JPH01108694U - - Google Patents
Info
- Publication number
- JPH01108694U JPH01108694U JP455188U JP455188U JPH01108694U JP H01108694 U JPH01108694 U JP H01108694U JP 455188 U JP455188 U JP 455188U JP 455188 U JP455188 U JP 455188U JP H01108694 U JPH01108694 U JP H01108694U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- earphone body
- synthetic resin
- resin foam
- covers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006260 foam Substances 0.000 claims 8
- 229920003002 synthetic resin Polymers 0.000 claims 8
- 239000000057 synthetic resin Substances 0.000 claims 8
Landscapes
- Headphones And Earphones (AREA)
Description
第１図は第一及び第二の考案の実施例によるイ
ヤホーンを実装した状態の断面図、第２図は第四
の考案の実施例によるパツドの断面図、第３図は
第一の考案の別の実施例によるイヤホーンを実装
した状態の断面図、第４図は第三の考案の実施例
によるパツドの断面図、第５図は第二の考案のさ
らに別の実施例によるイヤホーンを実装した状態
の断面図、第６図は第四の考案のさらに別の実施
例によるパツドの断面図、第７図は考案の効果を
示す図面代用グラフ、第８図は従来のイヤホーン
の実装状態を示す断面図、第９図は従来のイヤホ
ーン用パツドの断面図である。
Ｈ……イヤホーン、１……イヤホーン本体、１
０……パツド、１１……前面部、１２……背面リ
ング部、１００……耳介。
Fig. 1 is a cross-sectional view of the earphone mounted according to the embodiments of the first and second inventions, Fig. 2 is a sectional view of the pad according to the embodiment of the fourth invention, and Fig. 3 is a sectional view of the pad according to the embodiment of the fourth invention. FIG. 4 is a sectional view of a pad according to an embodiment of the third invention, and FIG. 5 is a sectional view of an earphone according to another embodiment of the second invention. 6 is a sectional view of a pad according to yet another embodiment of the fourth invention, FIG. 7 is a graph substituted for a drawing showing the effect of the invention, and FIG. 8 is a mounting state of a conventional earphone. 9 is a sectional view of a conventional earphone pad. H...Earphone, 1...Earphone body, 1
0...Pad, 11...Front part, 12...Back ring part, 100...Auricle.
Claims (1)
その内部に音響再生機構が収容されたイヤホーン
本体の少なくとも前面外周部を覆う柔軟な合成樹
脂発泡体よりなる前面部と、この前面部の外周部
に一体に設けられ、かつ上記イヤホーン本体の背
面外周部を覆う背面リング部とを備えるパツドが
上記イヤホーン本体に装着されており、上記パツ
ドの背面リング部が遮音性を有する柔軟な合成樹
脂発泡体よりなることを特徴とするイヤホーン。 ２ 耳介内に嵌合装着し得る大きさに形成され、
その内部に音響再生機構が収容されたイヤホーン
本体の少なくとも前面外周部を覆う柔軟な合成樹
脂発泡体よりなる前面部と、この前面部の外周部
に一体に設けられ、かつ上記イヤホーン本体の背
面外周部を覆う背面リング部とを備えるパツドが
上記イヤホーン本体に装着されており、上記パツ
ドの背面リング部が上記前面部よりも厚肉の遮音
性を有する柔軟な合成樹脂発泡体よりなることを
特徴とするイヤホーン。 ３ 耳介内に嵌合装着し得る大きさに形成され、
その内部に音響再生機構が収容されたイヤホーン
本体の少なくとも前面外周部を覆う柔軟な合成樹
脂発泡体よりなる前面部と、この前面部の外周部
に一体に設けられ、かつ上記イヤホーン本体の背
面外周部を覆う背面リング部とを備え、上記イヤ
ホーン本体に装着可能なパツドであつて、このパ
ツドの背面リング部が遮音性を有する柔軟な合成
樹脂発泡体よりなることを特徴とするイヤホーン
用パツド。 ４ 耳介内に嵌合装着し得る大きさに形成され、
その内部に音響再生機構が収容されたイヤホーン
本体の少なくとも前面外周部を覆う柔軟な合成樹
脂発泡体よりなる前面部と、この前面部の外周部
に一体に設けられ、かつ上記イヤホーン本体の背
面外周部を覆う背面リング部とを備え、上記イヤ
ホーン本体に装着可能なパツドであつて、このパ
ツドの背面リング部が上記前面部よりも厚肉の遮
音性を有する柔軟な合成樹脂発泡体よりなること
を特徴とするイヤホーン用パツド。[Claims for Utility Model Registration] 1. Formed to a size that can be fitted into the auricle,
A front part made of a flexible synthetic resin foam that covers at least the front outer periphery of the earphone body in which the sound reproduction mechanism is housed; 1. An earphone characterized in that a pad is attached to the earphone body and includes a back ring portion that covers the earphone body, and the back ring portion of the pad is made of a flexible synthetic resin foam having sound insulating properties. 2. Formed to a size that can be fitted and worn within the auricle,
A front part made of a flexible synthetic resin foam that covers at least the front outer periphery of the earphone body in which the sound reproduction mechanism is housed; A pad is attached to the earphone body, and the rear ring portion of the pad is made of a flexible synthetic resin foam having sound insulating properties that is thicker than the front portion. Earphones. 3. Formed to a size that can be fitted and worn within the auricle,
A front part made of a flexible synthetic resin foam that covers at least the front outer periphery of the earphone body in which the sound reproduction mechanism is housed; What is claimed is: 1. A pad for earphones that is attachable to the earphone body, the pad having a back ring portion that covers the earphone body, the back ring portion of the pad being made of a flexible synthetic resin foam having sound insulating properties. 4. Formed to a size that can be fitted into the auricle,
A front part made of a flexible synthetic resin foam that covers at least the front outer periphery of the earphone body in which the sound reproduction mechanism is housed; a pad that can be attached to the earphone body, the pad having a back ring portion that covers the earphone body, the back ring portion of the pad being made of a flexible synthetic resin foam having sound insulating properties that is thicker than the front portion Earphone pads featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988004551U JPH0631834Y2 (en) | 1988-01-18 | 1988-01-18 | Earphones and pads for earphones |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988004551U JPH0631834Y2 (en) | 1988-01-18 | 1988-01-18 | Earphones and pads for earphones |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01108694U true JPH01108694U (en) | 1989-07-24 |
| JPH0631834Y2 JPH0631834Y2 (en) | 1994-08-22 |
Family
ID=31207164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988004551U Expired - Lifetime JPH0631834Y2 (en) | 1988-01-18 | 1988-01-18 | Earphones and pads for earphones |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631834Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191785U (en) * | 1982-06-16 | 1983-12-20 | アイワ株式会社 | Open air headphone |
| JPS6121190U (en) * | 1984-07-11 | 1986-02-07 | 株式会社ケンウッド | Mounting structure of ear pads in headphone |
-
1988
- 1988-01-18 JP JP1988004551U patent/JPH0631834Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58191785U (en) * | 1982-06-16 | 1983-12-20 | アイワ株式会社 | Open air headphone |
| JPS6121190U (en) * | 1984-07-11 | 1986-02-07 | 株式会社ケンウッド | Mounting structure of ear pads in headphone |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0631834Y2 (en) | 1994-08-22 |
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