JPH0221750U - - Google Patents

Info

Publication number
JPH0221750U
JPH0221750U JP1988100505U JP10050588U JPH0221750U JP H0221750 U JPH0221750 U JP H0221750U JP 1988100505 U JP1988100505 U JP 1988100505U JP 10050588 U JP10050588 U JP 10050588U JP H0221750 U JPH0221750 U JP H0221750U
Authority
JP
Japan
Prior art keywords
lead
percolation
resin
connects
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988100505U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988100505U priority Critical patent/JPH0221750U/ja
Publication of JPH0221750U publication Critical patent/JPH0221750U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す正面図、第２
図は従来例を示す正面図である。 １……樹脂モールド型トランジスタ用ペレツト
、２……第１のリード片、３……ボンデイングワ
イヤ、４……第２のリード片、５……第１のパー
コレーシヨン、７……第２のパーコレーシヨン。 Figure 1 is a front view showing one embodiment of the present invention;
The figure is a front view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Resin molded transistor pellet, 2... First lead piece, 3... Bonding wire, 4... Second lead piece, 5... First percolation, 7... Second lead piece. Percolation.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂モールド型トランジスタ用ペレツトを搭載
する第１のリード片と、前記ペレツトにボンデイ
ングワイヤを介して電気的に接続される第２のリ
ード片との組を縦列に配列してなるリードフレー
ムにおいて、隣接する組の第１及び第２のリード
片の先端相互間を一定ピツチで結合する第１のパ
ーコレーシヨンと、隣接する組の第１のリード片
の頭部相互間を結合する第２のパーコレーシヨン
とを有することを特徴とする樹脂モールド型トラ
ンジスタのリードフレーム。 In a lead frame in which a pair of a first lead piece on which a resin-molded transistor pellet is mounted and a second lead piece electrically connected to the pellet via a bonding wire is arranged in a column, adjacent a first percolation that connects the tips of the first and second lead pieces of the adjacent set at a constant pitch; and a second percolation that connects the heads of the first lead pieces of the adjacent set. A lead frame for a resin-molded transistor, characterized by having a collation.
JP1988100505U 1988-07-28 1988-07-28 Pending JPH0221750U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988100505U JPH0221750U (en) 1988-07-28 1988-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988100505U JPH0221750U (en) 1988-07-28 1988-07-28

Publications (1)

Publication Number Publication Date
JPH0221750U true JPH0221750U (en) 1990-02-14

Family

ID=31328639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988100505U Pending JPH0221750U (en) 1988-07-28 1988-07-28

Country Status (1)

Country Link
JP (1) JPH0221750U (en)

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