JPH0211770Y2 - - Google Patents

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Publication number
JPH0211770Y2
JPH0211770Y2 JP4393084U JP4393084U JPH0211770Y2 JP H0211770 Y2 JPH0211770 Y2 JP H0211770Y2 JP 4393084 U JP4393084 U JP 4393084U JP 4393084 U JP4393084 U JP 4393084U JP H0211770 Y2 JPH0211770 Y2 JP H0211770Y2
Authority
JP
Japan
Prior art keywords
conductor pattern
around
recess
leads
kerf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4393084U
Other languages
Japanese (ja)
Other versions
JPS60156713U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4393084U priority Critical patent/JPS60156713U/en
Priority to US06/715,177 priority patent/US4628148A/en
Publication of JPS60156713U publication Critical patent/JPS60156713U/en
Application granted granted Critical
Publication of JPH0211770Y2 publication Critical patent/JPH0211770Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 本考案はパルストランス、ワイドバンドトラン
ス、デイレイライン等のように巻線を用いて素子
本体を形成し、そのリードを外部端子に接続して
ある小型電子部品の構造に関する。
[Detailed description of the invention] This invention relates to the structure of small electronic components such as pulse transformers, wideband transformers, delay lines, etc., in which the element body is formed using windings and the leads are connected to external terminals. .

従来のこの種の電子部品は第1図の断面図に示
すようにケース1の内部に弾性保護材で包んだ状
態の素子本体2を収納し、ケース1に固定してあ
る外部端子3に巻線のリード4を接続して全体を
樹脂封止する構造が一般的である。一点鎖線はデ
ユアルインラインパツケージを行つた場合の外形
形状である。第2図は第1図の平面図である。し
かし素子本体2のリードを外部端子3にからげて
接続するので組立の自動化が難しい。さらに素子
本体2から外部端子に接続するリードが多い場合
には第2図に示すようにリード4は交差した状態
で外部端子に接続され、特に組立時に短絡や断線
事故を生じ易く自動化をいつそう因難にしてい
る。第3図の平面図に示すように複数個の素子本
体5,6を収納する場合にはこのような状態はさ
らに頻発する。
As shown in the cross-sectional view of FIG. 1, a conventional electronic component of this type stores an element body 2 wrapped in an elastic protective material inside a case 1, and wraps it around an external terminal 3 fixed to the case 1. A structure in which the wire leads 4 are connected and the entire structure is sealed with resin is common. The one-dot chain line shows the external shape when dual in-line packaging is used. FIG. 2 is a plan view of FIG. 1. However, since the leads of the element body 2 are twisted and connected to the external terminals 3, it is difficult to automate the assembly. Furthermore, when there are many leads connected from the element body 2 to the external terminals, the leads 4 are connected to the external terminals in a crossed state as shown in Fig. 2, which tends to cause short circuits and disconnections, especially during assembly, making it difficult to implement automation. It's causing a lot of trouble. This situation occurs even more frequently when a plurality of element bodies 5, 6 are housed as shown in the plan view of FIG.

本考案の目的はこのような従来の欠点を改善
し、自動化に適した小型電子部品の構造を提供す
ることにある。
The purpose of the present invention is to overcome these conventional drawbacks and provide a structure of a small electronic component suitable for automation.

本考案は巻線してある素子本体を係止部を設け
た弾性保護材で包み、その係止部基板に設けた固
定手段に取付けてあり、基板の側辺には外部端子
の固着部分から巻線のリードを挾み込むために基
板の内部に延在する切溝が形成してあり、該固着
部分および切溝の周辺のいずれにも導体パターン
を設けて外部端子と素子本体を該導体パターンを
介して接続し、外部端子を露呈させた状態で全体
を樹脂封止してある小型電子部品において、少く
とも1つの切溝の周辺の導体パターンはその切溝
に続く固着部分とは別の固着部分の周辺の導体パ
ターンに接続していることを特徴とする。
In the present invention, the wound element body is wrapped with an elastic protective material provided with a locking part, and the locking part is attached to a fixing means provided on the board, and the side of the board is connected from the fixed part of the external terminal. A cut groove extending inside the board is formed to insert the winding lead, and a conductor pattern is provided both in the fixed part and around the cut groove to connect the external terminal and the element body to the conductor. In small electronic components that are connected via patterns and are entirely resin-sealed with external terminals exposed, the conductor pattern around at least one notch is separate from the fixed part following that notch. It is characterized in that it is connected to the conductor pattern around the fixed part.

以下パルストランスを例にとり本考案の小型電
子部品の実施例を示す第4図、第5図、第6図を
参照しながら説明する。第4図は封止に用いた樹
脂を除いた場合の正面図であり、第5図は分解斜
視図であり、第6図は導体パターンを表す基板の
部分平面図である。
Hereinafter, a pulse transformer will be described as an example, with reference to FIGS. 4, 5, and 6 showing embodiments of the small electronic component of the present invention. FIG. 4 is a front view with the resin used for sealing removed, FIG. 5 is an exploded perspective view, and FIG. 6 is a partial plan view of the substrate showing the conductor pattern.

まず第4図、第5図において、10は巻線を巻
回してあるトロイダルコア11を内部に包んでい
るシリコンゴム等からなる弾性保護材、12は合
成樹脂からなる平担な四角形の基板、13は外部
端子である。基板12の中央には貫通孔14が形
成され、対向する側辺には外部端子の垂直部分1
5を嵌め込み固着ための凹部16が形成されてい
る。4個の凹部16が片側の側辺にあるが、夫々
の凹部16には基板12の内部に延在する細い切
溝17を形成してある。この切溝17はトロイダ
ルコア11の巻線のリード18を挾み込む役割を
する。なお基板12の材質はセラミツクでもよ
い。
First, in FIGS. 4 and 5, 10 is an elastic protective material made of silicone rubber or the like that encloses a toroidal core 11 around which a winding wire is wound, 12 is a flat rectangular substrate made of synthetic resin, 13 is an external terminal. A through hole 14 is formed in the center of the substrate 12, and a vertical portion 1 of an external terminal is formed on the opposite side.
A recess 16 is formed for fitting and fixing 5. There are four recesses 16 on one side, and each recess 16 has a narrow groove 17 extending inside the substrate 12. This cut groove 17 serves to sandwich the lead 18 of the winding of the toroidal core 11. Note that the material of the substrate 12 may be ceramic.

弾性保護材10の形状はほぼ直方体であるが、
一面に係止部20を設けてある。係止部20は一
面から円柱状に突出し先端を鍔状に広くすると共
に鍔状の部分を基板12の貫通孔14の大きさよ
りもわずかに広くしてある。係止部20の先端を
弾性的に変形させて貫通孔14に通して基板12
の表面に出すことにより素子本体であるトロイダ
ルコア11を包んでいる弾性保護材10は裏面に
固定される。なお弾性保護材の形状はトロイダル
コア11の形状に合せて円柱状にしてもよい。
The shape of the elastic protective material 10 is approximately a rectangular parallelepiped,
A locking portion 20 is provided on one side. The locking portion 20 protrudes from one surface in a cylindrical shape and has a wide tip end shaped like a flange, and the flange-shaped portion is made slightly wider than the size of the through hole 14 of the substrate 12. The tip of the locking portion 20 is elastically deformed and passed through the through hole 14 to attach the substrate 12.
The elastic protective material 10 surrounding the toroidal core 11, which is the main body of the element, is fixed to the back surface by exposing it to the front surface. Note that the shape of the elastic protective material may be cylindrical in accordance with the shape of the toroidal core 11.

そして第5図の凹部16と切溝17の周辺には
第6図で示すような導体パターンが夫々形成して
ある。第6図は第5図の左側辺の導体パターンの
状態を示してあるが、右側辺は左側辺と対称であ
る。第6図では説明の都合上第5図の夫々4個ず
つの凹部16、切溝17、リード18を英字を付
すことにより区別して表してある。
Conductive patterns as shown in FIG. 6 are formed around the recess 16 and groove 17 shown in FIG. 5, respectively. FIG. 6 shows the state of the conductor pattern on the left side of FIG. 5, and the right side is symmetrical with the left side. In FIG. 6, for convenience of explanation, each of the four recesses 16, four grooves 17, and four leads 18 in FIG.

切溝17Aの周辺の導体パターン21Aが凹部
16Bの周辺の導体パターン22Bに接続し、切
溝17Bの周辺の導体パターン21Bが凹部16
Aの周辺の導体パターン22Aに接続する。同様
にして切溝17Cの周辺の導体パターン21Cが
凹部16Dの周辺の導体パターン22Dに接続
し、切溝17Dの周辺の導体パターン21Dが凹
部16Cの周辺の導体パターン22Cに接続す
る。つまり切溝の周辺の導体パターンは切溝の続
く凹部とは別の凹部の周辺の導体パターンに接続
している。そして等価的な記号で表してある巻線
23のリード18A,リード18Bは夫々切溝1
7A、切溝17Bに挾み込まれ、巻線24のリー
ド18C、リード18Dは夫々切溝17C、切溝
17Dに挾み込まれる。切溝に挾み込まれたリー
ドは夫々周辺の導体パターンに半田付けされる。
リード18A、リード18Bが夫々凹部16B、
凹部16Aに半田付けや溶接することにより固着
された外部端子13に導体パターンを介して接続
し、又リード18C、リード18Dは夫々凹部1
6D、凹部16Cに固着された外部端子13に導
体パターンを介して接続する。
The conductor pattern 21A around the kerf 17A connects to the conductor pattern 22B around the recess 16B, and the conductor pattern 21B around the kerf 17B connects to the recess 16.
Connect to the conductor pattern 22A around A. Similarly, the conductor pattern 21C around the kerf 17C is connected to the conductor pattern 22D around the recess 16D, and the conductor pattern 21D around the kerf 17D is connected to the conductor pattern 22C around the recess 16C. In other words, the conductor pattern around the kerf is connected to a conductor pattern around a recess different from the recess to which the kerf continues. Leads 18A and 18B of the winding 23, which are represented by equivalent symbols, are respectively kerf 1.
7A and the kerf 17B, and the leads 18C and 18D of the winding 24 are inserted into the kerf 17C and the kerf 17D, respectively. The leads inserted into the grooves are each soldered to the surrounding conductor patterns.
Lead 18A and lead 18B are respectively recessed part 16B,
The leads 18C and 18D are connected to the external terminals 13 fixed to the recesses 16A by soldering or welding through conductor patterns, and the leads 18C and 18D are connected to the recesses 1, respectively.
6D, and is connected to the external terminal 13 fixed in the recess 16C via a conductor pattern.

第7図は基板に形成される導体パターンの別の
実施例を示す基板の部分平面図であり、第6図と
同様に第5図の左側辺を表してある。
FIG. 7 is a partial plan view of a substrate showing another embodiment of a conductive pattern formed on the substrate, and similarly to FIG. 6, the left side of FIG. 5 is shown.

切溝30Aの周辺の導体パターン31Aは凹部
32Cの周辺の導体パターン33Cに接続し、切
溝30Bと凹部32Bの周辺の導体パターン34
は1つになつている。又切溝30Cの周辺の導体
パターン31Cは凹部32Dの周辺の導体パター
ン33Dに接続し、切溝30Dの周辺の導体パタ
ーン31Dは凹部32Aの周辺の導体パターン3
3Aに接続する。
The conductor pattern 31A around the kerf 30A is connected to the conductor pattern 33C around the recess 32C, and the conductor pattern 34 around the kerf 30B and the recess 32B is connected to the conductor pattern 33C around the recess 32C.
are becoming one. Further, the conductor pattern 31C around the kerf 30C is connected to the conductor pattern 33D around the recess 32D, and the conductor pattern 31D around the kerf 30D is connected to the conductor pattern 3 around the recess 32A.
Connect to 3A.

本考案の小型電子部品は外部端子の固着される
基板の側辺から切溝が形成されており、切溝に挾
み込まれた素子本体のリードは導体パターンを介
して外部端子に接続されるが、切溝の周辺の導体
パターンは例えば第7図の導体パターン34のよ
うに切溝に続く凹部周辺の導体パターンに接続し
たり、導体パターン21Aや導体パターン31A
のように切溝に続く凹部とは別の凹部周辺の導体
パターンに接続する。従つて客先の仕様等によ
り、外部端子の位置が規定されて素子本体のリー
ドとは離れた位置に存在したり、又リードを直接
外部端子に接続した時にリードが交差する位置に
存在した場合でも、導体パターンを自在に設計で
きるからリードが交差することはない。第6図の
リード18Aとリード18B、リード18Cとリ
ード18Dは夫々交差する位置に外部端子13は
存在するが、真直ぐに素子本体から引出して切溝
に挾むだけでよく交差することはない。
In the small electronic component of the present invention, a groove is formed from the side of the board to which the external terminal is fixed, and the leads of the element body inserted into the groove are connected to the external terminal via the conductor pattern. However, the conductor pattern around the kerf may be connected to the conductor pattern around the recess following the kerf, such as the conductor pattern 34 in FIG. 7, or the conductor pattern 21A or 31A.
Connect to the conductor pattern around the recess, which is different from the recess following the kerf. Therefore, if the position of the external terminal is specified by the customer's specifications and is located away from the leads on the element body, or if the leads are located at a position where the leads intersect when directly connected to the external terminal. However, because the conductor pattern can be designed freely, the leads never cross. Although the external terminals 13 are present at the positions where the leads 18A and 18B and the leads 18C and 18D intersect in FIG. 6, they can be pulled out straight from the element body and inserted into the grooves without intersecting.

本考案の小型電子部品はこのように外部端子に
素子本体のリードをからげて接続する必要はない
し、リードが交差することもない。従つて組立作
業が簡単になり自動化に適する。
The small electronic component of the present invention does not need to be connected to external terminals by twisting the leads of the device body, and the leads do not cross each other. Therefore, assembly work is simplified and suitable for automation.

なお本考案は実施例に限定されるものではな
い。例えば外部端子を固着する基板の側辺には凹
部を設けたが外部端子の先端を水平にしておき導
体パターンの上に固着すれば特に凹部を設けなく
てもよい。無論弾性保護材で包まれた素子本体が
複数あつてもよい。又素子本体が巻線したトロイ
ダルコアであるパルストランスを例にとり説明し
たが、素子本体の内容構造を限定する必要はな
く、少くとも素子本体の一部を巻線を用いて構成
してある種々の小型電子部品に応用し得ることは
明らかである。
Note that the present invention is not limited to the examples. For example, although a recess is provided on the side of the substrate to which the external terminal is fixed, it is not necessary to provide a recess if the tip of the external terminal is kept horizontal and is fixed on the conductor pattern. Of course, there may be a plurality of element bodies wrapped with an elastic protective material. In addition, although the explanation has been given by taking as an example a pulse transformer whose element body is a toroidal core wound with wire, there is no need to limit the content structure of the element body, and there are various types in which at least a part of the element body is constructed using winding It is clear that the present invention can be applied to small electronic components.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図と第2図は従来の小型電子部品の夫々断
面図と平面図、第3図は別の従来の小型電子部品
の平面図、第4図は本考案の小型電子部品の実施
例を示す正面図、第5図は第4図の分解斜視図、
第6図は導体パターンを示すための基板の部分平
面図、第7図は導体パターンの別の実施例を示す
ための基板の部分平面図である。 10:弾性保護材、11:トロイダルコア、1
2:基板、13:外部端子、14:貫通孔、1
6,16A,16B,16C,16D:凹部、1
7,17A,17B,17C,17D:切溝、2
1A,21B,21C,21D,22A,22
B,22C,22D:導体パターン、18,18
A,18B,18C,18D:リード、20:係
止部。
1 and 2 are a sectional view and a plan view, respectively, of a conventional small electronic component, FIG. 3 is a plan view of another conventional small electronic component, and FIG. 4 is an embodiment of the small electronic component of the present invention. 5 is an exploded perspective view of FIG. 4,
FIG. 6 is a partial plan view of the substrate for showing a conductive pattern, and FIG. 7 is a partial plan view of the substrate for showing another embodiment of the conductive pattern. 10: Elastic protective material, 11: Toroidal core, 1
2: Board, 13: External terminal, 14: Through hole, 1
6, 16A, 16B, 16C, 16D: recess, 1
7, 17A, 17B, 17C, 17D: Cut groove, 2
1A, 21B, 21C, 21D, 22A, 22
B, 22C, 22D: Conductor pattern, 18, 18
A, 18B, 18C, 18D: Lead, 20: Locking part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 巻線してある素子本体を係止部を設けた弾性保
護材で包み、その係止部を基板に設けた固定手段
に取付けてあり、基板の側辺には外部端子の固着
部分から巻線のリードを挾み込むために基板の内
部に延在する切溝が形成してあり、該固着部分お
よび切溝の周辺のいずれにも導体パターンを設け
て外部端子と素子本体を該導体パターンを介して
接続し、外部端子を露呈させた状態で全体を樹脂
封止してある小型電子部品において、少くとも1
つの切溝の周辺の導体パターンはその切溝に続く
固着部分とは別の固着部分の周辺の導体パターン
に接続していることを特徴とする小型電子部品。
The wound element body is wrapped with an elastic protective material provided with a locking part, and the locking part is attached to a fixing means provided on the board. A cut groove extending inside the board is formed to sandwich the lead of the circuit board, and a conductor pattern is provided both in the fixed part and around the cut groove, and the conductor pattern is used to connect the external terminal and the element body. At least one small electronic component that is connected via a
A small electronic component characterized in that a conductor pattern around one cut groove is connected to a conductor pattern around a fixed part different from a fixed part following the cut groove.
JP4393084U 1984-03-27 1984-03-27 small electronic components Granted JPS60156713U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP4393084U JPS60156713U (en) 1984-03-27 1984-03-27 small electronic components
US06/715,177 US4628148A (en) 1984-03-27 1985-03-20 Encapsulated electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4393084U JPS60156713U (en) 1984-03-27 1984-03-27 small electronic components

Publications (2)

Publication Number Publication Date
JPS60156713U JPS60156713U (en) 1985-10-18
JPH0211770Y2 true JPH0211770Y2 (en) 1990-04-03

Family

ID=30556052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4393084U Granted JPS60156713U (en) 1984-03-27 1984-03-27 small electronic components

Country Status (1)

Country Link
JP (1) JPS60156713U (en)

Also Published As

Publication number Publication date
JPS60156713U (en) 1985-10-18

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