JPH01160883U - - Google Patents
Info
- Publication number
- JPH01160883U JPH01160883U JP4884988U JP4884988U JPH01160883U JP H01160883 U JPH01160883 U JP H01160883U JP 4884988 U JP4884988 U JP 4884988U JP 4884988 U JP4884988 U JP 4884988U JP H01160883 U JPH01160883 U JP H01160883U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- circuit board
- printed circuit
- hole
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案の一実施例の断面図、第２図
はその―矢視図、第３図はその接続の方法を
示す断面図、第４図はそのときの熱流を示す図、
第５図ないし第９図はそれぞれ金属板の孔部の形
状の異なる実施例を示す図、第１０図は従来例の
断面図、第１１図はその―矢視図、第１
２図はその接続の方法を示す断面図である。
１…金属板、２…孔部、３…橋絡部、４…小孔
、５…プリント回路基板、６…銅箔、７…ハンダ
。
Fig. 1 is a sectional view of an embodiment of this invention, Fig. 2 is a view in the direction of the arrow, Fig. 3 is a sectional view showing the method of connection, Fig. 4 is a diagram showing the heat flow at that time,
5 to 9 are views showing embodiments with different shapes of holes in the metal plate, FIG. 10 is a sectional view of the conventional example, FIG.
FIG. 2 is a sectional view showing the method of connection. DESCRIPTION OF SYMBOLS 1...Metal plate, 2...Hole, 3...Bridging part, 4...Small hole, 5...Printed circuit board, 6...Copper foil, 7...Solder.
Claims (1)
せ、金属板に形成した孔部にハンダを充填して金
属板と銅箔とを接続するプリント回路基板と金属
板の接続構造において、上記孔部には孔部の対向
する周縁を連絡する橋絡部が形成されていること
を特徴とするプリント回路基板と金属板の接続構
造。 In a connection structure between a printed circuit board and a metal plate, in which the copper foil of the printed circuit board and the metal plate are overlapped, and the hole formed in the metal plate is filled with solder to connect the metal plate and the copper foil, the hole is A connection structure between a printed circuit board and a metal plate, characterized in that a bridge portion is formed to connect opposing peripheral edges of a hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4884988U JPH01160883U (en) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4884988U JPH01160883U (en) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160883U true JPH01160883U (en) | 1989-11-08 |
Family
ID=31274981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4884988U Pending JPH01160883U (en) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160883U (en) |
-
1988
- 1988-04-12 JP JP4884988U patent/JPH01160883U/ja active Pending