JPH01143194U - - Google Patents
Info
- Publication number
- JPH01143194U JPH01143194U JP3953788U JP3953788U JPH01143194U JP H01143194 U JPH01143194 U JP H01143194U JP 3953788 U JP3953788 U JP 3953788U JP 3953788 U JP3953788 U JP 3953788U JP H01143194 U JPH01143194 U JP H01143194U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- heat dissipation
- generating member
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例に係る放熱構造の説
明図、第２図は上記構造を有する装置に於ける放
熱状態の説明図、第３図乃至第５図は他例の説明
図、第６図及び第７図は従来例の説明図である。
１は筐体、２は電源ユニツト、３はプリント基
板、４は発熱素子、５は放熱部材、６は断熱材、
７は外装体、８はＣＲＴ、９はフアンである。
FIG. 1 is an explanatory diagram of a heat dissipation structure according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a heat dissipation state in a device having the above structure, and FIGS. 3 to 5 are explanatory diagrams of other examples. FIGS. 6 and 7 are explanatory diagrams of conventional examples. 1 is a housing, 2 is a power supply unit, 3 is a printed circuit board, 4 is a heating element, 5 is a heat dissipation member, 6 is a heat insulating material,
7 is an exterior body, 8 is a CRT, and 9 is a fan.
Claims (1)
て、 前記発熱部材を収納した筐体と、 前記発熱部材と筐体とに接触する放熱部材と、 前記発熱部材及び前記筐体内部の放熱部材を覆
う断熱材と、 を有することを特徴とした放熱構造。 (2) 請求項(1)の記載の放熱構造に於いて、前記
放熱部材の一部を断熱材で覆い、他を筐体内で露
出させた放熱構造。[Claims for Utility Model Registration] (1) In a heat dissipation structure for a device incorporating a heat generating member, the heat dissipating structure includes: a housing housing the heat generating member; a heat dissipating member in contact with the heat generating member and the housing; and the heat generating member. A heat dissipation structure comprising: a heat insulating material that covers a member and a heat dissipation member inside the casing. (2) The heat dissipation structure according to claim (1), wherein a part of the heat dissipation member is covered with a heat insulating material, and the other part is exposed within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3953788U JPH01143194U (en) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3953788U JPH01143194U (en) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143194U true JPH01143194U (en) | 1989-10-02 |
Family
ID=31266036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3953788U Pending JPH01143194U (en) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143194U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008047798A (en) * | 2006-08-21 | 2008-02-28 | Matsushita Electric Ind Co Ltd | Electronics |
-
1988
- 1988-03-28 JP JP3953788U patent/JPH01143194U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008047798A (en) * | 2006-08-21 | 2008-02-28 | Matsushita Electric Ind Co Ltd | Electronics |
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