JPH01100490U - - Google Patents
Info
- Publication number
- JPH01100490U JPH01100490U JP19401687U JP19401687U JPH01100490U JP H01100490 U JPH01100490 U JP H01100490U JP 19401687 U JP19401687 U JP 19401687U JP 19401687 U JP19401687 U JP 19401687U JP H01100490 U JPH01100490 U JP H01100490U
- Authority
- JP
- Japan
- Prior art keywords
- component
- fan
- guide plate
- holding member
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例である電子部品の冷
却構造を示す斜視図、第２図は第１図の正面図、
第３図は第２図のＡ―Ａ′矢視断面側面図である
。
１……シエルフ、２……印刷配線板、３……ガ
イド溝、４……対流誘導板、５……曲げ部、６…
…フアン、７……線材、８……コネクタ。
FIG. 1 is a perspective view showing a cooling structure for electronic components as an embodiment of the present invention, FIG. 2 is a front view of FIG. 1,
FIG. 3 is a cross-sectional side view taken along the line A-A' in FIG. DESCRIPTION OF SYMBOLS 1...Shelf, 2...Printed wiring board, 3...Guide groove, 4...Convection guide plate, 5...Bending portion, 6...
...Fan, 7...Wire, 8...Connector.
Claims (1)
の機器部品を実装している複数のシエルフ間に空
気を流して上記機器部品を自然冷却させる対流誘
導板と、この対流誘導板上に上記機器部品の高発
熱量を発生する部分を局部的に強制冷却させるフ
アンと、上記上段のシエルフのたわみを防止する
ようにこれを保持する保持部材と、この保持部材
に保持され上記フアンの駆動用電源接続線を接続
する接続部材とを設けたことを特徴とする電子部
品の冷却構造。 A convection guide plate that is housed in an electronic device and that naturally cools the device components by flowing air between a plurality of shelves each having a component of the electronic device mounted therein, and a convection guide plate that naturally cools the device component. A fan that locally forcibly cools a portion that generates a high amount of heat, a holding member that holds the upper shelf to prevent it from deflecting, and a power connection line for driving the fan that is held by this holding member. A cooling structure for an electronic component, characterized in that it is provided with a connecting member for connecting the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19401687U JPH01100490U (en) | 1987-12-23 | 1987-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19401687U JPH01100490U (en) | 1987-12-23 | 1987-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100490U true JPH01100490U (en) | 1989-07-05 |
Family
ID=31484771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19401687U Pending JPH01100490U (en) | 1987-12-23 | 1987-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100490U (en) |
-
1987
- 1987-12-23 JP JP19401687U patent/JPH01100490U/ja active Pending
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