JP6639939B2 - 研磨パッド、および、研磨パッドの製造方法 - Google Patents

研磨パッド、および、研磨パッドの製造方法 Download PDF

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Publication number
JP6639939B2
JP6639939B2 JP2016024739A JP2016024739A JP6639939B2 JP 6639939 B2 JP6639939 B2 JP 6639939B2 JP 2016024739 A JP2016024739 A JP 2016024739A JP 2016024739 A JP2016024739 A JP 2016024739A JP 6639939 B2 JP6639939 B2 JP 6639939B2
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JP
Japan
Prior art keywords
polymer
polishing pad
hydroxy group
polyurethane resin
derived
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016024739A
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English (en)
Japanese (ja)
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JP2017141393A (ja
Inventor
正敏 赤時
正敏 赤時
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitta DuPont Inc
Original Assignee
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Haas Inc filed Critical Nitta Haas Inc
Priority to JP2016024739A priority Critical patent/JP6639939B2/ja
Priority to PCT/JP2017/004579 priority patent/WO2017138564A1/fr
Priority to TW106104240A priority patent/TWI722108B/zh
Publication of JP2017141393A publication Critical patent/JP2017141393A/ja
Application granted granted Critical
Publication of JP6639939B2 publication Critical patent/JP6639939B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016024739A 2016-02-12 2016-02-12 研磨パッド、および、研磨パッドの製造方法 Active JP6639939B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016024739A JP6639939B2 (ja) 2016-02-12 2016-02-12 研磨パッド、および、研磨パッドの製造方法
PCT/JP2017/004579 WO2017138564A1 (fr) 2016-02-12 2017-02-08 Corps de polymère, tampon de polissage et procédé de production de corps de polymère
TW106104240A TWI722108B (zh) 2016-02-12 2017-02-09 研磨墊及研磨墊之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016024739A JP6639939B2 (ja) 2016-02-12 2016-02-12 研磨パッド、および、研磨パッドの製造方法

Publications (2)

Publication Number Publication Date
JP2017141393A JP2017141393A (ja) 2017-08-17
JP6639939B2 true JP6639939B2 (ja) 2020-02-05

Family

ID=59563179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016024739A Active JP6639939B2 (ja) 2016-02-12 2016-02-12 研磨パッド、および、研磨パッドの製造方法

Country Status (3)

Country Link
JP (1) JP6639939B2 (fr)
TW (1) TWI722108B (fr)
WO (1) WO2017138564A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10569384B1 (en) * 2018-11-06 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
US10464188B1 (en) 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
KR20220117220A (ko) * 2019-12-13 2022-08-23 주식회사 쿠라레 폴리우레탄, 연마층, 연마 패드 및 연마 방법
WO2023036801A1 (fr) * 2021-09-07 2023-03-16 Basf Se Mousses de polyuréthane à base de monomère ionique et leur utilisation dans des barrages de tranchée ou des coussins de support de canalisation ou un matériau thermiquement isolant

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4053635B2 (ja) * 1997-11-17 2008-02-27 株式会社イノアックコーポレーション 抗菌性ポリウレタン樹脂及びその製造方法
JP3391743B2 (ja) * 1999-08-10 2003-03-31 明成化学工業株式会社 新規なジオールスルホン酸第４級アンモニウム塩
US7709053B2 (en) * 2004-07-29 2010-05-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing of polymer-coated particles for chemical mechanical polishing
JP2011032397A (ja) * 2009-08-04 2011-02-17 Kyc Solutions Co Ltd 帯電防止樹脂
US8754184B2 (en) * 2009-11-16 2014-06-17 Chemtura Corporation Accelerated cure of isocyanate terminated prepolymers
JP6320014B2 (ja) * 2012-12-13 2018-05-09 キヤノン株式会社 電子写真用部材、プロセスカートリッジ及び電子写真装置
WO2015120430A1 (fr) * 2014-02-10 2015-08-13 President And Fellows Of Harvard College Tampon de polissage imprimé en 3d pour planarisation chimico-mécanique (cmp)
JP6587418B2 (ja) * 2014-05-15 2019-10-09 キヤノン株式会社 電子写真用部材、プロセスカートリッジ及び電子写真装置
JP6536144B2 (ja) * 2015-04-15 2019-07-03 東ソー株式会社 硬質ポリウレタンフォーム及びその製造方法

Also Published As

Publication number Publication date
TWI722108B (zh) 2021-03-21
JP2017141393A (ja) 2017-08-17
TW201800480A (zh) 2018-01-01
WO2017138564A1 (fr) 2017-08-17

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