequate cold storage, in particular, can be crucial to prevent quantitative and qualitative food losses. Therefore, frequent and precise measurements of temperature and humidity are required.

Typically, a sensor unit assembly includes a temperature sensor and humidity sensor that are exposed to the inner, sealed refrigerated space, and at least one electronic processing unit assembly that receives the sensors measurements in order to process and analyze these measurements.

Typically, the processing unit assembly includes a battery and is situated outside the inner (humid), sealed refrigerated space, and is wirely interconnected with the temperature and humidity sensors. As such, the response time is affected, and does not complying with the European cold chain EN12830 requirements.

Fast response time of temperature and humidity sensors is critical for the market of food or pharma goods delivery. For food transportation or storage, there are dedicated standard requirements, such as EN12830 and EN13485, which define the temperature sensor response time. According to these standards, external sensors must be able to detect temperature changes of ±20 degrees Celsius within less than 5 minutes.

Additionally, the pharma industry requires sensors to be able to stabilize with humidity changes of 20% humidity within 30 minutes. The cargo-sensing unit may be installed in transportable reefers, wherein the reefer size may reach, with no limitations, 52 feet, and is typically made of metallic parts.

Most sensors available in the market today comply with some parts of the above requirements, as it is challenging to provide a product that can meet all of them simultaneously. For example, there are wireless sensors that have humidity and temperature sensors, but they cannot comply with the fast response time regulations. On the other hand, there are wireless sensors that do meet the fast response time requirements but are built from separate components: a wired temperature sensor only and a communication box.

Thus, there is a need for systems and methods for overcoming the deficiencies of the conventional manner for wireless cargo-sensors and cargo-sensing units that have humidity and temperature sensors, but they cannot comply with the fast response time regulations. And thus, provide effective alternatives without added installation complexity, and providing robust field performance, for the life of the cargo-sensing unit.

SUMMARY It is the intention of the present invention to provide a wireless temperature and humidity cargo-sensing unit, having a high ingress rate (such as IP67), and configured to comply with the European cold chain EN12830 requirements, as well as the EN134requirements, and thereby also provides prolonged dust and waterproof.

Fast response time of temperature and humidity sensors is critical for the market of food or pharma goods delivery. For food transportation or storage, there are dedicated standard requirements, such as EN12830 and EN13485, which, among other things, define the temperature sensor response time. According to these standards, external sensors must be able to detect temperature changes of ±20 degrees Celsius within less than 5 minutes.

Additionally, the pharma industry requires sensors to be able to stabilize with humidity changes of 20% humidity within 30 minutes.

Accordingly, the embodiments described herein provide improved cargo-sensing systems that comply with the EN12830 and EN13485 response time of temperature and humidity requirements.

According to embodiments of the present disclosure there is provided a cargo-sensing unit including: an electronic board, having a dry-sealed section and a temperature and humidity section, wherein said temperature and humidity section comprises: a temperature sensor; and a humidity sensor, wherein said dry-sealed section comprises: at said least one processor; a communicator; and a memory having stored thereon computer program code that, when executed by said processor, controls said processor to: instruct said temperature sensor to capture a temperature sample of the cargo space within a cargo reefer; instruct said humidity sensor to capture a humidity sample of the cargo space within a cargo reefer; and instruct said processor to transmit said temperature sample and said humidity sample to a target preconfigured control unit.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate one or more embodiments and/or aspects of the disclosure and, together with the written description, serve to explain the principles of the disclosure. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment, and wherein: Fig. 1 is a block diagram of a wireless cargo-sensing system, according to an example embodiment of the present disclosure.

Fig. 2 illustrates an example global cloud-based management system, according to an example embodiment of the present disclosure.

Fig. 3a illustrates a bottom view of an example cargo-sensing system, according to some embodiments of the present disclosure.

Fig. 3b illustrates a bottom perspective view of the example shown in Fig. 3a, wherein an example cargo-sensing casing device and inner sensing and processing device, shown side by side, revealing an example PCBA device, according to an example embodiment of the present disclosure.

Fig. 3c illustrates an elevated perspective view of the showing the example PCBA device of the example shown in Fig. 3b, according to some embodiments of the present disclosure.

Fig. 4 illustrates the inner sensing and processing device of the example shown in Fig. 3c is subdivided into an electronics accommodation compartment, that is a dry-sealed section, and an open temperature and humidity compartment, according to an example embodiment of the present disclosure.

Fig. 5a illustrates a first face of the PCBA device, that is shown with no limitations as a bottom face, according to some embodiments of the present invention.

Fig. 5b illustrates the inner sensing and processing device of the example shown in Fig. 3b.

Fig. 5c illustrates an elevated, side perspective view of front barrier wall that sealingly separates the open temperature and humidity compartment from the electronics accommodation compartment, according to some embodiments of the present invention.

Fig. 6a is a front elevated perspective view of the sensors-casing device, according to some embodiments of the present invention.

Fig. 6b is a rear elevated perspective view of the sensors-casing device, according to some embodiments of the present invention.

Fig. 6c is a front elevated perspective, cross section AA’ view of the sensors-casing device, according to some embodiments of the present invention.

Fig. 6d is a rear elevated perspective, cross section AA’ view of the sensors-casing device, according to some embodiments of the present invention.

Fig. 6e is a top view of the sensors-casing device, according to some embodiments of the present invention.

Fig. 6f is a bottom view of the sensors-casing device, according to some embodiments of the present invention.

DETAILED DESCRIPTION The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the disclosure are shown. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided, so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. An embodiment is an example or implementation of the disclosures described herein. The various appearances of "one embodiment," "an embodiment", "example embodiment," "some embodiments," "certain embodiments," "various embodiments," etc., do not necessarily all refer to the same embodiment. Although various features of the disclosure may be described in the context of a single embodiment, the features may also be provided separately or in any suitable combination. Conversely, although the disclosure may be described herein in the context of separate embodiments for clarity, the disclosure may also be implemented in a single embodiment. Reference in the specification to "one embodiment", "an embodiment", "some embodiments" or "other embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiments is included in at least one embodiment, but not necessarily all embodiments, of the disclosures. It is understood that the phraseology and terminology employed herein are not to be construed as limiting and are for descriptive purposes only. Meanings of technical and scientific terms used herein are to be commonly understood as to which the disclosure belongs, unless otherwise defined. The present disclosure can be implemented in the testing or practice with methods and materials equivalent or similar to those described herein.

The present disclosure can be understood more readily by reference to the following detailed description of one or more example embodiments and the examples included herein. It is to be understood that embodiments are not limited to the example embodiments described within this disclosure. Numerous modifications and variations therein will be apparent to those skilled in the art and remain within the scope of the disclosure. It is also to be understood that the terminology used herein is for describing specific example embodiments only and is not intended to be limiting. Some example embodiments of the disclosed technology will be described more fully hereinafter with reference to the accompanying drawings. The disclosed technology might be embodied in many different forms and should not be construed as limited to the example embodiments set forth herein.

The disclosed technology also includes a cargo-sensing unit that has an easily installable form factor. In some embodiments, the low-power design permits the cargo sensors to operate for an extended field duration without an external power source or wire; this greatly simplifies installation.

Reference is made to the drawings. Fig. 1 is a block diagram of a wireless cargo-sensing system 100 , according to an example embodiment of the present disclosure. Wireless cargo-sensing system 100 includes a temperature and humidity sensors sub-unit 110 , a microcontroller unit (MCU) 120 configured to manage the collected sensed data and communicate via a preferably Low Power Wireless (LPW) communicator device 130 . Temperature and humidity sensors sub-unit 110 includes a temperature sensor 112 and a humidity sensor 114 . It should be noted that LPW communicator 130 may include Long Rage technology, facilitating communication with other compatible low power communication products, allowing for efficient data transfer to a variety of cloud-based management systems. Typically, cargo-sensing system 100 is powered by a battery unit 190 .

Wireless cargo-sensing system 100 may further include a hall effect sensor 118 configured to detect changes in magnetic fields and is primarily used to switch ON/Off the battery 190and other applications such as door open/close detection.

Wireless cargo-sensing system 100 may further include an accelerometer 116 , wherein accelerometer 116 is configured to measure the products acceleration, and is primarily used to detect product movements.

Temperature sensor 112 , humidity sensor 114 and accelerometer 116 , transmit their respective measured values to a microcontroller unit (MCU) 120 . Typically, MCU 120processes and converts the respective raw measurements into human-understandable formats before transmitting the data to other compatible remote target receiving devices, over a respective based management system 200 .

Reference is also made to Fig. 2 illustrating a (preferably) global cloud ( 220 ) based, based management system 200 , whereas LPW communicator 130 of a cargo carrier 50may transmit the collected data, by the respective MCU 120over a wireless network 200 (such as, with no limitations, a cellular wireless network) to a preconfigured control unit, such as a remote controlling center 210 .

Reference is also made to Figs. 3a, 3b and 3c, showing the physical components of an example embodiment of cargo-sensing system 100 , according to some embodiments of the present disclosure. Cargo-sensing system 100 includes a temperature sensor and humidity sensor sub-unit 110 , an example housing device 150 , an example PCBA device 140 , a battery unit 190 , and an example cargo-sensing casing device 160 .

Preferably, with no limitations, housing device 150 is made of a Low-Pressure Mold (LPM). Preferably, with no limitations, sensors-casing device 160is made of High-Pressure Mold (HPM). Housing device 150 , being made of an LPM material having high thermal conductivity such as, with no limitations, synthetic rubber. Housing device 150facilitates to seal the electronics components from any kind of humidity and wetness. Housing device 150 subdivides the inner space of cargo-sensing system 100 into two main sections: an electronics accommodation section 156 that is a dry-sealed section, and a temperature and humidity section that is exposed to inner space of the monitored reefer(s) of the cargo carrier 50 . Reference is also made to Fig. 4, illustrating an example embodiment of sub dividing the cargo-sensing system 100 into compartments: an electronics accommodation compartment 156 that is a dry-sealed section, and an open temperature and humidity compartment 158 that is exposed to inner space of the monitored cargo compartment of the cargo carrier 50 . Typically, the electronics accommodation compartment 156 and temperature and humidity compartment 158 are formed using LPM rubber. Electronics accommodation compartment 156is formed between two partitioning LPM barrier walls, front barrier wall 152 and rear barrier wall 154 . Front barrier wall 152 sealingly separates electronics accommodation compartment 156from temperature and humidity compartment 158 . Rear barrier wall 154sealingly supports the battery unit 190 , and PCBA device 140 inside electronics accommodation section 156 .

The electronics accommodation compartment 156 includes an example PCBA device 140 that is installed, for example only, in a separate upper opened and ventilated space 153of electronics accommodation compartment 156 section, houses battery unit 190 , facilitating good thermal dissipation. Upper ventilated space 153and PCBA device 140 are separated by a layer of an LPM material, providing PCBA device 140 with thermal and humidity isolation, as well as mechanical protection. The Cargo-sensing system 100 is enclosed by an example sensors-casing device 160 .

Fig. 5a illustrates a first face of PCBA device 140 , that is shown with no limitations as a bottom face, according to some embodiments of the present invention. Fig. 5a also reveals the two sections of PCBA device 140 : an exposed section 142 and a dry section 144 . Dry section 144 is operatively situated inside the dry electronics accommodation compartment 156 , and exposed section 142 is operatively situated inside open temperature and humidity compartment 158 . It should be appreciated that the length of exposed section 142 facilitates keeping temperature sensor 112 and humidity sensor 114 away from the dry section 144 . Fig. 5b illustrates an opposite, second face of PCBA device 140 , that is shown with no limitations as a top face. The exposed section ( 142 ) of PCBA device 140 , that is operatively exposed to inner space of the monitored cargo compartment of the cargo carrier 50 , hosts temperature sensor and humidity sensor sub-unit 110 . Fig. 5a reveals an example position of temperature sensor 112 . Fig. 5c illustrates an elevated, side perspective view of front barrier wall 152 , that sealingly separates the open temperature and humidity compartment 158 from the electronics accommodation compartment 156 , and thereby improves the humidity response time by preventing possible interferences to affect sensor readings, according to some embodiments of the present invention. Preferably, a thermal pad 113 is preferably placed at the tip of the exposed PCBA section 142 . Thermal pad 113 is typically made of highly conductive material, such as metal, that is connected directly into the temperature sensor 112 chip, effectively increasing its surface area, and facilitating efficient thermal transfer. This deliberate design decision enables thermal responsiveness, allowing the sensor to quickly respond to changes in the external environment.

Preferably, the exposed PCBA section 142 is perforated by one or more inner thermal isolator openings 115 that form thermal separation on the one hand, while still providing mechanical strength for the temperature sensor 112 . Preferably, the electronic components of PCBA section 142 , other than the temperature sensor 112 and humidity sensor 114 , are treated with a selective conformal coating, preferably including thermal pad 113 .

Reference is also made to Figs. 6a – 6f, illustrating a non-limiting example embodiment of a sensors-casing device 160 . Fig. 6a is a front elevated perspective view of sensors-casing device 160 ; Fig. 6b is a rear elevated perspective view of sensors-casing device 160 ; Fig. 6c is a front elevated perspective, cross section AA’ view of sensors-casing device 160 ; Fig. 6d is a rear elevated perspective, cross section AA’ view of sensors-casing device 160 ; Fig. 6e is a top view of sensors-casing device 160 ; and Fig. 6f is a bottom view of sensors-casing device 160 . The high-pressure molding (HPM) is configured to mechanically protect the exposed PCBA section 142 , including the temperature and humidity sensors sub-unit 110 . On the other hand, it is designed to be as open as possible, allowing almost 360 degrees of airflow around the temperature and humidity sensor, accurately measuring reefer air temperature. This airflow is facilitated via multiple vent openings 162 formed at the front end of the sensors-casing device 160 proximal to the exposed PCBA section 142 . The vents 162 are formed all across the HPM mold of sensors-casing device 160to allow good thermal responsiveness of the temperature sensor 112 and prevent water condensation during temperature changes.

Figs. 6c and 6d, that show cross section AA’ views of sensors-casing device 160 , also reveal the LPM isolation of PCBA device 140 , to prevent water accumulation. As non-limiting examples, LPW communicator 130 is configured to transmit one or more of: an indication of a door opening or closing event (e.g., from an accelerometer); temporal humidity level and/or temperature level inside a container; and a geographical location.

Although the above is discussed with reference to a distributed system environment, one of ordinary skill will understand that aspects of the present disclosure can be implemented in an integrated embodiment (e.g., all or substantially all aspects being implemented within a cargo-sensing unit) and/or various functions attributed to certain elements of the distributed system environment can be performed by other elements of the distributed system environment.

While certain example embodiments of the disclosed technology have been described above, it is to be understood that the disclosed technology is not to be limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims and their equivalents. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation. It is intended that each term contemplates its broadest meaning as understood by those skilled in the art and includes all technical equivalents that operate in a similar manner to accomplish a similar purpose. In the above description, numerous specific details are set forth. However, it is to be understood that some embodiments of the disclosed technology can be practiced without these specific details. In other instances, well-known methods, structures, and techniques have not been shown in detail in order to avoid obscuring an understanding of this description. References to "one embodiment," "an embodiment," "example embodiment," "some embodiments," "certain embodiments," "various embodiments," etc., indicate that the example embodiment(s) of the disclosed technology so described can include a particular feature, structure, or characteristic, but not that every embodiment necessarily includes the particular feature, structure, or characteristic. Further, repeated use of the phrase "in one embodiment" does not necessarily refer to the same embodiment, although it may.

Unless otherwise noted, the terms used herein are to be understood according to conventional usage by those of ordinary skill in the relevant art. In addition to any provided definitions of terms, it is to be understood that as used in the specification and in the claims, the term "or" is intended to mean an inclusive "or." Further, the terms "a," "an," and "the" are intended to mean one or more unless specified otherwise or clear from the context to be exclusively directed to a singular form.

Unless otherwise specified, the use of the ordinal adjectives "first," "second," "third," etc., to describe a common object, merely indicates that different instances of like objects are being referred to, and are not intended to imply that the objects so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

The materials described herein as making up the various elements of some example embodiments are intended to be illustrative only and not restrictive. Many suitable materials that would perform a same or a similar function as the materials described herein are intended to be embraced within the scope of the present disclosure. Such other materials not described herein can include, but are not limited to, materials that are developed after the time of the development of the invention.

This written description uses examples to disclose certain example embodiments of the disclosed technology, including the best mode, and also to enable any person skilled in the art to practice certain embodiments of the disclosed technology, including making and using any devices or systems and performing any incorporated methods. The scope of certain embodiments of the disclosed technology is defined in the claims and their equivalents, and can include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

The invention being thus described in terms of several embodiments and examples, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications, as would be obvious to one skilled in the art.

Claims (2)

WHAT IS CLAIMED IS:

1. A wireless cargo-sensing system and methods of using the same, substantially as described herein.

2. A cargo-sensing unit comprising: an electronic board, having a dry-sealed section and a temperature and humidity section, wherein said temperature and humidity section comprises: a temperature sensor; and a humidity sensor, wherein said dry-sealed section comprises: at said least one processor; a communicator; and a memory having stored thereon computer program code that, when executed by said processor, controls said processor to: instruct said temperature sensor to capture a temperature sample of the cargo space within a cargo reefer; instruct said humidity sensor to capture a humidity sample of the cargo space within a cargo reefer; and instruct said processor to transmit said temperature sample and said humidity sample to a target preconfigured control unit.