JPH0273741U - - Google Patents
Info
- Publication number
- JPH0273741U JPH0273741U JP1988152414U JP15241488U JPH0273741U JP H0273741 U JPH0273741 U JP H0273741U JP 1988152414 U JP1988152414 U JP 1988152414U JP 15241488 U JP15241488 U JP 15241488U JP H0273741 U JPH0273741 U JP H0273741U
- Authority
- JP
- Japan
- Prior art keywords
- package
- joint
- ceramic cap
- ceramic
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例の構
造を示す平面図、断面図、第２図は第１図に示す
実施例の接合部のろう付けの際の位置決め状態を
示す断面図、第３図ａ，ｂはそれぞれ従来のこの
種パツケージの一例の構造を示す平面図、断面図
、第４図は第３図に示すパツケージの接合部のろ
う付けの際の位置ずれ状態を示す断面図である。
１…パツケージ本体、２…半導体チツプ、３…
リード、４…ボンデイングワイヤ、５…セラミツ
クキヤツプ、７…ろう材、１１…カーボン板、１
２…金属片。なお図中同一符号は同一または相当
するものを示す。
Figures 1a and b are a plan view and a sectional view showing the structure of an embodiment of the present invention, respectively, and Figure 2 is a sectional view showing the positioning state of the joint portion of the embodiment shown in Figure 1 during brazing. , Figures 3a and 3b are a plan view and a cross-sectional view showing the structure of an example of a conventional package of this type, respectively, and Figure 4 shows a state of misalignment during brazing of the joints of the package shown in Figure 3. FIG. 1...Package body, 2...Semiconductor chip, 3...
Lead, 4... Bonding wire, 5... Ceramic cap, 7... Brazing metal, 11... Carbon plate, 1
2...Metal piece. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
ジ本体部と、該パツケージ本体部に接合部を低融
点金属でろう付けして取付けるセラミツクキヤツ
プとからなる半導体素子用パツケージにおいて、
上記パツケージ本体部とセラミツクキヤツプの接
合部に該接合部のろう付けの際の上記セラミツク
キヤツプの上記パツケージ本体部に対する位置決
めを行うテーパ状の傾斜を持たせたことを特徴と
する半導体素子用パツケージ。 A semiconductor device package comprising a ceramic package main body for storing a semiconductor chip, and a ceramic cap whose joint part is attached to the package main body by brazing with a low melting point metal,
A package for a semiconductor device, characterized in that a joint between the package body and the ceramic cap has a tapered slope for positioning the ceramic cap relative to the package body when the joint is brazed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152414U JPH0273741U (en) | 1988-11-25 | 1988-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152414U JPH0273741U (en) | 1988-11-25 | 1988-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273741U true JPH0273741U (en) | 1990-06-05 |
Family
ID=31427319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988152414U Pending JPH0273741U (en) | 1988-11-25 | 1988-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273741U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62177947A (en) * | 1986-01-31 | 1987-08-04 | Hitachi Ltd | Semiconductor device |
-
1988
- 1988-11-25 JP JP1988152414U patent/JPH0273741U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62177947A (en) * | 1986-01-31 | 1987-08-04 | Hitachi Ltd | Semiconductor device |