JPH01183892A - Lead wire cutting device for electronic components - Google Patents

Abstract

PURPOSE:To ensure the positioning of lead wires having the different diameters before they are cut and to make it possible to cut the wires in a pyramid shape, by providing a lead wire guide plate, which is slidably attached to the upper part of a pyramid lead cutter, and in which V grooves are provided at the tip. CONSTITUTION:A taping part 2 is conveyed to a specified position by a sending mechanism. Lead wires 11 of the taping part 2 are positioned and held with a lead wire guide plate 45 at the same time. Then, the taping member of an electronic part 10 is cut with a tape cutter 39, which is slidden in the direction of an arrow A and a tape cutter 40, which is slidden in the direction of an arrow B. A lead wire guide plate 41 is slidably attached to the upper part of a pyramid lead cutter 37. V grooves are provided at the tip part of the lead wire guide 41. The taping-member side of the lead wire 11 is moved to a specified position. The lead wire 11 is cut in a pyramid shape with the pyramid lead cutter 37 at the same time. In this way, the lead wires 11 having the different diameters are positively positioned and can be steadly positioned and cut in a pyramid shape.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a lead wire cutting device for electronic components that automatically cuts the lead wires of electronic components that are successively mounted on a printed circuit board from a taping member. It is.

BACKGROUND OF THE INVENTION FIG. 8 shows an overall view of a conventional electronic component lead wire cutting device. Further, FIGS. 9 to 12 are partially cutaway front views showing a process in which the lead wire of the radial taping component is cut by the electronic component lead wire cutting device shown in FIG. 8.

In FIG. 8, a convex portion (not shown) of the feeding mechanism of the radial type taping component 2 is fitted into the feeding hole 1 of the taping component 2, and by driving the feeding mechanism, the taping component 2 can be fed at any time. Then, in the sent taping component 2, the lead wire 11 is positioned and held at a predetermined position by the lead wire cutting guide plate 3, as shown in FIG. Next, as shown in FIG. 10, the tape cutter 4 slides in the direction of the arrow and the tape cutter 6 slides in the B direction by an external force such as an air cylinder.
The taping member of the electronic component 10 is cut.

Next, as shown in FIG. 11, the radial taping member of the lead wire 11 is moved to a predetermined position by the lead wire guide plate 6, and at the same time, as shown in FIG.
The tip of the lead wire 11 is cut into a pyramid shape.

Here, the lead wire guide plate 6 is fixed to the square pyramid lead cutter 7 as shown in FIG. 13, and the guide groove 61L of the lead wire guide plate 6 is made to match the maximum width of the lead wire 11. If the lead wire 11 has a small wire diameter, the position of the square pyramid of the cut lead wire 19 will shift as shown in FIG. 19.

FIG. 19a shows a state in which the lead wire 11 having a large wire diameter is cut.

As shown in FIGS. 14 and 16, the electronic component 1o in which the lead wire 11 has been cut to a predetermined length is held by the insertion chuck 21, and the tip of the lead wire 11 is placed on the lead wire guide plate. 22 into the guide hole 23. The lead wire guide plate 22 is shown in FIG.

As shown in FIG. 16, it is composed of a set of two pieces, and can be combined or separated as necessary.

When the two lead wire guide plates 22 are combined, a guide hole 23 is formed which is constricted at the center and widened at both upper and lower ends. As described above, although the center of the guide hole 23 is constricted, both ends are widened, so that the lead wire 11 can be easily inserted into the guide hole 23 even if the position of the lead wire 11 is slightly shifted. A printed circuit board 26 supported by a board guide 24 is located below the lead wire guide plate 22, and a guide pin 28 provided on a guide block 27 is passed through the lead wire insertion hole 26 of the printed circuit board 26 from below. .

The tip of the guide pin 28 is inserted from below into the guide hole 23 of the lead wire guide plate 22, as shown in FIG.
The lead wire 11 and guide pin 28 are connected to the lead wire guide plate 22.
contact at the center of the guide hole 23. A recess 29 having the same or larger diameter than the lead wire 11 is provided at the distal end of the guide pin 28 , and the distal end of the lead wire 11 is inserted into the recess 29 . When the lead wire 11 is inserted into the recess 29, the lead wire guide plate 22 is separated so as to divide the guide hole 23, the lead wire guide plate 22 is removed, and the electronic component 10 is pushed downward by the push rod 30 and inserted. The chuck 21 also separates from the electronic component 10. Therefore, the electronic component 1o moves downward while being held between the guide pin 28 and the push rod 30, and the lead wire 1o moves downward as shown in FIG.
1 is inserted into the lead wire insertion hole 26 of the printed circuit board 25, and the insertion work is completed.

Problem to be Solved by Genmei However, when using such an insertion method, the tip of the lead wire 11 must be pyramid-shaped. but,
When the lead wire guide plate 6 has a conventional shape, when the lead wire diameter is less than or equal to the width A of the guide groove 6a, the tip of the cut lead wire 11 has an angle as shown in FIG. It may not be cone-shaped. In this case, there was a problem in that the tip of the lead wire 11 could not stably fit into the recess 29 at the tip of the guide pin 28, leading to insertion errors.

In view of the above-mentioned problems, the present invention aims to provide a lead wire cutting device for electronic components that can make the lead wire tip shape into a pyramid shape when cutting the lead wire for any lead wire diameter. be.

Means for Solving the Problem In order to solve this problem, the electronic component lead wire cutting device of the present invention has a mechanism for feeding out a taping component for fixing a plurality of electronic components, and a mechanism for moving each electronic component to a predetermined position. a mechanism for cutting the taping member that fixes the predetermined electronic component; and a square pyramid lead cutter that is installed at the predetermined position at the same time as the taping member side of the lead wire of the predetermined electronic component is moved to the predetermined position. A lead wire guide plate is slidably attached to the top and has a V-groove at the tip, and the tip of the lead wire of the electronic component is cut into a pyramid shape.

Effect With the above structure, lead wires can be reliably positioned and cut into a pyramidal shape during cutting, no matter how different the wire diameters are.

EXAMPLE An example of the present invention will be described below with reference to the drawings. Fig. 1 shows a detailed view of a lead wire cutting device for electronic components in an embodiment of the present invention, Fig. 2 shows an overall view of a lead wire cutting section, and Fig. 3 shows a detailed view of an IJ-wire cutter. .

1 to 3, the force of a drive source 31 such as a cylinder is transmitted to a cutter slider 36 via a cam follower 35 by LN-32, 33, and 34. As a result, the cutter slider 36 moves in the directions of arrows M and B, thereby driving the square pyramid lead cutter 37 attached to the tip of the cutter slider 36.

In FIG. 1, a radial type taping component 2 is transported to a predetermined position by a feeding mechanism. The sent taping component 2 positions the lead wire 11 with the lead wire guide plate 45 and holds the lead wire 11 at the same time.

Next, the taping member of the electronic component 1o is cut by the tape cutter 39 sliding in the direction of the arrow and the tape cutter 40 sliding in the B direction.

Then, the lead wires 11
While moving the taping member side to a predetermined position, the lead wire 11 is cut into a square pyramid shape using a square pyramid lead cutter 37.

4 to 6 show the positioning operation of the lead wire 11 of the electronic component 1o.

As shown in FIGS. 4a and 4b, the lead wire guide plate 41 is
It is slidably attached to the square pyramid lead cutter 37 by a pin 42. Moreover, pressure is always applied to the cylinder 43 incorporated in the cutter slider 36, and the lead wire guide plate 41 is always pressed against the square pyramid lead cutter 37 by the piston 44.

Next, as shown in FIG. 6a and b, cutter slider 3
6 moves in the directions of arrows C and D in order to cut the lead wire 11, and first cuts the V at the tip of the lead wire guide plate 41.
The lead wire 11 of the electronic component 10 is positioned at a predetermined position by the groove portion 41a. Then, as the cutter slider 36 further moves in the directions of arrows C and D as shown in FIGS. 6a and 6b, the lead wire guide plate 41 has already moved
1, the piston 44 loses the force of the cutter slider 36 and leads in the direction of arrows E and F! 1
1, slide the top surface of the square pyramid cutter 37. Then, the lead wire 11il-j is cut by the square pyramid lead cutter 37. In this way, the lead a11 is positioned and cut.

Next, the case of cutting lead wires 11 having different lead wire diameters will be explained using FIG. 7, 11zQ.

As explained earlier, the tip of the lead wire guide plate 38 is
Due to the shape of the mold, when the lead wire diameter is small, as shown in Figure 7 B, when the lead wire diameter is medium, the 7th
As shown in the figure, if the lead wire diameter is large, the lead wire 11 is positioned as shown in FIG. 7C.

Effects of the Invention As described above, the lead wire cutting device of the present invention can stably cut radially taped electronic components into a pyramidal shape, and can cut thin lead wires that were previously impossible. can. In addition, even if a foreign object accidentally gets caught, the lead wire guide plate can escape and will not be damaged, making it extremely reliable and allowing the next electronic component to be mounted on the printed circuit board extremely smoothly. It is a dog of industrial value, such as being able to do things.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the main parts of an embodiment of the electronic component lead wire cutting device of the present invention, Fig. 2 is a front view showing the overall configuration, and Fig. 3 is a partially cutaway perspective view of the main parts. Figure 4a,
bN Figures 6a and b are a plan view and a sectional view showing the operation of the lead wire cutting process, Figure 7 aNC is a plan view showing the state in which the lead wire is fixed by the lead wire guide plate, and Figure 8 is a conventional electronic A perspective view of the main part of the component lead wire cutting device, FIGS. 9 to 12 are front views showing the lead wire cutting process by the operation of the device, and FIG. 13 is a partial cutaway of the main part of the device. A perspective view, FIGS. 14 to 18 are explanatory diagrams illustrating mounting of electronic components cut by the same apparatus onto a printed circuit board, and FIG.
Figures a and b are explanatory diagrams showing how the lead wires of a conventional device are cut. 2...Taping parts, 1o...Electronic parts, 11...Lead wire, 36...Cutter slider, 37...Pyramid lead Cutter, 39.40...Tape cutter, 41...
... Lead wire guide plate, 42 ... Bin, 4
3... Cylinder, 44 River... Piston, 45
...Lead wire guide board. Name of agent: Patent attorney Toshio Nakao and 1 other group
1 Figure/Chee ζ° Nk 1 Ashi Collection 3 Figure Section B - Figure 8 Figure 9 Figure 1゜ Figure 11 Figure 12 Figure 13 Figure 17 Figure 18 Figure 19 +a1

Claims (1)

[Claims] A mechanism for sending out a taping member for fixing a plurality of electronic components, a mechanism for moving it to a predetermined position, a mechanism for cutting the taping member for fixing the predetermined electronic components, and a mechanism for cutting the taping member side of the lead wire of the predetermined electronic component. At the same time as the lead wire of the electronic component is moved to the predetermined position, a square pyramid lead cutter is installed at the predetermined position, and a lead wire guide plate is slidably attached to the top of the lead cutter and has a V-groove at the tip. A lead wire cutting device for electronic components configured to cut the tip into a pyramid shape.