JPH0132739Y2 - - Google Patents

Description

[Detailed description of the invention] (a) Industrial application field The present invention relates to a facet eraser used in the exposure process of the photolithography process.

(b) Conventional technology FIG. 1 is an explanatory diagram schematically showing a wafer.

To improve the reliability of semiconductor devices, aluminum wiring must be free from scratches.

Therefore, the following measures have been proposed to reduce the number of scratches. That is, along the facet portion 11 of the wafer 10, a region (cut pattern region 12) in which aluminum is removed in a band shape is formed. The cut pattern area 12 is then cut using tweezers.
By gripping only the chisel, it prevents damage to other parts of the aluminum.

Fig. 2a is a partially exploded perspective view showing a conventional cut pattern area forming means, and Fig. 2b is a
FIG.

Reference numeral 10 denotes a wafer, on the surface of which aluminum (not shown) is vapor-deposited, and furthermore, a resist is applied thereon.

11 is a facet part.

20 is a glass mask, and an aluminum pattern (not shown) is formed on the lower surface.

30 is a paper tape that does not transmit light.

Arrow 40 is irradiation light.

The components as described above are arranged and exposed as follows.

The paper tape 30 is attached to the aluminum pattern of the glass mask 20, and the end surface 21 of the glass mask 20 is
Paste it only a certain distance from.

The glass mask 2 is placed in the predetermined position of the aligner.
Set to 0.

The wafer 10 is placed at a predetermined position on the stage of an aligner (not shown).

The stage is pushed up to bring the wafer 10 and glass mask 20 into contact.

The aluminum pattern on the glass mask 20 and the element pattern on the wafer 10 are aligned using an aligner.

Exposure is performed from above the glass mask 20.

After development, predetermined aluminum wiring and cut pattern area 1 are formed by aluminum etching.
I got 2.

However, since the paper tape 30 is attached to the glass mask 20 by the operator's eye, a cut pattern area 12 parallel to the facet portion 11 of the wafer 10 cannot be obtained. Therefore, there arises a problem that even the aluminum in the portion where the aluminum wiring should originally be formed is removed.
Further, there are drawbacks such as stains left on the glass mask 20 due to the paper tape 30.

(c) Purpose It is an object of the present invention to provide a facet eraser that can easily form a cut pattern area parallel to the facet of a wafer and eliminates dirt on the surface of a glass mask.

(D) Structure The facet eraser according to the present invention is characterized by comprising a shielding portion corresponding to a cut pattern area formed on a wafer, and a reference surface for setting the cut pattern area.

(E) Embodiment FIG. 3a is a partially exploded perspective view showing a state in which the facet eraser of the present invention is used, and FIG. 3b is a partial sectional view of FIG. 3a.

Reference numeral 10a denotes a wafer, on the surface of which aluminum (not shown) is vapor-deposited, and furthermore, a resist is applied thereon.

Reference numeral 11a denotes a facet portion where a cut pattern area 12a is formed.

20a is a glass mask, and an aluminum pattern is formed on the lower surface.

30a is a facet eraser made of Teflon, which includes a reference surface 31a, a handle 32a, and a shielding part 33.
a is formed.

The reference surface 31a is the end surface 21 of the glass mask 20a.
This is the part that comes into contact with a.

The shielding portion 33a is made of rubber and is attached to the facet eraser 30a, and is attached to the facet eraser 30a.
The cut pattern area 12a is formed in advance to have a size and shape that form a cut pattern area 12a.

Arrow 40a is irradiation light.

The components as described above are arranged and exposed as follows.

A glass mask 20a is set in a predetermined position on the aligner.

The facet eraser 30a is fixed so that its reference surface comes into contact with the end surface of the glass mask 20a on the aligner.

The wafer 10a is placed at a predetermined position on the stage of an aligner (not shown).

The stage is pushed up to bring the wafer 10a and glass mask 20a into contact.

The aluminum pattern on the glass mask 20a and the element pattern on the wafer 10a are aligned using an aligner.

Exposure is performed from above the glass mask 20a.

After development, predetermined aluminum wiring and cut pattern area 1 are formed by aluminum etching.
I got 2a.

In the embodiment, the facet eraser 30a and the shielding part 33a are made of different materials in order to set the cut pattern area 12a, but they may be made of the same material as the facet eraser 30a and formed integrally. Furthermore, although Teflon is used as the material for the facet eraser 30a, other materials may be used as long as they are made of resin.

(f) Effects In this invention, the end face of the glass mask is fixed in line with the reference plane of the facet eraser, so
A cut pattern area parallel to the facet portion can be obtained, and variations in the cut pattern area can be reduced. Therefore,
The inconvenience of removing necessary aluminum wiring does not occur. Furthermore, since paper tape is not used, the glass mask does not get dirty.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram schematically showing a wafer, Fig. 2a is a partially exploded perspective view showing a conventional cut pattern area forming means, Fig. 2b is a partial sectional view of Fig. 2a, Fig. 3a 3 is a partially exploded perspective view showing a state in which the facet eraser of the present invention is used, and FIG. 3b is a partial sectional view of FIG. 3a. 10a... Wafer, 12a... Cut pattern area, 30a... Facet eraser, 31a...
Reference plane, 33a...shielding part.

Claims (1)

[Scope of utility model registration request] In order to form a cut pattern area on the facet of the wafer, which is used for handling the wafer, etching the serial number of the wafer, etc., a part of the irradiation light that is irradiated onto the glass mask that is in contact with the wafer is blocked. In the facet eraser, the facet eraser includes a reference surface that comes into contact with an end surface of the glass mask to set the cut pattern area, and a shielding part that blocks the irradiation light corresponding to the cut pattern area. A faceless eraser characterized by being equipped with.