JPH0129233B2 - - Google Patents
Info
- Publication number
- JPH0129233B2 JPH0129233B2 JP58056490A JP5649083A JPH0129233B2 JP H0129233 B2 JPH0129233 B2 JP H0129233B2 JP 58056490 A JP58056490 A JP 58056490A JP 5649083 A JP5649083 A JP 5649083A JP H0129233 B2 JPH0129233 B2 JP H0129233B2
- Authority
- JP
- Japan
- Prior art keywords
- article
- tape
- adhesive layer
- fixing
- minute
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000002985 plastic film Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 229920006255 plastic film Polymers 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【発明の詳細な説明】
この発明は微小物品固定用テープ及びその使用
方法に関し、詳しくは電子部品などの微小物品を
基板上に仮付けしていく場合に使用される微小物
品固定用テープ及びその使用方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a tape for fixing minute articles and a method of using the same, and more specifically, a tape for fixing minute articles used for temporarily attaching minute articles such as electronic components to a substrate, and a method for using the same. Regarding usage.
従来、電子部品など非常に微小な部品をプリン
ト基板上へ順次供給し、組立てていく場合、微小
な部品の仮固定、並びに半田付けなどによる取付
固定のための支持手段として、前記部品をプリン
ト基板に供給する直前に、部品のプリント基板と
の当接面に接着剤、又は粘着剤を塗布し、該接着
剤等を介してプリント基板に部品を仮固定し、し
かる後、半田デイツプ槽に通して半田付すること
などが行われている。 Conventionally, when extremely small parts such as electronic parts are sequentially supplied onto a printed circuit board and assembled, the parts are placed on the printed board as a support means for temporarily fixing the small parts and for attaching and fixing them by soldering etc. Immediately before supplying the parts to the printed circuit board, adhesive or pressure-sensitive adhesive is applied to the contact surface of the parts to the printed circuit board, the parts are temporarily fixed to the printed circuit board via the adhesive, and then passed through a solder dip bath. For example, soldering is carried out by hand.
しかしながら、上記手段では、部品に接着剤等
を塗布するのが装置の面でも、工程の面でもかな
り微小な作動が要求され、実施が煩雑であるとい
つた欠点があり、又、指定位置に正しい姿勢で微
小物品を仮付固定することも難しいといつた欠点
があつた。 However, the above-mentioned method has the disadvantage that application of adhesive etc. to parts requires quite small movements both in terms of equipment and process, making it complicated to apply. The drawback was that it was difficult to temporarily fix small objects in the correct posture.
又、近年急速に進みつつある電子部品の小型化
のもとにあつては、上記欠点はさらに顕著化され
るに至つている。 Furthermore, with the rapid progress in miniaturization of electronic components in recent years, the above-mentioned drawbacks have become even more prominent.
この発明は上記欠点に鑑み、非常に微小な物品
であつても、安全に移送でき、かつ、常に規制さ
れた部位に接着剤等が塗布され、よつて、物品の
固定も均一な状態に行い得る微小物品固定用テー
プ及びその使用方法を提供することを目的として
なされたものであつて、第１の発明は微小物品固
定用テープに関し、プラスチツクフイルム又はシ
ートから成る基材の片面に所定間隔毎に陥凹部が
形成され、該陥凹部内底面には粘着剤層が剥離可
能に設けられて成ることを特徴とするものであつ
て、第２の発明は、第１の発明の使用方法に関
し、プラスチツクフイルム又はシートから成る基
材の片面に、所定間隔毎に陥凹部が形成され、該
陥凹部内底面には粘着剤層が剥離可能に設けられ
た微小物品固定用テープの前記粘着剤層上にそれ
ぞれ微小物品を粘着固定し、次いで該微小物品を
前記粘着剤層を付着させたまま前記微小物品固定
用テープから剥し、前記粘着剤層を介して微小物
品を所定の基板上に粘着固定していくことを特徴
とするものである。 In view of the above-mentioned drawbacks, this invention allows for safe transportation of even very small articles, and allows adhesives etc. to be applied to regulated areas at all times, so that articles can be fixed in a uniform state. The first invention relates to a tape for fixing minute articles and a method of using the same, and the first invention relates to a tape for fixing minute articles, in which the tape is applied at predetermined intervals on one side of a base material made of a plastic film or sheet. A recessed portion is formed in the recessed portion, and an adhesive layer is removably provided on the inner bottom surface of the recessed portion, the second invention relates to a method of using the first invention, On one side of a base material made of a plastic film or sheet, recesses are formed at predetermined intervals, and an adhesive layer is removably provided on the inner bottom surface of the recesses, on the adhesive layer. A microscopic article is adhesively fixed to each of the substrates, and then the microscopic article is peeled off from the microscopic article fixing tape with the adhesive layer still attached, and the microscopic article is adhesively fixed onto a predetermined substrate via the adhesive layer. It is characterized by the fact that
以下、この発明を実施例により説明する。 This invention will be explained below with reference to Examples.
第１図はこの発明の実施例の断面図、第２図は
第１図の平面図、第３図は実施例の使用方法を示
す説明図である。 FIG. 1 is a sectional view of an embodiment of the invention, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is an explanatory diagram showing how to use the embodiment.
この発明の微小物品固定用テープＡは、プラス
チツクフイルム又はシートから成る基材１の片面
１Ａに、所定間隔毎に陥凹部２をプレス成形など
により形成し、この陥凹部２の内底面に粘着剤層
３が剥離可能に設けられて構成されている。 The tape A for fixing minute objects of the present invention has recesses 2 formed at predetermined intervals on one side 1A of a base material 1 made of a plastic film or sheet by press molding or the like, and an adhesive is applied to the inner bottom surface of the recesses 2. The layer 3 is provided in a removable manner.
上記実施例において、プラスチツクフイルム又
はシートとしては、ポリエチレン、ポリプロピレ
ン、ポリエチレン−ポリプロピレンの混合物、ポ
リ塩化ビニル、ポリスチレン、ポリエステル、
EVAなどのフイルム又はシートが用いられ、こ
れらフイルム又はシートから成る基材１に形成さ
れた陥凹部内底面には、図示は省略したが、シリ
コーン樹脂などの離型剤を必要に応じコーテイン
グしたものが用いられる。 In the above embodiments, the plastic film or sheet may include polyethylene, polypropylene, a mixture of polyethylene-polypropylene, polyvinyl chloride, polystyrene, polyester,
A film or sheet such as EVA is used, and the inner bottom surface of the recess formed in the base material 1 made of the film or sheet is coated with a mold release agent such as silicone resin as necessary, although not shown. is used.
又、上記した陥凹部２の大きさは、微小物品４
がゆるく嵌合する開口面積とされ、かつ、少少の
振動が加わつても、側方向ずれ、あるいは転倒が
生じない深さとすることが望ましい。 Further, the size of the recessed portion 2 described above is the same as that of the minute article 4.
It is desirable that the opening area be such that it fits loosely, and the depth is such that even if a small amount of vibration is applied, lateral displacement or overturning will not occur.
又、陥凹部２内底面に設けられる粘着剤層３と
しては、アクリル系、ゴム系、ビニル系、シリコ
ーン系、EVA系、ナイロン系、ポリエステル系、
エポキシ系などの粘着又は接着剤が使用される。 The adhesive layer 3 provided on the inner bottom surface of the recessed portion 2 may be acrylic, rubber, vinyl, silicone, EVA, nylon, polyester,
Adhesives or adhesives such as epoxy are used.
なお、上記微小物品固定用テープＡの製造手段
としては、(イ)プラスチツクフイルム又はシートか
ら成る基材１の片面に必要な部分に必要な大きさ
の形状に粘着剤３等を塗布し、次いで粘着剤３等
を塗布した部分に加熱真空成型などによつて上記
した必要な大きさの凹部２に形成する手段、(ロ)プ
ラスチツクフイルム又はシートから成る基板１の
片面に予めプレス成形などにより陥凹部２を形成
し、この陥凹部２内底面に粘着剤３等を塗布する
ことなどが行われる。 The method for producing the tape A for fixing minute objects is as follows: (a) Applying an adhesive 3 or the like to the required size on one side of the base material 1 made of a plastic film or sheet, and then Means for forming a concave portion 2 of the necessary size as described above by heating and vacuum forming on a portion coated with an adhesive 3, etc.; (b) forming a concave portion 2 of the above-mentioned size in advance by press forming on one side of a substrate 1 made of a plastic film or sheet; A recess 2 is formed, and an adhesive 3 or the like is applied to the inner bottom surface of the recess 2.
次に、この発明の微小物品固定用テープの使用
方法について説明する。 Next, a method of using the tape for fixing minute articles of the present invention will be explained.
まず、第３図に示すように、微小物品固定用テ
ープＡの陥凹部２内に目的の微小物品４例えば電
子部品などを分配し、粘着剤層３に粘着させる。
このとき、微小物品４は、陥凹部２により案内さ
れるため、粘着時の向き及び姿勢が一定に配列さ
れる。 First, as shown in FIG. 3, a target micro-article 4, such as an electronic component, is distributed into the recess 2 of the tape A for fixing a micro-article, and is adhered to the adhesive layer 3.
At this time, the minute articles 4 are guided by the recessed portion 2, so that the orientation and posture at the time of adhesion are arranged in a constant manner.
なお、微小物品４を微小物品固定用テープＡに
粘着させる手段としては、前掲の(イ)の製造時の陥
凹部２を形成する段階において、粘着剤層３上に
予め微小物品を粘着させておいても良いし、ある
いは、陥凹部２及び粘着剤層３を設けた微小物品
固定用テープＡに分配配置していく構成としても
良い。 In addition, as a means for adhering the micro-article 4 to the tape A for fixing the micro-article, it is possible to adhere the micro-article to the adhesive layer 3 in advance in the step of forming the recessed portion 2 during manufacturing in (a) above. Alternatively, the structure may be such that they are distributed over the tape A for fixing minute articles provided with the recessed portions 2 and the adhesive layer 3.
微小物品４を粘着させた固定用テープＡは、次
いで基材Ｃ取付工程へと送られ、固定用テープＡ
より粘着剤層３を付着させたまま微小物品４が剥
され、第４図に示すように、この粘着剤層３を介
して所定の基板Ｃ上に仮付けされ、以後、半田付
工程（図示せず）へと移送されていくのである。 The fixing tape A to which the minute article 4 is attached is then sent to the base material C attachment process, and the fixing tape A
The minute article 4 is peeled off with the adhesive layer 3 still attached, and is temporarily attached onto a predetermined substrate C via this adhesive layer 3, as shown in FIG. (not shown).
なお、微小物品固定用テープＡから微小物品４
を剥し取る際、粘着剤層３が微小物品４側へ転位
付着させるため、陥凹部２の内底面と微小物品４
との粘着力に差を持たせるため、前述のように陥
凹部２の内底面に剥離処理を施すほか、剥離時に
陥凹部２の裏面を加熱するなどにより粘着力を弱
めるようにしても良い。 In addition, from tape A for fixing minute articles to minute article 4.
When peeling off the adhesive layer 3, the adhesive layer 3 dislocates and adheres to the micro-article 4 side, so that the inner bottom surface of the recess 2 and the micro-article 4
In order to create a difference in the adhesive strength between the two, in addition to applying a peeling treatment to the inner bottom surface of the recessed part 2 as described above, the adhesive strength may be weakened by heating the back surface of the recessed part 2 at the time of peeling.
なお、微小物品４の基板Ｃへの固定に粘着剤を
使用する場合は、予め基板側も赤外線ヒータなど
により加熱しておくことが行われる。 In addition, when using an adhesive to fix the minute article 4 to the substrate C, the substrate side is also heated in advance using an infrared heater or the like.
この発明は以上のように構成されているので、
単品毎の運搬に非常に面倒な微小物品であつて
も、これらは基板Ｃに形成された陥凹部２内に収
められ、この陥凹部２がいわばケースとして機能
するため、移動中、振動などにより、ずれたり転
倒したりすることがなく、陥凹部２内底面に設け
られた粘着剤層３の仮着作用も相俟つて、微小物
品の移送が安全に、かつ確実に行え、又、微小物
品４を微小物品固定用テープＡからピツクアツプ
すれば粘着剤層３は微小物品４側へ転位付着する
ので、以後の基板Ｃへの取付けが非常に容易とな
り、このような微小物品の取付工程上、大幅な省
力化が期待できるなど種々の実用的効果を有する
のである。 Since this invention is configured as described above,
Even if it is a very small item that is very difficult to transport individually, it is stored in the recess 2 formed in the substrate C, and since this recess 2 functions as a case, it will not be affected by vibrations etc. during transportation. The transfer of minute objects can be carried out safely and reliably without any slipping or falling, and together with the temporary adhesion effect of the adhesive layer 3 provided on the inner bottom surface of the recessed portion 2, the transfer of minute objects can be carried out safely and reliably. If 4 is picked up from the tape A for fixing minute articles, the adhesive layer 3 will be dislocated and adhered to the minute article 4 side, making subsequent attachment to the substrate C very easy. It has various practical effects such as significant labor savings.
又、この発明は、例えばコンデンサ、抵抗、
LSIなどの電子部品の供給装置に限らず、他の同
様な微小物品についても同様に適用でき、使用範
囲も広いなど種々の効果を有する。 Further, this invention can be applied to, for example, capacitors, resistors,
It can be applied not only to supply devices for electronic components such as LSIs, but also to other similar minute articles, and has various effects such as a wide range of use.
第１図はこの発明の実施例の断面図、第２図は
第１図の平面図、第３図、第４図はこの発明の使
用方法を説明する断面図である。
Ａ……微小物品固定用テープ、１……基材、２
……陥凹部、３……粘着剤、４……微小物品。
FIG. 1 is a sectional view of an embodiment of the invention, FIG. 2 is a plan view of FIG. 1, and FIGS. 3 and 4 are sectional views illustrating a method of using the invention. A...Tape for fixing minute objects, 1...Base material, 2
...Recessed portion, 3...Adhesive, 4...Minute article.
Claims (1)
材の片面に所定間隔毎に陥凹部が形成され、該陥
凹部内底面には粘着剤層が剥離可能に設けられて
成ることを特徴とする微小物品固定用テープ。 ２ プラスチツクフイルム又はシートから成る基
材の片面に、所定間隔毎に陥凹部が形成され、該
陥凹部内底面には粘着剤層が剥離可能に設けられ
た微小物品固定用テープの前記粘着剤層上にそれ
ぞれ微小物品を粘着固定し、次いで該微小物品を
前記粘着剤層を付着させたまま前記微小物品固定
用テープから剥し、前記粘着剤層を介して微小物
品を所定の基板上に粘着固定していくことを特徴
とする微小物品固定用テープの使用方法。[Scope of Claims] 1. Recesses are formed at predetermined intervals on one side of a base material made of a plastic film or sheet, and an adhesive layer is removably provided on the inner bottom surface of the recesses. Tape for fixing small objects. 2. The adhesive layer of a tape for fixing minute articles, wherein recesses are formed at predetermined intervals on one side of a base material made of a plastic film or sheet, and an adhesive layer is removably provided on the inner bottom surface of the recesses. A microscopic article is adhesively fixed on each of the substrates, and then the microscopic article is peeled off from the microscopic article fixing tape with the adhesive layer still attached, and the microscopic article is adhesively fixed on a predetermined substrate via the adhesive layer. A method of using a tape for fixing minute objects, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58056490A JPS59179575A (en) | 1983-03-30 | 1983-03-30 | Tape for fixing minute articles and method for using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58056490A JPS59179575A (en) | 1983-03-30 | 1983-03-30 | Tape for fixing minute articles and method for using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59179575A JPS59179575A (en) | 1984-10-12 |
| JPH0129233B2 true JPH0129233B2 (en) | 1989-06-08 |
Family
ID=13028530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58056490A Granted JPS59179575A (en) | 1983-03-30 | 1983-03-30 | Tape for fixing minute articles and method for using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59179575A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2203676B (en) * | 1987-02-25 | 1991-03-20 | Tdk Corp | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| JPH0787277B2 (en) * | 1987-03-25 | 1995-09-20 | ティーディーケイ株式会社 | Board mounting method for surface mount components |
| JPH024611A (en) * | 1988-06-22 | 1990-01-09 | Tokujiro Okui | Reception of small-sized electronic part |
| CN110066543A (en) * | 2019-05-13 | 2019-07-30 | 重庆宏图新材料科技有限公司 | A kind of polyethylene-polyvinyl acetate ester film aqueous ink special and preparation method thereof |
-
1983
- 1983-03-30 JP JP58056490A patent/JPS59179575A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59179575A (en) | 1984-10-12 |
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