JP4157838B2 - めっき溶液の再生方法 - Google Patents

めっき溶液の再生方法 Download PDF

Info

Publication number: JP4157838B2
Authority: JP; Japan
Prior art keywords: metal; tin; ions; auxiliary cathode; oxidation state
Prior art date: 2001-07-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP2003510478A

Other languages

English (en)

Japanese (ja)

Other versions

JP2004534151A (ja

Inventor

トーマスベック

ハンス・ユルゲンシュライアー

スヴェンラムプレヒト

ロルフシェーダー

カイ・イェンスマテヤート

Original Assignee

アトーテヒドイッチュラントゲゼルシャフトミットベシュレンクテルハフツング

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-07-03

Filing date

2002-06-17

Publication date

2008-10-01

2002-06-17 Application filed by アトーテヒドイッチュラントゲゼルシャフトミットベシュレンクテルハフツング filed Critical アトーテヒドイッチュラントゲゼルシャフトミットベシュレンクテルハフツング

2004-11-11 Publication of JP2004534151A publication Critical patent/JP2004534151A/ja

2008-10-01 Application granted granted Critical

2008-10-01 Publication of JP4157838B2 publication Critical patent/JP4157838B2/ja

2022-06-17 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths

Landscapes

Chemical & Material Sciences (AREA)
Metallurgy (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Electroplating Methods And Accessories (AREA)
Chemically Coating (AREA)
Separation Using Semi-Permeable Membranes (AREA)
Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Electrolytic Production Of Metals (AREA)

JP2003510478A 2001-07-03 2002-06-17 めっき溶液の再生方法 Expired - Lifetime JP4157838B2 (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE10132478A DE10132478C1 (de)	2001-07-03	2001-07-03	Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
PCT/EP2002/006654 WO2003004725A2 (en)	2001-07-03	2002-06-17	Regeneration method for a plating solution

Publications (2)

Publication Number	Publication Date
JP2004534151A JP2004534151A (ja)	2004-11-11
JP4157838B2 true JP4157838B2 (ja)	2008-10-01

Family

ID=7690626

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2003510478A Expired - Lifetime JP4157838B2 (ja)	2001-07-03	2002-06-17	めっき溶液の再生方法

Country Status (15)

Country	Link
US (1)	US20040245108A1 (de)
EP (1)	EP1427869B1 (de)
JP (1)	JP4157838B2 (de)
KR (1)	KR100827259B1 (de)
CN (1)	CN1232677C (de)
AT (1)	ATE289633T1 (de)
AU (1)	AU2002321069A1 (de)
BR (1)	BR0210829B1 (de)
CA (1)	CA2450258A1 (de)
DE (2)	DE10132478C1 (de)
ES (1)	ES2236552T3 (de)
MX (1)	MXPA03011772A (de)
MY (1)	MY130423A (de)
TW (1)	TWI279456B (de)
WO (1)	WO2003004725A2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI259680B (en)	2003-07-16	2006-08-01	Interdigital Tech Corp	Method and system for transferring information between network management entities of a wireless communication system
EP1630252A1 (de) *	2004-08-27	2006-03-01	ATOTECH Deutschland GmbH	Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen
JP4998704B2 (ja)	2007-01-22	2012-08-15	上村工業株式会社	置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
EP2298960A1 (de)	2009-08-24	2011-03-23	ATOTECH Deutschland GmbH	Verfahren zum stromlosen Abscheiden von Zinn und Zinnlegierungen
DE102009060676B4 (de)	2009-12-28	2015-07-23	Atotech Deutschland Gmbh	Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
CN102586851B (zh) *	2011-01-06	2015-03-04	宝山钢铁股份有限公司	一种缓解并减少镀锡溶液产生锡泥的电解方法
EP2671968B1 (de) *	2012-06-05	2014-11-26	ATOTECH Deutschland GmbH	Verfahren und Regenerierungsvorrichtung zur Regenerierung einer Plattierungszusammensetzung
CN106868577B (zh) *	2015-05-12	2018-06-08	江苏理工学院	减少污染的超临界复合电铸体系回收利用装置
CN106011810B (zh) *	2016-06-02	2019-01-11	东莞市智源电子科技有限公司	铜基材的化学锡镀液中四价锡的去除工艺
KR102404045B1 (ko) *	2016-10-24	2022-05-30	아토테크 도이칠란트 게엠베하 운트 콤파니 카게	금속 기판 상에 주석 층을 성막하는 방법 및 상기 방법에 의한 상기 주석 층 및 니켈/인 합금 하부층을 포함하는 구조체의 용도
CN110387540A (zh) *	2019-08-30	2019-10-29	江苏上达电子有限公司	一种化锡槽内二价锡的补充系统及方法
CN111676470A (zh) *	2020-05-29	2020-09-18	广东天承科技有限公司	一种简易可溶性的高价锡的还原方法
CN114232030B (zh) *	2021-12-23	2023-04-18	广东鑫菱环境科技有限公司	一种pcb甲基磺酸退锡废液循环再生方法
WO2024116456A1 (ja) *	2022-11-28	2024-06-06	株式会社村田製作所	めっき組成物の再生方法および再生装置
CN116288292A (zh) *	2023-03-20	2023-06-23	聂柱根	一种化学锡药水锡还原再生除铜装置
WO2025164402A1 (ja) *	2024-01-30	2025-08-07	株式会社村田製作所	めっき組成物およびその製造方法
WO2025169771A1 (ja) *	2024-02-06	2025-08-14	株式会社村田製作所	めっき組成物の製造方法および製造装置
WO2025249197A1 (ja) *	2024-05-30	2025-12-04	株式会社村田製作所	めっき組成物の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US1527576A (en) *	1923-02-19	1925-02-24	Wheeling Steel & Iron Company	Process of coating conducting materials with tin
US3784455A (en) *	1971-12-28	1974-01-08	Western Electric Co	Methods of electrolytic regenerative etching and metal recovery
DE2401719B2 (de) *	1974-01-15	1978-01-19	Vereinigte Aluminium Werke Ag, 5300 Bonn	Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden
JPS5226315A (en) *	1975-08-25	1977-02-26	Fuji Photo Film Co Ltd	Process for the recovery of silver from fixer
DE2742718C2 (de) *	1977-09-22	1984-04-19	ESTEL HOOGOVENS B.V., 1970 Ijmuiden	Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten
US4432844A (en) *	1982-01-28	1984-02-21	Fujisash Company	Process for regeneration of electrolyte containing tin salts by reducing the same
US4715894A (en) *	1985-08-29	1987-12-29	Techno Instruments Investments 1983 Ltd.	Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
DE3634710A1 (de) *	1986-10-11	1988-04-21	Ver Glaswerke Gmbh	Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung
CA2083196C (en) *	1991-11-27	1998-02-17	Randal D. King	Process for extending the life of a displacement plating bath
JPH06256999A (ja) *	1993-03-05	1994-09-13	Kawasaki Steel Corp	錫めっき液を回収再生する方法
US6280596B1 (en) *	1995-05-23	2001-08-28	Weirton Steel Corporation	Electrolytic tinplating of steel substrate and apparatus
US5705048A (en) *	1996-03-27	1998-01-06	Oxley Research, Inc.	Apparatus and a process for regenerating a CUCl2 etchant
DE19719020A1 (de) *	1997-05-07	1998-11-12	Km Europa Metal Ag	Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen
US6251255B1 (en) *	1998-12-22	2001-06-26	Precision Process Equipment, Inc.	Apparatus and method for electroplating tin with insoluble anodes
JP3455709B2 (ja) *	1999-04-06	2003-10-14	株式会社大和化成研究所	めっき方法とそれに用いるめっき液前駆体

2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
2002
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/en not_active Ceased
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 CA CA002450258A patent/CA2450258A1/en not_active Abandoned
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko not_active Expired - Lifetime
- 2002-06-17 EP EP02754692A patent/EP1427869B1/de not_active Expired - Lifetime
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown

Also Published As

Publication number	Publication date
WO2003004725A2 (en)	2003-01-16
AU2002321069A1 (en)	2003-01-21
CN1524132A (zh)	2004-08-25
ES2236552T3 (es)	2005-07-16
EP1427869B1 (de)	2005-02-23
MXPA03011772A (es)	2004-04-02
BR0210829A (pt)	2005-05-03
EP1427869A2 (de)	2004-06-16
ATE289633T1 (de)	2005-03-15
JP2004534151A (ja)	2004-11-11
CA2450258A1 (en)	2003-01-16
KR20040030725A (ko)	2004-04-09
WO2003004725A3 (en)	2004-04-15
MY130423A (en)	2007-06-29
TWI279456B (en)	2007-04-21
KR100827259B1 (ko)	2008-05-07
DE10132478C1 (de)	2003-04-30
BR0210829B1 (pt)	2011-07-26
CN1232677C (zh)	2005-12-21
HK1062926A1 (en)	2004-12-03
US20040245108A1 (en)	2004-12-09
DE60203050T2 (de)	2006-02-23
DE60203050D1 (de)	2005-03-31

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Date	Code	Title	Description
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2008-06-18	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080617
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Publication	Publication Date	Title
JP4157838B2 (ja)	2008-10-01	めっき溶液の再生方法
CN1276994C (zh)	2006-09-27	在金属表面上无电电镀银的浴及方法
WO2004085706A1 (en)	2004-10-07	Solution for etching copper surfaces and method of depositing metal on copper surfaces
JP3314967B2 (ja)	2002-08-19	置換めっき浴の寿命を延長させる方法
US5217751A (en)	1993-06-08	Stabilized spray displacement plating process
KR100292944B1 (ko)	2001-06-15	지지체 금속표면을 다른 금속으로 치환 도금하는 방법
EP2298960A1 (de)	2011-03-23	Verfahren zum stromlosen Abscheiden von Zinn und Zinnlegierungen
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CN101730391B (zh)	2012-01-04	避免伽凡尼腐蚀效应的电路板微蚀方法
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JPH03506052A (ja)	1991-12-26	無電解銅被覆の間に形成される銅粒子の溶解方法
CA2193007C (en)	2000-05-09	Process for extending the life of a displacement plating bath
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