JPH0187555U - - Google Patents

Info

Publication number
JPH0187555U
JPH0187555U JP1987184090U JP18409087U JPH0187555U JP H0187555 U JPH0187555 U JP H0187555U JP 1987184090 U JP1987184090 U JP 1987184090U JP 18409087 U JP18409087 U JP 18409087U JP H0187555 U JPH0187555 U JP H0187555U
Authority
JP
Japan
Prior art keywords
resin
semiconductor element
element mounting
mounting part
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987184090U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0526762Y2 (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184090U priority Critical patent/JPH0526762Y2/ja
Publication of JPH0187555U publication Critical patent/JPH0187555U/ja
Application granted granted Critical
Publication of JPH0526762Y2 publication Critical patent/JPH0526762Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987184090U 1987-12-01 1987-12-01 Expired - Lifetime JPH0526762Y2 ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184090U JPH0526762Y2 ( ) 1987-12-01 1987-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184090U JPH0526762Y2 ( ) 1987-12-01 1987-12-01

Publications (2)

Publication Number Publication Date
JPH0187555U true JPH0187555U ( ) 1989-06-09
JPH0526762Y2 JPH0526762Y2 ( ) 1993-07-07

Family

ID=31475475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184090U Expired - Lifetime JPH0526762Y2 ( ) 1987-12-01 1987-12-01

Country Status (1)

Country Link
JP (1) JPH0526762Y2 ( )

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009097572A1 (en) 2008-02-01 2009-08-06 Amerigon Incorporated Condensation and humidity sensors for thermoelectric devices

Also Published As

Publication number Publication date
JPH0526762Y2 ( ) 1993-07-07

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