JP2012145283A - Heating device - Google Patents

Heating device Download PDF

Info

Publication number
JP2012145283A
JP2012145283A JP2011004480A JP2011004480A JP2012145283A JP 2012145283 A JP2012145283 A JP 2012145283A JP 2011004480 A JP2011004480 A JP 2011004480A JP 2011004480 A JP2011004480 A JP 2011004480A JP 2012145283 A JP2012145283 A JP 2012145283A
Authority
JP
Japan
Prior art keywords
heating
heater
temperature
heating object
observation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011004480A
Other languages
Japanese (ja)
Other versions
JP5812609B2 (en
Inventor
Masatoshi Inoue
征利 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Takaoka Toko Co Ltd
Original Assignee
Takaoka Electric Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takaoka Electric Mfg Co Ltd filed Critical Takaoka Electric Mfg Co Ltd
Priority to JP2011004480A priority Critical patent/JP5812609B2/en
Publication of JP2012145283A publication Critical patent/JP2012145283A/en
Application granted granted Critical
Publication of JP5812609B2 publication Critical patent/JP5812609B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Control Of Resistance Heating (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Furnace Details (AREA)

Abstract

【課題】対象物をムラなく均一に高温加熱しながら高精度に計測するため、加熱装置を密閉構造とすることなく、さらに対象物をステージ動作させながらでも、対象物の加熱及び計測を可能とする加熱装置を提供する。
【解決手段】対象物6の上面に計測用に設けた開口部10を有するプレート型ヒーター5を配置し、前記対象物6の下面には接触式または非接触式の加熱ユニット7と、前記対象物6を支持する支持体11とで構成された加熱ケース9をステージに搭載し、ステージ動作させながら対象物6の加熱と計測を可能とする加熱装置を構成する。
【選択図】図1
[PROBLEMS] To heat and measure an object even when the object is stage-operated without using a hermetic structure to measure the object with high accuracy while heating the object uniformly and uniformly. A heating device is provided.
A plate-type heater having an opening provided for measurement is arranged on the upper surface of an object, and a contact-type or non-contact-type heating unit is disposed on the lower surface of the object. A heating case 9 composed of a support 11 that supports the object 6 is mounted on a stage, and a heating apparatus that enables heating and measurement of the object 6 while performing the stage operation is configured.
[Selection] Figure 1

Description

本発明は、対象物をリフロー半田付けする等のために加熱を行う場合において、加熱時に対象物の観察や表面形状などの計測が可能な加熱装置に関するものである。   The present invention relates to a heating apparatus capable of observing an object and measuring a surface shape and the like during heating when the object is heated for reflow soldering or the like.

製作段階において高温の加熱が必要な製品あるいは物質は工業生産品の中に数多く存在する。例えば精密機器に使用されている電子回路基板では、半導体素子などを表面実装する際に電気的接続をするための半田材などの接続用材料を融解させるために高温リフロー加熱がなされる。   There are many products or substances in industrial products that require high temperature heating in the production stage. For example, in an electronic circuit board used in precision equipment, high-temperature reflow heating is performed to melt a connection material such as a solder material for electrical connection when a semiconductor element or the like is surface-mounted.

高温リフロー加熱の方法としては密閉状態で加熱装置内部に熱風を循環させ均一な雰囲気温度にして加熱する方法や、赤外線ヒーター等の輻射熱を利用して加熱するもの、あるいは熱風と赤外線ヒーターの両方を併用するものがある。   As a method of high-temperature reflow heating, a method in which hot air is circulated inside the heating device in a sealed state to heat it to a uniform atmospheric temperature, a method of heating using radiant heat such as an infrared heater, or both hot air and an infrared heater are used. Some are used together.

高温リフロー加熱中に発生する対象物の変形などの問題は、製品の品質や歩留まりに影響を与えてしまうことから、高温加熱中の対象物の各種特性を把握しておくことは非常に重要である。     Problems such as deformation of objects that occur during high-temperature reflow heating affect product quality and yield, so it is very important to understand the various characteristics of objects during high-temperature heating. is there.

高温加熱中に対象物を光学計測して各部の寸法、形状変化を把握しようとする場合、従来の加熱装置は特許文献1に示されているように、均一に対象物を加熱するため密閉構造とし、加熱装置の一部にガラスなどの透明体を用いた観察窓を設ける必要があった。その場合、観察窓や装置筐体の外部表面が高温にならないように断熱材を挟んだ2重筐体、2重窓としたり、熱の影響を受けないように観察窓から離して光学計測器を設置したりするのが一般的である。   When an object is optically measured during high-temperature heating to grasp changes in the dimensions and shapes of each part, the conventional heating device, as shown in Patent Document 1, has a sealed structure to uniformly heat the object. In addition, it is necessary to provide an observation window using a transparent body such as glass in a part of the heating device. In that case, the optical measuring instrument is separated from the observation window so as not to be affected by heat, such as a double casing or double window with a heat insulating material sandwiched so that the external surface of the observation window or apparatus casing does not become high temperature. It is common to install.

特開2009-123796号公報JP 2009-123796

しかし、対象物を高精度に光学計測しようとする場合は、顕微鏡のような拡大光学系を用いる必要があり、そのような光学系は一般的に観察対象に対して非常に近接して設置する必要があるため、上記のように計測器を観察窓から離して設置することは不可能である。あるいは窓部を高温としないように断熱を目的として空気層を設けた、いわゆる2重窓も結果的に観察対象との距離が離れてしまうため設置不可能である。   However, when trying to optically measure an object with high accuracy, it is necessary to use a magnifying optical system such as a microscope, and such an optical system is generally placed very close to an observation target. Since it is necessary, it is impossible to install the measuring instrument away from the observation window as described above. Alternatively, a so-called double window provided with an air layer for the purpose of heat insulation so as not to bring the window to a high temperature cannot be installed because the distance from the observation object is consequently increased.

このような困難への対策として、観察窓が必要となる密閉構造を採用せず、光学計測器を薄い透明断熱構造で保護し、観察対象に近接して設置する事を可能とした断熱装置が本発明と同一の発明者により特願2009-209283に於いて提案されている。   As a countermeasure against such difficulties, there is a heat insulating device that does not use a sealed structure that requires an observation window, protects the optical measuring instrument with a thin transparent heat insulating structure, and can be installed close to the observation target It has been proposed in Japanese Patent Application No. 2009-209283 by the same inventors as the present invention.

しかし密閉構造でないことから、熱風による加熱は困難であり、輻射熱を利用した加熱では直接加熱されている面と、反対側の面との間に温度差ができ加熱均一性には限界がある。   However, since it is not a sealed structure, heating with hot air is difficult, and heating using radiant heat has a temperature difference between the directly heated surface and the opposite surface, and there is a limit to heating uniformity.

本発明が解決しようとする課題は、加熱装置を密閉構造とすることなく、かつ対象物をムラなく均一に加熱でき、加熱と同時に光学計測を可能とする加熱装置の実現である。   The problem to be solved by the present invention is the realization of a heating device that can uniformly heat an object without unevenness, and enables optical measurement simultaneously with the heating, without making the heating device a sealed structure.

前記課題を解決するために、加熱対象物を固定するための支持体と、前記加熱対象物の観察面裏側を接触または非接触で加熱する裏面加熱器と、前記加熱対象物と前記支持体と前記裏面加熱器とを搭載し動作させる少なくとも1軸の移動ステージと、面的に広がった均一温度領域を有し、その均一温度領域の一部に前記加熱対象物を観察するための開口部を有し、前記加熱対象物に近接させることで前記加熱対象物を観察面表側より非接触で加熱する表面加熱器とで構成する。   In order to solve the above problems, a support for fixing a heating object, a back surface heater for heating the back side of the observation surface of the heating object in contact or non-contact, the heating object and the support At least one axis moving stage for mounting and operating the backside heater, and a uniform temperature region spreading in a plane, and an opening for observing the heating object in a part of the uniform temperature region And a surface heater that heats the heating object in a non-contact manner from the observation surface front side by bringing the heating object close to the heating object.

前記移動ステージを動作させることで、前記開口部を通して前記加熱対象物全体を観察あるいは計測しながら前記加熱対象物の表面および裏面を同時に均一加熱することを可能とする。   By operating the moving stage, the front and back surfaces of the heating object can be uniformly heated simultaneously while observing or measuring the entire heating object through the opening.

前記加熱対象物に対し少なくとも一つの温度計を設置し、フィードバック制御により前記加熱対象物の温度を制御する機能を備える。   At least one thermometer is installed for the heating object, and the temperature of the heating object is controlled by feedback control.

前記観察用の開口部に、前記光学計測器の計測に影響を与えない程度の薄さの平行平面透明体を配置する。   A parallel flat transparent body having a thickness that does not affect the measurement of the optical measuring instrument is disposed in the observation opening.

以上のように構成することで、加熱機構を密閉構造としなくても対象物の両面を均一な温度でムラなく加熱することが可能となる。また加熱と同時に光学計測器を対象物へ接近しながらの高精度な計測が可能な加熱装置が実現できる。   By comprising as mentioned above, it becomes possible to heat both surfaces of a target object evenly at a uniform temperature without using a heating mechanism as a sealed structure. In addition, a heating apparatus capable of performing high-precision measurement while bringing the optical measuring instrument close to the object simultaneously with heating can be realized.

本発明の実施例を示した正面図である。It is the front view which showed the Example of this invention. 実施例の加熱ケース部を示した側面図である。It is the side view which showed the heating case part of the Example. 実施例のプレートヒーター部を示した断面図である。It is sectional drawing which showed the plate heater part of the Example. 赤外線ヒーター加熱による対象物の温度プロファイルを示したグラフである。It is the graph which showed the temperature profile of the target object by infrared heater heating. 赤外線ヒーター加熱+プレートヒーター加熱による対象物の温度プロファイルを示したグラフである。It is the graph which showed the temperature profile of the target object by infrared heater heating + plate heater heating.

以下では、本発明を具体的に実施するにあたり最良と思われる実施形態について述べる。   In the following, embodiments that are considered to be the best for concrete implementation of the present invention will be described.

まず、本発明を具現化した実施形態の例を、図1、図2を参照して説明する。   First, an example of an embodiment embodying the present invention will be described with reference to FIGS.

基本的な構成は、観察部と加熱部から構成され、観察部は対象物6の観察面表面を観察するための光学計測器1の光学系部2と、その光学系部2を断熱するための断熱器3からなる。また本実施例では光学系部2は対物レンズを表し、光学計測器1はその光学系部2にはいった光をカメラに結像させて、観察及び計測する役割を持っている。   The basic configuration includes an observation unit and a heating unit, and the observation unit insulates the optical system unit 2 of the optical measuring instrument 1 for observing the observation surface of the object 6 and the optical system unit 2. Insulator 3. Further, in this embodiment, the optical system unit 2 represents an objective lens, and the optical measuring instrument 1 has a role of observing and measuring the light entering the optical system unit 2 by forming an image on the camera.

観察部の断熱器3は光学系部2が接近して対象物6を観察する際に、対象物6からの熱またはプレートヒーター5からの熱が光学系部2へと伝熱されるのを断熱する機能を持つ。また、この断熱器3は光学系部2の光路部においてワーキングディスタンスより十分に薄く、光学系部2の光学性能を劣化させないような透明断熱構造で構成されていることが必要である。   When the optical system unit 2 approaches and observes the object 6, the heat insulator 3 of the observation unit insulates that heat from the object 6 or heat from the plate heater 5 is transferred to the optical system unit 2. It has a function to do. The heat insulator 3 is required to be sufficiently thin in the optical path portion of the optical system unit 2 than the working distance, and to have a transparent heat insulating structure that does not deteriorate the optical performance of the optical system unit 2.

加熱部は対象物6を観察面側から加熱するプレートヒーター5と、プレートヒーター5に取り付ける断熱材4と、加熱ケース9で構成される。断熱材4とプレートヒーター5には断熱器3を装着した光学系部2の挿入と光路を確保するため一部開口部10を設けている。   The heating unit includes a plate heater 5 that heats the object 6 from the observation surface side, a heat insulating material 4 that is attached to the plate heater 5, and a heating case 9. The heat insulating material 4 and the plate heater 5 are provided with a partial opening 10 in order to secure the optical path and insertion of the optical system unit 2 equipped with the heat insulator 3.

加熱ケース9は対象物6を観察面裏側から加熱する赤外線ヒーター7と、そのヒーターの下に配置するヒーター用断熱材8と、対象物6を支持する支持部11で構成される。また、加熱ケース9はXYステージ101上に搭載されていてXY移動が可能となっている。さらに加熱後に対象物6を強制冷却できるように側面には冷却用ファン201を設けている。   The heating case 9 includes an infrared heater 7 that heats the object 6 from the back side of the observation surface, a heater insulating material 8 that is disposed under the heater, and a support portion 11 that supports the object 6. The heating case 9 is mounted on the XY stage 101 and can move in the XY direction. Further, a cooling fan 201 is provided on the side surface so that the object 6 can be forcibly cooled after heating.

加熱ケース9内部には対象物6のサイズに合わせて図2に示すように赤外線ヒーター7を複数本配置している。また赤外線ヒーター7からの熱が加熱ケース9を伝わりXYステージ101へ伝熱する事を防ぐため、赤外線ヒーター7下面に低熱伝導材質のヒーター用断熱材8を配置している。対象物6を支持する支持部11の材質は、加熱により膨張してしまうと対象物6を計測する際に誤差要因となってしまうため、ファインセラミックスのような極低膨張材質で構成されると良い。またここでは、対象物6の観察面裏側からの加熱は赤外線ヒーター7を用いているが、これに限るものではない。ホットプレート式の加熱器のように直接対象物6を載せて加熱する場合も本発明の範疇である。しかしこの場合、加熱部の膨張収縮により対象物6も同時に動くため、加熱部の膨張収縮量が観察や計測に影響がない程度に抑える必要がある。   A plurality of infrared heaters 7 are arranged in the heating case 9 in accordance with the size of the object 6 as shown in FIG. In addition, in order to prevent heat from the infrared heater 7 from being transmitted to the XY stage 101 through the heating case 9, a heater heat insulating material 8 made of a low thermal conductivity material is disposed on the lower surface of the infrared heater 7. If the material of the support part 11 that supports the object 6 is expanded by heating, it becomes an error factor when the object 6 is measured. good. Here, although the infrared heater 7 is used to heat the object 6 from the back side of the observation surface, the present invention is not limited to this. The case where the object 6 is directly placed and heated like a hot plate type heater is also within the scope of the present invention. However, in this case, the object 6 also moves simultaneously due to the expansion and contraction of the heating unit, so it is necessary to suppress the expansion and contraction amount of the heating unit to such an extent that the observation and measurement are not affected.

配熱設計された赤外線ヒーター7で加熱を行うと、対象物6の観察面裏側は均一な温度で加熱することができる。また加熱ケース9はプレートヒーター5と接触していないため、加熱ケース9ごとXY動作させることが可能であり、対象物6の任意の位置を開口部10の直下に移動することができる。つまり赤外線ヒーター7と対象物6の位置関係を維持しながら対象物6の任意の部分を観察することを可能としている。   When heating is performed with the infrared heater 7 designed for heat distribution, the back side of the observation surface of the object 6 can be heated at a uniform temperature. Further, since the heating case 9 is not in contact with the plate heater 5, the XY operation can be performed together with the heating case 9, and an arbitrary position of the object 6 can be moved directly below the opening 10. That is, it is possible to observe an arbitrary portion of the object 6 while maintaining the positional relationship between the infrared heater 7 and the object 6.

しかし、観察面裏側からの赤外線ヒーター7の加熱だけでは、対象物6内部で観察面裏側から表側への熱平衡に要する時間に加え、対象物6の表側から雰囲気中への熱移動により、対象物6の観察面裏側と表側において温度差が出来てしまう。   However, only by heating the infrared heater 7 from the back side of the observation surface, in addition to the time required for thermal equilibrium from the back side of the observation surface to the front side inside the target object 6, heat transfer from the front side of the target object 6 to the atmosphere leads to the target object. Thus, there is a temperature difference between the back side and the front side.

そこで、観察面裏側からの赤外線ヒーター7と同時に観察面表側からプレートヒーター5での加熱を行う機構とした。対象物6とプレートヒーター5との距離を1〜2mm程度と非常に近接した位置に配置することで、効率よく加熱ができるとともに、プレートヒーター5が蓋の役割を果たし密閉構造に近い状態としている。また、加熱ケース9をXY動作させるため、プレートヒーター5は加熱ケースの動作範囲を覆うだけの領域が必要となる。このプレートヒーター5によって対象物6を観察面表側からも加熱し、表面側の雰囲気温度を安定させ、且つ、雰囲気中への熱の放出を防いでいる。図4.5に示した本実施例で検証した結果のグラフは対象物6の裏面と表面側の温度差がプレートヒーター5により大幅に改善されていることを表している。   Therefore, a mechanism is employed in which heating is performed by the plate heater 5 from the front side of the observation surface simultaneously with the infrared heater 7 from the back side of the observation surface. By arranging the distance between the object 6 and the plate heater 5 at a very close position of about 1 to 2 mm, the heating can be efficiently performed, and the plate heater 5 serves as a lid and is in a state close to a sealed structure. . Further, in order to cause the heating case 9 to perform the XY operation, the plate heater 5 needs an area that covers the operating range of the heating case. The object 6 is also heated from the front side of the observation surface by the plate heater 5 to stabilize the ambient temperature on the surface side and to prevent the release of heat into the atmosphere. The graph of the result verified in the present embodiment shown in FIG. 4.5 shows that the temperature difference between the back surface and the front surface side of the object 6 is greatly improved by the plate heater 5.

前記プレートヒーター5は少なくとも光学系部2が挿入される領域においては、光学系部2のワーキングディスタンスより十分に薄い必要がある。本実施例では図3に示すように、プレートヒーター部は加熱器用断熱材301と銅板303で加熱器302を挟みプレートヒーター部を構成している。加熱器302は光学系部2が挿入できるように干渉しない位置に配置することで銅板303の厚さのみがワーキングディスタンスに関係する。 The plate heater 5 needs to be sufficiently thinner than the working distance of the optical system unit 2 at least in the region where the optical system unit 2 is inserted. In the present embodiment, as shown in FIG. 3, the plate heater unit is configured by sandwiching the heater 302 with a heat insulator 301 for heater and a copper plate 303. Only the thickness of the copper plate 303 is related to the working distance by arranging the heater 302 at a position where it does not interfere so that the optical system unit 2 can be inserted.

上記のような構造の場合、加熱器302に接触している箇所と接触していない箇所とで温度ムラが発生してしまうが、本実施例のように金属の中でも非常に熱伝導の良い銅材を使用することで温度ムラは微小となる。さらに銅板303の厚みを薄くすれば熱平衡状態に達する時間が早くなり、また、光学部2のワーキングディスタンス確保も容易となる。ここでは、非常に薄くて電力密度の高い加熱器があれば光学系部2直下を含め加熱領域全面に配置しても前記と同様の効果を得ることができるが、それも本発明の範疇である。   In the case of the structure as described above, temperature unevenness occurs between the portion that is in contact with the heater 302 and the portion that is not in contact with the copper. However, as in this embodiment, copper having very good thermal conductivity among metals. By using the material, the temperature unevenness becomes minute. Furthermore, if the thickness of the copper plate 303 is reduced, the time to reach the thermal equilibrium state is shortened, and the working distance of the optical unit 2 can be easily ensured. Here, if there is a heater that is very thin and has a high power density, the same effect as described above can be obtained even if it is disposed over the entire heating area including directly under the optical system section 2, but this is also within the scope of the present invention. is there.

さらに上記の場合、対象物6の観察面表側に熱風を当てて加熱する方法も考えられるが、光学計測を行う場合、気体の揺らぎがあると空間の屈折率が変化し計測ノイズとして計測精度に影響を及ぼす可能性がある。そのため光路中は層流状態であることが望まれる。本実施例のように密閉構造でなく、対象物6をXY動作させている状態で層流状態の気流を作り出すのは困難である。
また、対象物6に直接熱風が当たり、対象物6が揺れて計測に影響を及ぼす恐れもある。対象物6を強固な固定方法で固定できれば揺れは収まるが、強い外力を対象物6にかけながら加熱すると、加熱中に熱応力が発生し熱変形が問題となる。
本実施例での検証実験においても、対象物6の固定方法により加熱中の変形の様子が変わることを確認している。
Furthermore, in the above case, a method of heating by applying hot air to the surface of the observation surface of the object 6 can be considered. However, when optical measurement is performed, if there is a gas fluctuation, the refractive index of the space changes and measurement noise is added to the measurement accuracy. May have an effect. Therefore, it is desirable that the optical path is in a laminar flow state. It is difficult to create a laminar airflow in a state where the object 6 is XY-operated instead of a sealed structure as in this embodiment.
Moreover, there is a possibility that hot air hits the object 6 directly and the object 6 is shaken to affect the measurement. If the object 6 can be fixed by a strong fixing method, the shaking is reduced. However, if the object 6 is heated while applying a strong external force to the object 6, thermal stress is generated during the heating, and thermal deformation becomes a problem.
Also in the verification experiment in the present embodiment, it is confirmed that the state of deformation during heating changes depending on the method of fixing the object 6.

プレートヒーター5の開口部10ではプレートヒーター5直下と比べ、雰囲気温度が低下することが考えられる。本実施例の検証でも時間経過とともに若干の温度低下が見られた。しかしこれは高速に計測する場合には問題とならないレベルである。   In the opening 10 of the plate heater 5, it is conceivable that the ambient temperature is lower than that immediately below the plate heater 5. Even in the verification of this example, a slight temperature decrease was observed with time. However, this is a level that does not cause a problem when measuring at high speed.

また本実施例の場合、対象物6の観察面表側と裏側の雰囲気温度では裏側の雰囲気温度のほうが上記の理由で安定するため、赤外線ヒーター7の温度制御は対象物6の観察面裏側温度に対して行うと良い。表側に対して温度制御を行うと、外乱を抑えるため操作量が増え両面での温度差が出来やすくなってしまう。さらに、プレートヒーターと赤外線ヒーターでは通常赤外線ヒーターのほうが昇温速度が速いため、対象物6は赤外線ヒーター7の出力に大きく影響を受ける。この場合、表側を目標温度に制御しようとすると、裏側温度は瞬間的にでも目標温度(表側温度)よりも高くなり、対象物6の許容温度を超えてしまう可能性がある。   In the case of the present embodiment, since the atmospheric temperature on the front side and the back side of the observation surface of the object 6 is more stable for the above reasons, the temperature control of the infrared heater 7 is controlled to the back surface temperature of the observation surface of the object 6. It is good to do for it. When temperature control is performed on the front side, the amount of operation increases in order to suppress disturbance, and a temperature difference between the two sides is easily made. In addition, the plate heater and the infrared heater usually have a higher heating rate than the infrared heater, so that the object 6 is greatly affected by the output of the infrared heater 7. In this case, if the front side is controlled to the target temperature, the back side temperature may be instantaneously higher than the target temperature (front side temperature) and may exceed the allowable temperature of the object 6.

一方、プレートヒーター5の開口部10において平行平面透明体を配置する構造が考えられる。平行平面透明体を配置することで、平行平面透明体が加熱されて高温体となり開口部10周辺の雰囲気温度の低下は軽減される。この時、平行平面透明体に厚みがあると、それ自身の厚みや熱膨張による変形によって光学系部2の結像性能を劣化させるため、平行平面透明体は顕微鏡のカバーガラスレベルの厚みで且つ、熱膨張がほとんどない材質、例えば合成石英ガラスなどを使用すれば計測への影響は小さくすることができる。これらの場合についても本発明の範疇である。   On the other hand, the structure which arrange | positions a parallel plane transparent body in the opening part 10 of the plate heater 5 can be considered. By disposing the parallel plane transparent body, the parallel plane transparent body is heated to become a high temperature body, and a decrease in the ambient temperature around the opening 10 is reduced. At this time, if the parallel plane transparent body has a thickness, the imaging performance of the optical system unit 2 is deteriorated due to its own thickness or deformation due to thermal expansion. If a material with little thermal expansion, such as synthetic quartz glass, is used, the influence on the measurement can be reduced. These cases are also within the scope of the present invention.

プレートヒーター5の開口部10に必要な大きさは、光学部2の開口数とプレートヒーター5の開口部10との距離によって決まるが、上記で説明したように開口部10では雰囲気温度の低下が起こるので、できるだけ小さいほうが良い。また、上記のように開口部10に薄い平行平面透明体を配置する場合、薄くてサイズの大きい平行平面透明体は取扱いが非常に難しく、製作も困難であるため好ましくない。また、自重によってたわみが発生し、結果として光学性能に影響を与えてしまう可能性もある。   The size required for the opening 10 of the plate heater 5 is determined by the distance between the numerical aperture of the optical unit 2 and the opening 10 of the plate heater 5, but as described above, the ambient temperature decreases in the opening 10. Because it happens, it is better to be as small as possible. Further, when a thin parallel plane transparent body is disposed in the opening 10 as described above, a thin and large parallel plane transparent body is not preferable because it is very difficult to handle and difficult to manufacture. In addition, deflection may occur due to its own weight, and as a result, optical performance may be affected.

本発明により、密閉空間で加熱しなくても対象物の表裏面を均一な温度分布で加熱することが可能となる。また同時に、加熱中の対象物の精密な形状観察及び計測が可能となる。
これは物体の高温ストレスによる影響を研究する分野において大きな需要があると考えられる。
According to the present invention, it is possible to heat the front and back surfaces of an object with a uniform temperature distribution without heating in an enclosed space. At the same time, precise shape observation and measurement of the object being heated are possible.
This is considered to be in great demand in the field of studying the effects of high temperature stress on objects.

1 光学計測器
2 光学部
3 断熱器
4 断熱材
5 プレートヒーター
6 対象物
7 赤外線ヒーター
8 ヒーター用断熱材
9 加熱ケース
10 開口部
11 支持部
101 XYステージ
201 冷却用ファン
301 加熱器用断熱材
302 加熱器
303 銅板
DESCRIPTION OF SYMBOLS 1 Optical measuring device 2 Optical part 3 Heat insulator 4 Heat insulating material 5 Plate heater 6 Object 7 Infrared heater 8 Heat insulating material 9 Heating case 10 Opening part 11 Support part 101 XY stage 201 Cooling fan 301 Heat insulating material 302 Heating 303 Copper plate

Claims (3)

加熱対象物を固定するための支持体と、
前記加熱対象物の観察面裏側を接触または非接触で加熱する裏面加熱器と、
前記加熱対象物と前記支持体と前記裏面加熱器とを搭載し動作させる少なくとも1軸の移動ステージと、
面的に広がった均一温度領域を有し、その均一温度領域の一部に前記加熱対象物を観察するための開口部を有し、前記加熱対象物に近接させることで前記加熱対象物を観察面表側より非接触で加熱する表面加熱器とで構成され、
前記移動ステージを動作させることで、前記開口を通して前記加熱対象物全体を観察あるいは計測しながら前記加熱対象物の表面および裏面を同時に均一加熱することを特徴とする加熱装置
A support for fixing the heating object;
A back surface heater for heating the back side of the observation surface of the heating object in contact or non-contact;
At least one axis moving stage on which the object to be heated, the support and the back surface heater are mounted and operated;
It has a uniform temperature region spread across the surface, and has an opening for observing the heating object in a part of the uniform temperature region, and observes the heating object by bringing it close to the heating object. It consists of a surface heater that heats from the surface side in a non-contact manner,
A heating apparatus characterized by operating the moving stage to simultaneously and uniformly heat the front and back surfaces of the heating object while observing or measuring the entire heating object through the opening.
前記加熱対象物に対し少なくとも一つの温度計を設置し、フィードバック制御により前記加熱対象物の温度を制御することを特徴とする請求項1の加熱装置 The heating apparatus according to claim 1, wherein at least one thermometer is installed for the heating object, and the temperature of the heating object is controlled by feedback control. 前記開口部に、観察あるいは計測用の光学系に影響を与えない薄さの平行平面透明体を配置することを特徴とする請求項1または請求項2いずれかに記載の加熱装置 The heating device according to claim 1 or 2, wherein a thin parallel plane transparent body that does not affect the optical system for observation or measurement is disposed in the opening.
JP2011004480A 2011-01-13 2011-01-13 Heating device Active JP5812609B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011004480A JP5812609B2 (en) 2011-01-13 2011-01-13 Heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011004480A JP5812609B2 (en) 2011-01-13 2011-01-13 Heating device

Publications (2)

Publication Number Publication Date
JP2012145283A true JP2012145283A (en) 2012-08-02
JP5812609B2 JP5812609B2 (en) 2015-11-17

Family

ID=46789014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011004480A Active JP5812609B2 (en) 2011-01-13 2011-01-13 Heating device

Country Status (1)

Country Link
JP (1) JP5812609B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018081041A (en) * 2016-11-18 2018-05-24 株式会社東光高岳 Heated object measurement system
JP2019144129A (en) * 2018-02-21 2019-08-29 株式会社東光高岳 Substrate shape measuring device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248430A (en) * 1990-02-27 1991-11-06 Hitachi Ltd Wiring correcting device
JPH06102193A (en) * 1992-08-04 1994-04-15 Sony Corp Liquid crystal panel inspection method and inspection device
JPH07281453A (en) * 1994-04-08 1995-10-27 Sigma Merutetsuku Kk Substrate heating method and apparatus
JPH09171953A (en) * 1995-12-20 1997-06-30 Sony Corp Substrate heating device, substrate heating method, semiconductor integrated circuit device, photomask, and liquid crystal display device
JPH09203687A (en) * 1996-01-26 1997-08-05 Sharp Corp Liquid crystal display inspection device
JP2000047163A (en) * 1998-07-24 2000-02-18 Hamamatsu Photonics Kk Method and device of correcting pixel defect of liquid crystal panel
JP2002357800A (en) * 2001-05-31 2002-12-13 Sony Corp Display device inspection equipment
JP2006165402A (en) * 2004-12-09 2006-06-22 Toyota Motor Corp Soldering device and soldering method
JP2006201120A (en) * 2005-01-24 2006-08-03 Olympus Corp Inspection apparatus of bio-related substance
JP2008157559A (en) * 2006-12-25 2008-07-10 Ishikawajima Inspection & Instrumentation Co High temperature furnace wall imaging device
WO2010116809A1 (en) * 2009-04-07 2010-10-14 Anbe Yoshinobu Heating apparatus for x-ray inspection

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03248430A (en) * 1990-02-27 1991-11-06 Hitachi Ltd Wiring correcting device
JPH06102193A (en) * 1992-08-04 1994-04-15 Sony Corp Liquid crystal panel inspection method and inspection device
JPH07281453A (en) * 1994-04-08 1995-10-27 Sigma Merutetsuku Kk Substrate heating method and apparatus
JPH09171953A (en) * 1995-12-20 1997-06-30 Sony Corp Substrate heating device, substrate heating method, semiconductor integrated circuit device, photomask, and liquid crystal display device
JPH09203687A (en) * 1996-01-26 1997-08-05 Sharp Corp Liquid crystal display inspection device
JP2000047163A (en) * 1998-07-24 2000-02-18 Hamamatsu Photonics Kk Method and device of correcting pixel defect of liquid crystal panel
JP2002357800A (en) * 2001-05-31 2002-12-13 Sony Corp Display device inspection equipment
JP2006165402A (en) * 2004-12-09 2006-06-22 Toyota Motor Corp Soldering device and soldering method
JP2006201120A (en) * 2005-01-24 2006-08-03 Olympus Corp Inspection apparatus of bio-related substance
JP2008157559A (en) * 2006-12-25 2008-07-10 Ishikawajima Inspection & Instrumentation Co High temperature furnace wall imaging device
WO2010116809A1 (en) * 2009-04-07 2010-10-14 Anbe Yoshinobu Heating apparatus for x-ray inspection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018081041A (en) * 2016-11-18 2018-05-24 株式会社東光高岳 Heated object measurement system
JP2019144129A (en) * 2018-02-21 2019-08-29 株式会社東光高岳 Substrate shape measuring device

Also Published As

Publication number Publication date
JP5812609B2 (en) 2015-11-17

Similar Documents

Publication Publication Date Title
KR101718378B1 (en) Evaluation device and evaluation method for substrate mounting apparatus and evaluation substrate used for the same
CN107389206B (en) A thermopile sensor and its control method
JP2017502529A (en) Low temperature RTP control using an infrared camera
JP2011501403A (en) Method for inspecting a test substrate under a predetermined temperature condition and an inspection apparatus capable of setting the temperature condition
KR102164075B1 (en) Warm test apparatus
CN112219272B (en) In-situ temperature sensing substrate, system and method
WO2010116809A1 (en) Heating apparatus for x-ray inspection
WO2010039329A2 (en) Adaptive laser beam shaping
CN101689481B (en) Stage for substrate temperature control unit
JP5812609B2 (en) Heating device
CN106064805B (en) It is a kind of to drive MEMS with thermostatically controlled hot type
JP5218871B2 (en) Temperature characteristic measuring device
JP2013217908A (en) Measuring device
JP3608241B2 (en) Thermal deformation measuring device
US12523550B2 (en) Thermopile laser sensor with response time acceleration and methods of use and manufacture
JP2011058969A (en) Heat insulating device for optical measuring instrument
KR101662713B1 (en) Thermal properties measurement sensors for thermoelectric thin film in cross-plane direction
JP5811702B2 (en) Temperature control device
JP6800000B2 (en) Heating object measurement system
Hu et al. Infrared Radiation Transparent Film Impact on Thermal Measurement
WO2014207894A1 (en) Inspection jig, and printed board inspection system employing the inspection jig
JP2009020027A (en) Temperature characteristic measuring device
JP2003017789A (en) Optical module test apparatus and optical module characteristic measuring method
TW202227777A (en) Apparatus and method for deformation measurement
Reinlein et al. Testing of thermally piezoelectric deformable mirror with buried functionality

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140107

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20140620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150331

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150512

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150707

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150811

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150914

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150915

R150 Certificate of patent or registration of utility model

Ref document number: 5812609

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250