JPH01302826A - Electrical circuit device - Google Patents

Abstract

PURPOSE:To enable high density and cost reduction to be achieved and a device which can be easily produced and can be easily managed after production to be obtained by providing specific electrically connected members, electrical circuit parts, electrical circuit retaining part members, and other electrical circuit parts and by allowing electrically connected members to be retained at the electrical circuit parts and one of electrical circuit parts while allowing the other to be mounted and removed. CONSTITUTION:This device has an electrically connected member 125 where a plurality of conductive members 107 are embedded within a retainer 111 consisting of an insulating material and both edges are exposed on both surfaces of the retainer 111, an electrical circuit part 101 which has a connection part 102 where one edge of a conductive member 107 is connected to one surface of the retainer 111 at the connection part 102, an electrical circuit retaining member 201 which connects and/or retains a surface other than those where the connection part 102 of the electrical circuit parts 101 exists, and another electrical circuit parts 104 which has a connection part 105 where the other edge of the conductive member 107 exposed on the other surface of the retainer 111. Also, either of the electrical circuit parts 101 or other electrical circuit parts 104 retains an electrically connected member 125 and the other can be freely mounted or removed.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to an electric circuit device.

[Prior Art] Conventionally, the following technology is known as a technology related to an electric circuit device in which an electric circuit member configured by electrically connecting electric circuit components to each other is sealed.

■Wire bonding method Figures 11 and 12 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on Figures 11 and 12. .

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a thermosetting resin 8 such as an epoxy resin by a method such as a transfer molding method, and then the lead frame 1 is extended outward from the resin-sealed component. Cut off the unnecessary part of
A semiconductor device 9 is made by bending it into a desired shape.

■T A B (Tape Automated Bo
nding) method (for example, Japanese Patent Application Laid-Open No. 139636-1983)
13 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. This method will be explained based on FIG. 13.

In this method, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. After the connection, the semiconductor device 9 is sealed with resin 20 or 21 which is a thermosetting resin such as epoxy resin.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 14 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 14. Note that this method is also called a flip chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
The semiconductor element 4 provided with the solder bumps 31 is mounted on the circuit board 3.
Position and mount it on 2. Thereafter, the circuit board 32 and the semiconductor element 4 are connected by heating and melting the solder, and after cleaning with flux, the semiconductor device 9 is sealed.

■The method shown in FIGS. 15 and 16. An insulating film 71 made of polyimide or the like is formed on the portion of the first semiconductor element 4 other than the connection portion 5, and the connection portion 5 is made of Au.
Then, the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. on the other hand,
An insulating film 71° made of polyimide or the like is formed on a portion of the second semiconductor element 4' other than the connection part 5', a metal material 70' made of Au or the like is provided in the connection part 5', and then a metal material 70' made of Au or the like is provided on the connection part 5'.
0' and the exposed surface 73' of the insulating film 71'.

Flatten 72°.

Thereafter, as shown in FIG. 16, the first semiconductor element 4 and the second semiconductor element 4° are positioned, and after positioning, thermocompression bonding is performed to connect the connecting portion 5 of the first semiconductor element 4 and the second semiconductor element 4. The connecting portion 5° of the semiconductor element 4' is connected to metal materials 70, 70.
Connect via °.

(2) Method shown in FIG. 17 An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit board 75 and the second circuit board 75'. After positioning the circuit board 75 and the second circuit board 75', pressure is applied or pressure and heat is applied to connect the connecting portion 76 of the first circuit board 75 and the second circuit board 7.
This is a method of connecting a 5° connection part 76'.

■The method shown in FIG. 18 Between the first circuit board 75 and the second circuit board 75°,
An elastic connector 8 made of an insulator [81] in which metal wires 82 made of e, Cu, etc. are arranged in a certain direction.
3, the first circuit board 75 and the second circuit board 7
In this method, after positioning at 5 degrees, pressure is applied to connect the connecting portion 76 of the first circuit board 75 and the connecting portion 76' of the second circuit board 75'.

[Problems to be Solved by the Invention] However, the conventional bonding method described above has the following problems.

■Wire bonding method■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, so the outer peripheral edge 10 of the semiconductor element 4 or the lead It becomes easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the frame 1. When the ultrafine metal wire 7 comes into contact with these outer peripheral edges 10 or 11, a short circuit occurs. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and when the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is inevitably subject to circuit design limitations.

(2) Since the semiconductor element 4 and the lead frame 1 are connected by the ultra-fine metal wire 7, a horizontal spread is required for the connection, and if this is attempted to be made smaller, the short circuit described in (2) above will occur. Therefore, the wire bonding method cannot reduce the horizontal size required for connection, and is not suitable for high-density packaging.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting portions 5 on the semiconductor element 4 (distance between the centers of adjacent connecting portions is 1I).
We have no choice but to keep a certain amount of distance between each other. (sub)
Therefore, once the size of the semiconductor element 4 is determined, the connection portion 5 will inevitably be
The maximum number of is determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

■Wire bonding takes time. In particular, as the number of connection points increases, bonding time increases and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Furthermore, in the connection portion 5 on the semiconductor element 4, since the AJ2 that is not alloyed with the ultrafine metal wire 7 is exposed, An corrosion tends to occur, resulting in a decrease in reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length l of the inner lead part 17 of the carrier film substrate 16 becomes longer, so the inner lead part 17 is easily deformed. If the inner lead part cannot be connected to the desired connection part 5 or the inner lead part 17
may come into contact with a portion of the semiconductor element 4 other than the connection portion 5 . In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■ Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be set to about 0.09 to 0.15 mm, and therefore, as mentioned in the problem of the wire bonding method (■), the number of connections It becomes difficult to increase

(2) Like the wire bonding method, the TAB method also connects in the horizontal direction, so it is difficult to reduce the size in the horizontal direction, and it is not suitable for high-density packaging.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a connection shape of the inner lead portions 17 is required for this purpose, which increases costs.

■In order to connect the connection part 5 of the semiconductor element 4 and the inner lead part 17, it is necessary to attach gold bumps to the connection part 5 of the semiconductor element 4 or the connection part of the inner lead part 17, which increases the cost. .

■The thermal expansion coefficient of the semiconductor element 4 is between resin 20 and resin 21.
Since the coefficient of thermal expansion is different from that of , when heat is applied to the semiconductor device 9 , thermal stress is generated and the characteristics of the semiconductor element 4 are deteriorated. Furthermore, cracks occur in the semiconductor element 4 or the resin 20 or 21, reducing the reliability of the device. Such a phenomenon becomes remarkable when the size of the semiconductor element 4 is large.

(2) CCB method (2) Solder bumps 31 must be formed at the connection portions 5 of the semiconductor element 4, resulting in high costs.

■If the amount of solder on the bump is large, a bridge will occur between adjacent solder bumps (a phenomenon in which adjacent solder bumps come into contact with each other), and conversely, if the amount of solder on the bump is small, the connection between the connection part 5 of the semiconductor element 4 and the circuit board 32 will occur. The connection portion 33 is no longer connected and electrical continuity is no longer established. In other words, the reliability of the connection becomes low.

Furthermore, the amount of solder and the solder shape of the connection affect the reliability of the connection ("Geometric Opportunity").
ofControlledCo11apse
InterconnectHons''.

S, Goldman, IBM J.
RES, DEVELOP, 1969, MA
Y, pp, 251-265. “Re1iabili
ty of Controlled Collapses
e Inter-connections', K.
C. Norris.

A. H. Landzberg, IBM J.
RES, DEVELOP.

1969, MAY, I) I1266-271. There is a problem called Brazing Technology Research Group Technical Data, No. 017-'84, Published by Brazing Technology Research Group).

As described above, since the amount of solder bumps 31 affects the reliability of the connection, it is necessary to control the amount of solder bumps 31.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether the connection has been made properly.

■Poor heat dissipation of semiconductor elements (reference material: Electr
onic Packaging Technolo8y
1987.1゜(Vol, 3. No, 1) P, 6
6-71. NIKKEI MICRO DEVICES
(May 1986, P, 97-108), therefore, great efforts are required to improve heat dissipation characteristics.

(2) Since it is a 5-surface douw mount method in which the connecting portion of the semiconductor element 4 and the connecting portion of the circuit board 32 are connected together, alignment is difficult and the manufacturing equipment becomes large-scale. Furthermore, although the connection is performed by reflowing after mounting, positional deviation may occur during transportation.

■Technique shown in FIGS. 15 and 16■ Flattening the exposed surface 72 of the insulating film 71, the exposed surface 73 of the metal material 70, or the exposed surface 72° of the insulating film 71° and the exposed surface 73° of the metal material 70°. This increases the number of steps required and increases costs.

■If there are irregularities on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70, or on the exposed surface 72° of the insulating film 71° and the exposed surface 73′ of the metal material 70′, the metal material 70 and the metal material 70′ will no longer connect, reducing reliability.

■In this method as well, 5surface Down
Since it is a mount method, as mentioned in Problem ① of the CCB method, positioning is difficult and the manufacturing equipment becomes quite complicated.

■Technology shown in Fig. 17■ After positioning, when applying pressure to connect the connecting portion 76 and the connecting portion 76°, it is difficult to apply a constant pressure, resulting in variations in the connection state, resulting in The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor. In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for cases where a large amount of current needs to flow.

(2) If the pitch of adjacent connecting parts (the distance 'm) between the centers of adjacent connecting parts is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■The resistance value changes due to variations in the amount of protrusion h1 of the connection part 76.76" of the circuit board 75.75', so h1
It is necessary to accurately control the variation and quantity.

■Furthermore, when an anisotropic conductive film is used to connect a semiconductor element and a circuit board, or to connect a first semiconductor element and a second semiconductor element, in addition to the drawbacks of It is necessary to provide a bump at the connection part, which increases the cost.

■Technology shown in Figure 18 ■Pressure is required, and a pressure jig is required.

■The contact resistance between the metal wire 82 of the elastic connector 83 and the connecting portion 76 of the first circuit board 75 or the connecting portion 76° of the second circuit board 75' changes depending on the pressing force and surface condition, so the connection Poor reliability.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
There is a high possibility that the surfaces of the first circuit board 75 and the second circuit board 75° will be damaged. Moreover, if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, the connection part 76.76° of the circuit board 75, 75°
Bow length t h 2 or elastic connector 83
Since the protrusion amount h3 of the metal wire 82 and its dispersion affect resistance value change and damage, it is necessary to devise ways to reduce the dispersion.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit board or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as (1) to (4) occur.

(The following is a blank space) [Means for solving the problem] The first gist of the present invention is to provide a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder. and an electrical connection member in which one end of the electrically conductive member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder. and: at least one or more connecting portions, to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected. with at least one electrical circuit component; having at least one or more connecting portions, located at the connecting portion or a portion other than the connecting portion, and at least one or more surfaces of the electric circuit component other than the surface where the at least one or more connecting portions are present; an electric circuit holding member having a circuit formed on at least one surface that connects and/or holds the surfaces of the holding body; and at least one or more other electrical circuit components to which the other end of at least one of the electrically conductive members exposed on the surface is connected. The electrical circuit device is characterized in that one of the other electrical circuit components holds the electrical connection member, and the other electrical circuit component that does not hold the electrical connection member is detachable.

A second aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; one end of at least one of the electrically conductive members exposed on one side of the holder is connected at the portion, and the connection is made by metallizing and/or connecting the connecting portion and the one end. or with at least one electrical circuit component formed through a connection layer formed by alloying: having at least one connection part, and at the connection part or a part other than the connection part; an electric circuit holding member having a circuit formed on at least one surface that connects and/or holds at least one surface other than the surface where the at least one connection portion of the electric circuit component exists; The other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected to the connecting portion, and the connection is , and at least one or more other electric circuit components formed through a connection layer formed by metallizing and/or alloying the connection portion and the other end; , the melting point of the material forming one end of the electrically conductive member exposed on one surface of the holder and the other end of the electrically conductive member exposed on the other surface. The electrical circuit component or the other electrical circuit component is made of materials with different melting points, and by heating the electrical circuit device to a temperature above the melting point of one end and the other end and below the melting point of the other end. There exists an electric circuit device characterized in that only one of the above is detachable.

A third aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; and at least one surface of the electrical circuit component that connects and/or holds at least one surface of the electric circuit component other than the surface where the connection portion is located at the connection portion or a portion other than the connection portion. An electrical circuit holding member having a circuit formed on its surface: an electrically conductive member having at least one connection portion and exposed on the other surface of the holder; and at least one other electrical circuit component to which at least one other end is connected; At least one end is connected to at least one connection part of the electric circuit holding member, and either the electric circuit holding member, the electric circuit component, or the other electric circuit component is connected to the electrical connection. It exists in an electric circuit device that holds a member and is characterized in that the other member that is not held is removable.

A fourth aspect of the present invention is that a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder are integrated, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; one end of one of the electrically conductive members exposed on one side of the holder is connected, and the connection is made by metallizing the connecting part and the one end. and/or with at least one electric circuit component formed through a connection layer formed by alloying; having at least one connection part and at the connection part or a part other than the connection part; , an electric circuit holding member in which a circuit is formed on at least one surface that connects and/or holds at least one surface other than the surface where the at least one connection portion of the electric circuit component exists: The other end of at least one of the electrically conductive members exposed on one surface of the holder is connected to the connecting portion, and the connecting portion has at least one connecting portion. , and at least one or more other electric circuit components formed through a connection layer formed by metallizing and/or alloying the connection portion and the other end; , one end of at least one of the electrically conductive members exposed on one side of the holder is metallized and/or alloyed with at least one connection portion of the electrical circuit holding member. The other end of at least one of the electrically conductive members that is connected and exposed on the other side of the holder is metallized and/or The melting point of the material forming one end of the electrical connection member that is connected by alloying and is exposed on one surface of the holder and the electrical conductivity that is exposed on the other surface. The melting point of the material forming the other end of the member is different from that of the material, and by heating the electric circuit device to a temperature higher than the melting point of one of the one end and the other end and lower than the melting point of the other end, the electric circuit device An electric circuit device exists in which only one of the circuit holding member, the electric circuit component, or the other electric circuit component is removable.

The constituent elements of the present invention will be individually explained below.

(Electrical circuit components) Electric circuit components in the present invention include, for example, semiconductor elements such as transistors and ), lead frames, etc.

Note that the number of electric circuit components held or connected to the electric circuit holding member may be one or more than one on one surface of the electric circuit holding member. Further, the size, shape, and type of the electrical circuit components to be held or connected may be arbitrary, but the greater the number of electrical circuit components to be held or connected, and the more types there are, the greater the variety. The more the effect of the present invention becomes significant.

Note that only one electric circuit component connected to the electrical connection member may be present on one surface of the holder, or a plurality of electric circuit components may be present on one surface of the holder.

Parts having connecting parts as electrical circuit parts are subject to wood inventions. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Furthermore, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

Note that the connecting portion is an electrically conductive material.

(Electrical circuit holding member) The material of the electric circuit holding member may be any metal, alloy, organic, or inorganic material, or may be a composite material thereof. Furthermore, the shape of the electric circuit holding member,
The size may be any shape and any size as long as the electrical circuit component to be held or connected can be uniformly and stably connected to other electrical circuit components.

The size, number, and type of electric circuit components to be held or connected to the electric circuit holding member may be arbitrary, but the greater the number and the greater the variety, the more effective the present invention is. The effect is remarkable.

Examples of the gold scraps or alloy include Ag.

Cu, Au, Al1. Be, Ca, Mg, Mo.

Fe, Ni, Co, Mn, W, Ti, Pt.

Examples include metals or alloys such as Cr, Pd, Nb, Ta, V, and Y.

Further, as the inorganic material, for example, Si.

Ge, GaAs, InGaAsP, InP.

Semiconductors such as a-Si, B203, Al2O2゜Na
2O, 20. Cab, ZnO, Bad.

PbO, Sb20. , As20. , Lax o,.

Z r02 , Bad, P'205 , T i 02
.

MgO, SiC, Bed, BP, BN.

h-BN, c-BN, Al1N, B4C, TaC.

TiB2, CrB2, TiN, Si3N4.

Ta2 o5. Ceramic such as S i02 or r a
, Ib, IIa, Ilb diamond, glass, synthetic quartz, carbon, boron, and other inorganic materials.

Further, as the organic material, for example, an insulating resin may be used, and the resin may be any of a thermosetting resin, an ultraviolet curing resin, and a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin , polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin, and other resins can be used.

Furthermore, a circuit is formed in the electric circuit holding member of the present invention. If the material of the electric circuit holding member is an insulator or the surface is insulated, a circuit pattern and a connection part may be formed on at least one surface, or a through hole or a peer hole may be formed to hold the circuit. They may be connected on both sides of the body, or a multilayer board may be formed by stacking multiple layers of holders with circuit patterns drawn on them.

Further, as the electric circuit holding member, it is also possible to form a laminated structure by combining members each having a different function. For example, a circuit board and a reinforcing plate, a circuit board and a heat radiation fin, etc. can be combined. Also,
The number of stacks and the functions of each can be set arbitrarily.

(Electrical Connection Member) The electrical connection member according to the present invention includes a plurality of electrically conductive members embedded in a holder made of an electrically insulating material. The buried conductive members are electrically insulated from each other.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

Furthermore, the electrical connection member may be made of one layer or may be made of two or more layers.

(Electrically conductive member) The electrically conductive member may be anything as long as it exhibits electrical conductivity. Although metal materials are generally used, materials other than metal materials such as those exhibiting superconductivity may also be used.

Gold is preferred as the material for the metal member, but any metal or alloy other than gold may also be used. For example, Ag, Be, Ca, Mg.

Mo, Ni, W, Fe, Ti, In, Ta.

Examples include metals or alloys such as Zn, Cu, An, Sn, and Pb-5n.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same kind of metal or alloy, or may be made of different kinds of metals or alloys. Furthermore, materials other than metals and alloys may be used, as long as they exhibit conductivity, and may include a metal material containing one or both of an organic material and an inorganic material. Further, a combination of an inorganic material and an organic material may be used as long as it exhibits conductivity.

Further, the cross section of the electrically conductive member can be circular, square, or any other shape.

Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection part of the electric circuit member, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on only one side or on both sides. If it is made to protrude further, it may be made into a bump shape.

Further, the intervals between the electrically conductive members may be the same as the intervals between the connecting parts of the electric circuit components, or may be narrower than the intervals between the connecting parts of the electric circuit components. When the interval is narrow, it becomes possible to connect the electric circuit component and the electrical connection member without requiring positioning of the electric circuit component and the electrical connection member.

Further, the electrically conductive member does not need to be arranged vertically in the holder, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. moreover,
One or more types of inorganic materials, metal materials, and alloy materials having a desired shape, such as powder or fibers, may be dispersed and held in the organic material. Furthermore, one or more types of organic materials, metal materials, and alloy materials having a desired shape, such as powder or fibers, may be dispersed and retained in the inorganic material. Furthermore, one or more types of inorganic or organic materials having a desired shape, such as powder or fibers, may be dispersed and held in the metal or alloy material. In addition, when the holding body is made of a metal material, for example, an electrically insulating material such as resin may be provided between the electrically conductive member and the holding body.

Here, as the organic material, for example, an insulating resin may be used, and the resin may be a thermosetting resin, an ultraviolet curing resin, or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin , polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin, and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin. moreover,
If you select a resin that has the same or similar coefficient of thermal expansion as the circuit board, and if there is at least one hole or multiple bubbles in the organic material, it will be possible to , it becomes possible to further prevent a decrease in reliability of the device.

Examples of inorganic materials and metal materials include 5i02, B
203, Aj220s, Naz O.

K20. Cab, ZnO, Bad, PbO.

St+203, Ag203, La203, ZrO
2゜Bad, P, 05, TiO2, MgO, SiC.

Bed, BP, BN, AfLN, B4 C,T
aC.

TiB2. CrB2. TiN, Si3N4゜Ta205
Inorganic materials such as ceramics, diamond, glass, carbon, boron, etc., and Ag.

Cu, Au, An, Be, Ca, Mg, Mo.

Metals or alloys such as Fe, Ni, Si, Co, Mn, and W may be used.

(Connection; Connection by metallization and/or alloying) The following three configurations can be considered for the connection between the end of the electrical connection member and the connection of the electrical circuit component.

Note that one or more electric circuit components may be connected to one electrical connection member, but at least one of the connected electric circuit components must be connected according to the following configuration. It would be good if it was done.

■One end of a plurality of electrically conductive members exposed on one surface of the holder and a plurality of connections of one electric circuit component, and a plurality of electrically conductive members exposed on the other surface of the holder. A configuration in which the other end of the electrically conductive member and the plurality of connection parts of the other electric circuit component are connected by a method other than metallization and/or alloying described in the following (1) and (2).

■It is formed by metallizing and/or alloying one end of the plurality of electrically conductive members exposed on one surface of the holder and at least one of the plurality of connecting parts of one electric circuit component. The other ends of the plurality of electrically conductive members, which are connected via the connection layer and are exposed on the other side of the holder, and the plurality of connection parts of the other electric circuit component are made of the metallization and/or alloy. Configurations that are connected in a way other than .

■It is formed by metallizing and/or alloying one end of the plurality of electrically conductive members exposed on one surface of the holder and at least one of the plurality of connecting parts of one electric circuit component. The other ends of the plurality of electrically conductive members connected via the connection layer and exposed on the other side of the holder and at least one of the plurality of connection parts of the other electric circuit component are metallized and/or Or a configuration in which the connection is made through a connection layer formed by alloying.

Next, the above connection layer will be described.

When the electrically conductive member to be connected and the connecting portion are made of the same type of pure metal, the connection layer formed by metallization has the same type of crystal structure as the electrically conductive member or the connecting portion. In addition, as a method of metallization, for example, after bringing an end of an electrically conductive member into contact with a connecting part corresponding to the end,
It may be heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes metalized to form a connection layer.

When the electrically conductive member to be connected and the connecting portion are made of different types of pure metals, the connecting layer to be formed is made of an alloy of both metals. As for the alloying method, for example, after bringing an end of an electrically conductive member into contact with a connecting part corresponding to the end,
It may be heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and a layer made of a solid solution or an intermetallic compound is formed in the vicinity of the contact portion, and this layer becomes a connection layer.

In addition, when Au is used for the metal member of the electrical connection member and A1 is used for the connection part of the electric circuit component, the
A heating temperature of 350°C is preferred.

When one of the electrically conductive member and the connecting portion to be connected is made of a pure metal and the other is made of an alloy, or when both are made of the same or different alloys, the connection layer is made of an alloy.

Regarding a plurality of electrically conductive members in one electrical connection member, if each electrically conductive member is made of the same kind of gold scrap or alloy, if each is made of different kinds of metal or alloy, or - When the electrically conductive members are made of the same kind of metals or alloys, different kinds of metals or alloys, or there are other cases, the above-mentioned metallization or alloying is performed in any case. On the other hand, the same applies to the connection portion.

In addition, the electrically conductive member or the connecting portion may be a metal or an alloy at the contact portion between the two, and the other portion may be a mixture of metal and glass, or metal and resin, for example. Good too.

Note that in order to increase the connection strength, it is preferable to reduce the surface roughness of the connected portion (particularly preferably 0.3 μm or less). Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

To perform a connection other than the metallization or alloying described above, for example, the electric circuit component and the electrically conductive member of the electrical connection member may be pressed to connect.

(Holding) Holding at least one surface of the electrical circuit holding member and the electrical circuit component other than the surface on which at least one electrical connection part is present, and holding the electrical circuit holding member and the electrical circuit component or other electrical circuit component. The following methods (1) to (4) can be considered for retention, and it is sufficient that at least one portion is retained by at least one of these methods.

■Retained by curing reaction of organic materials. When using resin as an organic material, the type of resin does not matter. For example, either a thermosetting resin or an ultraviolet curable resin may be used.

■Adhere and hold with adhesive. The type of adhesive does not matter. For example, either an acrylic adhesive or an epoxy adhesive may be used.

(2) Retained by metallization and/or alloying as described above.

■The electric circuit holding member and the part to be held by the electric circuit component are formed from the same material, their surfaces are cleaned, and they are bonded together in a vacuum. ).

(2) Other than methods (2) to (3) above, the electrical circuit holding member or electrical circuit component is held using any holding method that is strong enough to prevent the holding portion from shifting even if some external force is applied to the electrical circuit holding member or electrical circuit component after holding. For example, a method of holding by mechanical fitting or the like.

(Attachment/Detachment) As a method for making either an electric circuit component or another electric circuit component removable, there are two methods: Adhering at least a portion of the side of either of the parts connected to the electrical connection member,
A method in which the electrically conductive member exposed on both sides of the electrical connection member and the other connection portion of the electrical circuit component or other electrical circuit component are connected by pressing. By releasing the suppression, the electrical circuit component that is not bonded to the electrical connection member is separated from the electrical connection member, and after positioning again, the electrical circuit component is connected by pressing.

■Metallize and/or alloy at least one of the electrically conductive members exposed on any one surface of the electrical connection member and at least one of the connection parts of the electrical circuit component or another electrical circuit component. 1) and connect the other side by pressing after positioning in the same way as in ① above. By releasing the pressure, the metallized and/or alloyed and unconnected electrical circuit components are separated from the electrical connection member, and are connected by being pressed again after positioning.

(2) A method other than the above, in which either one of the electric circuit member or another electric circuit component holds the electrical connection member, and the other is connected by pressing as in (2) above.

Similarly, when the pressure is released, the electrical circuit component not holding the electrical connection member and the electrical connection member are separated, and are connected by pressing after positioning.

■The melting point of the material forming one end of the electrically conductive member exposed on one surface of the electrical connection member and the melting point of the material forming the other end of the electrically conductive member exposed on the other surface. A method of connecting electrical circuit components and other electrical circuit components using electrical connection members with different melting points. This connection is made by positioning the electrical circuit holding member, electrical connecting member, and other electrical circuit components at once, and then connecting the electrically conductive member that forms one exposed end of the electrical connecting member to the hot side. The electrical circuit component and the other electrical circuit component may be metallized and/or alloyed at the same time and connected by heating above the melting point of the electrical circuit component, or the holder and the electrical connecting member, or the electrical connecting member and the other electrical circuit component First, one of the electrical circuit components is positioned, metallized and/or alloyed and connected, and then, after positioning the other, the melting point of one end of the electrically conductive member and the other end of the electrically conductive member is The connection may be made by heating below the melting point and metallizing and/or alloying. In the latter case, the one end of the electrically conductive member that is connected first and the other end are
Made of a material with a high melting point.

By heating the electric circuit device created in this way again to a temperature above the melting point of one side and below the melting point of the other side, only the electric circuit parts connected to the electrically conductive member on the lower melting point side are removed from the electrically connecting member. After separation and repositioning, there is a method of connecting by metallizing and/or alloying again by heating above the melting point of one and below the melting point of the other. Also,
As long as the positional relationship of the connecting parts is the same, the electrical circuit component that was originally connected may be connected to the same electrical circuit component, or may be connected to a different electrical circuit component.

[Function] In the present invention, only either the electric circuit component or other electric circuit component can be attached or detached from the electrical connection member, so that even if the electric circuit component or other electric circuit component breaks down, it can be replaced. This makes it possible to obtain an electrical circuit device that is extremely easy to maintain.

In addition, if the positional relationship of the connecting parts is the same, it is possible to easily connect the electric circuit component with a different function to be held or connected to the electric circuit holding member with another electric circuit component, and to hold or connect the electric circuit component to the electric circuit holding member. Each time the connected electric circuit holding member is replaced, one electric circuit device can have a wide variety of functions.

Furthermore, since it is removable, even if an electric circuit device is found to be defective during a characteristic test after it is manufactured, the characteristics of either the electric circuit device held or connected to the electric circuit holding member or another electric circuit device are good. This can be used again in the manufacturing process of electric circuit devices, thereby improving yields and reducing costs.

In the present invention, the electrical circuit holding member and the electrical connecting member described above are used to connect the electrical circuit component to other electrical circuit components. This also makes it possible to increase the number of connection parts, which in turn makes it possible to increase the density.

Further, since the amount of metal members used for the electrical connection member is small, cost reduction is possible even if expensive gold is used as the metal member.

Further, in the present invention, after the electric circuit component is held or connected to the electric circuit holding member, the electric circuit component and other electric circuit components are connected via the electric connection member, so that the electric circuit component includes a plurality of electric circuit components. Furthermore, since a wide variety of devices can be used and they are connected in a batch process, a wide variety of electrical circuit devices can be produced in the same process.

In addition, by dividing the electrical circuit components held by the holding members by function, it is possible to create functional blocks for each holding member that holds or connects the electrical circuit components. electrical circuit devices can be produced in the same process.

Furthermore, since the electric circuit components are held in the electric circuit holding member, there is no need to use jigs to hold the electric circuit components during or after the manufacturing process of the electric circuit device, and the electric circuit device can be manufactured easily. and easy to manage after fabrication.

In the present invention, when Forest Products 4 with good thermal conductivity is used for the electric circuit holding member and when a material with good thermal conductivity is used as the insulator of the electrically conductive member, the Heat escapes to the outside world more quickly, resulting in an electrical circuit device with good heat dissipation. In addition, if the insulator of the electrically conductive member uses a material with a thermal expansion coefficient close to that of the electrical circuit component, or if the electrical circuit holding member uses a material with a thermal expansion coefficient close to that of the electrical circuit component, thermal stress , the occurrence of thermal strain is suppressed,
It is possible to prevent phenomena that impair the reliability of the electric circuit device, such as cracking of the electric circuit components or change in characteristics of the electric circuit components that may occur when heat is applied, and a highly reliable electric circuit device can be obtained.

In the present invention, when both electrical circuit components are connected by a connection layer formed by metallization and/or alloying via an electrical connection member, the electrical circuit components are strong (in terms of strength). Since the connection is strong) and reliable, it is possible to obtain an electrical circuit device that has a small connection resistance value, small variations in connection resistance, is mechanically strong, and has an extremely low defective rate.

In addition, when electrical circuit components are connected by a connection layer formed by metallization and/or alloying through an electrical connection member, the electrical circuit Contact resistance between parts becomes smaller.

On the other hand, if electrical circuit components or other electrical circuit components are connected by a connection other than metallization and/or alloying, it is possible to prevent the electrical circuit components from deteriorating due to heat that occurs during metallization and/or alloying. .

(Margin below) [Example] (First Example) A first example of the present invention will be described based on FIGS. 1(a) to (d) and FIGS. 2(a) to (C).

In the cross-sectional view of FIG. 1(a), an electric circuit holding member 201 holding a plurality of semiconductor elements 101, which are electric circuit components,
This shows a state in which the electrical connection member 125 is not connected. The number of semiconductor elements 101 may be any number as long as it is one or more.

The electrical connection member 125 includes a holder 1 made of an organic material.
A metal member 107, which is an electrically conductive member, is embedded in the holder 111, and one end 108 of the metal member 107
is exposed on one side of the metal member 10.
The other end 109 of 7 is exposed on the other surface of the holder.

101 is a semiconductor element, 102 is a connecting portion of the semiconductor element 101, and 201 is a circuit board that is an electric circuit holding member on which a circuit is formed on at least one surface. The circuit board 201 connects and/or holds at least one surface of the semiconductor element 101 other than the surface where the at least one connection portion 102 is present.

FIG. 1(b) shows a state in which the semiconductor element 101 is connected to one end 108 of the metal member 107 exposed on one surface of the holder 111 by metallization and/or alloying at the connecting portion 102. ing.

In FIG. 1(C), 104 is a circuit board which is another electric circuit component, and has a connection part 105. The circuit board 104 is connected to the other end 109 of the metal member 107 exposed on the other surface of the holder 111 by being alloyed at the connecting portion 105 .

FIG. 1(d) is a cross-sectional view of the entire structure integrated by the above connections.

This example will be explained in more detail below.

First, electrical connection parts! The electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

A manufacturing example is shown in FIGS. 2(a) to 2(c).

First, as shown in FIG. 2(a), metal wires 121 made of metal or alloy such as gold and having a diameter of 20 μm are wired at a pitch of 40 μm.
After winding, the metal wire 121 is embedded in a resin 123 such as polyimide. After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIG.
Shown in b) and (c).

In the electrical connection member 125 created in this way, the metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the holder (insulator) 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the semiconductor element 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 to the semiconductor element 101 and the circuit board 104, respectively.

Next, as shown in FIG. 1(a), on the circuit board 201,
The semiconductor 101 is positioned so that the positional relationship between the connection part 102 of the semiconductor element 101 and the connection part 105 of the circuit board 104 is the same as that at the time of connection, and the semiconductor 101 is connected to the circuit board 201 and/or
or hold it. After that, as shown in FIG. 1(b),
Connection portion 108 of electrical connection member 125 and semiconductor element 10
After positioning with the connection part 1, metallization and/or alloying are performed and the connection is made. The circuit board 201 is turned over so that the connecting portion 102 of the semiconductor 101 and the connecting portion 105 of the circuit board 104 face each other.

Then, arrange them as shown in FIG. Finally, the first
As shown in Figure (d), the circuit board 201 and the circuit board 10
4, and after positioning, the connection portion 109 of the electrical connection member 125 and the connection portion 105 of the circuit board 104 are connected by compression.

Also, when the pressure is released, as shown in Figure 1 (C),
Connection portion 105 of electrical connection member 125 and circuit board 104
The connection part 109 is in the state before connection, and further,
After positioning, press again to connect. Therefore,
If a defect occurs in the semiconductor element 101 or the circuit board 104, release the pressure, replace the defective part with a good one, position it, press it, and connect it again to make a good electrical circuit device. is obtained.

In this embodiment, the connecting portion 102 of the semiconductor element 101
Although the connection portion 108 of the electrical connection member 125 is metallized and/or alloyed for connection, the connection portion 105 of the circuit board 104 and the connection portion 109 of the electrical connection member 125 are metallized and/or alloyed. It is clear that the same effect can be obtained even if the connecting portion 102 of the semiconductor element 101 and the connecting portion 108 of the electrical connecting member 125 are connected by compression.

(Second example) A second example of 31 is shown in FIGS. 3(a) and 3(b).

In this embodiment, an adhesive is applied to a portion other than the connection portion on one surface of the electrical connection member 125 where the metal member 107 is exposed.

A semiconductor element 101 is mounted on a circuit board 201 which is a holding member.
After positioning the connection portion 102 of the semiconductor element 101 and the connection portion 105 of the circuit board 104 so that the positional relationship is the same as that at the time of connection, the connection and/or holding is performed. Next, the surface to which the adhesive 202 is applied and the connection portion 10 of the semiconductor element 101 are
(Figure 3(a))
, the connection portion 108 of the electrical connection member 125 and the semiconductor element 1
After positioning the connection portion 102 of 01, the electrical connection member 125 and the semiconductor element 101 are bonded together.

Other points are the same as the first embodiment.

Also in this example, defective parts can be easily replaced as in the first example.

(Third Embodiment) A third embodiment is shown in FIGS. 4(a) to (c) and FIGS. 5(a) and (b). In this embodiment, an electrical connection member is used in which the metal member exposed on one surface of the electrical connection member 125 and the metal member exposed on the other surface are made of materials with different melting points.

An example of a method for manufacturing this electrical connection member will be shown below.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
An electrical connection member 125 shown in (C) is prepared. This electrical connection member! As shown in FIG. 4(a), a resist 203 is formed on one side of the metal member 25 on the exposed portion of the metal member 107 by a photolithography process. Next, after forming a diffusion barrier layer 204 of M, W, Pd, etc. by sputtering, an Au-5n (20 wt%) layer is formed thereon (Fig. 4(b)), and the resist is removed by a lift-off method. (Figure 4 (C)). Furthermore, a barrier layer 204 and a Pb-Ag-
3n (36,1-1,4-62,5wt%) layer 206
(not shown in FIGS. 4(a) to 4(C)). The electrical connection member 125 formed in this way is connected to the metal member 1
At both ends of 07, the melting point of Au-3n (20wt%) is 280℃, Pb-Ag-5n (36, -i, 4-6
2.5wt%), which has a melting point of 180°C and a melting point of about 100°C.

As shown in FIG. 5, the electrical connection member 125 described above is heated to 300° C. or higher after positioning the circuit board 201 to which the semiconductor 101 is connected and/or held, the electrical connection member 125, and the circuit board 104. Press the semiconductor element 10
1 to the connection part 10 between the connection part 102 and the electrical connection member 125
8, and the connection portion 105 of the circuit board 104 and the connection portion 109 of the electrical connection member 125 are simultaneously metallized and/or alloyed and connected.

When the electrical circuit device fabricated as described above is heated to a temperature above the melting point of the - side and below the melting point of the other side, only the - side connection melts, so it is possible to disconnect only one side, and it is also possible to position the device at the same time. Afterwards, they can be reconnected by heating to a temperature above the melting point of one and below the melting point of the other.

In this example, the composition ratio changes due to thermal diffusion of metal atoms each time it is heated, so there is a limit to the number of times it can be connected and disconnected, but since both connections can be metallized and/or alloyed and connected, Contact resistance is extremely low, ensuring a stable connection at all times.

In this embodiment, A u -S n N 205 is applied to one end 108 side of the metal member 107, and Pb is applied to the other end 109 side.
-Ag-5n layer 206 is provided, but this may be reversed. Furthermore, 205° and 206 may be alloy layers other than those described above, as long as an appropriate melting point and difference in melting point are obtained.

(Fourth example) A fourth embodiment is shown in FIGS. 6(a) and 6(b).

The fourth embodiment is an example in which a semiconductor element 101 and a circuit board 104 whose portions other than connecting portions are covered with insulating films 103 and 106 are used as electric circuit components and other electric circuit components.

Further, FIG. 7(a) shows an electrical connection member.

The material shown in (b) was used. FIG. 7(a) is a perspective view;
FIG. 7(b) is a sectional view. In the electrical connection member 125 shown in FIGS. 7(a) and 7(b), the exposed portion of the metal member 107 protrudes from the surface of the holder (resin insulator) 111. Creating such an electrical connection member 125 is as follows:
For example, the following method may be used.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
Prepare the electrical connection member shown in (C). Next, both surfaces of this electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 10 μm. Also in this example, the metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the insulator 111.

Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 μm, but any amount may be used.

Further, the method for protruding the metal wire 121 is not limited to etching, but other chemical methods or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
Bumps 150 as shown in FIGS. 8(a) and 8(b) may be formed by inserting the metal wire 121 into a mold having a concave portion and crushing the protrusion 126 of the metal wire 121. In this case, the metal wire 121 becomes difficult to fall off from the insulator 111. The bumps may be created by melting the protrusions with heat, or by any other method.

In this example as well, defective parts were easily replaced and the connections were connected with high reliability. Furthermore, the reliability of various characteristics was also excellent.

(Fifth example) A fifth embodiment is shown in FIGS. 9(a) and 9(b).

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fourth embodiment. In the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fourth example. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the connecting portions of the semiconductor element.

That is, in the fourth embodiment, since the connection position of the electrical connection member 125 was arranged at the connection position between the semiconductor element 101 and the circuit board 104, it was necessary to position the electrical connection member 125, but in this example, Although it is necessary to position the semiconductor element 101 and the circuit board 104, the electrical connection member 1
Positioning with 25 becomes unnecessary. Therefore, the connection dimension (dll) between the semiconductor element toi and the circuit board 104.

Pll) and the connection dimension of the electrical connection member (d12°P12
) It is also possible to connect without positioning by selecting an appropriate value.

Other points are similar to the first embodiment.

In this example as well, defective parts were easily replaced and the connections were connected with high reliability.

(6th example) FIG. 10 shows a sixth embodiment.

In this embodiment, the electrical connection member 125 has a step, and the electrically conductive member 107 has a connection portion between the circuit board 201 and the circuit board 104 embedded in the holder 111.
Furthermore, on the circuit board 201 there is further a circuit board 207 which is an electrical connection member and a holding member.
The semiconductor elements 101 connected and/or held are connected to form a multilayer structure.

Other points are similar to the first embodiment.

In this example as well, defective parts were easily replaced and the connections were connected with high reliability.

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

■Highly reliable connections can be obtained when connecting semiconductor elements to electrical circuit components such as circuit boards and lead frames. Therefore, the conventionally used wire bonding method, TA
It becomes possible to replace the B method and CCB method.

■According to the present invention, the connecting parts of electrical circuit components can be placed in any position (especially inside), which enables more multi-point connections than the wire bonding method or TAB method, making it suitable for connections with a large number of pins. becomes. Furthermore, since an insulating material exists in advance between adjacent metals of the electrical connection member, electrical conduction between adjacent metals does not occur even if the adjacent pitch is narrowed, making it possible to connect more points than the CCB method. Become.

(2) The amount of metal members used in the electrical connection member is less than the conventional one, so even if an expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

■Electrical circuit devices such as high-density semiconductor devices can be obtained.

■If either electrical circuit components or other electrical circuit components are connected by a connection other than metallization and/or alloying, the electrical circuit components may deteriorate due to heat that occurs during metallization and/or alloying. It can be prevented. Additionally, depending on the application, it may be desirable to make electrical circuit components removable, and in such cases, this request can be met by connecting the electrical circuit components other than by metallization and/or alloying. It becomes possible.

In addition, when both electrical circuit components are connected via an electrical connection member and a connection layer formed by metallization and/or alloying, the electrical circuit components are strong (strong in terms of strength). The connection is secure and mechanically strong.
It is possible to obtain an electric circuit device with an extremely low defective rate.

■The holder of the electrical connection member is composed of an insulator in which one or both of powders and fibers made of one or more of metal materials and inorganic materials with good thermal conductivity are dispersed;
When electrically conductive members are made of insulated metal or inorganic materials, the heat generated from the electrical circuit components is radiated to the outside through the electrical connection members and other electrical circuit components. Therefore, an electric circuit device with good heat dissipation properties can be obtained.

In addition, when the electric circuit holding member is made of a metal material or an inorganic material with good thermal conductivity, the heat generated from the electric circuit parts can be radiated to the outside via the electric circuit holding member. An electrical circuit device with extremely good properties can be obtained.

■Since the electrical circuit component is held in the electrical holding member and then connected to other electrical circuit components, the shape of the holding member is matched to the electrical circuit component to be held, so it is independent of the size, shape, and type of the electrical circuit component. Connection becomes possible and high-density mounting becomes possible, which greatly improves the degree of freedom in design.

■By dividing the electrical circuit components to be held by function, each holding member is made into a functional block, and by using this, a wide variety of electrical circuit devices can be obtained in the same process, greatly improving the versatility of mounting and design. do.

■Since only either the electric circuit component held by the electric circuit holding member or other electric circuit component can be attached or detached from the electrical connection member, it is easy to attach or detach it even if the electric circuit component or other electric circuit component breaks down. Moreover, since the electric circuit components are connected and/or held by the electric circuit holding member that has a circuit formed on at least one surface, handling is easy and the electric circuit components can be easily replaced. Since the target connecting member is held by one of the electric circuit components, positioning during connection is easy, and the connection is made with high reliability.

[Phase] If the positional relationship of the connection parts is unified, it will be easier to connect electrical circuit components with different functions held by the electrical circuit holding member to other electrical circuit components, and Each time the electric circuit holding member is replaced, one electric circuit device can exhibit a different function, and a systemized electric circuit device can be obtained.

■Even if the electrical circuit components are found to be defective during the characteristic inspection after the electrical circuit device is manufactured, the electrical circuit components held or connected to the electrical circuit holding member with good characteristics or other electrical circuit components will be returned to the electrical circuit device manufacturing process. This makes it possible to improve yields and reduce costs.

■When using double-sided boards, multilayer boards, double-sided through-hole boards, etc. as electrical circuit holding members, it is possible to stack them using the same method, making three-dimensional mounting possible, and shortening signal lines to improve signal transmission. Delay time is reduced and an electrical circuit device that operates at high speed is obtained.

Furthermore, since the connecting portions between the electric circuit devices are significantly reduced, further miniaturization becomes possible, and the degree of freedom in product design increases.

[Brief explanation of the drawing]

FIGS. 1(a) to (d) are cross-sectional views showing the first embodiment, and FIGS. 2(a) to (C) show an example of a manufacturing method of the electrical connection member used in the first example. FIG. 2 is a cross-sectional view and a perspective view for explanation. FIGS. 3(a) and 3(b) are cross-sectional views showing the second embodiment. FIGS. 4(a) to 4(C) are cross-sectional views showing the steps of the electrical connection member used in the third embodiment, and FIG. 5(a). (b) is a sectional view showing before and after connection of the third embodiment. FIGS. 6(a) and (b) are sectional views showing before and after connection of the fourth embodiment, and FIGS. 7(a) and (b) show electrical connection members used in the fourth embodiment. A perspective view and a sectional view. FIG. 8 is a perspective view and a sectional view showing an example in which a bump is provided on the electrical connection member used in the fourth embodiment. FIGS. 9(a) and 9(b) are cross-sectional views showing the fifth embodiment before and after connection. FIG. 10 is a sectional view showing the sixth embodiment after connection. 11 to 1B show a conventional example, except for FIG. 12, which is a sectional view, and FIG. 12 is a plan perspective view. 1.55...Lead frame, 2...Element mounting part of lead frame, 3...Silver paste, 4,4°...
Semiconductor element, 5,5°... Connection part of semiconductor element, 6.
...Lead frame connection part, 7...Superfine metal wire, 8
... Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Peripheral edge of element mounting portion of lead frame, 16... Carrier film substrate, 17.
...Inner lead part of carrier film board, 20°21.123...Resin, 31...Solder bump, 32
゜51.75, 75°...Circuit board, 33,52゜7
6.76°... Connection portion of circuit board, 54... Connection portion of electrical connection member, 63... Sealing material, 70, 70°.
...Metal material, 71.71', 103,106...Insulating film, 72.72'...Exposed surface of insulating film, 73°73
°... Exposed surface of metal material, 77... Insulating material of anisotropic conductive film, 78... Anisotropic conductive film, 79... Conductive particles, 81... Insulating material of elastic connector, 82・
... Elastic connector metal wire, 83... Elastic connector, 101, 101'... Electric circuit parts (semiconductor element, circuit board), 102゜105.108,
109... Connection part, 104... Other electrical circuit parts (
circuit board), 107... electrically conductive member (metal member)
, 111... Holder (insulator), 121... Metal wire, 122... Rod, 124... Dotted line, 125... Electrical connection member, 126... Protrusion, 150... Bump, 201... Electric circuit holding member (circuit board), 202
...Adhesive, 203...Resist, 204...
Diffusion barrier, 2 '05- A u -S n layer, 20
6-P b -A g -S n layer, 207-... Electric circuit holding member (circuit board). 6th F! ! J (a) Figure 6 (b) Figure 7 (a) Figure 7 (b) Figure 8 (a) Figure 8 (b) Figure 9 (a) Figure 9 (b) Figure 11 Figure 12 Figure 13 Figure 15 Figure 17 Figure 18°

Claims (4)

[Claims] (1) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; A circuit is formed on at least one surface that connects and/or holds at least one surface other than the surface on which the at least one or more connection portion of the electric circuit component is present, in the part or a portion other than the connection portion. and an electric circuit holding member; having at least one or more connection portions, and in the connection portions,
and at least one or more other electrical circuit components to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected. An electric circuit device characterized in that either one of the electric circuit member and the other electric circuit component holds the electric connection member, and the other one that does not hold the electric circuit member is detachable. (2) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection is made through a connection layer formed by metallizing and/or alloying the connection part and the one end; and at least one electrical circuit component; and at least one or more surfaces that connect and/or hold at least one or more surfaces of the electric circuit component other than the surface where the at least one or more connection portion is present in the connection portion or a portion other than the connection portion; an electric circuit holding member in which a circuit is formed; having at least one or more connection portions, and in the connection portions,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made through a connection layer formed by metallizing and/or alloying the connection portion and the other end, and at least one other electric circuit component; In the device, the melting point of the material forming one end of the electrically conductive member exposed on one surface of the holder and the other end of the electrically conductive member exposed on the other surface are determined. By heating the electrical circuit device to a temperature above the melting point of one end and the other end and below the melting point of the other end, the electrical circuit component or the other electrical An electric circuit device characterized in that only one of the circuit components is detachable. (3) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; A circuit is formed on at least one surface that connects and/or holds at least one surface other than the surface on which the at least one or more connection portion of the electric circuit component is present, in the part or a portion other than the connection portion. an electrical circuit holding member; the other end of at least one of the electrically conductive members having at least one connection portion and exposed on the other surface of the holder at the connection portion; and at least one other electrical circuit component to which the electrically conductive member is connected. It is connected to at least one connection part of the electric circuit holding member, and either the electric circuit holding member, the electric circuit component, or the other electric circuit component holds the electric connection member. , an electric circuit device characterized in that the other side that is not held is removable. (4) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection is made through a connection layer formed by metallizing and/or alloying the connection part and the one end; and at least one electrical circuit component; and at least one or more surfaces that connect and/or hold at least one or more surfaces of the electric circuit component other than the surface where the at least one or more connection portion is present in the connection portion or a portion other than the connection portion; an electric circuit holding member in which a circuit is formed; having at least one or more connection portions, and in the connection portions,
the other end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
The connection is made through a connection layer formed by metallizing and/or alloying the connection portion and the other end, and at least one other electric circuit component; In the apparatus, one end of at least one of the electrically conductive members exposed on one side of the holding body is metallized and/or alloyed with at least one connection of the electrical circuit holding member. The other end of at least one of the electrically conductive members that is connected and exposed on the other side of the holder is metallized and/or The melting point of the material forming one end of the electrical connection member that is connected by alloying and is exposed on one surface of the holder and the electrical conductivity that is exposed on the other surface. The melting point of the material forming the other end of the member is different from that of the material, and by heating the electric circuit device to a temperature higher than the melting point of one of the one end and the other end and lower than the melting point of the other end, the electric circuit device An electric circuit device characterized in that only one of the circuit holding member, the electric circuit component, or the other electric circuit component is removable.