JPH01143168U - - Google Patents
Info
- Publication number
- JPH01143168U JPH01143168U JP3883988U JP3883988U JPH01143168U JP H01143168 U JPH01143168 U JP H01143168U JP 3883988 U JP3883988 U JP 3883988U JP 3883988 U JP3883988 U JP 3883988U JP H01143168 U JPH01143168 U JP H01143168U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- hybrid
- circuit body
- bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 1
- 238000010397 one-hybrid screening Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は、実施例ハイブリツドＩＣを示す斜視
図、第２図は、上・下混成集積回路体をチツプ部
品を介して重合する状態を示す説明図、第３図は
、上・下混成集積回路体をチツプ部品を介して一
体に接合した状態を示す説明図、第４図は、実施
例ハイブリツドＩＣをマザーボードに実装した状
態を示す正面図である。
２：上側混成集積回路体、３：下側混成集積回
路体、４：チツプ部品、２１，３１：リード端子
、２２，３２：導電パターン、２３：ハンダクリ
ーム。
FIG. 1 is a perspective view showing an example hybrid IC, FIG. 2 is an explanatory diagram showing a state in which upper and lower hybrid integrated circuit bodies are superimposed via chip parts, and FIG. 3 is an illustration of an upper and lower hybrid integrated circuit. FIG. 4 is an explanatory diagram showing a state in which the circuit bodies are integrally joined via chip components, and FIG. 4 is a front view showing a state in which the hybrid IC of the embodiment is mounted on a motherboard. 2: Upper hybrid integrated circuit body, 3: Lower hybrid integrated circuit body, 4: Chip parts, 21, 31: Lead terminals, 22, 32: Conductive pattern, 23: Solder cream.
Claims (1)
混成集積回路体と他方の混成集積回路体とを、直
交方向に重合し、両混成集積回路体の重合間にチ
ツプ部品を配置し、このチツプ部品の電極と両方
の混成集積回路体の導体パターンとを接続して、
一体接合したことを特徴とするハイブリツドＩＣ
。 One hybrid integrated circuit body having leads protruding from both ends thereof and the other hybrid integrated circuit body are superimposed in orthogonal directions, and a chip component is placed between the overlapping parts of both hybrid integrated circuit bodies. Connect the electrodes of the component and the conductor patterns of both hybrid integrated circuit bodies,
Hybrid IC characterized by integrally bonded
.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3883988U JPH0517902Y2 (en) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3883988U JPH0517902Y2 (en) | 1988-03-24 | 1988-03-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01143168U true JPH01143168U (en) | 1989-10-02 |
| JPH0517902Y2 JPH0517902Y2 (en) | 1993-05-13 |
Family
ID=31265377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3883988U Expired - Lifetime JPH0517902Y2 (en) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517902Y2 (en) |
-
1988
- 1988-03-24 JP JP3883988U patent/JPH0517902Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517902Y2 (en) | 1993-05-13 |
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