JPH01179435U - - Google Patents
Info
- Publication number
- JPH01179435U JPH01179435U JP1988076511U JP7651188U JPH01179435U JP H01179435 U JPH01179435 U JP H01179435U JP 1988076511 U JP1988076511 U JP 1988076511U JP 7651188 U JP7651188 U JP 7651188U JP H01179435 U JPH01179435 U JP H01179435U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- printed wiring
- integrated circuit
- circuit device
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す複合集積回路
装置の半導体チツプを含めたプリント配線基板の
部分断面図である。 １……プリント配線基板、２……アルミナセラ
ミツク板、３……半導体チツプ、４……抜け穴、
５……配線、６……金属細線、７……窪み部。
装置の半導体チツプを含めたプリント配線基板の
部分断面図である。 １……プリント配線基板、２……アルミナセラ
ミツク板、３……半導体チツプ、４……抜け穴、
５……配線、６……金属細線、７……窪み部。
Claims (1)
- 半導体素子が形成された半導体チツプをプリン
ト配線基板に搭載してなる複合集積回路装置にお
いて、一表面に抜け穴を有する窪みが形成された
前記プリント配線基板と、前記窪みに埋設された
前記半導体チツプと同程度の大きさのアルミナセ
ラミツク板と、前記アルミナセラミツク板に搭載
された前記半導体チツプとを備えることを特徴と
する複合集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076511U JPH01179435U (ja) | 1988-06-08 | 1988-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076511U JPH01179435U (ja) | 1988-06-08 | 1988-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179435U true JPH01179435U (ja) | 1989-12-22 |
Family
ID=31301534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988076511U Pending JPH01179435U (ja) | 1988-06-08 | 1988-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179435U (ja) |
-
1988
- 1988-06-08 JP JP1988076511U patent/JPH01179435U/ja active Pending