JPH02148787A - Flexible printed board sheet - Google Patents
Flexible printed board sheetInfo
- Publication number
- JPH02148787A JPH02148787A JP30311088A JP30311088A JPH02148787A JP H02148787 A JPH02148787 A JP H02148787A JP 30311088 A JP30311088 A JP 30311088A JP 30311088 A JP30311088 A JP 30311088A JP H02148787 A JPH02148787 A JP H02148787A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed circuit
- circuit board
- frame
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000013039 cover film Substances 0.000 claims abstract description 9
- 238000005452 bending Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 abstract description 4
- 239000012779 reinforcing material Substances 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフレキシブルプリント基板のシートに関し、特
に表面実装部品を搭載するフレキシブルプリント基板シ
ートに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible printed circuit board sheet, and particularly to a flexible printed circuit board sheet on which surface-mounted components are mounted.
従来、この種のフレキシブルプリント基板シートは一つ
のシートにフレキシブルプリント基板本体のみを有する
ｆｉ造か、あるいはフレキシブルプリント基板とその接
続部分を有して構成されるシート構造かのいずれかであ
る。Conventionally, this type of flexible printed circuit board sheet has either a FI structure in which one sheet has only a flexible printed circuit board body, or a sheet structure in which one sheet has a flexible printed circuit board and its connecting portion.
第４図はかかる従来の一例を示すフレキシブルプリント
基板の平面図であり、第５図は第４図に示すフレキシブ
ルプリント基板に表面実装部品を実装した状態でのＢ−
Ｂ’線断面図である。FIG. 4 is a plan view of a flexible printed circuit board showing an example of such a conventional flexible printed circuit board, and FIG. 5 is a plan view of the flexible printed circuit board shown in FIG.
It is a sectional view taken along the line B'.
第４図および第５図のＢ−Ｂ’線断面図に示すように、
フレキシブルプリント基板１は不透明なポリイミドフィ
ルム等で形成した軟質ベースらと、透明な第一のカバー
フィルム４および透明な第二のカバーフィルム６とから
なる三層構造で形成され、第二のカバーフィルム６には
第一のカバーフィルム４の表面実装部品９を搭載する位
置に対向して硬い補強基板７が接着さている。As shown in the BB' line cross-sectional views in Figures 4 and 5,
The flexible printed circuit board 1 has a three-layer structure consisting of a soft base made of an opaque polyimide film or the like, a transparent first cover film 4 and a transparent second cover film 6. A hard reinforcing substrate 7 is bonded to the first cover film 6 so as to face the position where the surface mount component 9 is mounted.
上述した従来のフレキシブルプリント基板シートは、フ
レキシブルプリント基板本体１を支持するのが補強基板
７だけであるので、表面実装部品９をフレキシブルプリ
ント基板本体１の第一のカバーフィルム４上に自動実装
機で搭載する場合、硬い補強基板７を接着していない部
分では、軟かい前記三層構造の曲がりや折れが生じやす
い、すなわち、硬い補強基板７のない部分は軟かく、こ
の部分の曲がりや折れによって部品９の実装位置がずれ
やすい。従って、基板の位置精度が悪くなり、部品の自
動搭載が困難になるという欠点がある。In the conventional flexible printed circuit board sheet described above, only the reinforcing board 7 supports the flexible printed circuit board body 1, so the surface mount components 9 are mounted on the first cover film 4 of the flexible printed circuit board body 1 using an automatic mounting machine. If the hard reinforcing board 7 is not attached, the three-layer structure is soft and easy to bend or break. Therefore, the mounting position of the component 9 is likely to shift. Therefore, there is a drawback that the positional accuracy of the board deteriorates and automatic mounting of components becomes difficult.
本発明の目的は、かかる表面実装部品の自動搭載を容易
に且つ正確に行うことのできるフレキシブルプリント基
板シートを提供することにある。An object of the present invention is to provide a flexible printed circuit board sheet on which surface mount components can be automatically mounted easily and accurately.
本発明のフレキシブルプリント基板シートは、表面実装
部品を搭載する複数個のフレキシブルプリント基板本体
と、前記複数個の基板本体の周囲に配置される枠部と、
前記枠部とフレキシブルプリント基板本体およびフレキ
シブルプリント基板本体間を接続する基板本体結合部と
を有し、これら基板本体、枠部および基板本体結合部を
共に軟度ベースおよびカバーフィルムからなる三層ｊＲ
３ｆｉに形成するとともに、前記フレキシブル基板本体
および枠部の裏面に補強部材を備えて構成される。The flexible printed circuit board sheet of the present invention includes a plurality of flexible printed circuit board bodies on which surface mount components are mounted, a frame portion disposed around the plurality of board bodies,
It has a board body joint part that connects the frame part, a flexible printed circuit board main body, and a flexible printed circuit board main body, and these board main body, frame part, and board main body joint part are all made of a three-layer jR made of a soft base and a cover film.
3fi, and a reinforcing member is provided on the back surface of the flexible substrate main body and the frame portion.
次に、本発明の実施例について図面を９照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示すフレキシブルプリント
基板シートの平面図である。FIG. 1 is a plan view of a flexible printed circuit board sheet showing an embodiment of the present invention.
第１図に示すように、本実施例は表面実装部品を搭載す
る複数個のフレキシブルプリント基板本体１と、これら
基板本体１の周囲に配置される枠部２と、これら枠部２
と基板本体１および基板本体ｌ相互間を接続する結合部
３とを有している。As shown in FIG. 1, this embodiment includes a plurality of flexible printed circuit board bodies 1 on which surface-mounted components are mounted, frame parts 2 disposed around these board bodies 1, and these frame parts 2.
and a coupling portion 3 that connects the substrate body 1 and the substrate body l.
すなわち、基板本体１は枠部２および結合部３により、
固定されるので、フレキシブルプリン１〜基板本体１は
曲がりや折れがなくなり、部品搭載にあたり容易且つ正
確に位置精度をだすことが可能になる。That is, the board main body 1 has the frame part 2 and the coupling part 3,
Since the flexible print 1 to the board main body 1 are fixed, there is no bending or folding, and it becomes possible to easily and accurately achieve positional accuracy when mounting components.
第２図は第１図におけるＡ−Ａ′線での断面図である。FIG. 2 is a sectional view taken along line A-A' in FIG. 1.
第２図に示すように、本実施例の基板本体１枠部２およ
び結合部３は共に三層構造で一体形成される。すなわち
、軟かいベース５の両面に第一および第二のカバーフィ
ルム４および６を接着し、且つ実装部品を搭載するため
の補強として硬い補強基板７を基板本体１の裏面側に接
着するとともに、外枠部２の補強として硬質補強材８を
同じく裏面側に接着する。これにより、軟質ベース５お
よびカバーフィルム４，６の曲がりや折れを防止するこ
とができる。As shown in FIG. 2, the substrate main body 1 frame portion 2 and coupling portion 3 of this embodiment are both integrally formed with a three-layer structure. That is, first and second cover films 4 and 6 are bonded to both sides of the soft base 5, and a hard reinforcing board 7 is bonded to the back side of the board body 1 as reinforcement for mounting the mounted components. A hard reinforcing material 8 is also bonded to the back side to reinforce the outer frame portion 2. This can prevent the soft base 5 and the cover films 4 and 6 from bending or breaking.
第３図は第１図に示すフレキシブルプリント基板上に表
面実装部品を実装した状態の第２図と同様の断面図であ
る。FIG. 3 is a sectional view similar to FIG. 2, showing a state in which surface mount components are mounted on the flexible printed circuit board shown in FIG. 1.
第３図に示すように、外枠部２に硬質補強材８があるた
め、フレキシブルプリント基板本体１の位置精度を高く
することができ、部品９を容易に且つ正確に自動実装す
ることができる。As shown in FIG. 3, since the outer frame portion 2 has a hard reinforcing material 8, the positional accuracy of the flexible printed circuit board body 1 can be increased, and the components 9 can be easily and accurately automatically mounted. .
以上説明したように、本発明のフレキシブルプリント基
板シートは、外枠部の内側に配置したフレキシブルプリ
ント基板本体を結合部をもって配置し且つこれら軟度ベ
ースおよびカバーフィルムからなる三層構造に形成する
とともに、フレキシブルプリント基板本体および枠部の
裏面側（表面実装部品搭載面とは反対側）に補強部材を
備えたことにより、フレキシブルプリント基板本体の曲
がりや折れを防止し、フレキシブルプリント基板本体上
に表面実装部品を容易且つ正確に自動実装することがで
きるという効果がある。As explained above, the flexible printed circuit board sheet of the present invention has a flexible printed circuit board body disposed inside an outer frame portion with a connecting portion, and is formed into a three-layer structure consisting of a flexible base and a cover film. By providing a reinforcing member on the back side of the flexible printed circuit board body and frame (the side opposite to the surface mounting surface for surface mount components), the flexible printed circuit board body is prevented from bending or breaking, and the surface mounted on the flexible printed circuit board body is This has the effect that components can be automatically mounted easily and accurately.
第１図は本発明の一実施例を示すフレキシブルプリント
基板シートの平面図、第２図は第１図におけるＡ−Ａ’
線断面図、第３図は第１図に示すフレキシブルプリント
基板上に表面実装部品を実装した状態の第２図と同様の
断面図、第４図は従来の一例を示すフレキシブルプリン
ト基板シートの平面図、第５図は第４図に示すフレキシ
ブルプリント基板に表面実装部品を実装した状態でのＢ
Ｂ′線断面図である。
１・・・フレキシブルプリント基板本体、２・・・枠部
、３・・・基板本体結合部、４，６・・・カバーフィル
ム、５・・・軟質ベース、７・・・補強基板、８・・・
硬質補強材、９・・・表面実装部品。
Ｉ−←
！
７羨゛ゴ杢１！１□ｆ（
５卓・１實べ−ん
ｊ？困FIG. 1 is a plan view of a flexible printed circuit board sheet showing an embodiment of the present invention, and FIG. 2 is a plan view taken along line A-A' in FIG.
3 is a cross-sectional view similar to FIG. 2 showing surface mount components mounted on the flexible printed circuit board shown in FIG. 1, and FIG. 4 is a plan view of a conventional flexible printed circuit board sheet. Figure 5 shows B with surface mount components mounted on the flexible printed circuit board shown in Figure 4.
It is a sectional view taken along the line B'. DESCRIPTION OF SYMBOLS 1... Flexible printed circuit board main body, 2... Frame part, 3... Board main body coupling part, 4, 6... Cover film, 5... Soft base, 7... Reinforcement board, 8...・・・
Hard reinforcing material, 9...Surface mount components. I-←! 7 envy 1! 1□f (5 tables, 1 practice?
Claims (1)
基板本体と、前記複数個の基板本体の周囲に配置される
枠部と、前記枠部とフレキシブルプリント基板本体およ
びフレキシブルプリント基板本体間を接続する基板本体
結合部とを有し、これら基板本体，枠部および基板本体
結合部を共に軟度ベースおよびカバーフィルムからなる
三層構造に形成するとともに、前記フレキシブル基板本
体および枠部の裏面に補強部材を備えたことを特徴とす
るフレキシブルプリント基板シート。A plurality of flexible printed circuit board bodies on which surface mount components are mounted, a frame portion disposed around the plurality of substrate bodies, and a substrate body connecting the frame portion, the flexible printed circuit board body, and the flexible printed circuit board body. The board body, the frame part and the board body joint part are all formed into a three-layer structure consisting of a flexible base and a cover film, and a reinforcing member is provided on the back surface of the flexible board body and the frame part. A flexible printed circuit board sheet characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30311088A JPH0680872B2 (en) | 1988-11-29 | 1988-11-29 | Flexible printed circuit board sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30311088A JPH0680872B2 (en) | 1988-11-29 | 1988-11-29 | Flexible printed circuit board sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02148787A true JPH02148787A (en) | 1990-06-07 |
| JPH0680872B2 JPH0680872B2 (en) | 1994-10-12 |
Family
ID=17917007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30311088A Expired - Lifetime JPH0680872B2 (en) | 1988-11-29 | 1988-11-29 | Flexible printed circuit board sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680872B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011505690A (en) * | 2007-11-29 | 2011-02-24 | エルジー イノテック カンパニー，リミティド | Printed circuit board, manufacturing method thereof, and panel for manufacturing printed circuit board |
-
1988
- 1988-11-29 JP JP30311088A patent/JPH0680872B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011505690A (en) * | 2007-11-29 | 2011-02-24 | エルジー イノテック カンパニー，リミティド | Printed circuit board, manufacturing method thereof, and panel for manufacturing printed circuit board |
| US8426739B2 (en) | 2007-11-29 | 2013-04-23 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0680872B2 (en) | 1994-10-12 |
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