JP2000248076A - Production of minute chemical device - Google Patents

Production of minute chemical device

Info

Publication number
JP2000248076A
JP2000248076A JP11056436A JP5643699A JP2000248076A JP 2000248076 A JP2000248076 A JP 2000248076A JP 11056436 A JP11056436 A JP 11056436A JP 5643699 A JP5643699 A JP 5643699A JP 2000248076 A JP2000248076 A JP 2000248076A
Authority
JP
Japan
Prior art keywords
composition
polymerizable compound
microchemical device
cross
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11056436A
Other languages
Japanese (ja)
Inventor
Takanori Anazawa
孝典 穴澤
Atsushi Teramae
敦司 寺前
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawamura Institute of Chemical Research
Original Assignee
Kawamura Institute of Chemical Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Institute of Chemical Research filed Critical Kawamura Institute of Chemical Research
Priority to JP11056436A priority Critical patent/JP2000248076A/en
Publication of JP2000248076A publication Critical patent/JP2000248076A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/286Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0809Geometry, shape and general structure rectangular shaped
    • B01L2300/0816Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0861Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0883Serpentine channels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0887Laminated structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/26Polymeric coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02Synthetic macromolecular fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • B32B2264/102Oxide or hydroxide
    • B32B2264/1027Clay

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for sticking a member having a groove on the surface to the other member in a state in which the space therebetween adheres completely, without blocking the extremely fine groove. SOLUTION: This method for producing a minute chemical device having a capillary flow pass between a member A and a member B comprises coating a composition C containing a cross-linkable compound on the member B, bringing the surface b coated with the composition C on the member B in a semi- hardened state in which the composition C loses the fluidity and the unreacted polymerizable groups remains, into contact with the grooved surface (a) of the member A, having a groove with 1-1,000 μm width and 1-1,000 μm depth on the surface, and completely hardening the composition C in the state.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、微小ケミカルデバ
イス、即ち、部材中に微小な流路、反応槽、電気泳動カ
ラム、膜分離機構などの構造が形成された、化学、生化
学、物理化学用などの微小反応デバイス(マイクロ・リ
アクター)や、集積型DNA分析デバイス、微小電気泳
動デバイス、微小クロマトグラフィーデバイスなどの微
小分析デバイスに関し、更に詳しくは、表面に溝を有す
る部材と他の部材を接着一体化させることにより形成さ
れた、キャピラリー状の流路を有する微小反応デバイス
や微小分析デバイスに関する。
The present invention relates to a microchemical device, that is, a chemistry, biochemistry, physical chemistry in which a structure such as a microchannel, a reaction tank, an electrophoresis column, a membrane separation mechanism, etc. is formed in a member. For micro-reaction devices (micro-reactors), micro-analysis devices such as integrated DNA analysis devices, micro-electrophoresis devices, micro-chromatography devices, etc. The present invention relates to a micro-reaction device and a micro-analysis device having a capillary flow path formed by bonding and integrating.

【0002】[0002]

【従来の技術】シリコン、石英、ガラス、ポリマーなど
の基材に、エッチング法により細い溝を形成して、液体
流路や分離用ゲルチャンネルとすることが知られており
(例えば、アール・エム・マコーミック等、「アナリテ
ィカル・ケミストリー」、第2626頁、第69巻、1
997年)、操作中の液体の蒸発防止などを目的とし
て、ガラス板などのカバーをネジ止めなどにより表面に
密着させて使用することが知られている。
2. Description of the Related Art It is known that a thin groove is formed in a base material such as silicon, quartz, glass, or polymer by an etching method to form a liquid channel or a gel channel for separation (for example, R.M.・ McCormick et al., “Analytical Chemistry”, p. 2626, vol. 69, 1
997), it is known that a cover such as a glass plate is tightly attached to the surface by screws or the like for the purpose of preventing evaporation of liquid during operation.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、基材と
カバーとの間を完全に密着させることはかなり困難であ
り、基材とカバーとの間への液体の漏洩が生じがちであ
った。
However, it is quite difficult to completely adhere the substrate and the cover to each other, and the liquid tends to leak between the substrate and the cover.

【0004】一方、これらの両部材を、接着剤を用いて
接着すると、基材に形成された溝が細い場合、接着剤が
溝に入り込み、流路を閉塞しがちであった。
On the other hand, when these two members are bonded with an adhesive, if the groove formed in the base material is narrow, the adhesive tends to enter the groove and block the flow path.

【0005】本発明が解決しようとする課題は、表面に
溝を有する部材と他の部材との間を完全に密着させた状
態で接着し、しかもごく細い溝を閉塞することなく接着
する方法を提供することにある。
[0005] The problem to be solved by the present invention is to provide a method for bonding a member having a groove on its surface and another member in a state in which they are completely adhered to each other, and for bonding without closing a very narrow groove. To provide.

【0006】[0006]

【課題を解決するための手段】本発明者等は、上記課題
を解決する方法について鋭意検討した結果、接着剤とし
て架橋重合性化合物、特にエネルギー線架橋重合性化合
物を使用し、熱やエネルギー線照射により流動性を喪失
するまで半硬化させた状態で、接着すべき他の部材と接
触させ、その状態で完全硬化させる方法を用いると、ご
く細い溝を閉塞することなく接着できることを見出し、
本発明を完成するに至った。
Means for Solving the Problems As a result of intensive studies on the method for solving the above-mentioned problems, the present inventors have found that a cross-linkable polymerizable compound, particularly an energy beam cross-linkable polymerizable compound, is used as an adhesive, and heat and energy rays are used. In the state of being semi-cured until the fluidity is lost by irradiation, it is contacted with other members to be bonded, and by using a method of completely curing in that state, it has been found that it is possible to bond without closing a very small groove,
The present invention has been completed.

【0007】即ち、本発明は上記課題を解決するため
に、(I)表面に幅1〜1000μm、深さ1〜100
0μmの溝を有する部材(A)と他の部材(B)を接着
することにより部材(A)と部材(B)との間にキャピ
ラリー状の流路を形成した微小ケミカルデバイスの製造
方法であって、部材(B)に架橋重合性化合物を含有す
る組成物(C)を塗布し、次いで架橋重合性化合物を含
有する組成物(C)が流動性を喪失し、かつ未反応の重
合性基が残存する程度に半硬化させた状態で、部材
(B)の架橋重合性化合物を含有する組成物(C)から
なる塗布面(b)と 部材(A)の溝を有する面(a)とを接
触させ、 その状態で架橋重合性化合物を含有する組成
物(C)を完全に硬化させることにより接着することを
特徴とする微小ケミカルデバイスの製造方法(以下、
「本発明の第1の製造方法」という。)を提供する。
That is, according to the present invention, in order to solve the above-mentioned problems, (I) the surface has a width of 1 to 1000 μm and a depth of 1 to 100 μm.
A method for manufacturing a microchemical device in which a member (A) having a groove of 0 μm and another member (B) are bonded to form a capillary-like flow path between the member (A) and the member (B). Then, the composition (C) containing the cross-linkable polymerizable compound is applied to the member (B), and then the composition (C) containing the cross-linkable polymerizable compound loses its fluidity and has an unreacted polymerizable group. In the state where semi-cured to the extent that remains, the coated surface (b) made of the composition (C) containing the crosslinkable polymerizable compound of the member (B) and the grooved surface (a) of the member (A) And then bonding by completely curing the composition (C) containing the cross-linkable polymerizable compound in that state (hereinafter, referred to as a method for producing a microchemical device).
This is referred to as "the first manufacturing method of the present invention". )I will provide a.

【0008】また、本発明は上記課題を解決するため
に、(II)表面に幅1〜1000μm、深さ1〜100
0μmの溝を有する部材(A)と他の部材(B)を接着
することにより部材(A)と部材(B)との間にキャピ
ラリー状の流路を形成した微小ケミカルデバイスの製造
方法であって、部材(A)の溝が形成された面(a)に、
溝の深さの1/10000〜1/2の厚さに架橋重合性
化合物を含有する組成物(C’)を、部材(B)に架橋
重合性化合物を含有する組成物(C)をそれぞれ塗布
し、次いで架橋重合性化合物を含有する組成物(C)及
び組成物(C’)が流動性を喪失し、かつ未反応の重合
性基が残存する程度に半硬化させた状態で、部材(A)
の半硬化した架橋重合性化合物を含有する組成物
(C’)からなる塗布面(a')と、部材(B)の半硬化し
た架橋重合性化合物を含有する組成物(C)からなる塗
布面(b')とを接触させ、その状態で架橋重合性化合物を
含有する組成物(C)及び組成物(C’)を完全に硬化
させることにより接着することを特徴とする微小ケミカ
ルデバイスの製造方法(以下、「本発明の第2の製造方
法」という。)を提供する。
In order to solve the above-mentioned problems, the present invention provides (II) a method of forming a surface having a width of 1 to 1000 μm and a depth of 1 to 100 μm.
A method for manufacturing a microchemical device in which a member (A) having a groove of 0 μm and another member (B) are bonded to form a capillary-like flow path between the member (A) and the member (B). Then, on the surface (a) where the groove of the member (A) is formed,
The composition (C ') containing the cross-linkable polymerizable compound at a thickness of 1/10000 to 1/2 of the depth of the groove, and the composition (C) containing the cross-linkable polymerizable compound in the member (B), respectively. After coating, the composition (C) and the composition (C ′) containing the cross-linkable polymerizable compound lose their fluidity and are semi-cured to such an extent that unreacted polymerizable groups remain, and (A)
A coating surface (a ′) composed of the composition (C ′) containing the semi-cured cross-linkable polymerizable compound, and a coating composed of the composition (C) containing the semi-cured cross-linked polymerizable compound of the member (B) A surface of the microchemical device, which is brought into contact with the surface (b ′), and in this state, the composition (C) containing the crosslinkable polymerizable compound and the composition (C ′) are completely cured to be bonded to each other. A manufacturing method (hereinafter, referred to as a “second manufacturing method of the present invention”) is provided.

【0009】さらに、本発明は上記課題を解決するため
に、 (III)表面に幅1〜1000μm、深さ1〜10
00μmの溝を有する部材(A)と他の部材(B)を接
着することにより部材(A)と部材(B)との間にキャ
ピラリー状の流路を形成した微小ケミカルデバイスの製
造方法であって、部材(B)に架橋重合性化合物を含有
する組成物(C)を塗布し、次いで架橋重合性化合物を
含有する組成物(C)が流動性を喪失し、かつ未反応の
重合性基が残存する程度に半硬化させた状態で、部材
(B)の架橋重合性化合物を含有する組成物(C)から
なる塗布面(b")と、部材(A)の溝が形成された面(a)
に、 溝の深さの1/10000〜1/10の厚さに架
橋重合性化合物を含有する組成物(C”)を塗布し、該
塗布面(a")とを接触させ、その状態で架橋重合性化合物
を含有する組成物(C)及び架橋重合性化合物を含有す
る組成物(C”)を完全に硬化させることにより接着す
ることを特徴とする微小ケミカルデバイスの製造方法
(以下、「本発明の第3の製造方法」という。)を提供
する。
In order to solve the above-mentioned problems, the present invention provides: (III) a surface having a width of 1 to 1000 μm and a depth of 1 to 10 μm;
A method for manufacturing a microchemical device in which a member (A) having a groove of 00 μm and another member (B) are bonded to form a capillary-like flow path between the member (A) and the member (B). Then, the composition (C) containing the cross-linkable polymerizable compound is applied to the member (B), and then the composition (C) containing the cross-linkable polymerizable compound loses its fluidity and has an unreacted polymerizable group. In the state where semi-cured to the extent that remains, the coated surface (b ″) of the composition (C) containing the crosslinkable polymerizable compound of the member (B) and the surface of the member (A) where the grooves are formed (a)
A composition (C ″) containing a cross-linkable polymerizable compound is applied to a thickness of 1/10000 to 1/10 of the depth of the groove, and the applied surface (a ″) is brought into contact with the composition. A method for producing a microchemical device, characterized in that a composition (C) containing a cross-linkable polymerizable compound and a composition (C ″) containing a cross-linkable polymerizable compound are completely cured so that they are bonded to each other (hereinafter, referred to as “ A third manufacturing method of the present invention ”).

【0010】[0010]

【発明の実施の形態】本発明の製造方法で用いられる部
材(A)は、本発明で得られる微小ケミカルデバイスに
使用する液体に対して不透過性であって、表面に幅1〜
1000μm、深さ1〜1000μmの溝を有するもの
である。溝の幅は1μm以上であり、5μm以上が好ま
しく、10μm以上であることがさらに好ましい。これ
より狭い幅の溝を有する微小ケミカルデバイスは製造が
困難となる。溝の幅は1000μm以下であり、300
μm以下が好ましく、100μm以下であることがさら
に好ましい。これより溝の幅が広いと、本発明の効果が
減じる。溝の深さは1μm以上であり、5μm以上が好
ましく、10μm以上であることがさらに好ましい。こ
れより浅い溝を有する微小ケミカルデバイスは製造が困
難となる。溝の深さはまた、1000μm以下であり、
300μm以下が好ましく、100μm以下であること
がさらに好ましい。これより溝が深いと本発明の効果が
減じる。溝の幅/深さ比は任意であるが、0.2〜5の
範囲が好ましく、0.5〜2.0の範囲がさらに好まし
い。上面から見た溝の形状は直線である必要はなく、任
意の形状であってよい。また、溝の断面形状も、方形、
台形、半円形など任意の形状であってよい。部材(A)
上において、溝に接続して他の構造、例えば、液溜め、
反応槽、流速計測部、弁、バルブ、ゲルが充填された
溝、分離膜、などが形成されていても良い。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The member (A) used in the production method of the present invention is impermeable to the liquid used in the microchemical device obtained by the present invention, and has a width of 1 to 3 on the surface.
It has a groove of 1000 μm and a depth of 1 to 1000 μm. The width of the groove is 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more. A microchemical device having a narrower groove becomes difficult to manufacture. The width of the groove is 1000 μm or less, and 300
μm or less, more preferably 100 μm or less. If the width of the groove is wider than this, the effect of the present invention is reduced. The depth of the groove is 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more. A microchemical device having a shallower groove becomes difficult to manufacture. The depth of the groove is also 1000 μm or less,
It is preferably 300 μm or less, more preferably 100 μm or less. If the groove is deeper than this, the effect of the present invention is reduced. The width / depth ratio of the groove is arbitrary, but is preferably in the range of 0.2 to 5, more preferably in the range of 0.5 to 2.0. The shape of the groove viewed from the top surface does not need to be a straight line, but may be any shape. Also, the cross-sectional shape of the groove is square,
Any shape such as a trapezoid or a semicircle may be used. Member (A)
Above, other structures connected to the groove, such as a reservoir,
A reaction tank, a flow rate measuring unit, a valve, a valve, a groove filled with gel, a separation membrane, and the like may be formed.

【0011】部材(A)の形状は特に限定する必要はな
く、用途目的に応じた形状を採りうる。例えば、シート
状(フィルム、リボンを含む)、板状、塗膜状、棒状、
チューブ状、その他複雑な形状の成型物などであり得る
が、成形し易く、エネルギー線を照射し易いといった面
から、接着すべき面が平面状の形状であること、特にシ
ート状又は板状であることが好ましい。部材(A)は支
持体上に形成されたものであってもよい。この場合の支
持体の素材は任意であり、例えば、ポリマー、ガラス、
セラミック、金属、半導体などであって良い。支持体の
形状も任意であり、例えば、板状物、シート状物、塗
膜、棒状物、紙、布、不織布、多孔質体、射出成型品等
であって良い。複数の微小ケミカルデバイスを1つの部
材(A)上に形成することも可能であるし、製造後、こ
れらを切断して複数の微小ケミカルデバイスとすること
も可能である。
[0011] The shape of the member (A) does not need to be particularly limited, and may take a shape according to the purpose of use. For example, sheet (including film and ribbon), plate, coating, rod,
It can be a tube, a molded product of other complicated shape, etc., but it is easy to mold and it is easy to irradiate energy rays, so that the surface to be adhered is a flat shape, especially a sheet or plate. Preferably, there is. The member (A) may be formed on a support. The material of the support in this case is arbitrary, for example, polymer, glass,
It may be ceramic, metal, semiconductor or the like. The shape of the support is also arbitrary, and may be, for example, a plate-like material, a sheet-like material, a coating film, a rod-like material, paper, cloth, nonwoven fabric, a porous body, an injection-molded product, and the like. It is possible to form a plurality of microchemical devices on one member (A), or it is also possible to cut them after manufacturing to form a plurality of microchemical devices.

【0012】部材(A)の素材は、架橋重合性化合物で
接着可能なものであれば特に制約はないが、接着剤とし
てエネルギー線硬化性化合物を使用する場合であって、
かつ後述の部材(B)が本発明で使用するエネルギー線
を透過させないものである場合には、本発明で使用する
エネルギー線を透過させるものである必要がある。部材
(A)の素材として使用可能なものとしては、例えば、
ポリマー、ガラス、石英の如き結晶、セラミック、シリ
コンの如き半導体、金属などが挙げられるが、これらの
中でも、易成形性、高生産性、低価格などの点からポリ
マーが特に好ましい。
The material of the member (A) is not particularly limited as long as it can be adhered with a cross-linkable polymerizable compound. However, when an energy ray-curable compound is used as an adhesive,
When the member (B) described later does not transmit the energy ray used in the present invention, it must be able to transmit the energy ray used in the present invention. As a material that can be used as the material of the member (A), for example,
Examples thereof include polymers, crystals such as glass and quartz, semiconductors such as ceramic and silicon, and metals. Of these, polymers are particularly preferable from the viewpoints of easy moldability, high productivity, and low cost.

【0013】部材(A)に使用できるポリマーとして
は、例えば、ポリスチレン、ポリ−α−メチルスチレ
ン、ポリスチレン/マレイン酸共重合体、ポリスチレン
/アクリロニトリル共重合体の如きスチレン系ポリマ
ー;ポルスルホン、ポリエーテルスルホンの如きポリス
ルホン系ポリマー;ポリメチルメタクリレート、ポリア
クリロニトリルの如き(メタ)アクリル系ポリマー;ポ
リマレイミド系ポリマー;ビスフェノールA系ポリカー
ボネート、ビスフェノールF系ポリカーボネート、ビス
フェノールZ系ポリカーボネートなどのポリカーボネー
ト系ポリマー;ポリエチレン、ポリプロピレン、ポリ−
4−メチルペンテン−1の如きポリオレフィン系ポリマ
ー;塩化ビニル、塩化ビニリデンの如き塩素含有ポリマ
ー;酢酸セルロース、メチルセルロースの如きセルロー
ス系ポリマー;ポリウレタン系ポリマー;ポリアミド系
ポリマー;ポリイミド系ポリマー;ポリ−2,6−ジメ
チルフェニレンオキサイド、ポリフェニレンサルファイ
ドの如きポリエーテル系又はポリチオエーテル系ポリマ
ー;ポリエーテルエーテルケトンの如きポリエーテルケ
トン系ポリマー;ポリエチレンテレフタレート、ポリア
リレートの如きポリエステル系ポリマー;エポキシ樹
脂;ウレア樹脂;フェノール樹脂等を挙げられる。これ
らの中でも、接着性が良好な点などから、スチレン系ポ
リマー、(メタ)アクリル系ポリマー、ポリカーボネー
ト系ポリマー、ポリスルホン系ポリマー、ポリエステル
系ポリマーが好ましい。
Examples of the polymer which can be used for the member (A) include styrene-based polymers such as polystyrene, poly-α-methylstyrene, polystyrene / maleic acid copolymer and polystyrene / acrylonitrile copolymer; porsulfone, polyethersulfone (Meth) acrylic polymers such as polymethyl methacrylate and polyacrylonitrile; polymaleimide polymers; polycarbonate polymers such as bisphenol A-based polycarbonate, bisphenol F-based polycarbonate and bisphenol Z-based polycarbonate; polyethylene, polypropylene, Poly
Polyolefin polymers such as 4-methylpentene-1; chlorine-containing polymers such as vinyl chloride and vinylidene chloride; cellulosic polymers such as cellulose acetate and methylcellulose; polyurethane polymers; polyamide polymers; polyimide polymers; Polyether or polythioether polymers such as dimethylphenylene oxide and polyphenylene sulfide; polyetherketone polymers such as polyetheretherketone; polyester polymers such as polyethylene terephthalate and polyarylate; epoxy resins; urea resins; Can be mentioned. Among these, styrene-based polymers, (meth) acrylic-based polymers, polycarbonate-based polymers, polysulfone-based polymers, and polyester-based polymers are preferable from the viewpoint of good adhesion.

【0014】部材(A)に使用するポリマーは、単独重
合体であっても、共重合体であっても良く、また、熱可
塑性ポリマーであっても、熱硬化性ポリマーであっても
良い。生産性の面から、部材(A)に使用するポリマー
は、熱可塑性ポリマー又はエネルギー線硬化性の架橋重
合体であることが好ましい。また、部材(A)は、ポリ
マーブレンドやポリマーアロイで構成されていても良い
し、積層体その他の複合体であっても良い。さらに、部
材(A)は、改質剤、着色剤、充填材、強化材などの添
加物を含有しても良い。
The polymer used for the member (A) may be a homopolymer or a copolymer, and may be a thermoplastic polymer or a thermosetting polymer. From the viewpoint of productivity, the polymer used for the member (A) is preferably a thermoplastic polymer or an energy ray-curable crosslinked polymer. The member (A) may be composed of a polymer blend or a polymer alloy, or may be a laminate or other composite. Further, the member (A) may contain additives such as a modifying agent, a coloring agent, a filler, and a reinforcing material.

【0015】部材(A)に含有させることができる改質
剤としては、例えば、シリコンオイルやフッ素置換炭化
水素などの疎水化剤(撥水剤);水溶性ポリマー、界面
活性剤、シリカゲルなどの無機粉末、などの親水化剤が
挙げられる。
The modifier which can be contained in the member (A) includes, for example, hydrophobizing agents (water repellents) such as silicone oil and fluorine-substituted hydrocarbons; water-soluble polymers, surfactants, silica gels and the like. And hydrophilic agents such as inorganic powders.

【0016】部材(A)に含有させることができる着色
剤としては、任意の染料や顔料、蛍光性の染料や顔料、
紫外線吸収剤が挙げられる。
As the colorant that can be contained in the member (A), any dye or pigment, fluorescent dye or pigment,
UV absorbers.

【0017】部材(A)に含有させることができる強化
材としては、例えば、クレイなどの無機粉末、有機や無
機の繊維が挙げられる。
Examples of the reinforcing material that can be contained in the member (A) include inorganic powders such as clay, and organic and inorganic fibers.

【0018】部材(A)が接着性の低い素材、例えば、
ポリオレフィン、フッ素系ポリマー、ポリフェニレンサ
ルファイド、ポリエーテルエーテルケトン等の場合に
は、部材(A)の接着面の表面処理やプライマーの使用
により、接着性を向上させることが好ましい。
The member (A) is made of a material having low adhesiveness, for example,
In the case of polyolefin, fluorine-based polymer, polyphenylene sulfide, polyether ether ketone, or the like, it is preferable to improve the adhesion by surface treatment of the bonding surface of the member (A) or use of a primer.

【0019】また、本発明の微小ケミカルデバイスの使
用に当たって、接着性を向上させる目的や、タンパク質
などの溶質のデバイス表面への吸着を抑制する目的で、
部材(A)の溝の表面を親水化することも好ましい。親
水化処理は溝の表面に限定されず、その他の部分も処理
されてよい。
Further, in using the microchemical device of the present invention, for the purpose of improving the adhesiveness and suppressing the adsorption of solutes such as proteins to the device surface,
It is also preferable to make the surface of the groove of the member (A) hydrophilic. The hydrophilic treatment is not limited to the surface of the groove, and other parts may be treated.

【0020】本発明で使用する部材(B)は、使用する
液体に対して不透過性であって、部材(A)の溝が形成
された面に接着し、部材(A)の溝と部材(B)でもっ
てキャピラリー状の流路を形成可能なものであれば、そ
の形状、素材、構造、表面状態などは任意である。これ
らについては、その表面に溝が形成されている必要が無
いこと以外は、部材(A)の場合と同様である。部材
(B)は表面に溝が形成されている必要は無いが、溝や
溝以外の構造が形成されていても良い。部材(B)は、
接着剤としてエネルギー線硬化性化合物を使用する場合
であって、かつ部材(A)が本発明で使用するエネルギ
ー線を透過させないものである場合には、本発明で使用
するエネルギー線を透過させるものである必要がある。
The member (B) used in the present invention is impermeable to the liquid to be used, and is adhered to the groove-formed surface of the member (A). (B) Any shape, material, structure, surface condition, and the like can be used as long as a capillary-shaped flow path can be formed by the method. These are the same as in the case of the member (A), except that the grooves need not be formed on the surface. The member (B) does not need to have a groove formed on the surface, but may have a groove or a structure other than the groove. The member (B)
When the energy ray-curable compound is used as an adhesive and the member (A) does not transmit the energy ray used in the present invention, the energy ray used in the present invention is transmitted. Needs to be

【0021】本発明で使用する架橋重合性化合物は、架
橋重合して架橋ポリマーを形成できるものであれば任意
であり、例えば、エポキシ系接着剤、ウレタン系接着
剤、フェノール系接着剤、ウレア系接着剤、などの熱硬
化性化合物;シリコン系接着剤などの水架橋型接着剤、
エネルギー線硬化性化合物などが挙げられる。これらの
中でも重合速度の速さから、エネルギー線硬化性化合物
が好ましい。エネルギー線硬化性化合物は、ラジカル重
合性、アニオン重合性、カチオン重合性等任意のもので
あってよい。エネルギー線硬化性化合物は、重合開始剤
の非存在下で重合するものに限らず、重合開始剤の存在
下でのみエネルギー線により重合するものも使用するこ
とができる。そのようなエネルギー線硬化性化合物とし
ては、重合性の炭素−炭素二重結合を有する物が好まし
く、中でも、反応性の高い(メタ)アクリル系化合物や
ビニルエーテル類、また光重合開始剤の不存在下でも硬
化するマレイミド系化合物が好ましい。
The crosslinkable polymerizable compound used in the present invention is not particularly limited as long as it can form a crosslinked polymer by crosslink polymerization. Examples thereof include an epoxy adhesive, a urethane adhesive, a phenol adhesive, and a urea adhesive. Thermosetting compounds such as adhesives; water-crosslinkable adhesives such as silicone-based adhesives;
Energy ray-curable compounds and the like. Among these, an energy ray-curable compound is preferable because of its high polymerization rate. The energy ray-curable compound may be any compound such as a radical polymerizable compound, an anionic polymerizable compound, and a cationic polymerizable compound. The energy ray-curable compound is not limited to one that polymerizes in the absence of a polymerization initiator, and one that is polymerized by an energy beam only in the presence of a polymerization initiator can also be used. As such an energy ray-curable compound, a compound having a polymerizable carbon-carbon double bond is preferable, and among them, a highly reactive (meth) acrylic compound, vinyl ethers, and the absence of a photopolymerization initiator are preferable. A maleimide-based compound that cures even below is preferred.

【0022】エネルギー線硬化性化合物として使用でき
る(メタ)アクリル系モノマーとしては、例えば、ジエ
チレングリコールジ(メタ)アクリレート、ネオペンチ
ルグリコールジ(メタ)アクリレート、1,6−ヘキサ
ンジオールジ(メタ)アクリレート、2,2’−ビス
(4−(メタ)アクリロイルオキシポリエチレンオキシ
フェニル)プロパン、2,2’−ビス(4−(メタ)ア
クリロイルオキシポリプロピレンオキシフェニル)プロ
パン、ヒドロキシジピバリン酸ネオペンチルグリコール
ジ(メタ)アクリレート、ジシクロペンタニルジアクリ
レート、ビス(アクロキシエチル)ヒドロキシエチルイ
ソシアヌレート、N−メチレンビスアクリルアミドの如
き2官能モノマー;トリメチロールプロパントリ(メ
タ)アクリレート、トリメチロールエタントリ(メタ)
アクリレート、トリス(アクロキシエチル)イソシアヌ
レート、カプロラクトン変性トリス(アクロキシエチ
ル)イソシアヌレート、の如き3官能モノマー;ペンタ
エリスリトールテトラ(メタ)アクリレートの如き4官
能モノマー;ジペンタエリスリトールヘキサ(メタ)ア
クリレートの如き6官能モノマー、などが挙げられる。
Examples of the (meth) acrylic monomer that can be used as the energy ray-curable compound include diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 2,2'-bis (4- (meth) acryloyloxypolyethyleneoxyphenyl) propane, 2,2'-bis (4- (meth) acryloyloxypolypropyleneoxyphenyl) propane, neopentylglycol dihydroxydipivalate A) bifunctional monomers such as acrylate, dicyclopentanyl diacrylate, bis (acryloxyethyl) hydroxyethyl isocyanurate, and N-methylenebisacrylamide; trimethylolpropane tri (meth) acrylate, Chi trimethylolethane tri (meth)
Trifunctional monomers such as acrylate, tris (acroxyethyl) isocyanurate and caprolactone-modified tris (acroxyethyl) isocyanurate; tetrafunctional monomers such as pentaerythritol tetra (meth) acrylate; dipentaerythritol hexa (meth) acrylate And hexafunctional monomers as described above.

【0023】また、エネルギー線硬化性化合物として、
重合性オリゴマー(プレポリマーとも呼ばれる)を用い
ることもでき、例えば、重量平均分子量が500〜50
000のものが挙げられる。そのような重合性オリゴマ
ーしては、例えば、エポキシ樹脂の(メタ)アクリル酸
エステル、ポリエーテル樹脂の(メタ)アクリル酸エス
テル、ポリブタジエン樹脂の(メタ)アクリル酸エステ
ル、分子末端に(メタ)アクリロイル基を有するポリウ
レタン樹脂などが挙げられる。
Also, as the energy ray-curable compound,
A polymerizable oligomer (also referred to as a prepolymer) can also be used, for example, having a weight average molecular weight of 500 to 50.
000. Examples of such a polymerizable oligomer include (meth) acrylate of epoxy resin, (meth) acrylate of polyether resin, (meth) acrylate of polybutadiene resin, and (meth) acryloyl at the molecular terminal. And a polyurethane resin having a group.

【0024】これらのエネルギー線硬化性化合物は、単
独で用いることもでき、2種類以上を混合して用いるこ
ともできる。
These energy ray-curable compounds can be used alone or as a mixture of two or more.

【0025】また、エネルギー線硬化性化合物を含有す
る組成物には、接着性を増すなどの目的で、単官能モノ
マー、例えば単官能(メタ)アクリル系モノマーを混合
することもできる。
The composition containing the energy ray-curable compound may be mixed with a monofunctional monomer, for example, a monofunctional (meth) acrylic monomer, for the purpose of increasing adhesiveness.

【0026】マレイミド系の架橋重合性化合物として
は、例えば、4,4’−メチレンビス(N−フェニルマ
レイミド)、2,3−ビス(2,4,5−トリメチル−
3−チエニル)マレイミド、1,2−ビスマレイミドエ
タン、1,6−ビスマレイミドヘキサン、トリエチレン
グリコールビスマレイミド、N,N’−m−フェニレン
ジマレイミド、m−トリレンジマレイミド、N,N’−
1,4−フェニレンジマレイミド、N,N’−ジフェニ
ルメタンジマレイミド、N,N’−ジフェニルエーテル
ジマレイミド、N,N’−ジフェニルスルホンジマレイ
ミド、1,4−ビス(マレイミドエチル)−1,4−ジ
アゾニアビシクロ−[2,2,2]オクタンジクロリ
ド、4,4’−イソプロピリデンジフェニル=ジシアナ
ート・N,N’−(メチレンジ−p−フェニレン)ジマ
レイミドなどの2官能マレイミド;N−(9−アクリジ
ニル)マレイミドの如きマレイミド基とマレイミド基以
外の重合性官能基とを有するマレイミド、などが挙げら
れる。マレイミド系のモノマーは、ビニルモノマー、ビ
ニルエーテル類、アクリル系モノマー等の重合性炭素・
炭素二重結合を有する化合物と共重合させることもでき
る。
Examples of the maleimide-based crosslinkable polymerizable compound include 4,4′-methylenebis (N-phenylmaleimide) and 2,3-bis (2,4,5-trimethyl-
3-thienyl) maleimide, 1,2-bismaleimideethane, 1,6-bismaleimidehexane, triethylene glycol bismaleimide, N, N'-m-phenylenedimaleimide, m-tolylenedimaleimide, N, N'-
1,4-phenylenedimaleimide, N, N'-diphenylmethane dimaleimide, N, N'-diphenylether dimaleimide, N, N'-diphenylsulfone dimaleimide, 1,4-bis (maleimidoethyl) -1,4- Bifunctional maleimides such as diazoniabicyclo- [2,2,2] octane dichloride, 4,4'-isopropylidenediphenyl dicyanate.N, N '-(methylenedi-p-phenylene) dimaleimide; N- (9-acridinyl) And maleimides having a maleimide group such as maleimide and a polymerizable functional group other than the maleimide group. Maleimide monomers include vinyl monomers, vinyl ethers, and polymerizable carbons such as acrylic monomers.
It can be copolymerized with a compound having a carbon double bond.

【0027】架橋重合性化合物を含有する組成物(C)
は必須成分として架橋重合性化合物を含有するものであ
り、複数種の架橋重合性化合物の混合物であり得る。例
えば、エネルギー線硬化性化合物の硬化物が架橋重合体
となるためには、組成物(C)は多官能のモノマー及び
/又はオリゴマーを含有することが必要であるが、その
他に、単官能のモノマー及び/又はオリゴマーを混合す
ることも可能である。
Composition (C) containing cross-linkable polymerizable compound
Contains a cross-linkable polymerizable compound as an essential component, and may be a mixture of a plurality of types of cross-linkable polymerizable compounds. For example, in order for the cured product of the energy ray-curable compound to be a crosslinked polymer, the composition (C) needs to contain a polyfunctional monomer and / or oligomer. It is also possible to mix monomers and / or oligomers.

【0028】架橋重合性化合物を含有する組成物(C)
に混合使用できる単官能(メタ)アクリル系モノマーと
しては、例えば、メチルメタクリレート、アルキル(メ
タ)アクリレート、イソボルニル(メタ)アクリレー
ト、アルコキシポリエチレングリコール(メタ)アクリ
レート、フェノキシジアルキル(メタ)アクリレート、
フェノキシポリエチレングリコール(メタ)アクリレー
ト、アルキルフェノキシポリエチレングリコール(メ
タ)アクリレート、ノニルフェノキシポリプロピレング
リコール(メタ)アクリレート、ヒドロキシアルキル
(メタ)アクリレート、グリセロールアクリレートメタ
クリレート、ブタンジオールモノ(メタ)アクリレー
ト、2−ヒドロキシ−3−フェノキシプロピルアクリレ
ート、2−アクリロイルオキシエチル−2−ヒドロキシ
プロピルアクリレート、エチレノキサイド変性フタル酸
アクリレート、w−カルゴキシアプロラクトンモノアク
リレート、2−アクリロイルオキシプロピルハイドロジ
ェンフタレート、2−アクリロイルオキシエチルコハク
酸、アクリル酸ダイマー、2−アクリロイスオキシプロ
ピリヘキサヒドロハイドロジェンフタレート、フッ素置
換アルキル(メタ)アクリレート、塩素置換アルキル
(メタ)アクリレート、スルホン酸ソーダエトキシ(メ
タ)アクリレート、スルホン酸−2−メチルプロパン−
2−アクリルアミド、燐酸エステル基含有(メタ)アク
リレート、スルホン酸エステル基含有(メタ)アクリレ
ート、シラノ基含有(メタ)アクリレート、((ジ)ア
ルキル)アミノ基含有(メタ)アクリレート、4級
((ジ)アルキル)アンモニウム基含有(メタ)アクリ
レート、(N−アルキル)アクリルアミド、(N、N−
ジアルキル)アクリルアミド、アクロロイルモリホリ
ン、などが挙げられる。
Composition (C) containing crosslinkable polymerizable compound
Examples of the monofunctional (meth) acrylic monomer that can be mixed and used in the above include, for example, methyl methacrylate, alkyl (meth) acrylate, isobornyl (meth) acrylate, alkoxy polyethylene glycol (meth) acrylate, phenoxydialkyl (meth) acrylate,
Phenoxy polyethylene glycol (meth) acrylate, alkylphenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polypropylene glycol (meth) acrylate, hydroxyalkyl (meth) acrylate, glycerol acrylate methacrylate, butanediol mono (meth) acrylate, 2-hydroxy-3 -Phenoxypropyl acrylate, 2-acryloyloxyethyl-2-hydroxypropyl acrylate, ethylenoxide-modified phthalic acid acrylate, w-carboxyaprolactone monoacrylate, 2-acryloyloxypropyl hydrogen phthalate, 2-acryloyloxyethyl succinic acid , Acrylic acid dimer, 2-acryloysoxypropyl hexahexahydrohydrate Zhen phthalate, fluorine-substituted alkyl (meth) acrylate, chlorine-substituted alkyl (meth) acrylate, sodium sulfonate ethoxy (meth) acrylate, sulfonic acid-2-methylpropane -
2-acrylamide, phosphoric acid ester group-containing (meth) acrylate, sulfonic acid ester group-containing (meth) acrylate, silano group-containing (meth) acrylate, ((di) alkyl) amino group-containing (meth) acrylate, quaternary ((di ) Alkyl) ammonium group-containing (meth) acrylate, (N-alkyl) acrylamide, (N, N-
Dialkyl) acrylamide, achloroyl morpholine, and the like.

【0029】架橋重合性化合物を含有する組成物(C)
に混合使用できる単官能マレイミド系モノマーとして
は、例えば、N−メチルマレイミド、N−エチルマレイ
ミド、N−ブチルマレイミド、N−ドデシルマレイミド
の如きN−アルキルマレイミド;N−シクロヘキシルマ
レイミドの如きN−脂環族マレイミド;N−ベンジルマ
レイミド;N−フェニルマレイミド、N−(アルキルフ
ェニル)マレイミド、N−ジアルコキシフェニルマレイ
ミド、N−(2−クロロフェニル)マレイミド、2,3
−ジクロロ−N−(2,6−ジエチルフェニル)マレイ
ミド、2,3−ジクロロ−N−(2−エチル−6−メチ
ルフェニル)マレイミドの如きN−(置換又は非置換フ
ェニル)マレイミド;N−ベンジル−2,3−ジクロロ
マレイミド、N−(4’−フルオロフェニル)−2,3
−ジクロロマレイミドの如きハロゲンを有するマレイミ
ド;ヒドロキシフェニルマレイミドの如き水酸基を有す
るマレイミド;N−(4−カルボキシ−3−ヒドロキシ
フェニル)マレイミドの如きカルボキシ基を有するマレ
イミド;N−メトキシフェニルマレイミドの如きアルコ
キシ基を有するマレイミド;N−[3−(ジエチルアミ
ノ)プロピル]マレイミドの如きアミノ基を有するマレ
イミド;N−(1−ピレニル)マレイミドの如き多環芳
香族マレイミド;N−(ジメチルアミノ−4−メチル−
3−クマリニル)マレイミド、N−(4−アニリノ−1
−ナフチル)マレイミドの如き複素環を有するマレイミ
ド、などが挙げられる。
Composition (C) containing crosslinkable polymerizable compound
Examples of the monofunctional maleimide-based monomer which can be mixed and used include N-alkylmaleimides such as N-methylmaleimide, N-ethylmaleimide, N-butylmaleimide and N-dodecylmaleimide; N-alicyclic rings such as N-cyclohexylmaleimide Group maleimide; N-benzylmaleimide; N-phenylmaleimide, N- (alkylphenyl) maleimide, N-dialkoxyphenylmaleimide, N- (2-chlorophenyl) maleimide, 2,3
N- (substituted or unsubstituted phenyl) maleimide such as -dichloro-N- (2,6-diethylphenyl) maleimide, 2,3-dichloro-N- (2-ethyl-6-methylphenyl) maleimide; N-benzyl -2,3-dichloromaleimide, N- (4'-fluorophenyl) -2,3
Maleimide having a halogen such as dichloromaleimide; maleimide having a hydroxyl group such as hydroxyphenylmaleimide; maleimide having a carboxy group such as N- (4-carboxy-3-hydroxyphenyl) maleimide; and alkoxy group such as N-methoxyphenylmaleimide. Maleimide having an amino group such as N- [3- (diethylamino) propyl] maleimide; polycyclic aromatic maleimide such as N- (1-pyrenyl) maleimide; N- (dimethylamino-4-methyl-
3-coumarinyl) maleimide, N- (4-anilino-1)
And maleimides having a heterocyclic ring such as -naphthyl) maleimide.

【0030】架橋重合性化合物を含有する組成物(C)
には、必要に応じて、光重合開始剤、溶剤、増粘剤、改
質剤、着色剤、などのその他の成分を混合して使用する
ことができる。
Composition (C) containing crosslinkable polymerizable compound
If necessary, other components such as a photopolymerization initiator, a solvent, a thickener, a modifier, and a colorant can be mixed and used.

【0031】架橋重合性化合物を含有する組成物(C)
に必要に応じて混合使用することができる光重合開始剤
は、本発明で使用するエネルギー線に対して活性であ
り、エネルギー線硬化性化合物を重合させることが可能
なものであれば、特に制限はなく、例えば、ラジカル重
合開始剤、アニオン重合開始剤、カチオン重合開始剤で
あって良い。そのような光重合開始剤としては、例え
ば、p−tert−ブチルトリクロロアセトフェノン、2,
2′−ジエトキシアセトフェノン、2−ヒドロキシ−2
−メチル−1−フェニルプロパン−1−オンの如きアセ
トフェノン類;ベンゾフェノン、4、4′−ビスジメチ
ルアミノベンゾフェノン、2−クロロチオキサントン、
2−メチルチオキサントン、2−エチルチオキサント
ン、2−イソプロピルチオキサントンの如きケトン類;
ベンゾイン、ベンゾインメチルエーテル、ベンゾインイ
ソプロピルエーテル、ベンゾインイソブチルエーテルの
如きベンゾインエーテル類;ベンジルジメチルケター
ル、ヒドロキシシクロヘキシルフェニルケトンの如きベ
ンジルケタール類;N−アジドスルフォニルフェニルマ
レイミドなどのアジドなどが挙げられる。また、マレイ
ミド系化合物などの重合性光重合開始剤を挙げることが
できる。
Composition (C) containing a crosslinkable polymerizable compound
The photopolymerization initiator, which can be mixed and used as required, is particularly limited as long as it is active with respect to the energy ray used in the present invention and can polymerize the energy ray-curable compound. However, for example, a radical polymerization initiator, an anionic polymerization initiator, or a cationic polymerization initiator may be used. As such a photopolymerization initiator, for example, p-tert-butyltrichloroacetophenone, 2,2
2'-diethoxyacetophenone, 2-hydroxy-2
Acetophenones such as -methyl-1-phenylpropan-1-one; benzophenone, 4,4'-bisdimethylaminobenzophenone, 2-chlorothioxanthone,
Ketones such as 2-methylthioxanthone, 2-ethylthioxanthone and 2-isopropylthioxanthone;
Benzoin ethers such as benzoin, benzoin methyl ether, benzoin isopropyl ether and benzoin isobutyl ether; benzyl ketals such as benzyl dimethyl ketal and hydroxycyclohexyl phenyl ketone; azides such as N-azidosulfonyl phenyl maleimide; Further, a polymerizable photopolymerization initiator such as a maleimide-based compound can be used.

【0032】重合性光重合開始剤は、例えば、エネルギ
ー線硬化性化合物として例示した多官能マレイミドの如
き多官能モノマーの他、組成物(C)に混合使用できる
単官能マレイミド系モノマーとして例示した単官能モノ
マーであっても良い。
The polymerizable photopolymerization initiator is, for example, a monofunctional maleimide monomer exemplified as a monofunctional maleimide monomer which can be mixed and used in the composition (C), in addition to a polyfunctional monomer such as a polyfunctional maleimide exemplified as an energy ray-curable compound. It may be a functional monomer.

【0033】架橋重合性化合物を含有する組成物(C)
に光重合開始剤を混合使用する場合の使用量は、非重合
性光重合開始剤の場合、0.005〜20重量%の範囲
が好ましく、0.01〜2重量%の範囲が特に好まし
い。
Composition (C) containing a crosslinkable polymerizable compound
When a non-polymerizable photopolymerization initiator is used by mixing with a photopolymerization initiator, the amount used is preferably in the range of 0.005 to 20% by weight, and particularly preferably in the range of 0.01 to 2% by weight.

【0034】架橋重合性化合物を含有する組成物(C)
に必要に応じて混合使用することができる増粘剤として
は、例えば、架橋重合性化合物に可溶でゲルに不溶なリ
ニアポリマーが挙げられる。
Composition (C) containing crosslinkable polymerizable compound
Examples of the thickener that can be mixed and used as necessary include a linear polymer that is soluble in a crosslinkable polymerizable compound and insoluble in a gel.

【0035】架橋重合性化合物を含有する組成物(C)
に必要に応じて混合使用することができる改質剤として
は、例えば、撥水剤として機能するシリコンオイルやフ
ッ素置換炭化水素などが挙げられる。
Composition (C) containing a crosslinkable polymerizable compound
Examples of the modifier which can be mixed and used as needed include, for example, silicone oil and fluorine-substituted hydrocarbon which function as a water repellent.

【0036】架橋重合性化合物を含有する組成物(C)
に必要に応じて混合使用することができる着色剤として
は、任意の染料や顔料、蛍光色素が挙げられる。
Composition (C) containing crosslinkable polymerizable compound
Examples of the colorant that can be mixed and used as needed include arbitrary dyes, pigments, and fluorescent dyes.

【0037】本発明の第1の製造方法は、部材(B)に
架橋重合性化合物を含有する組成物(C)を塗布し、次
いで架橋重合性化合物を含有する組成物(C)が流動性
を喪失し、かつ未反応の重合性基が残存し、接着性を喪
失しない程度に半硬化させた状態で、部材(B)の架橋
重合性化合物を含有する組成物(C)からなる塗布面
(b)と部材(A)の溝を有する面(a)とを接触させ、その
状態で架橋重合性化合物を含有する組成物(C)を完全
に硬化させることにより、部材(A)と部材(B)とを
接着させる方法である。
In the first production method of the present invention, the composition (C) containing the crosslinkable polymerizable compound is applied to the member (B), and then the composition (C) containing the crosslinkable polymerizable compound is applied to the fluidity. And the unreacted polymerizable group remains and is semi-cured to the extent that adhesiveness is not lost, and the member (B) is coated with the crosslinked polymerizable compound-containing composition (C).
(b) is brought into contact with the grooved surface (a) of the member (A), and in this state, the composition (C) containing the crosslinkable polymerizable compound is completely cured, whereby the member (A) and the member (A) (B).

【0038】部材(B)に架橋重合性化合物を塗布する
方法としては、部材(B)の上に塗布できる任意の塗布
方法を用いることができ、例えば、スピンコート法、ロ
ーラーコート法、流延法、ディッピング法、スプレー
法、バーコーターを用いる方法、X−Yアプリケータに
よる方法、スクリーン印刷法、凸版印刷法、グラビア印
刷法、などが挙げられる。塗布部位は任意であり、部材
(B)の部材(A)と接触する面全体であっても、部分
的であっても良いが、接着後形成されるキャピラリーの
周囲を囲む部位であることが好ましい。部材(B)の部
材(A)と接触する面以外の面にも塗布されてもかまわ
ない。塗布厚みも任意である。部分的に塗布する場合、
例えば、部材(A)の溝部に対面する位置を避けて塗布
する場合には、X−Yアプリケーターを用いる方法や各
種印刷法などにより実施することができる。
As a method for applying the crosslinkable polymerizable compound to the member (B), any coating method that can be applied on the member (B) can be used. For example, spin coating, roller coating, casting, etc. Methods, a dipping method, a spray method, a method using a bar coater, a method using an XY applicator, a screen printing method, a letterpress printing method, a gravure printing method, and the like. The application site is arbitrary and may be the entire surface of the member (B) in contact with the member (A) or may be a partial surface, but may be a site surrounding the capillary formed after bonding. preferable. The coating may be applied to a surface of the member (B) other than the surface in contact with the member (A). The coating thickness is also arbitrary. When applying partially,
For example, in the case where the coating is performed while avoiding the position facing the groove of the member (A), it can be performed by a method using an XY applicator, various printing methods, or the like.

【0039】架橋重合性化合物の未硬化の塗布物は、架
橋重合性化合物の種類に応じて、加熱、加湿、エネルギ
ー線照射などにより、ゲル化点以上で、且つ未反応の重
合性反応基が残存する程度に半硬化させる。ゲル化点と
は、塗膜中で架橋重合が進行し、塗膜全体にわたって、
網目中に未反応の架橋重合性化合物を吸蔵した網目状の
ポリマーが形成される反応時点を指し、重合反応がゲル
化点を過ぎると塗膜は流動性を喪失する。
The uncured coating of the cross-linkable polymerizable compound may be heated, humidified, irradiated with energy rays, or the like, depending on the type of the cross-linkable polymerizable compound, so that the unreacted polymerizable reactive group has a temperature above the gel point. Semi-cured to the extent that it remains. The gel point means that cross-linking polymerization proceeds in the coating film, and the entire coating film
A reaction point at which a network-like polymer having an unreacted crosslinked polymerizable compound inserted in the network is formed. When the polymerization reaction has passed the gel point, the coating film loses fluidity.

【0040】本発明の製造方法においては、部材(B)
に塗布された架橋重合性化合物の塗膜の流動性が無くな
った状態で部材(A)と積層する。これにより、架橋重
合性化合物が部材(A)の溝に入り込むことを阻止でき
る。一方、重合が進行しすぎ、未反応の重合性反応基が
過少になると、塗膜が柔軟性を失うと共に接着性が低下
し、部材(A)との接着が不完全となりがちである。好
適な半硬化の程度は、使用する系での簡単な実験により
最適値を求めることができる。
In the manufacturing method of the present invention, the member (B)
Is laminated with the member (A) in a state where the fluidity of the coating film of the cross-linkable polymerizable compound applied to the film is lost. This can prevent the crosslinkable polymerizable compound from entering the groove of the member (A). On the other hand, if the polymerization proceeds too much and the amount of unreacted polymerizable reactive groups becomes too small, the coating film loses flexibility and the adhesiveness is reduced, and the adhesion to the member (A) tends to be incomplete. A suitable degree of semi-curing can be determined by simple experiments in the system used.

【0041】なお、半硬化状態の塗膜は粘着性を示す場
合もあるが、本発明においては、粘着性を示す必要はな
い。半硬化の塗膜の粘着性の強さは架橋重合性化合物の
化学構造に大きく依存するが、粘着性の強さと、接着力
の強さとは無関係である。一般的に言って、架橋した半
硬化塗膜の粘着性は低い傾向にある。
The semi-cured coating film may show tackiness in some cases, but in the present invention, it is not necessary to show tackiness. The adhesive strength of the semi-cured coating film largely depends on the chemical structure of the crosslinkable polymerizable compound, but is independent of the adhesive strength and the adhesive strength. Generally speaking, the tackiness of cross-linked semi-cured coatings tends to be low.

【0042】架橋重合性化合物を含有する組成物(C)
からなる塗膜を半硬化させた後、部材(B)の塗布面と
部材(A)の溝を有する面とを接触させ、その状態でさ
らに硬化させ、架橋重合性化合物を完全に硬化させる。
ここで言う完全硬化とは、十分な接着力を生じる程度の
硬化を指し、必ずしも、架橋重合性基が完全に消失する
必要はない。架橋重合性化合物がエネルギー線硬化性化
合物である場合には、部材(A)と部材(B)の接着面
に、部材(A)及び/又は部材(B)の外部からエネル
ギー線を照射することにより硬化させる。
Composition (C) containing a crosslinkable polymerizable compound
After semi-curing of the coating film composed of, the coated surface of the member (B) is brought into contact with the grooved surface of the member (A), and further cured in that state, whereby the crosslinked polymerizable compound is completely cured.
The term “complete curing” as used herein refers to curing to the extent that a sufficient adhesive force is generated, and it is not always necessary to completely eliminate the crosslinkable polymerizable group. When the crosslinkable polymerizable compound is an energy ray-curable compound, the bonding surface between the member (A) and the member (B) is irradiated with energy rays from outside the member (A) and / or the member (B). To cure.

【0043】半硬化及び完全硬化に用いることのできる
エネルギー線としては、架橋重合性化合物を硬化させる
ことが可能なものであり、完全硬化に用いることのでき
るエネルギー線としては、さらに部材(A)及び/又は
部材(B)を透過するものである。このようなエネルギ
ー線としては、紫外線、可視光線、赤外線などの光線;
エックス線、ガンマ線等の電離放射線;電子線、イオン
ビーム、ベータ線、重粒子線等の粒子線が挙げられる
が、取り扱い性や硬化速度の面から紫外線及び可視光が
好ましく、紫外線が特に好ましい。硬化速度を速め、硬
化を完全に行なう目的で、エネルギー線の照射を低酸素
濃度雰囲気で行なうことが好ましい。低酸素濃度雰囲気
としては、窒素気流中、二酸化炭素気流中、アルゴン気
流中、真空又は減圧雰囲気が好ましい。半硬化に使用す
るエネルギー線と完全硬化に使用するエネルギー線は同
じである必要はない。
The energy rays that can be used for the semi-curing and the complete curing are those that can cure the crosslinkable polymerizable compound, and the energy rays that can be used for the complete curing include the member (A) And / or through the member (B). Examples of such energy rays include light rays such as ultraviolet rays, visible light rays, and infrared rays;
Ionizing radiations such as X-rays and gamma rays; and electron beams, ion beams, beta rays, heavy particle beams and the like, but ultraviolet rays and visible lights are preferred from the viewpoint of handleability and curing speed, and ultraviolet rays are particularly preferred. For the purpose of accelerating the curing speed and performing the curing completely, it is preferable to perform the irradiation of the energy rays in a low oxygen concentration atmosphere. The low oxygen concentration atmosphere is preferably a nitrogen stream, a carbon dioxide stream, an argon stream, a vacuum or a reduced pressure atmosphere. The energy beam used for semi-curing and the energy beam used for complete curing need not be the same.

【0044】本発明の第2の製造方法は、部材(A)の
溝が形成された面(a)に、 溝の深さの1/10000〜
1/2の厚さに架橋重合性化合物を含有する組成物
(C’)を、部材(B)に架橋重合性化合物を含有する
組成物(C)をそれぞれ塗布し、次いで架橋重合性化合
物を含有する組成物(C)及び組成物(C’)が流動性
を喪失し、かつ未反応の重合性基が残存する程度に半硬
化させた状態で、部材(A)の半硬化した架橋重合性化
合物を含有する組成物(C’)からなる塗布面(a')と、
部材(B)の半硬化した架橋重合性化合物を含有する組
成物(C)からなる塗布面(b')とを接触させ、その状態
で架橋重合性化合物を含有する組成物(C)及び組成物
(C’)を完全に硬化させることにより接着する方法で
ある。
According to the second manufacturing method of the present invention, the surface (a) where the groove of the member (A) is formed has a thickness of 1/10000 of the depth of the groove.
A composition (C ′) containing the cross-linkable polymerizable compound and a composition (C) containing the cross-linkable polymerizable compound are applied to the member (B) to a thickness of 2, respectively. In a state in which the composition (C) and the composition (C ′) to be contained lose fluidity and are semi-cured to the extent that unreacted polymerizable groups remain, semi-cured cross-linked polymerization of the member (A) A coating surface (a ′) composed of a composition (C ′) containing a reactive compound,
The composition (C) containing the crosslinked polymerizable compound and the composition in that state are brought into contact with the coated surface (b ′) of the composition (C) containing the semi-cured crosslinked polymerizable compound of the member (B) and in that state This is a method in which the object (C ′) is completely cured so as to be bonded.

【0045】即ち、本発明の第2の製造方法は、部材
(A)にも特定の厚みの架橋重合性化合物を含有する組
成物(C’)を塗布し、該塗膜を半硬化させた後、同じ
く塗膜を半硬化させた部材(B)と接着する点が本発明
の第1の製造方法と異なる。
That is, in the second production method of the present invention, the composition (C ′) containing the crosslinked polymerizable compound having a specific thickness was applied to the member (A), and the coating was semi-cured. Thereafter, the second embodiment is different from the first production method of the present invention in that the film is adhered to the member (B) in which the coating film is also semi-cured.

【0046】部材(A)に塗布される組成物(C’)の
量は、部材(B)上の組成物(C)からなる塗膜がなけ
れば、部材(A)と部材(B)間に間隙を生じたり、接
着が不完全となるようなごく薄いもので良く、その厚み
は、溝の深さの1/10000以上である。勿論、溝の
深さが、例えば、1μm程度とごく浅い時には、1/1
0000より大きな値が実際的な下限となる場合もあり
得る。しかし、該塗膜は、必ずしも完全に部材(A)の
凹部以外の表面を覆っている必要はなく、例えば、分子
的な間隙があっても良い。これより薄いと、本発明の第
1の製造方法と効果面で差がなくなる。部材(A)に塗
布される組成物(C’)からなる塗膜の厚みは、溝の深
さの1/2以下であり、1/10以下であることが好ま
しく、1/100以下であることが更に好ましい。これ
より厚いと、組成物(C’)を塗布した際、組成物
(C’)が溝を埋め、部材(A)と部材(B)間に形成
されるキャピラリーが閉塞しがちとなるので、好ましく
ない。
The amount of the composition (C ') applied to the member (A) is determined by the amount of the composition (C) on the member (B) if there is no coating film of the composition (C) on the member (B). It may be very thin such that a gap is formed or adhesion is incomplete, and its thickness is 1 / 10,000 or more of the depth of the groove. Of course, when the depth of the groove is as shallow as about 1 μm, for example, 1/1
A value greater than 0000 may be a practical lower limit. However, the coating film does not necessarily need to completely cover the surface of the member (A) other than the concave portions, and may have a molecular gap, for example. If the thickness is smaller than this, there is no difference in effect from the first manufacturing method of the present invention. The thickness of the coating film composed of the composition (C ′) applied to the member (A) is 1 / or less of the groove depth, preferably 1/10 or less, and is 1/100 or less. Is more preferred. If the thickness is larger than this, when the composition (C ′) is applied, the composition (C ′) fills the groove, and the capillary formed between the member (A) and the member (B) tends to be closed. Not preferred.

【0047】組成物(C’)を構成する架橋重合性化合
物は、本発明の第1の製造方法で使用できる架橋重合性
化合物として挙げた群から選ぶことができる。組成物
(C’)については、本発明の第1の製造方法で使用す
る組成物(C)と同様である。組成物(C’)は組成物
(C)と同じであっても異なっていても良いが、異なる
場合には、互いに接着可能なものである必要があり、そ
れぞれに含有される架橋重合性化合物が互いに重合可能
なものであることが好ましく、同じ硬化方法で硬化する
ものであることがさらに好ましい。組成物(C’)は組
成物(C)と同じものであることが好ましい。また、薄
く塗布するために、組成物(C’)は揮発性溶剤を含有
するものであることも好ましい。組成物(C’)の塗布
方法、組成物(C’)の硬化方法等については、本発明
の第1の製造方法で組成物(C)に関して述べたと同様
である。組成物(C’)が揮発性溶剤を含有するもので
ある場合には、半硬化の前又は後で、かつ部材(A)と
の接着前に溶剤を除去する必要がある。これ以外の部
分、例えば、部材(A)、部材(B)、組成物(C)に
関すること、エネルギー線、塗布方法、半硬化や硬化方
法に関すること、その他に関しては、本発明の第1の製
造方法の場合と同様である。
The crosslinkable polymerizable compound constituting the composition (C ′) can be selected from the group described as the crosslinkable polymerizable compound that can be used in the first production method of the present invention. The composition (C ′) is the same as the composition (C) used in the first production method of the present invention. The composition (C ′) may be the same as or different from the composition (C), but if different, it is necessary that the composition (C ′) can adhere to each other, and the crosslinkable polymerizable compound contained in each of them Are preferably polymerizable with each other, and are more preferably cured by the same curing method. The composition (C ′) is preferably the same as the composition (C). In order to apply thinly, it is also preferable that the composition (C ′) contains a volatile solvent. The method for applying the composition (C ′), the method for curing the composition (C ′), and the like are the same as those described for the composition (C) in the first production method of the present invention. When the composition (C ′) contains a volatile solvent, the solvent needs to be removed before or after semi-curing and before bonding to the member (A). Regarding other parts, for example, regarding the member (A), the member (B), the composition (C), the energy ray, the coating method, the semi-curing or curing method, and the like, the first production of the present invention Similar to the method.

【0048】本発明の第2の製造方法は、本発明の第1
の製造方法で得られる微小ケミカルデバイスと比べて、
接着強度を高くすることが容易であり、高い流体圧力で
の使用が可能である。また、本発明の第1の製造方法と
比べて、組成物(C)塗膜の半硬化の程度の許容範囲が
広くなり、製造が容易である。
The second manufacturing method of the present invention is the same as the first manufacturing method of the present invention.
Compared with microchemical devices obtained by the manufacturing method of
It is easy to increase the adhesive strength and can be used at a high fluid pressure. Further, as compared with the first production method of the present invention, the allowable range of the degree of semi-curing of the coating film of the composition (C) is widened, and the production is easy.

【0049】本発明の第3の製造方法は、部材(B)に
架橋重合性化合物を含有する組成物(C)を塗布し、次
いで架橋重合性化合物を含有する組成物(C)が流動性
を喪失し、かつ未反応の重合性基が残存する程度に半硬
化させた状態で、部材(B)の架橋重合性化合物を含有
する組成物(C)からなる塗布面(b")と、部材(A)の
溝が形成された面(a)に、 溝の深さの1/10000〜
1/10の厚さに架橋重合性化合物を含有する組成物
(C”)を塗布し、該塗布面(a")とを接触させ、その状
態で架橋重合性化合物を含有する組成物(C)及び架橋
重合性化合物を含有する組成物(C”)を完全に硬化さ
せることにより接着する方法である。
In the third production method of the present invention, the composition (C) containing the crosslinkable polymerizable compound is applied to the member (B), and then the composition (C) containing the crosslinkable polymerizable compound is applied to the fluidity. And the coated surface (b ") of the composition (C) containing the cross-linkable polymerizable compound of the member (B), in a state of being semi-cured to the extent that unreacted polymerizable groups remain, and On the surface (a) where the groove of the member (A) is formed, 1/1000 of the depth of the groove
A composition (C ″) containing a cross-linkable polymerizable compound is applied to a thickness of 1/10, and the coated surface (a ″) is brought into contact with the composition (C ″). )) And the composition (C ″) containing the cross-linkable polymerizable compound are completely cured to bond the composition.

【0050】即ち、本発明の第3の製造方法は、部材
(A)に塗布した架橋重合性化合物を含有する組成物
(C”)の塗膜を半硬化させずに部材(B)と接着する
点において、本発明の第2の製造方法と異なる。
That is, in the third production method of the present invention, the coating of the composition (C ″) containing the crosslinkable polymerizable compound applied to the member (A) is bonded to the member (B) without semi-curing. This is different from the second manufacturing method of the present invention.

【0051】部材(A)に塗布される組成物(C”)の
量は、部材(B)上の組成物(C)からなる塗膜がなけ
れば、部材(A)と部材(B)間に間隙を生じたり、接
着が不完全となるようなごく薄いもので良く、その厚み
は溝の深さの1/10000以上である。勿論、溝の深
さが、例えば、1μm程度とごく浅い時には、1/10
000より大きな値が実際的な下限となる場合もあり得
る。しかし、該塗膜は必ずしも完全に部材(A)の凹部
以外の表面を覆っている必要はなく、例えば、分子的な
間隙があっても良い。これより薄いと、本発明の第1の
製造方法と効果面で差がなくなる。塗膜の厚みは溝の深
さの1/10以下であり、1/30以下であることが好
ましく、1/100以下であることが更に好ましい。こ
れより厚いと、部材(A)と部材(B)を接触させた
際、組成物(C”)が流動して溝を埋め、部材(A)と
部材(B)間に形成されるキャピラリーを閉塞しがちと
なるので好ましくない。
The amount of the composition (C ″) applied to the member (A) is determined by the amount of the composition (C ″) between the member (A) and the member (B) unless there is a coating film composed of the composition (C) on the member (B). The thickness of the groove may be as small as 1 / 10,000 or more of the depth of the groove, and the depth of the groove may be as shallow as, for example, about 1 μm. Sometimes 1/10
A value greater than 000 may be a practical lower limit. However, the coating does not necessarily have to completely cover the surface of the member (A) other than the concave portions, and may have, for example, a molecular gap. If the thickness is smaller than this, there is no difference in effect from the first manufacturing method of the present invention. The thickness of the coating film is 1/10 or less, preferably 1/30 or less, more preferably 1/100 or less of the depth of the groove. When the thickness is larger than this, when the member (A) and the member (B) are brought into contact, the composition (C ″) flows to fill the groove, and the capillary formed between the member (A) and the member (B) is formed. It is not preferable because it tends to be blocked.

【0052】組成物(C”)を構成する架橋重合性化合
物は、本発明の第1の製造方法で使用できる架橋重合性
化合物として挙げた群から選ぶことができる。組成物
(C”)については、本発明の第1の製造方法で使用す
る組成物(C)と同様である。組成物(C”)は組成物
(C)と同じであっても異なっていても良いが、異なる
場合には、互いに接着可能なものである必要があり、そ
れぞれに含有される架橋重合性化合物が互いに重合可能
なものであることが好ましく、同じ架橋重合性化合物を
含有するものであることがさらに好ましい。組成物
(C”)は組成物(C)と同じものであることも好まし
い。また、薄く塗布するために、組成物(C”)は揮発
性溶剤を含有するものであることも好ましい。組成物
(C”)の塗布方法、組成物(C”)の硬化方法等につ
いては、本発明の第1の製造方法で組成物(C)に関し
て述べたと同様である。組成物(C”)が揮発性溶剤を
含有するものである場合には、部材(A)との接着前に
溶剤を除去する必要がある。これ以外の部分、例えば、
部材(A)、部材(B)、組成物(C)に関すること、
エネルギー線、塗布方法、硬化方法に関すること、その
他に関しては、本発明の第1の製造方法の場合と同様で
ある。
The crosslinkable polymerizable compound constituting the composition (C ″) can be selected from the group described as the crosslinkable polymerizable compound that can be used in the first production method of the present invention. Is the same as the composition (C) used in the first production method of the present invention. The composition (C ″) may be the same as or different from the composition (C), but if different, it is necessary that the composition (C ″) can adhere to each other, and the crosslinkable polymerizable compound contained in each Are preferably polymerizable with each other, and more preferably contain the same crosslinkable polymerizable compound.The composition (C ″) is also preferably the same as the composition (C). In order to apply the composition thinly, the composition (C ") preferably contains a volatile solvent. The method for applying the composition (C") and the method for curing the composition (C ") are described below. This is the same as that described for the composition (C) in the first production method of the present invention.If the composition (C ″) contains a volatile solvent, the composition before bonding to the member (A) is used. It is necessary to remove the solvent. Other parts, for example,
Items relating to the member (A), the member (B), and the composition (C);
Regarding the energy beam, the coating method, the curing method, and the like, they are the same as those of the first manufacturing method of the present invention.

【0053】本発明の第3の製造方法は、本発明の第1
の製造方法で得られる微小ケミカルデバイスと比べて、
接着強度を高くすることが容易であり、高い流体圧力で
の使用が可能である。また、本発明の第1の製造方法と
比べて、組成物(C)塗膜の半硬化の程度の許容範囲が
広くなり、製造が容易である。
The third manufacturing method of the present invention is the first manufacturing method of the present invention.
Compared with microchemical devices obtained by the manufacturing method of
It is easy to increase the adhesive strength and can be used at a high fluid pressure. Further, as compared with the first production method of the present invention, the allowable range of the degree of semi-curing of the coating film of the composition (C) is widened, and the production is easy.

【0054】[0054]

【実施例】以下、実施例及び比較例を用いて、本発明を
更に詳細に説明するが、本発明はこれらの実施例の範囲
に限定されるものではない。なお、以下の実施例におい
て、「部」及び「%」は、特に断りがない限り、各々
「重量部」及び「重量%」を表わす。
The present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to the scope of these examples. In the following examples, “parts” and “%” represent “parts by weight” and “% by weight”, respectively, unless otherwise specified.

【0055】<実施例1> 〔部材(A)の作製〕アクリル樹脂(旭化成工業株式会
社製の「デルペット670N」)製の厚さ3mmの平板の
表面上に、1,6−ヘキサンジオールジアクリレート
(日本化薬株式会社製の「カヤラッドHDDA」)10
0部、及び紫外線重合開始剤1−ヒドロキシシクロヘキ
シルフェニルケトン(チバガイギー社製の「イルガキュ
アー184」)2部からなる混合物を25μmのバーコ
ーターを用いて塗布した。次に、図1に示した形状の溝
(2)となる部分に照射される紫外線を遮断するフォト
マスクを介して、ウシオ電機株式会社製のマルチライト
200型露光装置用光源ユニットを用いて、窒素雰囲気
中で10mW/cm2の紫外線を10秒間照射した。紫外
線照射後、エタノールにて未硬化物を洗浄除去した後、
アクリル樹脂板を2.5cm×2.5cmに切断して、図1
に示した形状の幅25μm×深さ26μmの溝(2)が
形成された部材(A)[A−1](1)を作製した。
<Example 1> [Preparation of member (A)] A 1,6-hexanedioldiamine was placed on the surface of a 3 mm-thick flat plate made of an acrylic resin ("Delpet 670N" manufactured by Asahi Kasei Corporation). Acrylate (“Kayarad HDDA” manufactured by Nippon Kayaku Co., Ltd.) 10
A mixture consisting of 0 parts and 2 parts of an ultraviolet polymerization initiator 1-hydroxycyclohexylphenyl ketone (“Irgacure 184” manufactured by Ciba Geigy) was applied using a 25 μm bar coater. Next, using a light source unit for a multi-light 200 type exposure apparatus manufactured by Ushio Inc., through a photomask for blocking ultraviolet rays irradiated to a portion to be the groove (2) having the shape shown in FIG. Ultraviolet rays of 10 mW / cm 2 were irradiated for 10 seconds in a nitrogen atmosphere. After UV irradiation, wash and remove uncured material with ethanol,
The acrylic resin plate was cut into 2.5 cm x 2.5 cm,
(A) [A-1] (1) in which a groove (2) having a width of 25 μm and a depth of 26 μm having the shape shown in FIG.

【0056】〔部材(B)の作製〕部材(A)で使用し
たと同じアクリル樹脂の平板を切断して、2.5cm×
2.5cm×3mmの板状の部材(B)[B−1]を得た。
[Preparation of Member (B)] The same acrylic resin flat plate as used in the member (A) was cut and cut into 2.5 cm ×
A 2.5 cm × 3 mm plate-shaped member (B) [B-1] was obtained.

【0057】〔組成物(C)の調製〕4エチレンオキサ
イド変性ビスフェノールAジアクリレート(第一工業株
式会社製の「BPE−4」)100部及び紫外線重合開
始剤1−ヒドロキシシクロヘキシルフェニルケトン(チ
バガイギー社製「イルガキュアー 184」)0.02
部からなる組成物(C)[C−1]を調製した。
[Preparation of composition (C)] 100 parts of ethylene oxide-modified bisphenol A diacrylate ("BPE-4" manufactured by Daiichi Kogyo Co., Ltd.) and 1-hydroxycyclohexyl phenyl ketone (UV initiator) (Ciba Geigy) "Irgacure 184") 0.02
A composition (C) [C-1] consisting of 3 parts by weight was prepared.

【0058】〔接着〕部材(B)[B−1](3)の
2.5cm×2.5cmの一方の面の全体に、塗工ローラー
を用いて、組成物(C)[C−1]を厚み約30μmに
塗布し、ウシオ電機株式会社製のマルチライト200型
露光装置用光源ユニットを用いて、窒素ガス雰囲気(酸
素濃度約2%)中で10mW/cm2 の紫外線を1秒間照
射して、半硬化させた。
[Adhesion] Using a coating roller, the composition (C) [C-1] was applied to one entire surface of the member (B) [B-1] (3) measuring 2.5 cm × 2.5 cm. Is applied to a thickness of about 30 μm, and irradiated with ultraviolet light of 10 mW / cm 2 for 1 second in a nitrogen gas atmosphere (oxygen concentration of about 2%) using a light source unit for a Multilight 200 type exposure apparatus manufactured by Ushio Inc. And semi-cured.

【0059】窒素ガス雰囲気(酸素濃度約2%)中に
て、塗膜を半硬化させた部材(B)[B−1](3)の
塗布面と、部材(A)[A−1](1)を溝の形成され
た面とが接触するように積層し、クランプにて約100
kNの力で挟み、挟んだ時点から約3秒後に、10秒
間、3kwメタルハライドランプ2本を用いて、表裏両
側からそれぞれ60mW/cm2の紫外線を同時に照射す
ることにより、 組成物(C)[C−1]を硬化させて
接着して、図2に示した形状の微小ケミカルデバイス
[D−1]を得た。
In a nitrogen gas atmosphere (oxygen concentration: about 2%), the coating surface of the member (B) [B-1] (3) obtained by semi-curing the coating film and the member (A) [A-1] (1) is laminated so that the surface on which the groove is formed is in contact with the surface, and about 100 mm is clamped.
Approximately 3 seconds from the point of sandwiching with the force of kN, and simultaneously irradiating 60 mW / cm 2 of ultraviolet light from both the front and back sides simultaneously using two 3 kW metal halide lamps for 10 seconds, the composition (C) [ C-1] was cured and bonded to obtain a microchemical device [D-1] having the shape shown in FIG.

【0060】また、クランプで挟んだ時点から約60秒
後に紫外線の照射を開始した以外は同様にして、微小ケ
ミカルデバイス[D−1’]を得た。
A microchemical device [D-1 '] was obtained in the same manner except that ultraviolet irradiation was started about 60 seconds after the clamp.

【0061】なお、確認のため、別途、塗膜を半硬化さ
せた部材(B)[B−1]から塗膜を掻き取ったとこ
ろ、塗膜はゲル状であり、流動性を示さなかった。
For confirmation, the coating was separately scraped off from the member (B) [B-1] in which the coating was semi-cured. As a result, the coating was gel-like and did not show fluidity. .

【0062】〔流通及び漏洩試験〕得られた微小ケミカ
ルデバイス[D−1]のキャピラリー開口部(4)から
マラカイトグリーン(和光純薬株式会社製)にて着色し
た水を導入したところ、キャピラリーの閉塞は認められ
なかった。次いで、キャピラリーに0.1MPaの水圧
を掛けた状態で1時間静置する試験を行ったが、キャピ
ラリー部から部材(A)[A−1]と部材(B)[B−
1]の間隙への水の漏洩や、部材(A)[A−1]と部
材(B)[B−1]の剥離は認められなかった。
[Distribution and Leakage Test] Water colored with malachite green (manufactured by Wako Pure Chemical Industries, Ltd.) was introduced from the capillary opening (4) of the obtained microchemical device [D-1]. No obstruction was observed. Next, a test was performed in which the capillary was allowed to stand still for 1 hour in a state where a water pressure of 0.1 MPa was applied, and the members (A) [A-1] and (B) [B-
No leakage of water into the gap of [1] and separation of the member (A) [A-1] from the member (B) [B-1] were observed.

【0063】また、微小ケミカルデバイス[D−1’]
についても全く同様であった。即ち、半硬化した組成物
(C)[C−1]が流動してキャピラリーを閉塞するこ
とがないことが確認された。
Further, a microchemical device [D-1 ']
The same was true for. That is, it was confirmed that the semi-cured composition (C) [C-1] did not flow to block the capillary.

【0064】<実施例2> 〔微小ケミカルデバイスの作製〕実施例1において、
組成物(C’)[C’−2]として、組成物(C)[C
−1]の5%エタノール溶液を用いたこと、部材
(A)[A−1]の溝が形成された面全体に組成物
[C’−2]をスプレーし、40℃にて15分間熱風乾
燥することによりエタノールを除去したこと、組成物
(C’)[C’−2]の溶剤除去塗膜が形成された部材
(A)[A−2]に窒素ガス雰囲気中で紫外線を1秒間
照射して半硬化させた後、接着に供したこと、以外は、
実施例1と同様にして、微小ケミカルデバイス[D−
2]を作製した。
<Example 2> [Preparation of microchemical device]
As the composition (C ′) [C′-2], the composition (C) [C
Using the 5% ethanol solution of [-1], and spraying the composition [C'-2] on the entire surface of the member (A) [A-1] where the grooves are formed, and hot air at 40 ° C. for 15 minutes. The ethanol was removed by drying, and the member (A) [A-2] on which the solvent-removed coating film of the composition (C ') [C'-2] was formed was irradiated with ultraviolet rays for 1 second in a nitrogen gas atmosphere. After being irradiated and semi-cured, and then subjected to bonding,
In the same manner as in Example 1, the fine chemical device [D-
2] was produced.

【0065】なお、確認のため、別途、組成物(C)
[C’−2]の溶剤除去塗膜が形成された部材(A)
[A−2]に窒素ガス雰囲気中で紫外線を10秒間照射
して完全硬化させたものの断面を走査型電子顕微鏡によ
って観察し、塗布厚みを測定したところ、約1.3μm
であった。
For confirmation, the composition (C) was separately prepared.
Member (A) on which the solvent-removed coating film of [C'-2] is formed
[A-2] was irradiated with ultraviolet rays for 10 seconds in a nitrogen gas atmosphere and completely cured. The cross section of the cured product was observed with a scanning electron microscope, and the coating thickness was measured to be about 1.3 μm.
Met.

【0066】〔流通及び漏洩試験〕実施例2で得た微小
ケミカルデバイス[D−2]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-2] obtained in Example 2 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0067】<実施例3> 〔微小ケミカルデバイスの作製〕実施例2において、
組成物(C’)[C’−2]の溶剤除去塗膜が形成され
た部材(A)[A−2]に紫外線を照射することなく接
着に供したこと以外は、実施例2と同様にして、微小ケ
ミカルデバイス[D−3]を作製した。
<Example 3> [Preparation of microchemical device]
Same as Example 2 except that the member (A) [A-2] on which the solvent-removed coating film of the composition (C ') [C'-2] was formed was used for adhesion without irradiating ultraviolet rays. Thus, a microchemical device [D-3] was produced.

【0068】なお、確認のため、別途、組成物(C’)
[C’−2]の乾燥物が塗布された部材(A)[A−
2]に窒素ガス中で紫外線を10秒間照射して完全硬化
させたものの断面を走査型電子顕微鏡によって観察し、
塗布厚みを測定したところ、約1.3μmであった。
For confirmation, the composition (C ′) was prepared separately.
Member (A) coated with the dried product of [C′-2] [A-
2] was irradiated with ultraviolet rays in nitrogen gas for 10 seconds and completely cured, and the cross section was observed with a scanning electron microscope.
The measured coating thickness was about 1.3 μm.

【0069】〔流通及び漏洩試験〕実施例3で得た微小
ケミカルデバイス[D−3]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-3] obtained in Example 3 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0070】<実施例4> 〔微小ケミカルデバイスの作製〕実施例1において、
組成物(C)[C−4]としてビスフェノールAタイプ
エポキシ(大日本インキ化学工業(株)製の「エピクロン
857」)とアミンタイプ硬化剤(大日本インキ化学工
業(株)製の「エピクロンB1170−70」)との混合
物(20℃における粘度1100mPa・s)]を使用
したこと、紫外線照射に代えて、25℃にて60分静
置して半硬化させたこと、紫外線照射に代えて、40
℃にて30分静置して完全硬化させたこと、以外は、実
施例1と同様にして、微小ケミカルデバイス[D−4]
を作製した。
<Example 4> [Preparation of microchemical device]
As composition (C) [C-4], a bisphenol A type epoxy ("Epiclon 857" manufactured by Dainippon Ink and Chemicals, Inc.) and an amine type curing agent ("Epiclon B1170" manufactured by Dainippon Ink and Chemicals, Inc.) -70 ") (viscosity at 20 ° C. of 1100 mPa · s)], and instead of ultraviolet irradiation, the mixture was allowed to stand at 25 ° C. for 60 minutes to be semi-cured. 40
Microchemical device [D-4] in the same manner as in Example 1 except that it was left at 30 ° C. for 30 minutes to completely cure.
Was prepared.

【0071】なお、確認のため、別途、塗膜を半硬化さ
せた部材[B−4]から塗膜を掻き取ったところ、塗膜
はゲル状であり、流動性を示さなかった。
For confirmation, when the coating film was separately scraped from the member [B-4] in which the coating film was semi-cured, the coating film was gel-like and did not show fluidity.

【0072】〔流通及び漏洩試験〕実施例4で得た微小
ケミカルデバイス[D−4]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-4] obtained in Example 4 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0073】[実施例5] 〔微小ケミカルデバイスの作製〕実施例1において、組
成物(C)[C−1]に代えて、4エチレンオキサイド
変性ビスフェノールAジアクリレート(第一工業株式会
社製の「BPE−4」)50部及びN−シクロヘキシル
マレイミド(東京化成株式会社製)50部からなる組成
物(C)を使用した以外は、実施例1と同様にして、微
小ケミカルデバイス[D−5]を作製した。
[Example 5] [Production of microchemical device] In Example 1, 4-ethylene oxide-modified bisphenol A diacrylate (manufactured by Daiichi Kogyo Co., Ltd.) was used in place of composition (C) [C-1]. "BPE-4") and a microchemical device [D-5] in the same manner as in Example 1 except that a composition (C) consisting of 50 parts of N-cyclohexylmaleimide (manufactured by Tokyo Chemical Industry Co., Ltd.) was used. ] Was produced.

【0074】〔流通及び漏洩試験〕実施例5で得た微小
ケミカルデバイス[D−5]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-5] obtained in Example 5 was evaluated by performing the same tests as in Example 1, and the same results as in Example 1 were obtained.

【0075】[実施例6] 〔微小ケミカルデバイスの作製〕実施例1において、部
材(B)の素材として、アクリル樹脂に代えて、ポリカ
ーボネート(三菱エンジニアリングプラスチックス株式
会社製んお「ユーピロンS−2000」を使用した以外
は、実施例1と同様にして、微小ケミカルデバイス[D
−6]を作製した。
[Example 6] [Preparation of microchemical device] In Example 1, instead of acrylic resin, polycarbonate (Mitsubishi Engineering Plastics Co., Ltd. “Iupilon S-2000”) was used as the material of the member (B). Is used in the same manner as in Example 1 except that the microchemical device [D
-6].

【0076】〔流通及び漏洩試験〕実施例6で得た微小
ケミカルデバイス[D−6]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-6] obtained in Example 6 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0077】[実施例7] 〔微小ケミカルデバイスの作製〕実施例1において、部
材(B)の素材として、アクリル樹脂に代えて、ポリス
ルホン(アモコ社製の「ユーデル P−1700」)を
使用した以外は、実施例1と同様にして、微小ケミカル
デバイス[D−7]を作製した。
[Example 7] [Preparation of microchemical device] In Example 1, polysulfone ("Udel P-1700" manufactured by Amoco) was used as the material of member (B) instead of acrylic resin. Except for the above, a microchemical device [D-7] was produced in the same manner as in Example 1.

【0078】〔流通及び漏洩試験〕実施例7で得た微小
ケミカルデバイス[D−7]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-7] obtained in Example 7 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0079】[実施例8] 〔微小ケミカルデバイスの作製〕実施例1において、部
材(B)の素材として、アクリル樹脂に代えて、ポリエ
ーテルスルホン(住友化学工業株式会社製の「ヴィクト
レックス 200P」)を使用した以外は、実施例1と
同様にして、微小ケミカルデバイス[D−8]を作製し
た。
[Example 8] [Preparation of microchemical device] In Example 1, instead of acrylic resin, polyether sulfone (“Victrex 200P” manufactured by Sumitomo Chemical Co., Ltd.) was used as the material of the member (B). ) Was prepared in the same manner as in Example 1 except that the microchemical device [D-8] was used.

【0080】〔流通及び漏洩試験〕実施例8で得た微小
ケミカルデバイス[D−8]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-8] obtained in Example 8 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0081】[実施例9] 〔微小ケミカルデバイスの作製〕実施例1において、部
材(B)の素材として、アクリル樹脂に代えて、ポリス
チレン(大日本インキ化学工業株式会社製の「ディック
スチレン XC−520」)を使用した以外は、実施例
1と同様にして、微小ケミカルデバイス[D−9]を作
製した。
[Example 9] [Preparation of microchemical device] In Example 1, polystyrene ("Dick Styrene XC-" manufactured by Dainippon Ink and Chemicals, Inc.) was used as the material of the member (B) instead of acrylic resin. 520 "), except that a microchemical device [D-9] was produced in the same manner as in Example 1.

【0082】〔流通及び漏洩試験〕実施例9で得た微小
ケミカルデバイス[D−9]について、実施例1と同様
の試験を行なって評価したところ、実施例1と同様の結
果を得た。
[Distribution and Leakage Test] The microchemical device [D-9] obtained in Example 9 was evaluated by performing the same tests as in Example 1, and the same results as in Example 1 were obtained.

【0083】[実施例10] 〔微小ケミカルデバイスの作製〕部材(B)の素材とし
て、アクリル樹脂に代えて、ポリアリレート樹脂(ユニ
チカ株式会社製の「Uポリマー U−100)を使用し
た以外は、実施例1と同様にして、微小ケミカルデバイ
ス[D−10]を作製した。
[Example 10] [Preparation of microchemical device] As a material for the member (B), a polyarylate resin ("U-Polymer U-100" manufactured by Unitika Ltd.) was used in place of the acrylic resin. In the same manner as in Example 1, a microchemical device [D-10] was produced.

【0084】〔流通及び漏洩試験〕実施例10で得た微
小ケミカルデバイス[D−10]について、実施例1と
同様の試験を行なって評価したところ、実施例1と同様
の結果を得た。
[Distribution and Leakage Test] The microchemical device [D-10] obtained in Example 10 was evaluated by performing the same test as in Example 1, and the same result as in Example 1 was obtained.

【0085】[比較例1] 〔微小ケミカルデバイスの作製〕実施例1において、半
硬化を行わなかった以外は実施例1と同様にして、微小
ケミカルデバイス[D−C1]を作製した。
[Comparative Example 1] [Preparation of microchemical device] A microchemical device [D-C1] was prepared in the same manner as in Example 1 except that semi-curing was not performed.

【0086】〔流通及び漏洩試験〕比較例1で得た微小
ケミカルデバイス[D−C1]について、実施例1と同
様の試験を行って評価したところ、キャピラリーは閉塞
していた。
[Distribution and Leakage Test] The microchemical device [D-C1] obtained in Comparative Example 1 was evaluated by performing the same test as in Example 1. As a result, the capillary was closed.

【0087】[比較例2] 〔微小ケミカルデバイスの作製〕実施例4において、半
硬化を行わなかった以外は、実施例4と同様にして、微
小ケミカルデバイス[D−C2]を作製した。
[Comparative Example 2] [Preparation of microchemical device] A microchemical device [D-C2] was prepared in the same manner as in Example 4, except that semi-curing was not performed.

【0088】〔流通及び漏洩試験〕比較例2で得た微小
ケミカルデバイス[D−C2]について、実施例1と同
様の試験を行って評価したところ、キャピラリーは閉塞
していた。
[Distribution and Leakage Test] The microchemical device [D-C2] obtained in Comparative Example 2 was evaluated by performing the same test as in Example 1. As a result, the capillary was closed.

【0089】[比較例3] 〔微小ケミカルデバイスの作製〕実施例1において、
組成物(C)[C−1]に代えて、組成物(C)[C−
C3]として組成物[C−1]の5%エタノール溶液を
用いたこと、組成物(C)の塗布方法として、組成物
(C)[C−C3]をスプレーし、40℃にて15分間
熱風乾燥することによりエタノールを除去したこと、
組成物(C)からなる塗膜の半硬化を行わなかったこ
と、以外は実施例1と同様にして、微小ケミカルデバイ
ス[D−C3]を作製した。
[Comparative Example 3] [Preparation of microchemical device]
Instead of the composition (C) [C-1], the composition (C) [C-
A 5% ethanol solution of the composition [C-1] was used as [C3], and the composition (C) was applied by spraying the composition (C) [C-C3] at 40 ° C. for 15 minutes. Removing ethanol by hot air drying,
A microchemical device [D-C3] was produced in the same manner as in Example 1, except that the coating film composed of the composition (C) was not semi-cured.

【0090】なお、確認のため、別途、組成物(C)
[C−C3]の溶剤除去塗膜が形成された部材(B)
[B−C3]に紫外線を10秒間照射して完全硬化させ
て、その断面を走査型電子顕微鏡によって観察し、塗布
厚みを測定したところ、約1.4μmであった。
For confirmation, the composition (C) was separately prepared.
Member (B) on which the solvent-removed coating film of [C-C3] is formed
[B-C3] was irradiated with ultraviolet rays for 10 seconds to be completely cured, and the cross section thereof was observed with a scanning electron microscope. The coating thickness was measured to be about 1.4 μm.

【0091】〔流通及び漏洩試験〕比較例3で得た微小
ケミカルデバイス[D−C3]について、実施例1と同
様の試験を行って評価したところ、キャピラリーの閉塞
は認められなかったが、水が部材(A)[A−C3]と
部材(B)[B−C3]間に入り込み、外部に漏出し
た。この結果から、キャピラリーの閉塞を防止するため
に、比較例3のように塗布厚みを薄くすると、接着不完
全となり、漏洩が生じ易いことが分かる。
[Distribution and Leakage Test] The microchemical device [D-C3] obtained in Comparative Example 3 was evaluated by performing the same test as in Example 1. As a result, no blockage of the capillary was observed. Penetrated between the member (A) [A-C3] and the member (B) [B-C3] and leaked to the outside. From this result, it can be seen that when the coating thickness is reduced as in Comparative Example 3 in order to prevent the capillary from being blocked, the adhesion is incomplete and leakage is likely to occur.

【0092】[0092]

【発明の効果】本発明の製造方法によれば、溝が形成さ
れた部材と他の部材との間を完全に密着させることが可
能なため、流路から両部材間への液体の漏洩が生じない
微小ケミカルデバイスを製造することができる。また、
本発明の製造方法によれば、流路が細い場合にも接着剤
で閉塞されることがない微小ケミカルデバイスを製造す
ることができる。さらに、本発明の微小ケミカルデバイ
スの製造方法は、接着剤としてエネルギー線架橋重合性
化合物を使用した場合に、ごく短時間で接着可能であり
生産性が高いという利点を有する。
According to the manufacturing method of the present invention, the member in which the groove is formed and the other member can be completely adhered to each other. A microchemical device that does not occur can be manufactured. Also,
According to the manufacturing method of the present invention, it is possible to manufacture a microchemical device that is not blocked by an adhesive even when a flow path is narrow. Further, the method for producing a microchemical device of the present invention has an advantage that, when an energy beam crosslinkable polymerizable compound is used as an adhesive, bonding can be performed in a very short time and productivity is high.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例で使用した部材(A)を表面に直角な方
向から見た平面図である。
FIG. 1 is a plan view of a member (A) used in an example when viewed from a direction perpendicular to a surface.

【符号の説明】[Explanation of symbols]

1 部材(A) 2 溝 1 member (A) 2 groove

【図2】実施例で作製した微小ケミカルデバイスの俯瞰
図である。
FIG. 2 is an overhead view of the microchemical device manufactured in the example.

【符号の説明】[Explanation of symbols]

1 部材(A) 3 部材(B) 4 キャピラリーの開口部 1 member (A) 3 member (B) 4 opening of capillary

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08L 33/06 C08L 33/06 67/00 67/00 69/00 69/00 81/06 81/06 101/16 101/00 Fターム(参考) 4F071 AA22B AA33B AA43B AA50B AA64B AC10A AC19A AF01A AF07A AF13A CA01 CB02 CB04 CC03 CC04 CD03 4J002 AA011 AA021 BG072 BG132 4J011 QA03 QA08 QA13 QA17 QA19 QA39 SA00 UA01 UA03 WA06 4J040 DF041 DF051 DK001 GA00 GA17 JB07 MA10 PA18 PA32──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08L 33/06 C08L 33/06 67/00 67/00 69/00 69/00 81/06 81/06 101 / 16 101/00 F term (reference) 4F071 AA22B AA33B AA43B AA50B AA64B AC10A AC19A AF01A AF07A AF13A CA01 CB02 CB04 CC03 CC04 CD03 4J002 AA011 AA021 BG072 BG132 4J011 QA03 QA08 QA01 QA01 QA08 QA01 QA13 MA10 PA18 PA32

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】 表面に幅1〜1000μm、深さ1〜1
000μmの溝を有する部材(A)と他の部材(B)を
接着することにより部材(A)と部材(B)との間にキ
ャピラリー状の流路を形成した微小ケミカルデバイスの
製造方法であって、 部材(B)に架橋重合性化合物を含有する組成物(C)
を塗布し、次いで架橋重合性化合物を含有する組成物
(C)が流動性を喪失し、かつ未反応の重合性基が残存
する程度に半硬化させた状態で、部材(B)の架橋重合
性化合物を含有する組成物(C)からなる塗布面(b)と
部材(A)の溝を有する面(a)とを接触させ、その状態
で架橋重合性化合物を含有する組成物(C)を完全に硬
化させることにより接着することを特徴とする微小ケミ
カルデバイスの製造方法。
1. A surface having a width of 1 to 1000 μm and a depth of 1 to 1
A method for manufacturing a microchemical device in which a member (A) having a groove of 000 μm and another member (B) are bonded to form a capillary-like flow path between the member (A) and the member (B). The composition (C) containing the cross-linkable polymerizable compound in the member (B)
The composition (C) containing the cross-linkable polymerizable compound is then semi-cured to the extent that the composition (C) loses fluidity and unreacted polymerizable groups remain, and then the cross-linking polymerization of the member (B) is performed. The coating surface (b) made of the composition (C) containing the reactive compound is brought into contact with the grooved surface (a) of the member (A), and in that state, the composition (C) containing the crosslinkable polymerizable compound A method for producing a microchemical device, wherein the adhesive is adhered by completely curing the same.
【請求項2】 架橋重合性化合物がエネルギー線硬化性
の架橋重合性化合物であり、組成物(C)の半硬化及び
硬化がエネルギー線照射によるものである請求項1記載
の微小ケミカルデバイスの製造方法。
2. The production of a microchemical device according to claim 1, wherein the crosslinkable polymerizable compound is an energy ray-curable crosslinkable polymerizable compound, and the semi-curing and curing of the composition (C) are performed by energy ray irradiation. Method.
【請求項3】 架橋重合性化合物が、アクリロイル基又
はマレイミド基を有する架橋重合性化合物である請求項
2記載の微小ケミカルデバイスの製造方法。
3. The method for producing a microchemical device according to claim 2, wherein the crosslinkable polymerizable compound is a crosslinkable polymerizable compound having an acryloyl group or a maleimide group.
【請求項4】 部材(A)及び部材(B)がそれぞれ、
スチレン系ポリマー、(メタ)アクリル系ポリマー、ポ
リカーボネート系ポリマー、ポリスルホン系ポリマー、
ポリエステル系ポリマーなる群から選ばれたポリマーで
形成されている請求項1、2又は3記載の微小ケミカル
デバイスの製造方法。
4. The member (A) and the member (B) are:
Styrene polymer, (meth) acrylic polymer, polycarbonate polymer, polysulfone polymer,
4. The method for producing a microchemical device according to claim 1, wherein the device is formed of a polymer selected from the group consisting of polyester-based polymers.
【請求項5】 表面に幅1〜1000μm、深さ1〜1
000μmの溝を有する部材(A)と他の部材(B)を
接着することにより部材(A)と部材(B)との間にキ
ャピラリー状の流路を形成した微小ケミカルデバイスの
製造方法であって、 部材(A)の溝が形成された面(a)に、 溝の深さの1/
10000〜1/2の厚さに架橋重合性化合物を含有す
る組成物(C’)を、部材(B)に架橋重合性化合物を
含有する組成物(C)をそれぞれ塗布し、次いで架橋重
合性化合物を含有する組成物(C)及び組成物(C’)
が流動性を喪失し、かつ未反応の重合性基が残存する程
度に半硬化させた状態で、部材(A)の半硬化した架橋
重合性化合物を含有する組成物(C’)からなる塗布面
(a')と、部材(B)の半硬化した架橋重合性化合物を含
有する組成物(C)からなる塗布面(b')とを接触させ、
その状態で架橋重合性化合物を含有する組成物(C)及
び組成物(C’)を完全に硬化させることにより接着す
ることを特徴とする微小ケミカルデバイスの製造方法。
5. A surface having a width of 1 to 1000 μm and a depth of 1 to 1
A method for manufacturing a microchemical device in which a member (A) having a groove of 000 μm and another member (B) are bonded to form a capillary-like flow path between the member (A) and the member (B). The surface (a) of the member (A) where the groove is formed has a depth of 1 /
A composition (C ′) containing a crosslinkable polymerizable compound is applied to a thickness of 10,000 to さ に, and a composition (C) containing a crosslinkable polymerizable compound is applied to a member (B). Composition (C) and composition (C ′) containing compound
Is coated with the composition (C ′) containing the semi-cured cross-linkable polymerizable compound of the member (A) in a state where the fluidity is lost and semi-cured to the extent that unreacted polymerizable groups remain. surface
(a ') and the coated surface (b') of the composition (C) containing the semi-cured crosslinked polymerizable compound of the member (B),
A method for producing a microchemical device, wherein the composition (C) and the composition (C ′) containing the crosslinkable polymerizable compound are completely cured in this state so as to be adhered.
【請求項6】 架橋重合性化合物がエネルギー線硬化性
の架橋重合性化合物であり、組成物(C)及び組成物
(C’)の半硬化及び硬化がエネルギー線照射によるも
のである請求項5記載の微小ケミカルデバイスの製造方
法。
6. The cross-linkable polymerizable compound is an energy-ray-curable cross-linkable polymerizable compound, and the semi-curing and curing of the composition (C) and the composition (C ′) are performed by energy beam irradiation. A manufacturing method of the microchemical device according to the above.
【請求項7】 架橋重合性化合物が、アクリロイル基又
はマレイミド基を有する架橋重合性化合物である請求項
6記載の微小ケミカルデバイスの製造方法。
7. The method for producing a microchemical device according to claim 6, wherein the crosslinkable polymerizable compound is a crosslinkable polymerizable compound having an acryloyl group or a maleimide group.
【請求項8】 部材(A)及び部材(B)がそれぞれ、
スチレン系ポリマー、(メタ)アクリル系ポリマー、ポ
リカーボネート系ポリマー、ポリスルホン系ポリマー、
ポリエステル系ポリマーなる群から選ばれたポリマーで
形成されている請求項5、6又は7記載の微小ケミカル
デバイスの製造方法。
8. The member (A) and the member (B) are each
Styrene polymer, (meth) acrylic polymer, polycarbonate polymer, polysulfone polymer,
8. The method for producing a microchemical device according to claim 5, wherein the device is formed of a polymer selected from the group consisting of polyester-based polymers.
【請求項9】 表面に幅1〜1000μm、深さ1〜1
000μmの溝を有する部材(A)と他の部材(B)を
接着することにより部材(A)と部材(B)との間にキ
ャピラリー状の流路を形成した微小ケミカルデバイスの
製造方法であって、 部材(B)に架橋重合性化合物を含有する組成物(C)
を塗布し、次いで架橋重合性化合物を含有する組成物
(C)が流動性を喪失し、かつ未反応の重合性基が残存
する程度に半硬化させた状態で、部材(B)の架橋重合
性化合物を含有する組成物(C)からなる塗布面(b")
と、部材(A)の溝が形成された面(a)に、溝の深さの
1/10000〜1/10の厚さに架橋重合性化合物を
含有する組成物(C”)を塗布し、該塗布面(a")とを接
触させ、その状態で架橋重合性化合物を含有する組成物
(C)及び架橋重合性化合物を含有する組成物(C”)
を完全に硬化させることにより接着することを特徴とす
る微小ケミカルデバイスの製造方法。
9. A surface having a width of 1 to 1000 μm and a depth of 1 to 1
A method for manufacturing a microchemical device in which a member (A) having a groove of 000 μm and another member (B) are bonded to form a capillary-like flow path between the member (A) and the member (B). The composition (C) containing the cross-linkable polymerizable compound in the member (B)
The composition (C) containing the cross-linkable polymerizable compound is then semi-cured to the extent that the composition (C) loses fluidity and unreacted polymerizable groups remain, and then the cross-linking polymerization of the member (B) is performed. Coated surface (b ") composed of composition (C) containing a hydrophilic compound
And a composition (C ″) containing a crosslinkable polymerizable compound in a thickness of 1/10000 to 1/10 of the depth of the groove is applied to the grooved surface (a) of the member (A). The composition (C) containing the cross-linkable polymerizable compound and the composition (C ") containing the cross-linkable polymerizable compound in the state of contact with the coating surface (a")
A method for producing a microchemical device, comprising bonding by completely curing the device.
【請求項10】 架橋重合性化合物が、エネルギー線硬
化性の架橋重合性化合物であり、組成物(C)の半硬
化、及び、組成物(C)及び組成物(C”)の硬化がエ
ネルギー線照射によるものである請求項9記載の微小ケ
ミカルデバイスの製造方法。
10. The crosslinkable polymerizable compound is an energy ray-curable crosslinkable polymerizable compound, and the semi-curing of the composition (C) and the curing of the composition (C) and the composition (C ″) are performed with energy. The method for manufacturing a microchemical device according to claim 9, wherein the method is performed by irradiation with a line.
【請求項11】 架橋重合性化合物が、アクリロイル基
又はマレイミド基を有する架橋重合性化合物である請求
項10記載の微小ケミカルデバイスの製造方法。
11. The method for producing a microchemical device according to claim 10, wherein the crosslinkable polymerizable compound is a crosslinkable polymerizable compound having an acryloyl group or a maleimide group.
【請求項12】 部材(A)及び部材(B)がそれぞ
れ、スチレン系ポリマー、(メタ)アクリル系ポリマ
ー、ポリカーボネート系ポリマー、ポリスルホン系ポリ
マー、ポリエステル系ポリマーなる群から選ばれたポリ
マーで形成されている請求項9、10又は11記載の微
小ケミカルデバイスの製造方法。
12. The member (A) and the member (B) are each formed of a polymer selected from the group consisting of a styrene-based polymer, a (meth) acryl-based polymer, a polycarbonate-based polymer, a polysulfone-based polymer, and a polyester-based polymer. The method for producing a microchemical device according to claim 9, 10 or 11.
JP11056436A 1999-03-04 1999-03-04 Production of minute chemical device Pending JP2000248076A (en)

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JP2000288381A (en) * 1999-04-08 2000-10-17 Kawamura Inst Of Chem Res Manufacture of microchemical device
JP2000297157A (en) * 1999-04-15 2000-10-24 Kawamura Inst Of Chem Res Microchemical device
JP2004205225A (en) * 2002-12-20 2004-07-22 Sumitomo Bakelite Co Ltd Method for bonding microchip substrate and microchip
JP2005042073A (en) * 2003-07-25 2005-02-17 Univ Waseda Resin substrate bonding method and sorting apparatus using the bonding method
JP2006030160A (en) * 2004-04-14 2006-02-02 Hitachi Maxell Ltd Reaction vessel
JP2007098347A (en) * 2005-10-07 2007-04-19 Kawamura Inst Of Chem Res Polymerizable composition for microfluid device, and microfluid device
JP2012132894A (en) * 2010-12-01 2012-07-12 Arkray Inc Device and method for manufacturing the same
JP2019177304A (en) * 2018-03-30 2019-10-17 住友理工株式会社 Composite member for fluid device and method for manufacturing the same
NL2030209B1 (en) * 2021-12-21 2023-06-29 Surfix B V Process for manufacturing a microfluidic device

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JPH02187098A (en) * 1989-01-13 1990-07-23 Matsushita Electric Ind Co Ltd Installation of electronic component
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000288381A (en) * 1999-04-08 2000-10-17 Kawamura Inst Of Chem Res Manufacture of microchemical device
JP2000297157A (en) * 1999-04-15 2000-10-24 Kawamura Inst Of Chem Res Microchemical device
JP2004205225A (en) * 2002-12-20 2004-07-22 Sumitomo Bakelite Co Ltd Method for bonding microchip substrate and microchip
JP2005042073A (en) * 2003-07-25 2005-02-17 Univ Waseda Resin substrate bonding method and sorting apparatus using the bonding method
JP2006030160A (en) * 2004-04-14 2006-02-02 Hitachi Maxell Ltd Reaction vessel
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JP2012132894A (en) * 2010-12-01 2012-07-12 Arkray Inc Device and method for manufacturing the same
JP2019177304A (en) * 2018-03-30 2019-10-17 住友理工株式会社 Composite member for fluid device and method for manufacturing the same
JP7063682B2 (en) 2018-03-30 2022-05-09 住友理工株式会社 Composite members for fluid devices and their manufacturing methods
NL2030209B1 (en) * 2021-12-21 2023-06-29 Surfix B V Process for manufacturing a microfluidic device
WO2023118292A1 (en) * 2021-12-21 2023-06-29 Surfix B.V. Process for manufacturing a microfluidic device
US12358271B2 (en) 2021-12-21 2025-07-15 Surfix B.V. Process for manufacturing a microfluidic device

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